找货询价

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

QQ咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

技术支持

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

售后咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

8P34S1212NLGI8

型号:

8P34S1212NLGI8

品牌:

IDT[ INTEGRATED DEVICE TECHNOLOGY ]

页数:

19 页

PDF大小:

443 K

IDT8P34S1212I  
Datasheet  
1:12 LVDS Output 1.8V Fanout Buffer  
Description  
Features  
The IDT8P34S1212I is a high-performance differential LVDS fanout  
buffer. The device is designed for the fanout of high-frequency, very  
low additive phase-noise clock and data signals. The  
IDT8P34S1212I is characterized to operate from a 1.8V power  
supply. Guaranteed output-to-output and part-to-part skew  
characteristics make the IDT8P34S1212I ideal for those clock  
distribution applications that demand well-defined performance and  
repeatability.  
12 low skew, low additive jitter LVDS output pairs  
Two selectable, differential clock input pairs  
Differential CLK0, CLK1 pairs can accept the following differential  
input levels: LVDS, CML  
Maximum input clock frequency: 1.2GHz (maximum)  
LVCMOS/LVTTL interface levels for the control input select pin  
Output skew: 10ps (typical)  
Two selectable differential inputs and 12 low skew outputs are  
available. The integrated bias voltage reference enables easy  
interfacing of single-ended signals to the device inputs. The device is  
optimized for low power consumption and low additive phase noise.  
Propagation delay: 340ps (typical)  
Low additive phase jitter, RMS; fREF = 156.25MHz, VPP = 1V,  
12kHz- 20MHz: 41fs (typical)  
Maximum device current consumption (IDD): 227mA (maximum)  
at 1.89V  
Full 1.8V supply voltage  
Lead-free (RoHS 6), 40-Lead VFQFN packaging  
-40°C to 85°C ambient operating temperature  
Block Diagram  
Pin Assignment  
Q0  
nQ0  
30 29 28 27 26 25 24 23 22 21  
Q1  
nQ1  
31  
32  
33  
34  
20  
19  
18  
17  
V
V
DD  
DD  
Q8  
nQ8  
Q9  
nQ3  
Q3  
IDT8P34S1212I  
40-Lead VFQFN  
Q2  
nQ2  
V
DD  
nQ2  
Q3  
nQ3  
6.0mm x 6.0mm x 0.90mm  
package body  
nQ9 35  
16 Q2  
CLK0  
Q4  
nQ4  
36  
37  
38  
39  
40  
15  
14  
13  
12  
11  
Q10  
nQ10  
Q11  
nQ1  
Q1  
4.65mm x 4.65mm ePad Size  
NL Package  
nCLK0  
Q5  
nQ5  
nQ0  
Q0  
fREF  
Top View  
nQ11  
Q6  
V
V
V
DD  
DD  
DD  
nQ6  
1
2
3
4
5
6
7
8
9
10  
CLK1  
Q7  
nQ7  
nCLK1  
Q8  
nQ8  
Q9  
nQ9  
SEL  
Q10  
nQ10  
VREF  
VREF  
Q11  
nQ11  
©2017 Integrated Device Technology, Inc.  
1
November 24, 2017  
IDT8P34S1212I Datasheet  
Pin Descriptions and Characteristics  
Note 1.  
Table 1. Pin Descriptions  
Number  
Name  
SEL  
Type  
Description  
Reference select control. See Table 3 for function.  
LVCMOS/LVTTL interface levels.  
1
2
Input  
Input  
Pulldown  
Pulldown  
CLK1  
nCLK1  
nc  
Non-inverting differential clock/data input.  
Inverting differential clock/data input.  
Do not connect.  
Pulldown/  
Pullup  
3
Input  
4, 10  
Unused  
Power  
5, 6, 11, 20,  
31, 40  
VDD  
Power supply pins.  
Bias voltage reference. Provides an input bias voltage for the CLKx, nCLKx  
input pairs in AC-coupled applications. Refer to Figures 2B and 2C for  
applicable AC-coupled input interfaces.  
7
8
VREF  
Pulldown/  
Pullup  
nCLK0  
Input  
Inverting differential clock/data input.  
9
CLK0  
Q0, nQ0  
Q1, nQ1  
Q2, nQ2  
Q3, nQ3  
GND  
Input  
Pulldown  
Non-inverting differential clock/data input.  
Differential output pair 0. LVDS interface levels.  
Differential output pair 1. LVDS interface levels.  
Differential output pair 2. LVDS interface levels.  
Differential output pair 3. LVDS interface levels.  
Power supply ground.  
12, 13  
14, 15  
16, 17  
18, 19  
21, 30  
22, 23  
24, 25  
26, 27  
28, 29  
32, 33  
34, 35  
36, 37  
38, 39  
Output  
Output  
Output  
Output  
Power  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Q4, nQ4  
Q5, nQ5  
Q6, nQ6  
Q7, nQ7  
Q8, nQ8  
Q9, nQ9  
Q10, nQ10  
Q11, nQ11  
Differential output pair 4. LVDS interface levels.  
Differential output pair 5. LVDS interface levels.  
Differential output pair 6. LVDS interface levels.  
Differential output pair 7. LVDS interface levels.  
Differential output pair 8. LVDS interface levels.  
Differential output pair 9. LVDS interface levels.  
Differential output pair 10. LVDS interface levels.  
Differential output pair 11. LVDS interface levels.  
1.  
Pulldown and Pullup refers to an internal input resistors. See Table 2, Pin Characteristics, for typical values.  
Table 2. Pin Characteristics  
Symbol  
CIN  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
pF  
Input Capacitance  
Input Pulldown Resistor  
Input Pullup Resistor  
2
RPULLDOWN  
RPULLUP  
51  
51  
k  
k  
Note 1.  
Table 3. SEL Input Function Table  
Input  
SEL  
0 (Default)  
1
Operation  
CLK0, nCLK0 is the selected differential clock input.  
CLK1, nCLK1 is the selected differential clock input.  
1. SEL is an asynchronous control.  
©2017 Integrated Device Technology, Inc.  
2
November 24, 2017  
 
