请登录

免费注册
全部商品
电子元器件
方案中心
工业品
PDF资料
购物车 0
上传BOM

产品分类

找货询价

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

QQ咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

会员中心
购物车
技术支持

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

售后咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

0ICAB-001-XTP

型号：

0ICAB-001-XTP

描述：

高速CAN收发器[ High-Speed CAN Transceiver ]

品牌：

AMI[ AMI SEMICONDUCTOR ]

页数：

12 页

PDF大小：

657 K

下载PDF手册
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
1.0 General Description  
The AMIS-42671 CAN transceiver with autobaud is the interface between a controller area network (CAN) protocol controller and the  
physical bus. It may be used in both 12V and 24V systems. The transceiver provides differential transmit capability to the bus and  
differential receive capability to the CAN controller. Due to the wide common-mode voltage range of the receiver inputs, the AMIS-  
42671 is able to reach outstanding levels of electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission  
(EME) is achieved by the excellent matching of the output signals.  
The AMIS-42671 is primarily intended for industrial network applications where long network lengths are mandatory. Examples are  
elevators, in-building networks, process control and trains. To cope with the long bus delay the communication speed needs to be low.  
AMIS-42671 allows low transmit data rates down 10 Kbit/s or lower. The autobaud function allows the CAN controller to determine the  
incoming baud rate without influencing the CAN communication on the bus.  
2.0 Key Features  
• Fully compatible with the ISO 11898-2 standard  
• Autobaud function  
• Wide range of bus communication speed (0 up to 1 Mbit/s)  
• Allows low transmit data rate in networks exceeding 1 km  
• Ideally suited for 12V and 24V industrial and automotive applications  
• Low electromagnetic emission (EME) common-mode choke is no longer required  
• Differential receiver with wide common-mode range (+/- 35V) for high EMS  
• No disturbance of the bus lines with an un-powered node  
• Thermal protection  
• Bus pins protected against transients  
• Silent mode in which the transmitter is disabled  
• Short circuit proof to supply voltage and ground  
• Logic level inputs compatible with 3.3V devices  
• ESD protection for CAN bus at ± 8 kV  
3.0 Technical Characteristics  
Table 1: Technical Characteristics  
Symbol  
VCANH  
VCANL  
Vi(dif)(bus_dom)  
tpd(rec-dom)  
tpd(dom-rec)  
CM-range  
Parameter  
DC voltage at pin CANH  
DC voltage at pin CANL  
Differential bus output voltage in dominant state  
Propagation delay TxD to RxD  
Propagation delay TxD to RxD  
Input common-mode range for comparator  
Conditions  
0 < VCC < 5.25V; no time limit  
0 < VCC < 5.25V; no time limit  
42.5Ω < RLT < 60Ω  
See Figure 8  
See Figure 8  
Guaranteed differential receiver threshold and  
leakage current  
Min.  
-45  
-45  
1.5  
70  
Max.  
+45  
+45  
3
245  
245  
+35  
Unit  
V
V
V
ns  
ns  
V
100  
-35  
VCM-peak  
VCM-step  
Common-mode peak  
Common-mode step  
See Figure 9 and Figure 10 (Notes)  
See Figure 9 and Figure 10 (Notes)  
-500  
-150  
500  
150  
mV  
mV  
Note: The parameters VCM-peak and VCM-step guarantee low electromagnetic emission.  
4.0 Ordering Information  
Ordering Code (Tubes)  
Ordering Code (Tape)  
Marketing Name  
Package  
Temp. Range  
0ICAB-001-XTD  
0ICAB-001-XTP  
AMIS 42671AGA  
SOIC-8 GREEN  
-40°C…125°C  
AMI Semiconductor – Oct. 07, Rev. 1.0  
1
www.amis.com Specifications subject to change without notice  
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
5.0 Block Diagram  
VCC  
8
3
AUTB  
TxD  
Thermal  
shutdown  
VCC  
Slope  
Control  
7
6
CANH  
CANL  
1
Driver  
control  
Auto-  
baud  
Control  
AMIS-42671  
4
COMP  
RxD  
VREF  
Ri(cm)  
Vcc/2  
+
5
Ri(cm)  
2
PC20070930.2  
GND  
Figure 1: Block Diagram  
6.0 Typical Application  
6.1 Application Schematic  
VBAT  
IN  
60 Ω  
60 Ω  
47 nF  
OUT  
5V-reg  
VCC  
VCC  
3
AUTB  
8
4
1
CANH  
7
CAN  
BUS  
RxD  
CAN  
controller  
AMIS-  
42671  
VREF  
CANL  
5
6
TxD  
60 Ω  
60 Ω  
2
GND  
GND  
47 nF  
PC20071001.1  
Figure 2: Application Diagram  
AMI Semiconductor – Oct. 07, Rev. 1.0  
2
www.amis.com Specifications subject to change without notice  
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
6.2 Pin Description  
6.2.1. Pin Out (Top View)  
8
7
6
5
1
2
3
4
TxD  
GND  
VCC  
AUTB  
CANH  
CANL  
VREF  
RxD  
PC20070929.1  
Figure 3: Pin Configuration  
6.3 Pin Description  
Table 2: Pin Out  
Pin  
1
2
Name  
TxD  
GND  
VCC  
Description  
Transmit data input; low input → dominant driver; internal pull-up current  
Ground  
Supply voltage  
3
4
5
RxD  
VREF  
Receive data output; dominant transmitter→ low output  
Reference voltage output  
6
7
8
CANL  
CANH  
AUTB  
Low-level CAN bus line (low in dominant mode)  
High-level CAN bus line (high in dominant mode)  
Autobaud mode control input; internal pull-down current  
AMI Semiconductor – Oct. 07, Rev. 1.0  
3
www.amis.com Specifications subject to change without notice  
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
7.0 Functional Description  
7.1 Operating Modes  
The behavior of AMIS-42671 under various conditions is illustrated in Table 3 below. In case the device is powered, one of two  
operating modes can be selected through pin AUTB.  
Table 3: Functional table of AMIS-42671 when not connected to the bus; X = don’t care  
VCC  
pin TxD  
pin AUTB  
pin CANH  
pin CANL  
Bus state  
pin RxD  
4.75 to 5.25.V  
4.75 to 5.25.V  
4.75 to 5.25.V  
VCC<PORL (unpowered)  
PORL<VCC<4.75V  
0
X
0 (or floating)  
1
X
X
X
High  
VCC/2  
VCC/2  
0V<CANH<VCC  
0V<CANH<VCC  
Low  
VCC/2  
VCC/2  
0V<CANL<VCC  
0V<CANL<VCC  
Dominant  
Recessive  
Recessive  
Recessive  
Recessive  
0
1
1
1
1
1 (or floating)  
X
>2V  
7.1.1. High-Speed Mode  
If pin AUTB is pulled low (or left floating), the transceiver is in its high-speed mode and is able to communicate via the bus lines. The  
signals are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus line outputs are optimized  
to give extremely low electromagnetic emissions.  
7.1.2. Autobaud Mode  
If pin AUTB is pulled high, AMIS-42671 is in Autobaud mode. The transmitter is disabled while the receiver remains active. All other IC  
functions also continue to operate. Normal bus activity can be monitored at the RxD pin and transmit data on TxD is looped back to  
RxD without influencing the CAN communication.  
TxD  
CANH  
CANL  
RxD  
AUTB  
PC20071002.4  
Figure 4: Simplified Schematic Diagram of Autobaud Function  
In Autobaud mode the local CAN controller is able to detect the used communication speed of other transmitting network nodes. Bus  
communication is received and via the RxD pin sent to the CAN controller. If the CAN controller operates at the wrong baud rate, it will  
transmit an error frame. This message will be looped back to the CAN controller which will increment its error counter. The CAN  
controller will be reset with another baud rate. When an error-free message is received, the correct baud rate is detected. A logic low  
may now be applied to pin AUTB, returning to the High-Speed Mode.  
7.2 Over-temperature Detection  
A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of  
approximately 160°C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is  
reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes high. The thermal protection  
circuit is particularly necessary when a bus line short-circuits.  
AMI Semiconductor – Oct. 07, Rev. 1.0  
4
www.amis.com Specifications subject to change without notice  
 
