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0ICAG-001-XTP

型号：

0ICAG-001-XTP

描述：

高速CAN收发器[ High Speed CAN Transceiver ]

品牌：

AMI[ AMI SEMICONDUCTOR ]

页数：

12 页

PDF大小：

646 K

下载PDF手册
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
1.0 Introduction  
The AMIS-42673 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus. It  
may be used in both 12V and 24V systems. The digital interface level is powered from a 3.3V supply providing true I/O voltage levels  
for 3.3V CAN controllers.  
The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. Due to the  
wide common-mode voltage range of the receiver inputs, the AMIS-42673 is able to reach outstanding levels of electromagnetic  
susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of the output  
signals.  
The AMIS-42673 is primarily intended for applications where long network lengths are mandatory. Examples are elevators, in-building  
networks, process control and trains. To cope with the long bus delay the communication speed needs to be low. AMIS-42673 allows  
low transmit data rates down to 10 kbit/s or lower.  
2.0 Key Features  
• True 3,3V or 5,0V logic level interface  
• Fully compatible with the “ISO 11898-2” standard  
• Wide range of bus communication speed (0 up to 1Mbit/s)  
• Allows low transmit data rate in networks exceeding 1 km  
• Ideally suited for 12V and 24V applications  
• Low electromagnetic emission (EME). Common-mode-choke is no longer required  
• Differential receiver with wide common-mode range (+/- 35V) for high electromagnetic susceptibility (EMS)  
• No disturbance of the bus lines with an un-powered node  
• Thermal protection  
• Bus pins protected against transients  
• Short circuit proof to supply voltage and ground  
• ESD protection for CAN bus at ± 8 kV  
3.0 Technical Characteristics  
Table 1: Technical Characteristics  
Symbol  
VCANH  
VCANL  
Parameter  
Conditions  
Min  
Max  
Unit  
DC voltage at pin CANH  
DC voltage at pin CANL  
0 < VCC < 5.25V; no time limit  
0 < VCC < 5.25V; no time limit  
-45  
+45  
V
-45  
+45  
V
Differential bus output voltage in  
dominant state  
Vi(dif)(bus_dom)  
1.5  
3
V
42.5Ω < RLT < 60Ω  
tpd(rec-dom)  
tpd(dom-rec)  
Propagation delay TxD to RxD  
Propagation delay TxD to RxD  
Figure 7  
Figure 7  
100  
100  
230  
245  
ns  
ns  
Input common-mode range for  
comparator  
Guaranteed differential receiver  
threshold and leakage current  
Figure 8 and  
Figure 9 (Note 1)  
Figure 8 and  
CM-range  
VCM-peak  
VCM-step  
-35  
+35  
500  
150  
V
Common-mode peak  
-500  
-150  
mV  
mV  
Common-mode step  
Figure 9 (Note 1)  
Note 1: The parameters VCM-peak and VCM-step guarantee low EME.  
4.0 Ordering Information  
Ordering Code (Tubes)  
0ICAG-001-XTD  
Ordering Code (Tape)  
0ICAG-001-XTP  
Marketing Name  
AMIS 42673AGA  
Package  
SOIC-8 GREEN  
Temp. Range  
-40°C…125°C  
AMI Semiconductor – October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
1
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
5.0 Block Diagram  
VCC  
3
AMIS-42673  
Thermal  
VCC  
shutdown  
1
TxD  
V33  
7
6
CANH  
CANL  
Driver  
control  
'S'  
8
4
COMP  
RxD  
VREF  
Ri(cm)  
Vcc/2  
+
5
Ri(cm)  
2
PC20071003.2  
GND  
Figure 1: Block Diagram  
6.0 Typical Application  
6.1 Application Schematic  
VBAT  
IN  
60 Ω  
60 Ω  
OUT  
OUT  
5V-reg  
47 nF  
3.3V-  
reg  
CAN  
BUS  
IN  
VCC  
V33  
8
VCC  
3
RxD  
CANH  
VREF  
CANL  
4
1
7
5
6
CAN  
controller  
AMIS-  
42673  
TxD  
60 Ω  
60 Ω  
47 nF  
2
PC20071003.3  
GND  
GND  
Figure 2: Application Diagram  
AMI Semiconductor – October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