IDT8P34S1212I Datasheet  
Absolute Maximum Ratings  
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress  
specifications only. Functional operation of the product at these conditions or any conditions beyond those listed in the DC Characteristics or  
AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.  
Item  
Rating  
Supply Voltage, VDD  
Inputs, VI  
4.6V  
-0.5V to VDD + 0.5V  
Outputs, IO  
Continuous Current  
Surge Current  
10mA  
15mA  
Input Sink/Source, IREF  
±2mA  
Maximum Junction Temperature, TJ,MAX  
Storage Temperature, TSTG  
125°C  
-65°C to 150°C  
2000V  
ESD - Human Body ModelNote 1.  
ESD - Charged Device ModelNote 1.  
1500V  
1.  
According to JEDEC JS-001-2012/JESD11-C101E.  
DC Electrical Characteristics  
Table 4A. Power Supply DC Characteristics, V = 1.8V ± 5%, T = -40°C to 85°C  
DD  
A
Symbol Parameter  
VDD Power Supply Voltage  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
1.71  
1.8  
1.89  
V
Q0 to Q11 terminated 100between  
IDD  
Power Supply Current  
185  
227  
mA  
nQx, Qx  
Table 4B. LVCMOS/LVTTL DC Characteristics, V = 1.8V ± 5%, T = -40°C to 85°C  
DD  
A
Symbol Parameter  
Test Conditions  
Minimum  
0.65 * VDD  
-0.3  
Typical  
Maximum  
VDD + 0.3  
0.35 * VDD  
150  
Units  
V
VIH  
VIL  
IIH  
Input High Voltage  
Input Low Voltage  
Input High Current  
Input Low Current  
V
SEL  
SEL  
VDD = VIN = 1.89V  
µA  
µA  
IIL  
VDD = 1.89V, VIN = 0V  
-10  
©2017 Integrated Device Technology, Inc.  
3
November 24, 2017  
IDT8P34S1212I Datasheet  
Table 4C. Differential Inputs Characteristics, V = 1.8V ± 5%, T = -40°C to 85°C  
DD  
A
Symbol Parameter  
Input High CLK0, CLK1,  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
IIH  
VIN = VDD = 1.89V  
150  
µA  
Current  
nCLK0, nCLK1  
CLK0, CLK1  
VIN = 0V, VDD = 1.89V  
VIN = 0V, VDD = 1.89V  
-10  
µA  
µA  
Input Low  
Current  
IIL  
nCLK0, nCLK1  
-150  
Reference Voltage forNInotpeu3.t  
BiasNote 1.  
VREF  
VPP  
IREF = +100µA, VDD = 1.8V  
VDD = 1.89V  
0.9  
0.2  
0.9  
1.30  
1.0  
V
V
V
Peak-to-Peak Voltage  
Common Mode Input  
VoltageNote 2. Note 3.  
VCMR  
VDD – (VPP/2)  
1.  
VREF specification is applicable to the AC-coupled input interfaces shown in Figures 2B and 2C.  
2.  
3.  
Common mode input voltage is defined as crosspoint voltage.  
VIL should not be less than -0.3V and VIH should not be higher than VDD  
.
Note 1.  
Table 4D. LVDS DC Characteristics, V = 1.8V ± 5%, T = -40°C to 85°C  
DD  
A
Symbol Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
454  
Units  
mV  
mV  
V
VOD  
VOD  
VOS  
Differential Output Voltage  
outputs loaded with 100  
247  
VOD Magnitude Change  
Offset Voltage  
50  
1.00  
1.40  
50  
VOS  
VOS Magnitude Change  
mV  
1.  
Output drive current must be sufficient to drive up to 30cm of PCB trace (assume nominal 50impedance).  
©2017 Integrated Device Technology, Inc.  
4
November 24, 2017  
IDT8P34S1212I Datasheet  
AC Electrical Characteristics  
Note 1.  
Table 5. AC Electrical Characteristics, V = 1.8V ± 5%, T = -40°C to 85°C  
DD  
A
Symbol  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum Units  
Input  
CLK[0:1],  
fREF  
1.2  
GHz  
V/ns  
ps  
Frequency nCLK[0:1]  
Input CLK[0:1],  
Edge Rate nCLK[0:1]  
V/t  
1.5  
Propagation DelayNote 2.  
Note 3.  
tPD  
CLK[0:1]; nCLK[0:1] to any Qx, nQx  
200  
340  
450  
tsk(o)  
tsk(i)  
Output SkewNote 4. Note 5.  
Input SkewNote 5.  
10  
5
45  
45  
ps  
ps  
ps  
ps  
tsk(p)  
tsk(pp)  
Pulse Skew  
fREF = 100MHz  
3
20  
Part-to-Part SkewNote 6.  
250  
fREF = 122.88MHz Square Wave, VPP = 1V,  
Integration Range: 1kHz – 40MHz  
89  
74  
74  
58  
41  
41  
85  
61  
61  
225  
200  
150  
150  
81  
fs  
fs  
fs  
fs  
fs  
fs  
fs  
fs  
fs  
ps  
f
REF = 122.88MHz Square Wave, VPP = 1V,  
Integration Range: 10kHz – 20MHz  
fREF = 122.88MHz Square Wave, VPP = 1V,  
Integration Range: 12kHz – 20MHz  
fREF = 156.25MHz Square Wave, VPP = 1V,  
Integration Range: 1kHz – 40MHz  
Buffer Additive Phase  
Jitter, RMS; refer to  
Additive Phase Jitter  
Section  
f
REF = 156.25MHz Square Wave, VPP = 1V,  
Integration Range: 10kHz – 20MHz  
tJIT  
60  
fREF = 156.25MHz Square Wave, VPP = 1V,  
Integration Range: 12kHz – 20MHz  
60  
fREF = 156.25MHz Square Wave, VPP = 0.5V,  