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
7.3 High Communication Speed Range  
The transceiver is primarily intended for industrial applications. It allows very low baud rates needed for long bus length applications.  
But also high speed communication is possible up to 1Mbit/s.  
7.4 Fail-safe Features  
A current-limiting circuit protects the transmitter output stage from damage caused by an accidental short-circuit to either positive or  
negative supply voltage, although power dissipation increases during this fault condition.  
The pins CANH and CANL are protected from automotive electrical transients (according to “ISO 7637”; see Figure 5). Pin TxD is  
pulled high internally should the input become disconnected.  
8.0 Electrical Characteristics  
8.1 Definitions  
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing into the pin;  
sourcing current means the current is flowing out of the pin.  
8.2 Absolute Maximum Ratings  
Stresses above those listed in the following table may cause permanent device failure. Exposure to absolute maximum ratings for  
extended periods may affect device reliability.  
Table 4: Absolute Maximum Ratings  
Symbol  
VCC  
VCANH  
VCANL  
VTxD  
VRxD  
VAUTB  
VREF  
Vtran(CANH)  
Vtran(CANL)  
Parameter  
Supply voltage  
Conditions  
Min.  
-0.3  
-45  
Max.  
+7  
+45  
+45  
VCC + 0.3  
VCC + 0.3  
VCC + 0.3  
VCC + 0.3  
+150  
Unit  
V
V
V
V
V
V
V
V
DC voltage at pin CANH  
DC voltage at pin CANL  
DC voltage at pin TxD  
DC voltage at pin RxD  
DC voltage at pin AUTB  
DC voltage at pin VREF  
Transient voltage at pin CANH  
Transient voltage at pin CANL  
0 < VCC < 5.25V; no time limit  
0 < VCC < 5.25V; no time limit  
-45  
-0.3  
-0.3  
-0.3  
-0.3  
-150  
-150  
-4  
Note 1  
Note 1  
Note 2  
Note 4  
+150  
+4  
+500  
V
kV  
V
Vesd  
Electrostatic discharge voltage at all pins  
-500  
Latch-up  
Static latch-up at all pins  
Note 3  
100  
mA  
Tstg  
Tamb  
Tjunc  
Storage temperature  
Ambient temperature  
Maximum junction temperature  
-55  
-40  
-40  
+155  
+125  
+150  
°C  
°C  
°C  
Notes:  
1.  
2.  
3.  
4.  
Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4).  
Standardized human body model ESD pulses in accordance to MIL883 method 3015.7.  
Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78.  
Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.  
8.3 Thermal Characteristics  
Table 5: Thermal Characteristics  
Symbol  
Rth(vj-a)  
Parameter  
Conditions  
In free air  
In free air  
Value  
150  
45  
Unit  
K/W  
K/W  
Thermal resistance from junction to ambient in SO8 package  
Thermal resistance from junction to substrate of bare die  
Rth(vj-s  
)
AMI Semiconductor – Oct. 07, Rev. 1.0  
5
www.amis.com Specifications subject to change without notice  
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
8.4 DC and Timing Characteristics  
VCC = 4.75 to 5.25V; Tjunc = -40 to +150°C; RLT =60Ω unless specified otherwise.  
Table 6: DC and Timing Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Supply (Pin VCC  
ICC  
)
Supply current  
Dominant; VTXD = 0V  
Recessive; VTXD = VCC  
25  
2
45  
4
65  
8
mA  
mA  
Transmitter Data Input (Pin TxD)  
VIH  
VIL  
