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0ICAH-002-XTP

型号：

0ICAH-002-XTP

描述：

高速CAN收发器[ High-Speed CAN Transceiver ]

品牌：

AMI[ AMI SEMICONDUCTOR ]

页数：

12 页

PDF大小：

626 K

下载PDF手册
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
1.0 General Description  
The AMIS-42670 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus and  
may be used in both 12V and 24V systems. The transceiver provides differential transmit capability to the bus and differential receive  
capability to the CAN controller. Due to the wide common-mode voltage range of the receiver inputs, the AMIS-42670 is able to reach  
outstanding levels of electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the  
excellent matching of the output signals.  
The AMIS-42670 is the industrial version of the AMIS-30660 and primarily intended for applications where long network lengths are  
mandatory. Examples are elevators, in-building networks, process control and trains. To cope with the long bus delay the  
communication speed needs to be low. AMIS-42670 allows low transmit data rates down 10 Kbit/s or lower.  
2.0 Key Features  
• Fully compatible with the ISO 11898-2 standard  
• Certified “Authentication on CAN Transceiver Conformance (d1.1)”  
• Wide range of bus communication speed (0 up to 1 Mbit/s)  
• Allows low transmit data rate in networks exceeding 1 km  
• Ideally suited for 12V and 24V industrial and automotive applications  
• Low electromagnetic emission (EME) common-mode choke is no longer required  
• Differential receiver with wide common-mode range (+/- 35V) for high EMS  
• No disturbance of the bus lines with an un-powered node  
• Thermal protection  
• Bus pins protected against transients  
• Silent mode in which the transmitter is disabled  
• Short circuit proof to supply voltage and ground  
• Logic level inputs compatible with 3.3V devices  
3.0 Technical Characteristics  
Table 1: Technical Characteristics  
Symbol  
VCANH  
VCANL  
Vi(dif)(bus_dom)  
tpd(rec-dom)  
tpd(dom-rec)  
CM-range  
Parameter  
DC voltage at pin CANH  
DC voltage at pin CANL  
Differential bus output voltage in dominant state  
Propagation delay TxD to RxD  
Propagation delay TxD to RxD  
Input common-mode range for comparator  
Conditions  
0 < VCC < 5.25V; no time limit  
0 < VCC < 5.25V; no time limit  
42.5Ω < RLT < 60Ω  
See Figure 7  
See Figure 7  
Guaranteed differential receiver threshold and  
leakage current  
Min.  
-45  
-45  
1.5  
70  
Max.  
+45  
+45  
3
245  
245  
+35  
Unit  
V
V
V
ns  
ns  
V
100  
-35  
VCM-peak  
VCM-step  
Common-mode peak  
Common-mode step  
See Figures 8 and 9 (Notes)  
See Figures 8 and 9 (Notes)  
-500  
-150  
500  
150  
mV  
mV  
Note: The parameters VCM-peak and VCM-step guarantee low electromagnetic emission.  
4.0 Ordering Information  
Ordering Code (Tubes)  
Ordering Code (Tape)  
Marketing Name  
Package  
Temp. Range  
0ICAH-002-XTD  
0ICAH-002-XTP  
AMIS 42670NGA  
SOIC-8 GREEN  
-40°C…125°C  
AMI Semiconductor – October 07, Rev. 1.0  
1
www.amis.com Specifications subject to change without notice  
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
5.0 Block Diagram  
VCC  
8
3
S
Thermal  
shutdown  
VCC  
7
6
CANH  
CANL  
Driver  
control  
TxD  
1
AMIS-42670  
4
COMP  
RxD  
VREF  
Ri(cm)  
Vcc/2  
+
5
Ri(cm)  
2
PD20070831.4  
GND  
Figure 1: Block Diagram  
6.0 Typical Application  
6.1 Application Schematic  
VBAT  
IN  
60 Ω  
60 Ω  
OUT  
5V-reg  
47 nF  
VCC  
VCC  
3
S
8
CANH  
7
5
6
CAN  
BUS  
RxD  
CAN  
controller  
AMIS-  
42670  
VREF  
CANL  
4
1
TxD  
60 Ω  
60 Ω  
47 nF  
2
PC20070831.3  
GND  
GND  
Figure 2: Application Diagram  
AMI Semiconductor – October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
2
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
6.2 Pin Description  
6.2.1. Pin Out (Top View)  
1
2
3
4
8
7
6
5
TxD  
GND  
VCC  
S
CANH  
CANL  
VREF  
RxD  
PC20070831.2  
Figure 3: Pin Configuration  
6.3 Pin Description  
Table 2: Pin Out  
Pin  
1
2
Name  
TxD  
GND  
VCC  
Description  
Transmit data input; low input → dominant driver; internal pull-up current  
Ground  
Supply voltage  
3
4
5
6
7
RxD  
VREF  
CANL  
CANH  
S
Receive data output; dominant transmitter → low output  
Reference voltage output  
Low-level CAN bus line (low in dominant mode)  
High-level CAN bus line (high in dominant mode)  
Silent mode control input; internal pull-down current  
8
AMI Semiconductor – October 07, Rev. 1.0  
3
www.amis.com Specifications subject to change without notice  
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
7.0 Functional Description  
7.1 Operating Modes  
The behavior of AMIS-42670 under various conditions is illustrated in Table 3 below. In case the device is powered, one of two  
operating modes can be selected through pin S.  
Table 3: Functional table of AMIS-42670; X = don’t care  
VCC  
pin TxD  
pin S  
pin CANH  
pin CANL  
Bus state  
pin RxD  
4.75 to 5.25.V  
4.75 to 5.25.V  
4.75 to 5.25.V  
VCC<PORL (unpowered)  
PORL<VCC<4.75V  
0
X
0 (or floating)  
1
X
X
X
High  
VCC/2  
VCC/2  
0V<CANH<VCC  
0V<CANH<VCC  
Low  
VCC/2  
VCC/2  
0V<CANL<VCC  
0V<CANL<VCC  
Dominant  
Recessive  
Recessive  
Recessive  
Recessive  
0
1
1
1
1
1 (or floating)  
X
>2V  
7.1.1. High-Speed Mode  
If pin S is pulled low (or left floating), the transceiver is in its high-speed mode and is able to communicate via the bus lines. The signals  
are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus line outputs are optimized to give  
extremely low electromagnetic emissions.  
7.1.2. Silent Mode  
In silent mode, the transmitter is disabled. All other IC functions continue to operate. The silent mode is selected by connecting pin S to  
VCC and can be used to prevent network communication from being blocked, due to a CAN controller which is out of control.  
7.2 Over-temperature Detection  
A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of  
approximately 160°C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is  
reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes high. The thermal protection  
circuit is particularly necessary when a bus line short-circuits.  
7.3 High Communication Speed Range  
The transceiver is primarily intended for industrial applications. It allows very low baud rates needed for long bus length applications.  
But also high speed communication is possible up to 1Mbit/s.  
7.4 Fail-safe Features  
A current-limiting circuit protects the transmitter output stage from damage caused by an accidental short-circuit to either positive or  
negative supply voltage, although power dissipation increases during this fault condition.  
The pins CANH and CANL are protected from automotive electrical transients (according to “ISO 7637”; see Figure 4). Pin TxD is  
pulled high internally should the input become disconnected.  
AMI Semiconductor – October 07, Rev. 1.0  
4
www.amis.com Specifications subject to change without notice  
 