Integration Range: 1kHz – 40MHz  
123  
87  
f
REF = 156.25MHz Square Wave, VPP = 0.5V,  
Integration Range: 10kHz – 20MHz  
fREF = 156.25MHz Square Wave, VPP = 0.5V,  
Integration Range: 12kHz – 20MHz  
10% to 90%,  
87  
400  
260  
outputs loaded with 100   
20% to 80%,  
outputs loaded with 100   
tR / tF  
Output Rise/ Fall Time  
110  
ps  
MUXISOLATION Mux IsolationNote 7.  
f
REF = 100MHz  
72.6  
dB  
1.  
Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is  
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equi-  
librium has been reached under these conditions.  
2.  
3.  
4.  
5.  
6.  
Measured from the differential input crossing point to the differential output crossing point  
Input VPP = 400mV  
Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the differential cross points.  
This parameter is defined in accordance with JEDEC Standard 65.  
Defined as skew between outputs on different devices operating at the same supply voltage, same frequency, same temperature and  
with equal load conditions. Using the same type of inputs on each device, the outputs are measured at the differential cross points.  
Qx, nQx outputs measured differentially. See MUX Isolation diagram in the Parameter Measurement Information section.  
7.  
©2017 Integrated Device Technology, Inc.  
5
November 24, 2017  
IDT8P34S1212I Datasheet  
Additive Phase Jitter  
The spectral purity in a band at a specific offset from the fundamental  
compared to the power of the fundamental is called the dBc Phase  
Noise. This value is normally expressed using a Phase noise plot  
and is most often the specified plot in many applications. Phase noise  
is defined as the ratio of the noise power present in a 1Hz band at a  
specified offset from the fundamental frequency to the power value of  
the fundamental. This ratio is expressed in decibels (dBm) or a ratio  
of the power in the 1Hz band to the power in the fundamental. When  
the required offset is specified, the phase noise is called a dBc value,  
which simply means dBm at a specified offset from the fundamental.  
By investigating jitter in the frequency domain, we get a better  
understanding of its effects on the desired application over the entire  
time record of the signal. It is mathematically possible to calculate an  
expected bit error rate given a phase noise plot.  
Additive Phase Jitter @ 74fs (typical)  
Offset from Carrier Frequency (Hz)  
As with most timing specifications, phase noise measurements have  
issues relating to the limitations of the measurement equipment. The  
noise floor of the equipment can be higher or lower than the noise  
floor of the device. Additive phase noise is dependent on both the  
noise floor of the input source and measurement equipment.  
Measured using a Wenzel Oscillator as the input source.  
©2017 Integrated Device Technology, Inc.  
6
November 24, 2017  
IDT8P34S1212I Datasheet  
Additive Phase Jitter  
The spectral purity in a band at a specific offset from the fundamental  
compared to the power of the fundamental is called the dBc Phase  
Noise. This value is normally expressed using a Phase noise plot  
and is most often the specified plot in many applications. Phase noise  
is defined as the ratio of the noise power present in a 1Hz band at a  
specified offset from the fundamental frequency to the power value of  
the fundamental. This ratio is expressed in decibels (dBm) or a ratio  
of the power in the 1Hz band to the power in the fundamental. When  
the required offset is specified, the phase noise is called a dBc value,  
which simply means dBm at a specified offset from the fundamental.  
By investigating jitter in the frequency domain, we get a better  
understanding of its effects on the desired application over the entire  
time record of the signal. It is mathematically possible to calculate an  
expected bit error rate given a phase noise plot.  
Additive Phase Jitter @ 41fs (typical)  
Offset from Carrier Frequency (Hz)  
As with most timing specifications, phase noise measurements have  
issues relating to the limitations of the measurement equipment. The  
noise floor of the equipment can be higher or lower than the noise  
floor of the device. Additive phase noise is dependent on both the  