IIH  
IIL  
Ci  
High-level input voltage  
Output recessive  
Output dominant  
VTxD = VCC  
VTxD = 0V  
Not tested  
2.0  
-0.3  
-1  
-75  
-
-
-
0
-200  
5
VCC+0.3  
+0.8  
+1  
-350  
10  
V
V
µA  
µA  
pF  
Low-level input voltage  
High-level input current  
Low-level input current  
Input capacitance  
Mode Select (Pin AUTB)  
VIH  
VIL  
IIH  
High-level input voltage  
Autobaud mode  
High-speed mode  
VS =2V  
2.0  
-0.3  
20  
-
-
30  
30  
VCC+0.3  
+0.8  
50  
V
V
µA  
µA  
Low-level input voltage  
High-level input current  
Low-level input current  
IIL  
VS =0.8V  
15  
45  
Receiver Data Output (Pin RxD)  
VOH  
High-level output voltage  
IRXD = - 10mA  
0.6 x VCC  
0.75 x  
VCC  
0.25  
V
V
V
V
VOL  
Low-level output voltage  
IRXD = 6mA  
0.45  
Reference Voltage Output (Pin VREF  
VREF  
)
Reference output voltage  
-50µA < IVREF < +50µA  
0.45 x VCC  
0.40 x VCC  
0.50 x  
VCC  
0.50 x  
VCC  
0.55 x VCC  
0.60 x VCC  
VREF_CM  
Reference output voltage for full common -35V <VCANH< +35V;  
mode range  
-35V <VCANL< +35V  
Bus Lines (Pins CANH and CANL)  
Vo(reces)(CANH)  
Vo(reces)(CANL)  
Io(reces) (CANH)  
Recessive bus voltage at pin CANH  
Recessive bus voltage at pin CANL  
Recessive output current at pin CANH  
VTxD = VCC; no load  
VTxD = VCC; no load  
-35V <VCANH< +35V;  
0V <VCC < 5.25V  
-35V <VCANL < +35V;  
0V <VCC < 5.25V  
VTxD = 0V  
2.0  
2.0  
-2.5  
2.5  
2.5  
-
3.0  
3.0  
+2.5  
V
V
mA  
Io(reces) (CANL)  
Recessive output current at pin CANL  
-2.5  
-
+2.5  
mA  
Vo(dom) (CANH)  
Vo(dom) (CANL)  
Vi(dif) (bus)  
Dominant output voltage at pin CANH  
Dominant output voltage at pin CANL  
Differential bus input voltage  
3.0  
0. 5  
1.5  
3.6  
1.4  
2.25  
4.25  
1.75  
3.0  
V
V
V
VTxD = 0V  
VTxD = 0V; dominant;  
42.5 Ω < RLT < 60 Ω  
VTxD =VCC; recessive;  
No load  
(VCANH - VCANL  
)
-120  
0
+50  
mV  
Io(sc) (CANH)  
Io(sc) (CANL)  
Vi(dif)(th)  
Short circuit output current at pin CANH  
Short circuit output current at pin CANL  
Differential receiver threshold voltage  
VCANH = 0V; VTxD = 0V  
VCANL = 36V; VTxD = 0V  
-5V <VCANL < +10V;  
-5V <VCANH < +10V;  
See Figure 6  
-45  
45  
0.5  
-70  
70  
0.7  
-95  
120  
0.9  
mA  
mA  
V
Vihcm(dif) (th)  
Differential receiver threshold voltage for -35V <VCANL < +35V;  
0.25  
50  
0.7  
70  
1.05  
100  
V
high common-mode  
-35V <VCANH < +35V;  
See Figure 6  
Vi(dif) (hys)  
Differential receiver input voltage hysteresis  
-5V <VCANL < +10V;  
-5V <VCANH < +10V;  
See Figure 6  
mV  
Ri(cm)(CANH)  
Ri(cm) (CANL)  
Ri(cm)(m)  
Common-mode input resistance at pin  
CANH  
Common-mode input resistance at pin  
CANL  
Matching between pin CANH and pin CANL VCANH =VCANL  
common-mode input resistance  
15  
15  
-3  
25  
25  
0
37  
37  
+3  
KΩ  
KΩ  
%
Ri(dif)  
Ri(cm)(m)  
Differential input resistance  
Matching between pin CANH and pin CANL VCANH =VCANL  
common-mode input resistance  
25  
-3  
50  
0
75  
+3  
KΩ  
%
Ri(dif)  
Differential input resistance  
25  
50  
75  
KΩ  
AMI Semiconductor – Oct. 07, Rev. 1.0  
6
www.amis.com Specifications subject to change without notice  
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
