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0ICAA-001-XTP

型号：

0ICAA-001-XTP

描述：

高速低功耗CAN收发器[ High-Speed Low Power CAN Transceiver ]

品牌：

AMI[ AMI SEMICONDUCTOR ]

页数：

12 页

PDF大小：

695 K

下载PDF手册
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
1.0 General Description  
The AMIS-42675 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus. It  
may be used in both 12V and 24V systems. The transceiver provides differential transmit capability to the bus and differential receive  
capability to the CAN controller.  
The AMIS-42675 is the low power member of the CAN high-speed transceiver family and offers the following additional features:  
•
•
•
Ideal passive behaviour when supply voltage is removed  
Wake-up over bus  
Extremely low current standby mode  
Due to the wide common-mode voltage range of the receiver inputs, the AMIS-42675 is able to reach outstanding levels of electro-  
magnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of the  
output signals.  
The AMIS-42675 is the industrial version of the AMIS-42665 and primarily for applications where long network lengths are mandatory.  
Examples are elevators, in-building networks, process control and trains. To cope with the long bus delay the communication speed  
needs to be low. AMIS-42675 allows low transmit data rates down 10 Kbit/s or lower.  
2.0 Key Features  
• Compatible with the ISO 11898 standard (ISO 11898-2, ISO 11898-5 and SAE J2284)  
• Wide range of bus communication speed (0 up to 1 Mbit/s)  
• Ideally suited for 12V and 24V industrial and automotive applications  
• Allows low transmit data rate in networks exceeding 1 km  
• Extremely low current standby mode with wake-up via the bus  
• Low electromagnetic emission (EME): common-mode choke is no longer required  
• Differential receiver with wide common-mode range (+/- 35V) for high EMS  
• Voltage source via VSPLIT pin for stabilizing the recessive bus level (further EMC improvement)  
• No disturbance of the bus lines with an un-powered node  
• Thermal protection  
• Bus pins protected against transients  
• Power down mode in which the transmitter is disabled  
• Bus and VSPLIT pins short circuit proof to supply voltage and ground  
• Logic level inputs compatible with 3.3V devices  
• At least 110 nodes can be connected to the same bus  
3.0 Ordering Information  
Table 1: Ordering Information  
Ordering Code (Tubes)  
Ordering Code (Tape)  
Marketing Name  
Package  
Temp. Range  
0ICAA-001-XTD  
0ICAA-001-XTP  
AMIS 42675AGA  
SOIC-8 GREEN  
-40°C…125°C  
AMI Semiconductor –October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
1
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
4.0 Technical Characteristics  
Table 2: Technical Characteristics  
Symbol  
VCC  
VSTB  
VTxD  
VRxD  
VCANH  
VCANL  
VSPLIT  
VO(dif)(bus_dom)  
CM-range  
Parameter  
Power supply voltage  
DC voltage at pin STB  
DC voltage at pin TxD  
Conditions  
Min.  
4.75  
-0.3  
-0.3  
-0.3  
-35  
-35  
-35  
1.5  
-35  
Max.  
Unit  
V
V
V
V
V
V
V
V
5.25  
VCC  
VCC  
VCC  
+35  
+35  
+35  
3
DC voltage at pin RxD  
DC voltage at pin CANH  
DC voltage at pin CANL  
DC voltage at pin VSPLIT  
Differential bus output voltage in dominant state  
Input common-mode range for comparator  
0 < VCC < 5.25V; no time limit  
0 < VCC < 5.25V; no time limit  
0 < VCC < 5.25V; no time limit  
42.5Ω < RLT < 60Ω  
Guaranteed differential receiver threshold and  
+35  
V
leakage current  
VCM-peak  
Cload  
tpd(rec-dom)  
t pd(dom-rec)  
VCM-step  
Tjunc  
Common-mode peak  
Note  
-500  
500  
15  
230  
245  
150  
150  
mV  
pF  
ns  
ns  
mV  
°C  
Load capacitance on IC outputs  
Propagation delay TxD to RxD  
Propagation delay TxD to RxD  
Common-mode step  
See Figure 5  
See Figure 5  
Note  
70  
100  
-150  
-40  
Junction temperature  
Note: The parameters VCM-peak and VCM-step guarantee low EME.  
5.0 Block Diagram  
VCC  
3
AMIS- 42675  
VCC  
POR  
7
CANH  
1
Thermal  
shutdown  
VCC  
VSPLIT  
TxD  
STB  
5
VCC  
VSPLIT  
CANL  
Mode&  
wake-up  
control  
6
8
Driver  
control  
4
2
Wake - up  
Filter  
RxD  
COMP  
GND  
COMP  
PC20071005.2  
Figure 1: Block Diagram  
AMI Semiconductor –October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
2
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
6.0 Typical Application  
6.1 Application Schematic  
VBAT  
IN  
OUT  
5V-reg  
VCC  
VCC  
CANH  
VSPLIT  
3
7
5
6
STB  
8
4
1
60 Ω  
CAN  
controller  
RxD  
AMIS-  
42675  
CAN  
BUS  
47 nF  
60 Ω  
CANL  
TxD  
2
PC20071005.3  
GND  
GND  
Figure 2: Application Diagram  
6.2 Pin Description  
8
7
6
5
1
2
3
4
STB  
TxD  
GND  
VCC  
CANH  
CANL  
VSPLIT  
RxD  
PC20071005.1  
Figure 3: Pin Configuration  
Table 3: Pin Out  
Pin  
1
2
Name  
TxD  
GND  
VCC  
Description  
Transmit data input; low input => dominant driver; internal pull-up current  
Ground  
Supply voltage  
3
4
5
6
7
RxD  
Receive data output; dominant transmitter => low output  
Common-mode stabilization output  
Low-level CAN bus line (low in dominant mode)  
High-level CAN bus line (high in dominant mode)  
Stand-by mode control input  
VSPLIT  
CANL  
CANH  
STB  
8
AMI Semiconductor –October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
3
 
