请登录

免费注册
全部商品
电子元器件
方案中心
工业品
PDF资料
购物车 0
上传BOM

产品分类

找货询价

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

QQ咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

会员中心
购物车
技术支持

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

售后咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

SZESD7361P2T5G

型号：

SZESD7361P2T5G

品牌：

ONSEMI[ ONSEMI ]

页数：

9 页

PDF大小：

134 K

下载PDF手册
ESD7361, SZESD7361  
ESD Protection Diodes  
Low Capacitance ESD Protection Diode  
for High Speed Data Line  
The ESD7361 Series ESD protection diodes are designed to protect  
high speed data lines from ESD. Ultra−low capacitance make this  
device an ideal solution for protecting voltage sensitive high speed  
data lines.  
www.onsemi.com  
MARKING  
DIAGRAMS  
Features  
• Low Capacitance (0.55 pF Max, I/O to GND)  
• Protection for the Following IEC Standards:  
♦ IEC61000−4−2 (ESD): Level 4 15 kV Contact  
♦ IEC61000−4−4 (EFT): 40 A −5/50 ns  
♦ IEC61000−4−5 (Lightning): 1 A (8/20 ms)  
• ISO 10605 (ESD) 330 pF/2 kW 15 kV Contact  
• SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
2
SOD−323  
CASE 477  
7H  
M
1
1
2
SOD−523  
CASE 502  
7X  
1
2
SOD−923  
CASE 514AB  
2 M  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
Typical Applications  
X, XX = Specific Device Code  
M
= Date Code  
• Wireless Charger  
• Near Field Communications  
PIN CONFIGURATION  
AND SCHEMATIC  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
−55 to +125  
−55 to +150  
260  
Unit  
°C  
Operating Junction Temperature Range  
Storage Temperature Range  
T
J
1
2
T
stg  
°C  
Cathode  
Anode  
Lead Solder Temperature −  
Maximum (10 Seconds)  
T
L
°C  
IEC 61000−4−2 Contact (ESD)  
IEC 61000−4−2 Air (ESD)  
ISO 10605 330 pF/2 kW Contact (ESD)  
ESD  
ESD  
ESD  
15  
15  
15  
kV  
kV  
kV  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 6 of  
this data sheet.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
September, 2015 − Rev. 2  
ESD7361/D  
ESD7361, SZESD7361  
ELECTRICAL CHARACTERISTICS  
I
(T = 25°C unless otherwise noted)  
A
I
F
Symbol  
Parameter  
Maximum Reverse Peak Pulse Current  
Clamping Voltage @ I  
I
PP  
V
C
PP  
V
C
V
V
BR RWM  
V
Working Peak Reverse Voltage  
RWM  
V
I
V
F
R
T
I
I
R
Maximum Reverse Leakage Current @ V  
RWM  
V
Breakdown Voltage @ I  
Test Current  
BR  
T
I
T
*See Application Note AND8308/D for detailed explanations of  
datasheet parameters.  
I
PP  
Uni−Directional TVS  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
A
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
V
Reverse Working Voltage  
Breakdown Voltage  
V
RWM  
5
16  
V
BR  
I = 1 mA; pin 1 to pin 2  
16.5  
V
T
Reverse Leakage Current  
Clamping Voltage (Note 2)  
Clamping Voltage (Note 2)  
Junction Capacitance  
I
V
= 5.0 V  
<1  
31  
34  
1000  
nA  
V
R
RWM  
V
I
PP  
I
PP  
= 8 A  
C
V
= 16 A  
V
C
C
V
R
V
R
= 0 V, f = 1 MHz  
= 0 V, f < 1 GHz  
0.55  
0.55  
pF  
J
Dynamic Resistance  
Insertion Loss  
R
TLP Pulse  
0.735  
W
DYN  
f = 1 MHz  
f = 5 GHz  
0.01  
2
dB  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
1. For test procedure see Figures 9 and 10 and application note AND8307/D.  
2. ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model.  
TLP conditions: Z = 50 W, t = 100 ns, t = 4 ns, averaging window; t = 30 ns to t = 60 ns.  
0
p
r
1
2
1.E−03  
1.E−04  
1.E−05  
1.E−06  
1.E−07  
1.E−08  
1.E−09  
1.E−10  
1.E−11  
1.E−12  
1.E−13  
1
0.8  
0.6  
0.4  
0.2  
0
6
8
10  
(V)  
12  
0
5
10  
15  
VOLTAGE (V)  
20  
25  
30  
0
2
4
14  
16  
18  
V
Bias  
Figure 1. Typical IV Characteristics  
Figure 2. Typical CV Characteristics  
www.onsemi.com  
2
 