Table 7: DC and Timing Characteristics (continued)  
Symbol  
Ci(CANH)  
Ci(CANL)  
Ci(dif)  
ILI(CANH)  
ILI(CANL)  
VCM-peak  
Parameter  
Conditions  
Min.  
Typ.  
7.5  
7.5  
3.75  
170  
170  
Max.  
20  
20  
Unit  
pF  
pF  
Input capacitance at pin CANH  
Input capacitance at pin CANL  
Differential input capacitance  
Input leakage current at pin CANH  
Input leakage current at pin CANL  
VTxD = VCC; not tested  
VTxD = VCC; not tested  
VTxD = VCC; not tested  
VCC = 0V; VCANH = 5V  
VCC = 0V; VCANL = 5V  
10  
pF  
10  
10  
-500  
250  
250  
500  
µA  
µA  
mV  
Common-mode peak during transition from See Figure 9 and Figure 10  
dom → rec or rec → dom  
Difference in common-mode between See Figure 9 and Figure 10  
dominant and recessive state  
VCM-step  
-150  
150  
mV  
Power-on-Reset (POR)  
PORL  
POR level  
CANH, CANL, Vref in tri- 2.2  
3.5  
4.7  
V
state below POR level  
Thermal Shutdown  
Tj(sd)  
Shutdown junction temperature  
150  
40  
30  
25  
65  
70  
160  
180  
130  
°C  
Timing Characteristics (see Figure 7 and Figure 8)  
td(TxD-BUSon)  
td(TxD-BUSoff)  
td(BUSon-RxD)  
td(BUSoff-RxD)  
tpd(rec-dom)  
Delay TxD to bus active  
Delay TxD to bus inactive  
Delay bus active to RxD  
Delay bus inactive to RxD  
Propagation delay TxD to RxD from  
recessive to dominant  
Vs = 0V  
Vs = 0V  
Vs = 0V  
Vs = 0V  
Vs = 0V  
85  
60  
55  
ns  
ns  
ns  
ns  
ns  
105  
105  
135  
245  
100  
td(dom-rec)  
Propagation delay TxD to RxD from  
dominant to recessive  
Vs = 0V  
100  
245  
ns  
8.5 Measurement Set-ups and Definitions  
+5 V  
100 nF  
TxD  
VCC  
3
CANH  
7
1
4
1 nF  
VREF  
Transient  
Generator  
AMIS-  
42671  
5
RxD  
1 nF  
CANL  
6
2
8
PC20071002.1  
20 pF  
GND  
AUTB  
Figure 5: Test Circuit for Transients  
VRxD  
High  
Low  
Hysteresis  
PC20040829.7  
0,9  
0,5  
Vi(dif)(hys)  
Figure 6: Hysteresis of the Receiver  
AMI Semiconductor – Oct. 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
7
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
+5 V  
100 nF  
TxD  
VCC  
3
CANH  
7
1
4
RLT  
VREF  
CLT  
AMIS-  
42671  
5
100 pF  
60 Ω  
RxD  
6
CANL  
2
8
20 pF  
GND  
AUTB  
PC20071002.3  
Figure 7: Test Circuit for Timing Characteristics  
HIGH  
LOW  
TxD  
CANH  
CANL  
dominant  
Vi(dif)  
VCANH - VCANL  
=
0,9V  
0,5V  
recessive  
RxD  
0,7 x VCC  
0,3 x VCC  
td(TxD-BUSon)  
td(TxD-BUSoff)  
td(BUSon-RxD)  
td(BUSoff-RxD)  
tpd(rec-dom)  
tpd(dom-rec)  
PC20040829.6  
Figure 8: Timing Diagram for AC Characteristics  
AMI Semiconductor – Oct. 07, Rev. 1.0  
8
www.amis.com Specifications subject to change without notice  
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
+5 V  
100 nF  
TxD  
VCC  
3
6.2 kΩ  
CANH  
CANL  
7
6
5
10 nF  
1
4
Active Probe  
AMIS-  
42671  
Generator  
Spectrum Anayzer  
6.2 kΩ  
30 Ω  
RxD  
30 Ω  
VREF  
2
8
47 nF  
20 pF  
GND  
AUTB  
PC20071002.2  
Figure 9: Basic Test Set-up for Electromagnetic Measurement  
CANH  
CANL  
recessive  
VCM-peak  
VCM-step  
Vi(com)  
=
V
CANH + VCANL  
PC20040829.7  
VCM-peak  
Figure 10: Common-mode Voltage Peaks (see measurement set-up Figure 9)  
AMI Semiconductor – Oct. 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
9
 