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
7.0 Functional Description  
7.1 Operating Modes  
AMIS-42675 provides two modes of operation as illustrated in Table 4. These modes are selectable through pin STB.  
Table 4: Operating Modes  
Pin RXD  
Mode  
Pin STB  
Low  
High  
Normal  
Standby  
Low  
High  
Bus dominant  
Wake-up request detected  
Bus recessive  
No wake-up request detected  
7.1.1. Normal Mode  
In the normal mode, the transceiver is able to communicate via the bus lines. The signals are transmitted and received to the CAN  
controller via the pins TxD and RxD. The slopes on the bus lines outputs are optimized to give extremely low EME.  
7.1.2. Stand-by Mode  
In stand-by mode both the transmitter and receiver are disabled and a very low-power differential receiver monitors the bus lines for  
CAN bus activity. The bus lines are terminated to ground and supply current is reduced to a minimum, typically 10µA. When a wake-up  
request is detected by the low-power differential receiver, the signal is first filtered and then verified as a valid wake signal after a time  
period of tBUS, the RxD pin is driven low by the transceiver to inform the controller of the wake-up request.  
7.2 Split Circuit  
The VSPLIT pin is operational only in normal mode. In standby mode this pin is floating. The VSPLIT is connected as shown in Figure 2 and  
its purpose is to provide a stabilized DC voltage of 0.5 x VCC to the bus avoiding possible steps in the common-mode signal therefore  
reducing EME. These unwanted steps could be caused by an un-powered node on the network with excessive leakage current from the  
bus that shifts the recessive voltage from its nominal 0.5 x VCC voltage.  
7.3 Wake-up  
Once a valid wake-up (dominant state longer than tBUS) has been received during the standby mode the RxD pin is driven low.  
7.4 Over-temperature Detection  
A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of  
approximately 160°C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is  
reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes high. The thermal protection  
circuit is particularly needed when a bus line short circuits.  
7.5 High Communication Speed Range  
The transceiver is primarily intended for industrial applications. It allows very low baud rates needed for long bus length applications.  
But also high speed communication is possible up to 1Mbit/s.  
7.6 Fail Safe Features  
A current-limiting circuit protects the transmitter output stage from damage caused by accidental short circuit to either positive or  
negative supply voltage, although power dissipation increases during this fault condition.  
The pins CANH and CANL are protected from automotive electrical transients (according to ISO 7637; see Figure 4). Pins TxD and  
STB are pulled high internally should the input become disconnected. Pins TxD, STB and RxD will be floating, preventing reverse  
supply should the VCC supply be removed.  
AMI Semiconductor –October 07, Rev. 1.0  
4
www.amis.com  
Specifications subject to change without notice  
 