noise floor of the input source and measurement equipment.  
Measured using a Wenzel Oscillator as the input source.  
©2017 Integrated Device Technology, Inc.  
7
November 24, 2017  
IDT8P34S1212I Datasheet  
Parameter Measurement Information  
V
DD  
V
nCLK[0:1]  
CLK[0:1]  
DD  
GND  
1.8V ±5% LVDS Output Load Test Circuit  
Differential Input Level  
nCLK0  
CLK0  
nCLK1  
CLK1  
nQx  
Qx  
nQ[0:11]  
nQy  
Qy  
Q[0:11]  
tPD2  
tPD1  
tsk(i)  
tsk(i) = |tPD1 - tPD2  
|
Input Skew  
Output Skew  
nCLK[0:1]  
CLK[0:1]  
Part 1  
nQx  
Qx  
nQy  
Qy  
Part 2  
nQy  
tPLH  
tPHL  
Qy  
tsk(pp)  
tsk(p)= |tPHL - tPLH  
|
Part-to-Part Skew  
Pulse Skew  
©2017 Integrated Device Technology, Inc.  
8
November 24, 2017  
IDT8P34S1212I Datasheet  
Parameter Measurement Information, continued  
Spectrum of Output Signal Q  
MUX selects active  
input clock signal  
A0  
nCLK[0:1]  
MUX_ISOLATION = A0 – A1  
CLK[0:1]  
nQ[0:11]  
MUX selects other input  
A1  
Q[0:11]  
tPD  
ƒ
Frequency  
(fundamental)  
Propagation Delay  
MUX Isolation  
nQ[0:11]  
nQ[0:11]  
90%  
80%  
90%  
tR  
80%  
tR  
VOD  
10%  
VOD  
20%  
10%  
20%  
Q[0:11]  
Q[0:11]  
tF  
tF  
Output Rise/Fall Time, 20% – 80%  
Output Rise/Fall Time, 10% – 90%  
Differential Output Voltage Setup  
Offset Voltage Setup  
©2017 Integrated Device Technology, Inc.  
9
November 24, 2017  
IDT8P34S1212I Datasheet  
Applications Information  
Wiring the Differential Input to Accept Single-Ended Levels  
Figure 1 shows how a differential input can be wired to accept single  
ended levels. The reference voltage V1= VDD/2 is generated by the  
bias resistors R1 and R2. The bypass capacitor (C1) is used to help  
filter noise on the DC bias. This bias circuit should be located as  
close to the input pin as possible. The ratio of R1 and R2 might need  
to be adjusted to position the V1in the center of the input voltage  
swing. For example, if the input clock swing is 1.8V and VDD = 1.8V,  
R1 and R2 value should be adjusted to set V1 at 0.9V. The values  
below are for when both the single ended swing and VDD are at the  
same voltage. This configuration requires that the sum of the output  
impedance of the driver (Ro) and the series resistance (Rs) equals  
the transmission line impedance. In addition, matched termination at  
the input will attenuate the signal in half. This can be done in one of  
two ways. First, R3 and R4 in parallel should equal the transmission  
line impedance. For most 50applications, R3 and R4 can be 100.  
The values of the resistors can be increased to reduce the loading for  
slower and weaker LVCMOS driver. When using single-ended  
signaling, the noise rejection benefits of differential signaling are  
reduced. Even though the differential input can handle full rail  
LVCMOS signaling, it is recommended that the amplitude be  
reduced. The datasheet specifies a lower differential amplitude,  
however this only applies to differential signals. For single-ended  
applications, the swing can be larger, however VIL cannot be less  
than -0.3V and VIH cannot be more than VDD + 0.3V. Though some  
of the recommended components might not be used, the pads should  
be placed in the layout. They can be utilized for debugging purposes.  
The datasheet specifications are characterized and guaranteed by  
using a differential signal.  
Figure 1. Recommended Schematic for Wiring a Differential Input to Accept Single-ended Levels  
Recommendations for Unused Input and Output Pins  
Inputs:  
Outputs:  
CLK/nCLK Inputs  
LVDS Outputs  
For applications not requiring the use of a differential input, both the  
CLK and nCLK pins can be left floating. Though not required, but for  
additional protection, a 1kresistor can be tied from CLK to ground.  
Unused LVDS outputs must either have a 100differential  
termination or have a 100pull-up resistor to VDD in order to ensure  
proper device operation.  
©2017 Integrated Device Technology, Inc.  
10  
November 24, 2017  
IDT8P34S1212I Datasheet  
1.8V Differential Clock Input Interface  
The CLK /nCLK accepts LVDS and other differential signals. The  
differential input signal must meet both the VPP and VCMR input  
requirements. Figures 2A to 2D show interface examples for the CLK  