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
9.0 Package Outline  
SOIC-8: Plastic small outline; eight leads; body width 150mil  
AMI Semiconductor – Oct. 07, Rev. 1.0  
10  
www.amis.com Specifications subject to change without notice  
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
10.0 Soldering  
10.1 Introduction  
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data  
Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011).  
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount  
ICs, or for printed circuit boards with high population densities. In these situations reflow soldering is often used.  
10.2 Re-flow Soldering  
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit  
board by screen printing, stencilling or pressure-syringe dispensing before package placement.  
Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating,  
soldering and cooling) vary between 100 and 200 seconds, depending on heating method.  
Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept  
below 230°C.  
10.3 Wave Soldering  
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed circuit boards with a high  
component density, as solder bridging and non-wetting can present major problems.  
To overcome these problems the double-wave soldering method was specifically developed.  
If wave soldering is used, the following conditions must be observed for optimal results:  
• Use a double-wave soldering method, comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.  
For packages with leads on two sides and a pitch (e):  
o
Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the  
printed-circuit board.  
o
Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board.  
The footprint must incorporate solder thieves at the downstream end.  
• For packages with leads on four sides, the footprint must be placed at a 45 degree angle to the transport direction of the printed-  
circuit board. The footprint must incorporate solder thieves downstream and at the side corners.  
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen  
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.  
Typical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most  
applications.  
10.4 Manual Soldering  
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat  
part of the lead. Contact time must be limited to ten seconds at up to 300°C.  
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds, between 270 and 320°C.  
Table 8: Soldering  
Soldering Method  
Wave  
Not suitable  
Package  
Reflow (1)  
Suitable  
Suitable  
Suitable  
Suitable  
Suitable  
BGA, SQFP  
HLQFP, HSQFP, HSOP, HTSSOP, SMS  
PLCC (3) , SO, SOJ  
LQFP, QFP, TQFP  
Not suitable (2)  
Suitable  
Not recommended (3)(4)  
Not recommended (5)  
SSOP, TSSOP, VSO  
Notes:  
1.  
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size  
of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For  
details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”  
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heat sink (at bottom version) can not be achieved, and  
as solder may stick to the heatsink (on top version).  
If wave soldering is considered, then the package must be placed at a 45 degree angle to the solder wave direction. The package footprint must incorporate solder  
thieves downstream and at the side corners.  
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a  
pitch (e) equal to or smaller than 0.65mm.  
2.  
3.  
4.  
5.  
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a  
pitch (e) equal to or smaller than 0.5mm.  
AMI Semiconductor – Oct. 07, Rev. 1.0  
11  
www.amis.com Specifications subject to change without notice  
AMIS-42671 High-Speed CAN Transceiver  
Data Sheet  
For Long Networks  
11.0 Company or Product Inquiries  
For more information about AMI Semiconductor’s high-speed Industrial CAN transceivers, visit our Web site at: http://www.amis.com  
12.0 Document History  
Date  
Revision  
Change  
October 2007  
1.0  
Initial release  
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express,  
statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS  
makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any  
time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range,  
unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not  
recommended without additional processing by AMIS for such applications. Copyright ©2007 AMI Semiconductor, Inc.  
AMI Semiconductor – Oct. 07, Rev. 1.0  
12  
www.amis.com Specifications subject to change without notice  
厂商 型号 描述 页数 下载