2
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
6.2 Pin Description  
6.2.1. Pin Out (top view)  
8
7
6
5
1
2
3
4
V33  
TxD  
GND  
VCC  
CANH  
CANL  
VREF  
RxD  
PC20071003.1  
Figure 3: Pin Configuration  
6.2.2. Pin Description  
Table 2: Pin Out  
Pin  
1
2
Name  
TxD  
GND  
VCC  
Description  
Transmit data input; low input → dominant driver; internal pull-up current  
Ground  
Supply voltage  
3
4
5
RxD  
VREF  
Receive data output; dominant transmitter→ low output  
Reference voltage output  
6
7
8
CANL  
CANH  
V33  
LOW-level CAN bus line (low in dominant mode)  
HIGH-level CAN bus line (high in dominant mode)  
3.3V supply for digital I/O  
AMI Semiconductor – October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
3
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
7.0 Functional Description  
7.1 General  
The AMIS-42673 is the interface between the CAN protocol controller and the physical bus. It is intended for use in industrial and  
automotive applications requiring baud rates up to 1Mbit/s. It provides differential transmit capability to the bus and differential receiver  
capability to the CAN protocol controller. It is fully compatible to the “ISO 11898-2” standard.  
7.2 Operating Modes  
AMIS-42673 only operates in high-speed mode as illustrated in Table 3.  
The transceiver is able to communicate via the bus lines. The signals are transmitted and received to the CAN controller via the pins  
TxD and RxD. The slopes on the bus lines outputs are optimised to give extremely low EME.  
Table 3: Functional table of AMIS-42673; X = don’t care  
VCC  
4.75 to 5.25.V  
4.75 to 5.25.V  
VCC<PORL (unpowered)  
PORL<VCC<4.75V  
pin TxD  
0
1 (or floating)  
X
pin CANH  
High  
VCC/2  
0V<CANH<VCC  
0V<CANH<VCC  
pin CANL  
Low  
VCC/2  
0V<CANL<VCC  
0V<CANL<VCC  
Bus state  
Dominant  
Recessive  
Recessive  
Recessive  
pin RxD  
0
1
1
1
>2V  
7.3 Over-temperature Detection  
A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of  
approximately 160°C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is  
reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes HIGH. The thermal protection  
circuit is particularly needed when a bus line short circuits.  
7.4 High Communication Speed Range  
The transceiver is primarily intended for industrial applications. It allows very low baud rates needed for long bus length applications.  
But also high speed communication is possible up to 1Mbit/s.  
7.5 Fail-safe Features  
A current-limiting circuit protects the transmitter output stage from damage caused by accidental short-circuit to either positive or  
negative supply voltage - although power dissipation increases during this fault condition.  
The pins CANH and CANL are protected from automotive electrical transients (according to “ISO 7637”; see Figure 4).  
Should TxD become disconnected, this pin is pulled high internally.  
When the Vcc supply is removed, pins TxD and RxD will be floating. This prevents the AMIS-42673 from being supplied by the CAN  
controller through the I/O pins.  
7.6 3.3V Interface  
AMIS-42673 may be used to interface with 3.3V or 5V controllers by use of the V33 pin. This pin may be supplied with 3.3V or 5V to  
have the corresponding digital interface voltage levels.  
When the V33 pin is supplied at 2.5V, even interfacing with 2.5V CAN controllers is possible. See also Digital Output Characteristics @  
V33 = 2.5V, Table 7. In this case a pull-up resistor from TxD to V33 is necessary.  
AMI Semiconductor – October 07, Rev. 1.0  
4
www.amis.com  
Specifications subject to change without notice  
 