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
8.0 Electrical Characteristics  
8.1 Definitions  
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing into the pin;  
sourcing current means the current is flowing out of the pin.  
8.2 Absolute Maximum Ratings  
Stresses above those listed in the following table may cause permanent device failure. Exposure to absolute maximum ratings for  
extended periods may affect device reliability.  
Table 5: Absolute Maximum Ratings  
Symbol  
VCC  
VCANH  
VCANL  
VSPLIT  
VTxD  
VRxD  
Parameter  
Supply voltage  
Conditions  
Min.  
-0.3  
-50  
Max.  
+7  
Unit  
V
DC voltage at pin CANH  
DC voltage at pin CANL  
DC voltage at pin VSPLIT  
DC voltage at pin TxD  
DC voltage at pin RxD  
DC voltage at pin STB  
Transient voltage at pin CANH  
Transient voltage at pin CANL  
Transient voltage at pin VSPLIT  
0 < VCC < 5.25V; no time limit  
0 < VCC < 5.25V; no time limit  
0 < VCC < 5.25V; no time limit  
+50  
V
-50  
+50  
V
-50  
+50  
V
-0.3  
-0.3  
-0.3  
-300  
-300  
-300  
VCC + 0.3  
VCC + 0.3  
VCC + 0.3  
+300  
V
V
V
VSTB  
Note 1  
Note 1  
Note 1  
V
Vtran(CANH)  
Vtran(CANL)  
Vtran(VSPLIT)  
Vesd(  
+300  
V
+300  
V
Electrostatic discharge voltage at all pins  
Note 2  
Note 4  
Note 3  
-5  
-750  
+5  
+750  
120  
+150  
kV  
V
mA  
°C  
Latch-up  
Tstg  
Tamb  
Tjunc  
Notes:  
Static latch-up at all pins  
Storage temperature  
-55  
-40  
-40  
Ambient temperature  
+125  
+170  
°C  
°C  
Maximum junction temperature  
1) Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4).  
2) Standardized human body model electrostatic discharge (ESD) pulses in accordance to MIL883 method 3015.7.  
3) Static latch-up immunity: Static latch-up protection level when tested according to EIA/JESD78.  
4) Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.  
8.3 Thermal Characteristics  
Table 6: Thermal Characteristics  
Symbol  
Rth(vj-a)  
Rth(vj-s)  
Parameter  
Conditions  
In free air  
Value  
145  
Unit  
K/W  
Thermal resistance from junction to ambient in SO8 package  
Thermal resistance from junction to substrate of bare die  
In free air  
45  
K/W  
AMI Semiconductor –October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
5
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
8.4 Characteristics  
VCC = 4.75 to 5.25V; Tjunc = -40 to +150°C; RLT =60Ω unless specified otherwise.  
Table 7: Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Supply (pin VCC  
ICC  
)
Supply current  
45  
4
65  
8
mA  
mA  
Dominant; VTxD = 0V  
Recessive; VTxD = VCC  
Tjunc,max = 100°C  