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
8.0 Electrical Characteristics  
8.1 Definitions  
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing into the pin;  
sourcing current means the current is flowing out of the pin.  
8.2 Absolute Maximum Ratings  
Stresses above those listed in the following table may cause permanent device failure. Exposure to absolute maximum ratings for  
extended periods may affect device reliability.  
Table 4: Absolute Maximum Ratings  
Symbol  
VCC  
VCANH  
VCANL  
VTxD  
VRxD  
VS  
VREF  
Vtran(CANH)  
Vtran(CANL)  
Parameter  
Supply voltage  
Conditions  
Min.  
-0.3  
-45  
Max.  
+7  
+45  
+45  
VCC + 0.3  
VCC + 0.3  
VCC + 0.3  
VCC + 0.3  
+150  
Unit  
V
V
V
V
V
V
V
V
DC voltage at pin CANH  
DC voltage at pin CANL  
DC voltage at pin TxD  
DC voltage at pin RxD  
DC voltage at pin S  
DC voltage at pin VREF  
Transient voltage at pin CANH  
Transient voltage at pin CANL  
0 < VCC < 5.25V; no time limit  
0 < VCC < 5.25V; no time limit  
-45  
-0.3  
-0.3  
-0.3  
-0.3  
-150  
-150  
-4  
Note 1  
Note 1  
Note 2  
Note 4  
+150  
+4  
+750  
V
kV  
V
Vesd  
Electrostatic discharge voltage at all pins  
-750  
Latch-up  
Static latch-up at all pins  
Note 3  
100  
mA  
Tstg  
Tamb  
Tjunc  
Storage temperature  
Ambient temperature  
Maximum junction temperature  
-55  
-40  
-40  
+155  
+125  
+150  
°C  
°C  
°C  
Notes:  
1.  
2.  
3.  
4.  
Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4).  
Standardized human body model ESD pulses in accordance to MIL883 method 3015.7.  
Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78.  
Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.  
8.3 Thermal Characteristics  
Table 5: Thermal Characteristics  
Symbol  
Rth(vj-a)  
Parameter  
Conditions  
In free air  
In free air  
Value  
150  
45  
Unit  
K/W  
K/W  
Thermal resistance from junction to ambient in SO8 package  
Thermal resistance from junction to substrate of bare die  
Rth(vj-s  
)
AMI Semiconductor – October 07, Rev. 1.0  
5
www.amis.com Specifications subject to change without notice  
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
8.4 DC and Timing Characteristics  
VCC = 4.75 to 5.25V; Tjunc = -40 to +150°C; RLT =60Ω unless specified otherwise.  
Table 6: DC and Timing Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Supply (Pin VCC  
ICC  
)
Supply current  
Dominant; VTXD = 0V  
Recessive; VTXD = VCC  
25  
2
45  
4
65  
8
mA  
mA  
Transmitter Data Input (Pin TxD)  
VIH  
VIL  
IIH  
IIL  
High-level input voltage  
Output recessive  
Output dominant  
VTxD = VCC  
VTxD = 0V  
Not tested  
2.0  
-0.3  
-1  
-75  
-
-
-
0
-200  
5
VCC+0.3  
+0.8  
+1  
-350  
10  
V
V
µA  
µA  
pF  
Low-level input voltage  
High-level input current  
Low-level input current  
Input capacitance  
Ci  
Mode Select (Pin S)  
VIH  
VIL  
IIH  
High-level input voltage  
Low-level input voltage  
High-level input current  
Low-level input current  
Silent mode  