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
8.0 Electrical Characteristics  
8.1 Definitions  
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means that the current is flowing into the  
pin. Sourcing current means that the current is flowing out of the pin.  
8.2 Absolute Maximum Ratings  
Stresses above those listed in Table 4 may cause permanent device failure. Exposure to absolute maximum ratings for extended  
periods may effect device reliability.  
Table 4: Absolute Maximum Ratings  
Symbol  
Parameter  
Conditions  
Min.  
-0.3  
-0.3  
-45  
Max.  
+7  
Unit  
V
Supply voltage  
VCC  
V33  
VCANH  
VCANL  
VTxD  
VRxD  
VREF  
Vtran(CANH)  
Vtran(CANL)  
Vtran(VREF)  
I/O interface voltage  
+7  
V
DC voltage at pin CANH  
DC voltage at pin CANL  
DC voltage at pin TxD  
DC voltage at pin RxD  
DC voltage at pin VREF  
Transient voltage at pin CANH  
Transient voltage at pin CANL  
Transient voltage at pin VREF  
0 < VCC < 5.25V; no time limit  
0 < VCC < 5.25V; no time limit  
+45  
V
-45  
+45  
V
-0.3  
-0.3  
-0.3  
-150  
-150  
-150  
VCC + 0.3  
VCC + 0.3  
VCC + 0.3  
+150  
V
V
V
V
Note 1  
Note 1  
Note 1  
+150  
V
+150  
V
Electrostatic discharge voltage at  
CANH and CANL pin  
Electrostatic discharge voltage at all  
other pins  
Static latch-up at all pins  
Storage temperature  
Note 2  
Note 5  
Note 3  
Note 5  
Note 4  
-8  
-500  
-4  
+8  
+500  
+ 4  
+250  
100  
+155  
+125  
+150  
kV  
V
kV  
V
Vesd(CANL/CANH)  
Vesd  
-250  
Latch-up  
Tstg  
Tamb  
mA  
-55  
-40  
-40  
°C  
°C  
°C  
Ambient temperature  
Maximum junction temperature  
Tjunc  
Notes:  
1) Applied transient waveforms in accordance with “ISO 7637 part 3”, test pulses 1, 2, 3a, and 3b (see Figure 4).  
2) Standardized human body model system ESD pulses in accordance to IEC 1000.4.2.  
3) Standardized human body model ESD pulses in accordance to MIL883 method 3015. Supply pin 8 is ±4kV.  
4) Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78.  
5) Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.  
8.3 Thermal Characteristics  
Table 5: Thermal Characteristics  
Symbol  
Parameter  
Conditions  
In free air  
In free air  
Value  
Unit  
Thermal resistance from junction to ambient in SO8 package  
Thermal resistance from junction to substrate of bare die  
145  
45  
K/W  
K/W  
Rth(vj-a)  
Rth(vj-s  
)
AMI Semiconductor – October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
5
 