Supply current in standby mode  
10  
15  
µA  
ICCS  
Transmitter Data Input (pin TxD)  
High-level input voltage  
Output recessive  
Output dominant  
2.0  
-0.3  
-5  
-
VCC + 0.3  
+0.8  
+5  
V
VIH  
VIL  
IIH  
IIL  
Low-level input voltage  
High-level input current  
Low-level input current  
Input capacitance  
-
0
V
µA  
µA  
pF  
V
V
TxD =VCC  
TxD = 0V  
-75  
-
-200  
5
-350  
10  
Not tested  
Ci  
Transmitter Mode Select (pin STB)  
High-level input voltage  
Standby mode  
Normal mode  
2.0  
-0.3  
-5  
-
-
VCC + 0.3  
+0.8  
+5  
V
VIH  
VIL  
IIH  
IIL  
Low-level input voltage  
High-level input current  
Low-level input current  
Input capacitance  
V
0
-4  
5
µA  
µA  
pF  
V
V
STB =VCC  
STB = 0V  
-1  
-10  
Not tested  
-
10  
Ci  
Receiver Data Output (pin RxD)  
High-level output voltage  
0.6 x VCC  
0.75 x VCC  
0.45  
V
V
VOH  
VOL  
Ioh  
I
I
RXD = -10mA  
RXD = 5mA  
Low-level output voltage  
High-level output current  
Low-level output current  
0.25  
-10  
10  
-5  
5
-15  
mA  
mA  
Vo = 0.7 x VCC  
Vo = 0.3 x VCC  
15  
Iol  
Bus Lines (pins CANH and CANL)  
Recessive bus voltage  
2.0  
-100  
-2.5  
-2.5  
2.5  
3.0  
100  
+2.5  
+2.5  
V
Vo(reces) (norm)  
Vo(reces) (stby)  
Io(reces) (CANH)  
Io(reces) (CANL)  
V
TxD = VCC; no load  
normal mode  
TxD = VCC; no load  
Recessive bus voltage  
0
-
mV  
mA  
mA  
V
standby mode  
Recessive output current at pin CANH  
Recessive output current at pin CANL  
-35V <VCANH< +35V;  
0V <VCC < 5.25V  
-35V <VCANL < +35V;  
0V <VCC < 5.25V  
-
Dominant output voltage at pin CANH  
Dominant output voltage at pin CANL  
Differential bus output voltage  
3.0  
0. 5  
1.5  
3.6  
1.4  
4.25  
1.75  
3.0  
V
V
V
Vo(dom) (CANH)  
Vo(dom) (CANL)  
Vo(dif) (bus_dom)  
V
V
V
TxD = 0V  
TxD = 0V  
TxD = 0V; dominant;  
2.25  
(VCANH - VCANL  
Differential bus output voltage  
(VCANH - VCANL  
)
42.5Ω < RLT < 60Ω  
TxD = VCC; recessive;  
no load  
V
-120  
0
+50  
mV  
Vo(dif) (bus_rec)  
)
Short circuit output current at pin CANH  
-45  
45  
-70  
70  
-120  
120  
0.9  
mA  
mA  
V
Io(sc) (CANH)  
Io(sc) (CANL)  
Vi(dif) (th)  
V
V
CANH = 0V; VTxD = 0V  
CANL = 36V; VTxD = 0V  
Short circuit output current at pin CANL  
Differential receiver threshold voltage  
(see Figure 5)  
0.5  
0.7  
-5V <VCANL < +12V;  
-5V <VCANH < +12V;  
Differential receiver threshold voltage for high -35V <VCANL < +35V;  
0.40  
50  
0.7  
70  
1.00  
100  
V
Vihcm(dif) (th)  
Vi(dif) (hys)  
common-mode (see Figure 5)  
-35V <VCANH < +35V;  
-35V <VCANL < +35V;  
-35V <VCANH < +35V;  
Differential receiver input voltage hysteresis  