High-speed mode  
VS =2V  
2.0  
-0.3  
20  
-
-
30  
30  
VCC+0.3  
+0.8  
50  
V
V
µA  
µA  
IIL  
VS =0.8V  
15  
45  
Receiver Data Output (Pin RxD)  
VOH  
High-level output voltage  
IRXD = - 10mA  
0.6 x VCC  
0.75 x  
VCC  
0.25  
V
V
V
V
VOL  
Low-level output voltage  
IRXD = 6mA  
0.45  
Reference Voltage Output (Pin VREF  
VREF  
)
Reference output voltage  
-50µA < IVREF < +50µA  
0.45 x VCC  
0.40 x VCC  
0.50 x  
VCC  
0.50 x  
VCC  
0.55 x VCC  
0.60 x VCC  
VREF_CM  
Reference output voltage for full common -35V <VCANH< +35V;  
mode range  
-35V <VCANL< +35V  
Bus Lines (Pins CANH and CANL)  
Vo(reces)(CANH)  
Vo(reces)(CANL)  
Io(reces) (CANH)  
Recessive bus voltage at pin CANH  
Recessive bus voltage at pin CANL  
Recessive output current at pin CANH  
VTxD = VCC; no load  
VTxD = VCC; no load  
-35V <VCANH< +35V;  
0V <VCC < 5.25V  
-35V <VCANL < +35V;  
0V <VCC < 5.25V  
VTxD = 0V  
2.0  
2.0  
-2.5  
2.5  
2.5  
-
3.0  
3.0  
+2.5  
V
V
mA  
Io(reces) (CANL)  
Recessive output current at pin CANL  
-2.5  
-
+2.5  
mA  
Vo(dom) (CANH)  
Vo(dom) (CANL)  
Vi(dif) (bus)  
Dominant output voltage at pin CANH  
Dominant output voltage at pin CANL  
Differential bus input voltage  
3.0  
0. 5  
1.5  
3.6  
1.4  
2.25  
4.25  
1.75  
3.0  
V
V
V
VTxD = 0V  
VTxD = 0V; dominant;  
(VCANH - VCANL  
)
42.5 Ω < RLT < 60 Ω  
V
TxD =VCC; recessive;  
-120  
0
+50  
mV  
No load  
Io(sc) (CANH)  
Io(sc) (CANL)  
Vi(dif)(th)  
Short circuit output current at pin CANH  
Short circuit output current at pin CANL  
Differential receiver threshold voltage  
VCANH = 0V; VTxD = 0V  
VCANL = 36V; VTxD = 0V  
-5V <VCANL < +10V;  
-5V <VCANH < +10V;  
See Figure 5  
-45  
45  
0.5  
-70  
70  
0.7  
-95  
120  
0.9  
mA  
mA  
V
Vihcm(dif) (th)  
Differential receiver threshold voltage for -35V <VCANL < +35V;  
0.25  
50  
0.7  
70  
1.05  
100  
V
high common-mode  
-35V <VCANH < +35V;  
See Figure 5  
Vi(dif) (hys)  
Differential receiver input voltage hysteresis  
-5V <VCANL < +10V;  
-5V <VCANH < +10V;  
See Figure 5  
mV  
Ri(cm)(CANH)  
Ri(cm) (CANL)  
Ri(cm)(m)  
Common-mode input resistance at pin  
CANH  
Common-mode input resistance at pin  
CANL  
Matching between pin CANH and pin CANL VCANH =VCANL  
common-mode input resistance  
15  
15  
-3  
25  
25  
0
37  
37  
+3  
KΩ  
KΩ  
%
Ri(dif)  
Ri(cm)(m)  
Differential input resistance  
Matching between pin CANH and pin CANL VCANH =VCANL  
common-mode input resistance  
25  
-3  
50  
0
75  
+3  
KΩ  
%
Ri(dif)  
Differential input resistance  
25  
50  
75  
KΩ  
AMI Semiconductor – October 07, Rev. 1.0  
6
www.amis.com Specifications subject to change without notice  
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
Table 7: DC and Timing Characteristics (continued)  
Symbol  
Ci(CANH)  
Ci(CANL)  
Ci(dif)  
ILI(CANH)  
ILI(CANL)  
VCM-peak  
Parameter  
Conditions  
Min.  
Typ.  
7.5  
7.5  
3.75  
170  
170  
Max.  
20  
20  
Unit  
pF  
pF  
Input capacitance at pin CANH  