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
8.4 DC Characteristics  
VCC = 4.75 to 5.25V; V33 = 2.9V to 3.6V; Tjunc = -40 to +150 °C; RLT = 60Ω unless specified otherwise  
Table 6: Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Supply (pin VCC and pin V33)  
Dominant; VTXD = 0V  
Recessive; VTXD = VCC  
45  
4
65  
8
mA  
mA  
Supply current  
ICC  
I33  
I33  
V
33 = 3.3V; CL = 20pF;  
recessive  
33 = 3.3V; CL = 20pF;  
I/O interface current  
1
µA  
µA  
V
I/O interface current (1)  
170  
1Mbps  
Transmitter Data Input (pin TxD)  
HIGH-level input voltage  
Output recessive  
Output dominant  
2.0  
-0.3  
-1  
-
VCC  
+0.8  
+1  
V
VIH  
VIL  
IIH  
IIL  
LOW-level input voltage  
HIGH-level input current  
LOW-level input current  
Input capacitance (1)  
-
0
V
VTxD = V33  
TxD = 0V  
µA  
µA  
pF  
-50  
-
-200  
5
-300  
10  
V
Ci  
Receiver Data Output (pin RxD)  
0.75 x  
V33  
0.18  
-15  
10  
HIGH-level output voltage  
0.7 x V33  
V
VOH  
I
I
V
V
RXD = - 10mA  
RXD = 5mA  
LOW-level output voltage  
HIGH-level output current (1)  
LOW-level output current (1)  
0.35  
-20  
15  
V
VOL  
Ioh  
Iol  
-10  
5
mA  
mA  
RxD = 0.7 x V33  
RxD = 0.45V  
Reference Voltage Output (pin VREF  
)
0.50 x  
VCC  
0.55 x  
VCC  
Reference output voltage  
0.45 x VCC  
0.40 x VCC  
V
V
VREF  
-50µA < IVREF < +50µA  
Reference output voltage for full common-  
mode range  
-35V < VCANH < +35V;  
-35V < VCANL < +35V  
0.50 x  
VCC  
0.60 x  
VCC  
VREF_CM  
Bus Lines (pins CANH and CANL)  
Recessive bus voltage at pin CANH  
2.0  
2.0  
2.5  
2.5  
3.0  
3.0  
V
V
Vo(reces)(CANH)  
Vo(reces)(CANL)  
V
V
TxD = VCC; no load  
TxD = VCC; no load  
Recessive bus voltage at pin CANL  
-35V < VCANH < +35V;  
0V < VCC < 5.25V  
-35V < VCANL < +35V;  
0V < VCC < 5.25V  
Recessive output current at pin CANH  
-2.5  
-2.5  
-
-
+2.5  
+2.5  
mA  
mA  
Io(reces) (CANH)  
Recessive output current at pin CANL  
Io(reces) (CANL)  
Vo(dom) (CANH)  
Vo(dom) (CANL)  
Dominant output voltage at pin CANH  
Dominant output voltage at pin CANL  
3.0  
3.6  
1.4  
4.25  
1.75  
V
V
V
V
V
TxD = 0V  
0. 5  
TxD = 0V  
TxD = 0V; dominant;  
1.5  
2.25  
0
3.0  
V
Differential bus input voltage (VCANH  
VCANL  
-
42.5Ω < RLT < 60Ω  
TxD = VCC; recessive;  
no load  
Vi(dif) (bus)  
)
V
-120  
+50  
mV  
Short circuit output current at pin CANH  
Short circuit output current at pin CANL  
-45  
45  
-70  
70  
-95  
mA  
mA  
Io(sc) (CANH)  
Io(sc) (CANL)  
V
V
CANH = 0V;VTxD = 0V  
CANL = 36V; VTxD = 0V  
120  
-5V < VCANL < +12V;  
-5V < VCANH < +12V;  
see Figure 5  
-35V < VCANL < +35V;  
-35V < VCANH < +35V;  
see Figure 5  
-35V < VCANL < +35V;  
-35V < VCANH < +35V;  
see Figure 5  
Differential receiver threshold voltage  
0.5  
0.25  
50  
0.7  
0.7  
70  
0.9  
1.05  
100  
V
V
Vi(dif)(th)  
Differential receiver threshold voltage for  
high common-mode  
Vihcm(dif) (th)  
Differential receiver input voltage hysteresis  
Common-mode input resistance at pin CANH  
Common-mode input resistance at pin  
CANL  
mV  
Vi(dif) (hys)  
15  
15  
25  
25  
37  
37  
Ri(cm)(CANH)  
Ri(cm) (CANL)  
KΩ  
KΩ  
Matching between pin CANH and pin CANL  
common-mode input resistance  
Differential input resistance  
-3  
0
+3  
75  
%
Ri(cm)(m)  
Ri(dif)  
VCANH = VCANL  
25  
50  
KΩ  
AMI Semiconductor – October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
6
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
Table 7: Characteristics (Continued)  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Bus Lines (pins CANH and CANL)  
Input capacitance at pin CANH  
7.5  
7.5  
20  
20  
pF  
pF  
pF  
µA  
µA  
Ci(CANH)  
Ci(CANL)  
Ci(dif)  
ILI(CANH)  
ILI(CANL)  
V
V
TxD = VCC; not tested  
TxD = VCC; not tested  