AMI

 		0ICAA-001-XTD 高速低功耗CAN收发器[ High-Speed Low Power CAN Transceiver ] 12 页

AMI

 		0ICAA-001-XTP 高速低功耗CAN收发器[ High-Speed Low Power CAN Transceiver ] 12 页

AMI

 		0ICAB-001-XTD 高速CAN收发器[ High-Speed CAN Transceiver ] 12 页

AMI

 		0ICAG-001-XTD 高速CAN收发器[ High Speed CAN Transceiver ] 12 页

AMI

 		0ICAG-001-XTP 高速CAN收发器[ High Speed CAN Transceiver ] 12 页

AMI

 		0ICAH-002-XTD 高速CAN收发器[ High-Speed CAN Transceiver ] 12 页

AMI

 		0ICAH-002-XTP 高速CAN收发器[ High-Speed CAN Transceiver ] 12 页

AMI

 		0ICAW-001-XTP [ Interface Circuit, PDSO20, 0.300 INCH, GREEN, PLASTIC, SOIC-20 ] 16 页

购物指南

支付方式

配送服务

售后服务

发票须知

优惠券使用规则

特色服务

PCBA制造

国产品牌推荐

国产料号替代

质量保证

技术资料

行业资讯

关于我们

关于达普

联系我们

联系我们

服务热线：400-618-9990

企业邮箱：smail@ic72.com

服务时间：周一至周六 8:30-17:30

达普官方微信号

PDF索引：

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

IC型号索引：

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

Copyright 2024 gkzhan.com Al Rights Reserved 京ICP备06008810号-21 京

深圳网络警察报警平台
公共信息安全网络监察
经营性网站备案信息
不良信息举报中心
工商网监电子标识
全国公安机关备案
0.224263s