Input capacitance at pin CANL  
Differential input capacitance  
Input leakage current at pin CANH  
Input leakage current at pin CANL  
VTxD = VCC; not tested  
VTxD = VCC; not tested  
VTxD = VCC; not tested  
VCC = 0V; VCANH = 5V  
VCC = 0V; VCANL = 5V  
10  
pF  
10  
10  
-500  
250  
250  
500  
µA  
µA  
mV  
Common-mode peak during transition from See Figure 8 and Figure 9  
dom → rec or rec → dom  
Difference in common-mode between See Figure 8 and Figure 9  
dominant and recessive state  
VCM-step  
-150  
150  
mV  
Power-on-Reset (POR)  
PORL  
POR level  
CANH, CANL, Vref in tri- 2.2  
3.5  
4.7  
V
state below POR level  
Thermal Shutdown  
Tj(sd)  
Shutdown junction temperature  
150  
40  
30  
25  
65  
70  
160  
180  
130  
°C  
Timing Characteristics (see Figure 6 and Figure 7)  
td(TxD-BUSon)  
td(TxD-BUSoff)  
td(BUSon-RxD)  
td(BUSoff-RxD)  
tpd(rec-dom)  
Delay TxD to bus active  
Delay TxD to bus inactive  
Delay bus active to RxD  
Delay bus inactive to RxD  
Propagation delay TxD to RxD from  
recessive to dominant  
Vs = 0V  
Vs = 0V  
Vs = 0V  
Vs = 0V  
Vs = 0V  
85  
60  
55  
ns  
ns  
ns  
ns  
ns  
105  
105  
135  
245  
100  
td(dom-rec)  
Propagation delay TxD to RxD from  
dominant to recessive  
Vs = 0V  
100  
245  
ns  
8.5 Measurement Set-ups and Definitions  
+5 V  
100 nF  
TxD  
VCC  
3
CANH  
7
1
4
1 nF  
VREF  
Transient  
Generator  
AMIS-  
42670  
5
RxD  
1 nF  
CANL  
6
2
8
PC20070831.1  
20 pF  
GND  
S
Figure 4: Test Circuit for Transients  
VRxD  
High  
Low  
Hysteresis  
PC20040829.7  
0,9  
0,5  
Vi(dif)(hys)  
Figure 5: Hysteresis of the Receiver  
AMI Semiconductor – October 07, Rev. 1.0  
7
www.amis.com Specifications subject to change without notice  
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
+5 V  
100 nF  
TxD  
VCC  
3
CANH  
7
1
4
RLT  
VREF  
CLT  
AMIS-  
42670  
5
100 pF  
60 Ω  
RxD  
6
CANL  
2
8
20 pF  
GND  
S
PC20070831.5  
Figure 6: Test Circuit for Timing Characteristics  
HIGH  
LOW  
TxD  
CANH  
CANL  
dominant  
Vi(dif)  
VCANH - VCANL  
=
0,9V  
0,5V  
recessive  
RxD  
0,7 x VCC  
0,3 x VCC  
td(TxD-BUSon)  
td(TxD-BUSoff)  
td(BUSon-RxD)  
td(BUSoff-RxD)  
tpd(rec-dom)  
tpd(dom-rec)  
PC20040829.6  
Figure 7: Timing Diagram for AC Characteristics  
AMI Semiconductor – October 07, Rev. 1.0  
8
www.amis.com Specifications subject to change without notice  
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
+5 V  
100 nF  
TxD  
VCC  
3
6.2 kΩ  
CANH  
CANL  
7
6
5
10 nF  
1
4
Active Probe  
AMIS-  
42670  
Generator  
RxD  
Spectrum Anayzer  
6.2 kΩ  
30 Ω  
30 Ω  
VREF  
2
8
47 nF  
20 pF  
GND  
S
PC20070831.6  
Figure 8: Basic Test Set-up for Electromagnetic Measurement  
CANH  
CANL  
recessive  
VCM-peak  
VCM-step  
Vi(com)  
=
V
CANH + VCANL  
PC20040829.7  
VCM-peak  
Figure 9: Common-mode Voltage Peaks (see measurement set-up Figure 8)  
AMI Semiconductor – October 07, Rev. 1.0  
9
www.amis.com Specifications subject to change without notice  
 