(see Figure 5  
mV  
Common-mode input resistance at pin CANH  
15  
15  
-3  
26  
26  
0
37  
37  
+3  
KΩ  
KΩ  
%
Ri(cm) (CANH)  
Ri(cm) (CANL)  
Ri(cm) (m)  
Common-mode input resistance at pin CANL  
Matching between pin CANH and pin CANL  
common mode input resistance  
VCANH = VCANL  
Differential input resistance  
25  
50  
7.5  
75  
20  
20  
10  
KΩ  
pF  
pF  
pF  
Ri(dif)  
Input capacitance at pin CANH  
Input capacitance at pin CANL  
Differential input capacitance  
Ci(CANH)  
Ci(CANL)  
Ci(dif)  
VTxD = VCC; not tested  
VTxD = VCC; not tested  
VTxD = VCC; not tested  
7.5  
3.75  
AMI Semiconductor –October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
6
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
Table 8: Characteristics (continued)  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Common-mode Stabilization (pin VSPLIT  
)
Reference output voltage at pin VSPLIT  
Normal mode;  
0.3 x VCC  
-
0.7 x VCC  
VSPLIT  
-500µA < ISPLIT < 500µA  
Stand-by mode  
Normal mode  
VSPLIT leakage current  
VSPLIT limitation current  
-5  
-3  
+5  
+3  
µA  
mA  
ISPLIT(i)  
ISPLIT(lim)  
Power-on-Reset (POR)  
PORL  
POR level  
2.2  
3.5  
4.7  
V
CANH, CANL, Vref in tri-  
state below POR level  
Thermal Shutdown  
Shutdown junction temperature  
Timing Characteristics (see Figure 4 and Figure 5)  
150  
40  
160  
85  
180  
105  
105  
°C  
ns  
ns  
Tj(sd)  
Delay TXD to bus active  
td(TxD-BUSon)  
Cl = 100pF between  
CANH to CANL  
Cl = 100pF between  
CANH to CANL  
Delay TXD to bus inactive  
30  
60  
td(TxD-BUSoff)  
Delay bus active to RXD  
Delay bus inactive to RXD  
Propagation delay TXD to RXD from recessive  
to dominant  
25  
40  
90  
55  
100  
105  
105  
230  
ns  
ns  
ns  
td(BUSon-RXD)  
td(BUSoff-RXD)  
tpd(rec-dom)  
C
C
rxd = 15pF  
rxd = 15pF  
Cl = 100pF between  
CANH to CANL  
Propagation delay TXD to RXD from dominant  
to recessive  
90  
245  
ns  
td(dom-rec)  
Cl = 100pF between  
CANH to CANL  
Delay standby mode to normal mode  
Dominant time for wake-up via bus  
5
0.75  
7.5  
2.5  
10  
5
µs  
µs  
td(stb-nm)  
tdbus  
8.5 Measurement Set-ups and Definitions  
+5 V  
100 nF  
TxD  
VCC  
3
CANH  
7
1
4
1 nF  
VSPLIT  
Transient  
Generator  
AMIS-  
42675  
5
RxD  
1 nF  
6
CANL  
2
8
PC20071006.1  
20 pF  
GND  
STB  
Figure 4: Test Circuit for Transients  
VRxD  
High  
Low  
Hysteresis  
PC20040829.7  
0,9  
0,5  
Vi(dif)(hys)  
Figure 5: Hysteresis of the Receiver  
AMI Semiconductor –October 07, Rev. 1.0  
7
www.amis.com  
Specifications subject to change without notice  
 