/nCLK input driven by the most common driver types. The input  
interfaces suggested here are examples only. If the driver is from  
another vendor, use their termination recommendation. Please  
consult with the vendor of the driver component to confirm the driver  
termination requirements.  
Figure 2A. Differential Input Driven by an  
LVDS Driver - DC Coupling  
Figure 2B. Differential Input Driven by an  
LVPECL Driver - AC Coupling  
Figure 2C. Differential Input Driven by an  
LVDS Driver - AC Coupling  
Figure 2D. Differential Input Driven by a CML Driver  
©2017 Integrated Device Technology, Inc.  
11  
November 24, 2017  
IDT8P34S1212I Datasheet  
LVDS Driver Termination  
For a general LVDS interface, the recommended value for the  
termination impedance (ZT) is between 90and 132. The actual  
value should be selected to match the differential impedance (Z0) of  
your transmission line. A typical point-to-point LVDS design uses a  
100parallel resistor at the receiver and a 100differential  
transmission-line environment. In order to avoid any  
transmission-line reflection issues, the components should be  
surface mounted and must be placed as close to the receiver as  
possible. IDT offers a full line of LVDS compliant devices with two  
types of output structures: current source and voltage source. The  
standard termination schematic as shown in Figure 3A can be used  
with either type of output structure. Figure 3B, which can also be  
used with both output types, is an optional termination with center tap  
capacitance to help filter common mode noise. The capacitor value  
should be approximately 50pF. If using a non-standard termination, it  
is recommended to contact IDT and confirm if the output structure is  
current source or voltage source type. In addition, since these  
outputs are LVDS compatible, the input receiver’s amplitude and  
common-mode input range should be verified for compatibility with  
the output.  
Figure 3A. Standard LVDS Termination  
Figure 3B. Optional LVDS Termination  
©2017 Integrated Device Technology, Inc.  
12  
November 24, 2017  
IDT8P34S1212I Datasheet  
VFQFN EPAD Thermal Release Path  
In order to maximize both the removal of heat from the package and  
the electrical performance, a land pattern must be incorporated on  
the Printed Circuit Board (PCB) within the footprint of the package  
corresponding to the exposed metal pad or exposed heat slug on the  
package, as shown in Figure 4. The solderable area on the PCB, as  
defined by the solder mask, should be at least the same size/shape  
as the exposed pad/slug area on the package to maximize the  
thermal/electrical performance. Sufficient clearance should be  
designed on the PCB between the outer edges of the land pattern  
and the inner edges of pad pattern for the leads to avoid any shorts.  
and dependent upon the package power dissipation as well as  
electrical conductivity requirements. Thus, thermal and electrical  
analysis and/or testing are recommended to determine the minimum  
number needed. Maximum thermal and electrical performance is  
achieved when an array of vias is incorporated in the land pattern. It  
is recommended to use as many vias connected to ground as  
possible. It is also recommended that the via diameter should be 12  
to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is  
desirable to avoid any solder wicking inside the via during the  
soldering process which may result in voids in solder between the  
exposed pad/slug and the thermal land. Precautions should be taken  
to eliminate any solder voids between the exposed heat slug and the  
land pattern. Note: These recommendations are to be used as a  
guideline only. For further information, please refer to the Application  
Note on the Surface Mount Assembly of Amkor’s Thermally/  
Electrically Enhance Leadframe Base Package, Amkor Technology.  
While the land pattern on the PCB provides a means of heat transfer  
and electrical grounding from the package to the board through a  
solder joint, thermal vias are necessary to effectively conduct from  
the surface of the PCB to the ground plane(s). The land pattern must  
be connected to ground through these vias. The vias act as “heat  