Input capacitance at pin CANL  
Differential input capacitance  
3.75  
170  
170  
10  
VTxD = VCC; not tested  
VCC = 0V; VCANH = 5V  
VCC = 0V; VCANL = 5V  
Input leakage current at pin CANH  
Input leakage current at pin CANL  
10  
10  
250  
250  
Common-mode peak during transition from  
dom → rec or rec → dom  
Difference in common-mode between  
dominant and recessive state  
Figure 8 and  
Figure 9  
Figure 8 and  
Figure 9  
-500  
-150  
500  
150  
mV  
mV  
VCM-peak  
VCM-step  
Power on Reset  
PORL  
CANH, CANL, Vref in tri-  
state below POR level  
POR level  
2.2  
3.5  
4.7  
V
Thermal Shutdown  
shutdown junction temperature  
150  
160  
180  
°C  
Tj(sd)  
Timing Characteristics (see Figures 6 and 7)  
Delay TxD to bus active  
Delay TxD to bus inactive  
Delay bus active to RxD  
Delay bus inactive to RxD  
40  
30  
25  
65  
85  
60  
110  
110  
110  
135  
ns  
ns  
ns  
ns  
td(TxD-BUSon)  
td(TxD-BUSoff)  
td(BUSon-RxD)  
td(BUSoff-RxD)  
55  
100  
Propagation delay TxD to RxD from  
recessive to dominant  
Propagation delay TxD to RxD from  
dominant to recessive  
100  
100  
230  
245  
ns  
ns  
tpd(rec-dom)  
td(dom-rec)  
Note: 1) Not tested at ATE  
VCC = 4.75 to 5.25V; V33 = 2.5V ± 5%; Tjunc = -40 to +150 °C; RLT = 60Ω unless specified otherwise.  
Table 8: Digital Output Characteristics @ V33 = 2.5V  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Receiver Data Output (pin RxD)  
HIGH-level output current  
LOW-level output current  
-2.6  
mA  
mA  
Ioh  
Iol  
VOH > 0.9 x V33  
VOL < 0.1 x V33  
4
8.5 Measurement Set-ups and Definitions  
+3.3 V  
100 nF  
+5 V  
VCC  
V33  
100 nF  
3
8
CANH  
7
TxD  
RxD  
1
1 nF  
VREF  
Transient  
Generator  
AMIS-  
42673  
5
1 nF  
4
6
CANL  
2
PC20071003.4  
20 pF  
GND  
Figure 4: Test Circuit for Automotive Transients  
AMI Semiconductor – October 07, Rev. 1.0  
7
www.amis.com  
Specifications subject to change without notice  
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
VRxD  
High  
Low  
Hysteresis  
PC20040829.7  
0,9  
0,5  
Vi(dif)(hys)  
Figure 5: Hysteresis of the Receiver  
+3.3 V  
+5 V  
100 nF  
100 nF  
VCC  
V33  
3
8
CANH  
7
TxD  
RxD  
1
RLT  
VREF  
CLT  
AMIS-  
42673  
5
100 pF  
60 Ω  
4
6
CANL  
2
20 pF  
GND  
PC20071003.5  
Figure 6: Test Circuit for Timing Characteristics  
HIGH  
LOW  
TxD  
CANH  
CANL  
dominant  
recessive  
Vi(dif)  
=
0,9V  
0,5V  
V
CANH - VCANL  
RxD  
0,7 x V33  
0,3 x V33  
td(TxD-BUSon)  
td(TxD-BUSoff)  
td(BUSon-RxD)  
td(BUSoff-RxD)  
tpd(rec-dom)  
tpd(dom-rec)  
PC20040829.6  
Figure 7: Timing Diagram for AC Characteristics  
AMI Semiconductor – October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
8
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
+3.3 V  
100 nF  
+5 V  
VCC  
V33  
3
8
6.2 kΩ  
CANH  
CANL  
7
6
5
TxD  
10 nF  
1
Active Probe  
AMIS-  
42673  
Generator  
RxD  
Spectrum Anayzer  
6.2 kΩ  
30 Ω  
4
30 Ω  
VREF  
2
47 nF  
20 pF  
GND  
PC20071003.6  
Figure 8: Basic Test Set-up for Electromagnetic Measurement  
CANH  
CANL  
recessive  
VCM-peak  
VCM-step  
Vi(com)  
=
V
CANH + VCANL  
PC20040829.7  
VCM-peak  
Figure 9: Common-mode Voltage Peaks (see measurement set-up Figure 8)  
AMI Semiconductor – October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
9
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
9.0 Package Outline  
SOIC-8: Plastic small outline; 8 leads; body width 150 mil; JEDEC: MS-012  
AMI Semiconductor – October 07, Rev. 1.0  
10  
www.amis.com  
Specifications subject to change without notice  
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
10.0 Soldering  
10.1 Introduction to Soldering Surface Mount Packages  
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data  
Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for  
all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards (PCB) with  
high population densities. In these situations re-flow soldering is often used.  
10.2 Re-flow Soldering  
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by screen  
printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for example,  
infrared/convection heating in a conveyor type oven.  
Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical re-  
flow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept below 230°C.  
10.3 Wave Soldering  
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as  
solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was  
specifically developed. If wave soldering is used the following conditions must be observed for optimal results:  
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.  
• For packages with leads on two sides and a pitch (e):  
o
Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of  
the PCB;  
o
Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The  
footprint must incorporate solder thieves at the downstream end.  
• For packages with leads on four sides, the footprint must be placed at a 45º angle to the transport direction of the PCB. The footprint  
must incorporate solder thieves downstream and at the side corners.  
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen  
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds  
at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.  
10.4 Manual Soldering  
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat  
part of the lead. Contact time must be limited to 10 seconds at up to 300°C.  
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.  
Table 9: Soldering Process  
Soldering Method  
Wave  
Package  
Re-flow(1)  
Suitable  
Suitable  
Suitable  
Suitable  
Suitable  
BGA, SQFP  
Not suitable  
HLQFP, HSQFP, HSOP, HTSSOP, SMS  
Not suitable (2)  
Suitable  
PLCC (3), SO, SOJ  
LQFP, QFP, TQFP  
SSOP, TSSOP, VSO  
Notes  
Not recommended (3)(4)  
Not recommended (5)  
1.  
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the  
package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to  
the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”  
These packages are not suitable for wave soldering as a solder joint between the PCB and heatsink (at bottom version) can not be achieved, and as solder may stick to  
the heatsink (on top version).  
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves  
downstream and at the side corners.  
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch  
(e) equal to or smaller than 0.65mm.  
2.  
3.  
4.  
5.  
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e)  
equal to or smaller than 0.5mm.  
AMI Semiconductor – October 07, Rev. 1.0  
11  
www.amis.com  
Specifications subject to change without notice  
AMIS-42673 High Speed CAN Transceiver  
Data Sheet  
For Long Networks  
11.0 Company or Product Inquiries  
For more information about AMI Semiconductor’s Industrial CAN Transceivers, visit our Web site at http://www.amis.com.  
12.0 Revision History  
Date  
Revision  
Change  
October 2007  
1.0  
Initial release  
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express,  
statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes  
no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and  
without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual  
environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without  
additional processing by AMIS for such applications. Copyright ©2007 AMI Semiconductor, Inc.  
AMI Semiconductor – October 07, Rev. 1.0  
12  
www.amis.com  
Specifications subject to change without notice  
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