 
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
+5 V  
100 nF  
TxD  
VCC  
3
CANH  
7
1
4
RLT  
VSPLIT  
CLT  
AMIS-  
42675  
5
100 pF  
60 Ω  
RxD  
6
CANL  
2
8
20 pF  
GND  
STB  
PC20071006.2  
Figure 6: Test Circuit for Timing Characteristics  
HIGH  
LOW  
TxD  
CANH  
CANL  
dominant  
recessive  
Vi(dif)  
=
0,9V  
0,5V  
VCANH - VCANL  
RxD  
0,7 x VCC  
0,3 x VCC  
td(TxD-BUSon)  
td(TxD-BUSoff)  
td(BUSon-RxD)  
td(BUSoff-RxD)  
tpd(rec-dom)  
tpd(dom-rec)  
PC20040829.6  
Figure 7: Timing Diagram for AC Characteristics  
AMI Semiconductor –October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
8
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
+5 V  
100 nF  
TxD  
VCC  
3
6.2 kΩ  
CANH  
CANL  
7
6
5
10 nF  
1
4
Active Probe  
AMIS-  
42675  
Generator  
RxD  
Spectrum Anayzer  
6.2 kΩ  
30 Ω  
30 Ω  
VSPLIT  
2
8
47 nF  
20 pF  
GND  
STB  
PC20071006.3  
Figure 8: Basic Test Set-up for EME  
Figure 9: EME Measurements  
AMI Semiconductor –October 07, Rev. 1.0  
www.amis.com Specifications subject to change without notice  
9
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
9.0 Package Outline  
SOIC-8: Plastic small outline; 8 leads; body width 150mil. AMIS reference: SOIC150 8 150 G  
AMI Semiconductor –October 07, Rev. 1.0  
10  
www.amis.com  
Specifications subject to change without notice  
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
10.0 Soldering  
10.1 Introduction to Soldering Surface Mount Packages  
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data  
Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for  
all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards (PCBs) with  
high population densities. In these situations re-flow soldering is often used.  
10.2 Re-flow Soldering  
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by  
screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for  
example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100  
and 200 seconds depending on heating method. Typical re-flow peak temperatures range from 215 to 250°C. The top-surface  
temperature of the packages should preferably be kept below 230°C.  
10.3 Wave Soldering  
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as  
solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was  
specifically developed. If wave soldering is used the following conditions must be observed for optimal results:  
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.  
• For packages with leads on two sides and a pitch (e):  
•
Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of  
the PCB;  
•
Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The  
footprint must incorporate solder thieves at the downstream end.  
• For packages with leads on four sides, the footprint must be placed at a 45º angle to the transport direction of the PCB. The footprint  
must incorporate solder thieves downstream and at the side corners.  
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen  
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds  
at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.  
10.4 Manual Soldering  
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat  
part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be  
soldered in one operation within two to five seconds between 270 and 320°C.  
Table 9: Soldering Method  
Soldering Method  
Wave  
Package  
Re-flow(1)  
Suitable  
Suitable  
Suitable  
Suitable  
Suitable  
BGA, SQFP  
Not suitable  
HLQFP, HSQFP, HSOP, HTSSOP, SMS  
PLCC (3) , SO, SOJ  
LQFP, QFP, TQFP  
SSOP, TSSOP, VSO  
Notes:  
Not suitable (2)  
Suitable  
Not recommended (3)(4)  
Not recommended (5)  
1.  
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the  
package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to  
the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.  
These packages are not suitable for wave soldering as a solder joint between the PCB and heatsink (at bottom version) can not be achieved, and as solder may stick to  
the heatsink (on top version).  
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves  
downstream and at the side corners.  
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch  
(e) equal to or smaller than 0.65mm.  
2.  
3.  
4.  
5.  
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e)  
equal to or smaller than 0.5mm.  
AMI Semiconductor –October 07, Rev. 1.0  
11  
www.amis.com  
Specifications subject to change without notice  
AMIS-42675 High-Speed Low Power CAN Transceiver  
For Long Networks  
Data Sheet  
11.0 Company or Product Inquiries  
For more information about AMI Semiconductor, our technology and our products, visit our Web site at http://www.amis.com.  
12.0 Revision History  
Date  
Revision  
Change  
October 2007  
1.0  
Initial release  
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express,  
statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes  
no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and  
without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual  
environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without  
additional processing by AMIS for such applications. Copyright ©2007 AMI Semiconductor, Inc.  
AMI Semiconductor –October 07, Rev. 1.0  
12  
www.amis.com  
Specifications subject to change without notice  
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