pipes”. The number of vias (i.e. “heat pipes”) are application specific  
SOLDER  
PIN  
SOLDER  
EXPOSED HEAT SLUG  
PIN  
PIN PAD  
GROUND PLANE  
LAND PATTERN  
(GROUND PAD)  
PIN PAD  
THERMAL VIA  
Figure 4. P.C. Assembly for Exposed Pad Thermal Release Path – Side View (drawing not to scale)  
©2017 Integrated Device Technology, Inc.  
13  
November 24, 2017  
IDT8P34S1212I Datasheet  
Power Considerations  
This section provides information on power dissipation and junction temperature for the IDT8P34S1212I. Equations and example calculations  
are also provided.  
1. Power Dissipation.  
The total power dissipation for the IDT8P34S1212I is the sum of the core power plus the output power dissipation into the load. The following  
is the power dissipation for VDD = 1.8V + 5% = 1.89V, which gives worst case results.  
The maximum current at 85°C is as follows:  
IDD_MAX = 227mA  
Power (core)MAX = VDD_MAX * IDD_MAX = 1.89V * 227mA = 429.03mW  
Total Power_MAX = 429.03mW  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The  
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond  
wire and bond pad temperature remains below 125°C.  
The equation for Tj is as follows: Tj = JA * Pd_total + TA  
Tj = Junction Temperature  
JA = Junction-to-Ambient Thermal Resistance  
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)  
TA = Ambient Temperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and  
a multi-layer board, the appropriate value is 33°C/W per Table 6 below.  
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:  
85°C + 0.429W * 33°C/W = 99.16°C. This is below the limit of 125°C.  
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of  
board (multi-layer).  
Table 6. vs. Air Flow Table for a 40-Lead VFQFN  
JA  
JA vs. Air Flow (m/s)  
Meters per Second  
0
1
2
Multi-Layer PCB, JEDEC Standard Test Boards  
33.0°C/W  
26.3C/W  
24.0°C/W  
©2017 Integrated Device Technology, Inc.  
14  
November 24, 2017  
IDT8P34S1212I Datasheet  
Reliability Information  
Table 7. vs. Air Flow Table for a 40-Lead VFQFN  
JA  
JA vs. Air Flow (m/s)  
Meters per Second  
0
1
2
Multi-Layer PCB, JEDEC Standard Test Boards  
33.0°C/W  
26.3C/W  
24.0°C/W  
Transistor Count  
The transistor count for the IDT8P34S1212I is: 8438  
©2017 Integrated Device Technology, Inc.  
15  
November 24, 2017  
IDT8P34S1212I Datasheet  
Package Outline Drawings – Page 1  
©2017 Integrated Device Technology, Inc.  
16  
November 24, 2017  
IDT8P34S1212I Datasheet  
Package Outline Drawings – Page 2  
©2017 Integrated Device Technology, Inc.  
17  
November 24, 2017  
IDT8P34S1212I Datasheet  
Package Outline Drawings – Page 3  
©2017 Integrated Device Technology, Inc.  
18  
November 24, 2017  
IDT8P34S1212I Datasheet  
Ordering Information  
Table 8. Ordering Information  
Part/Order Number  
8P34S1212NLGI  
8P34S1212NLGI8  
Marking  
Package  
Shipping Packaging  
Tray  
Temperature  
-40C to 85C  
-40C to 85C  
IDT8P34S1212NLGI  
IDT8P34S1212NLGI  
“Lead-Free” 40-Lead VFQFN  
“Lead-Free” 40-Lead VFQFN  
Tape & Reel  
Revision History  
Revision Date  
Description  
Updated the description of pins 3, 8, and 9 in Table 1  
November 24, 2017 Updated the package drawings; however, no technical changes  
Completed other minor changes  
January 20, 2014  
Initial release.  
Corporate Headquarters  
6024 Silver Creek Valley Road  
San Jose, CA 95138 USA  
www.IDT.com  
Sales  
Tech Support  
1-800-345-7015 or 408-284-8200  
Fax: 408-284-2775  
www.IDT.com/go/support  
www.IDT.com/go/sales  
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time, without  
notice, at IDT’s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when  
installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products  
for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under  
intellectual property rights of IDT or any third parties.  
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably  
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.  
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of  
IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. Integrated Device Technology, Inc.. All rights reserved.  
©2017 Integrated Device Technology, Inc.  
19  
November 24, 2017  
厂商 型号 描述 页数 下载