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
9.0 Package Outline  
SOIC-8: Plastic small outline; eight leads; body width 150mil  
AMI Semiconductor – October 07, Rev. 1.0  
10  
www.amis.com Specifications subject to change without notice  
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
10.0 Soldering  
10.1 Introduction  
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data  
Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011).  
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount  
ICs, or for printed circuit boards with high population densities. In these situations reflow soldering is often used.  
10.2 Re-flow Soldering  
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit  
board by screen printing, stencilling or pressure-syringe dispensing before package placement.  
Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating,  
soldering and cooling) vary between 100 and 200 seconds, depending on heating method.  
Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept  
below 230°C.  
10.3 Wave Soldering  
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed circuit boards with a high  
component density, as solder bridging and non-wetting can present major problems.  
To overcome these problems the double-wave soldering method was specifically developed.  
If wave soldering is used, the following conditions must be observed for optimal results:  
• Use a double-wave soldering method, comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.  
For packages with leads on two sides and a pitch (e):  
o
Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the  
printed-circuit board.  
o
Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board.  
The footprint must incorporate solder thieves at the downstream end.  
• For packages with leads on four sides, the footprint must be placed at a 45 degree angle to the transport direction of the printed-  
circuit board. The footprint must incorporate solder thieves downstream and at the side corners.  
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen  
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.  
Typical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most  
applications.  
10.4 Manual Soldering  
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat  
part of the lead. Contact time must be limited to ten seconds at up to 300°C.  
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds, between 270 and 320°C.  
Table 8: Soldering  
Soldering Method  
Wave  
Not suitable  
Package  
Reflow (1)  
Suitable  
Suitable  
Suitable  
Suitable  
Suitable  
BGA, SQFP  
HLQFP, HSQFP, HSOP, HTSSOP, SMS  
PLCC (3) , SO, SOJ  
LQFP, QFP, TQFP  
Not suitable (2)  
Suitable  
Not recommended (3)(4)  
Not recommended (5)  
SSOP, TSSOP, VSO  
Notes:  
1.  
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size  
of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For  
details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”  
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heat sink (at bottom version) can not be achieved, and  
as solder may stick to the heatsink (on top version).  
If wave soldering is considered, then the package must be placed at a 45 degree angle to the solder wave direction. The package footprint must incorporate solder  
thieves downstream and at the side corners.  
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a  
pitch (e) equal to or smaller than 0.65mm.  
2.  
3.  
4.  
5.  
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a  
pitch (e) equal to or smaller than 0.5mm.  
AMI Semiconductor – October 07, Rev. 1.0  
11  
www.amis.com Specifications subject to change without notice  
AMIS-42670 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
11.0 Company or Product Inquiries  
For more information about AMI Semiconductor’s high-speed Industrial CAN transceivers, visit our Web site at: http://www.amis.com  
12.0 Document History  
Date  
Revision  
Change  
October 2007  
1.0  
Initial release  
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express,  
statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS  
makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any  
time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range,  
unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not  
recommended without additional processing by AMIS for such applications. Copyright ©2007 AMI Semiconductor, Inc.  
AMI Semiconductor – October 07, Rev. 1.0  
12  
www.amis.com Specifications subject to change without notice  
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