IDT

8P34S1102I [ 1:2 LVDS Output 1.8V Fanout Buffer ] 16 页

IDT

8P34S1102I_17 [ 1:2 LVDS Output 1.8V Fanout Buffer ] 16 页

IDT

8P34S1102NLGI [ 1:2 LVDS Output 1.8V Fanout Buffer ] 16 页

IDT

8P34S1102NLGI8 [ 1:2 LVDS Output 1.8V Fanout Buffer ] 16 页

IDT

8P34S1212NLGI [ 1:12 LVDS Output 1.8V Fanout Buffer ] 19 页

IDT

8P34S2102 [ Dual 1:2 LVDS Output 1.8V Fanout Buffer ] 19 页

IDT

8P34S2102NLGI [ Dual 1:2 LVDS Output 1.8V Fanout Buffer ] 19 页

IDT

8P34S2102NLGI/W [ Dual 1:2 LVDS Output 1.8V Fanout Buffer ] 19 页

IDT

8P34S2102NLGI8 [ Dual 1:2 LVDS Output 1.8V Fanout Buffer ] 19 页

IDT

8P34S2102_17 [ Dual 1:2 LVDS Output 1.8V Fanout ] 17 页

PDF索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

IC型号索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

Copyright 2024 gkzhan.com Al Rights Reserved 京ICP备06008810号-21 京

0.211804s