ESD7361, SZESD7361  
1
0.5  
0
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
−0.5  
−1  
−1.5  
−2  
−2.5  
−3  
−3.5  
−4  
1.E+07  
1.E+08  
1.E+09  
1.E+07 5.E+08 1.E+09 2.E+09 2.E+09 3.E+09  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
Figure 3. Typical Insertion Loss  
ESD7361HT1G (SOD323)  
Figure 4. Typical Capacitance Over Frequency  
ESD7361HT1G (SOD323)  
1
0.5  
0
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
−0.5  
−1  
−1.5  
−2  
−2.5  
−3  
−3.5  
−4  
1.E+07  
1.E+08  
1.E+09  
1.E+07  
1.E+09 2.E+09  
3.E+09 4.E+09  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
Figure 5. Typical Insertion Loss  
ESD7361XV2T1G (SOD523)  
Figure 6. Typical Capacitance Over Frequency  
ESD7361XV2T1G (SOD523)  
1
0.5  
0
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
−0.5  
−1  
−1.5  
−2  
−2.5  
−3  
−3.5  
−4  
1.E+07  
1.E+08  
FREQUENCY (Hz)  
1.E+09  
1.E+07  
1.E+09 2.E+09  
3.E+09 4.E+09  
FREQUENCY (Hz)  
Figure 7. Typical Insertion Loss  
ESD7361P2T5G (SOD923)  
Figure 8. Typical Capacitance Over Frequency  
ESD7361P2T5G (SOD923)  
www.onsemi.com  
3
ESD7361, SZESD7361  
IEC61000−4−2 Waveform  
IEC 61000−4−2 Spec.  
I
peak  
First Peak  
Current  
(A)  
100%  
90%  
Test Volt-  
age (kV)  
Current at  
30 ns (A)  
Current at  
60 ns (A)  
Level  
1
2
3
4
2
4
6
8
7.5  
15  
4
8
2
4
6
8
I @ 30 ns  
22.5  
30  
12  
16  
I @ 60 ns  
10%  
t
P
= 0.7 ns to 1 ns  
Figure 9. IEC61000−4−2 Spec  
Oscilloscope  
ESD Gun  
TVS  
50 W  
Cable  
50 W  
Figure 10. Diagram of ESD Clamping Voltage Test Setup  
The following is taken from Application Note  
AND8308/D − Interpretation of Datasheet Parameters  
for ESD Devices.  
systems such as cell phones or laptop computers it is not  
clearly defined in the spec how to specify a clamping voltage  
at the device level. ON Semiconductor has developed a way  
to examine the entire voltage waveform across the ESD  
protection diode over the time domain of an ESD pulse in the  
form of an oscilloscope screenshot, which can be found on  
the datasheets for all ESD protection diodes. For more  
information on how ON Semiconductor creates these  
screenshots and how to interpret them please refer to  
AND8307/D.  
ESD Voltage Clamping  
For sensitive circuit elements it is important to limit the  
voltage that an IC will be exposed to during an ESD event  
to as low a voltage as possible. The ESD clamping voltage  
is the voltage drop across the ESD protection diode during  
an ESD event per the IEC61000−4−2 waveform. Since the  
IEC61000−4−2 was written as a pass/fail spec for larger  
www.onsemi.com  
4
ESD7361, SZESD7361  
25  
20  
15  
10  
5
−25  
−20  
−15  
−10  
−5  
0
0
0
5
10  
15  
20  
25  
30  
35  
40  
0
−2  
−4  
−6  
−8  
−10  
−12  
−14  
V , VOLTAGE (V)  
C
V , VOLTAGE (V)  
C
Figure 11. Positive TLP I−V Curve  
Figure 12. Negative TLP I−V Curve  
NOTE: TLP parameter: Z = 50 W, t = 100 ns, t = 300 ps, averaging window: t = 30 ns to t = 60 ns. V is the equivalent voltage  
IEC  
0
p
r
1
2
stress level calculated at the secondary peak of the IEC 61000−4−2 waveform at t = 30 ns with 2 A/kV. See TLP description  
below for more information.  
50 W Coax  
Cable  
Transmission Line Pulse (TLP) Measurement  
L
Attenuator  
S
Transmission Line Pulse (TLP) provides current versus  
voltage (I−V) curves in which each data point is obtained  
from a 100 ns long rectangular pulse from a charged  
transmission line. A simplified schematic of a typical TLP  
system is shown in Figure 13. TLP I−V curves of ESD  
protection devices accurately demonstrate the product’s  
ESD capability because the 10s of amps current levels and  
under 100 ns time scale match those of an ESD event. This  
is illustrated in Figure 14 where an 8 kV IEC 61000−4−2  
current waveform is compared with TLP current pulses at  
8 A and 16 A. A TLP I−V curve shows the voltage at which  
the device turns on as well as how well the device clamps  
voltage over a range of current levels.  
÷
50 W Coax  
Cable  
I
M
V
M
10 MW  
DUT  
V
C
Oscilloscope  
Figure 13. Simplified Schematic of a Typical TLP  
System  
Figure 14. Comparison Between 8 kV IEC 61000−4−2 and 8 A and 16 A TLP Waveforms  
www.onsemi.com  
5
 
ESD7361, SZESD7361  
ORDERING INFORMATION  
Device  
†
Package  
Shipping  
ESD7361HT1G  
SOD−323  
(Pb−Free)  
3000 / Tape & Reel  
3000 / Tape & Reel  
8000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
8000 / Tape & Reel  
ESD7361XV2T1G  
ESD7361P2T5G  
SOD−523  
(Pb−Free)  
SOD−923  
(Pb−Free)  
SZESD7361HT1G  
SZESD7361XV2T1G  
SZESD7361P2T5G  
SOD−323  
(Pb−Free)  
SOD−523  
(Pb−Free)  
SOD−923  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
6
ESD7361, SZESD7361  
PACKAGE DIMENSIONS  
SOD−323  
CASE 477−02  
ISSUE H  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
H
E
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING  
WITH SOLDER PLATING.  
D
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
5. DIMENSION L IS MEASURED FROM END OF RADIUS.  
1
E
b
2
MILLIMETERS  
DIM MIN NOM MAX  
0.80  
INCHES  
NOM MAX  
1.00 0.031 0.035 0.040  
0.10 0.000 0.002 0.004  
0.006 REF  
MIN  
A
0.90  
0.05  
A1 0.00  
A3  
A
A3  
0.15 REF  
0.32  
0.12 0.177 0.003 0.005 0.007  
1.70  
1.25  
b
C
D
E
L
0.25  
0.089  
1.60  
1.15  
0.08  
2.30  
0.4 0.010 0.012 0.016  
1.80 0.062 0.066 0.070  
1.35 0.045 0.049 0.053  
0.003  
H
2.50  
2.70 0.090 0.098 0.105  
E
L
A1  
C
NOTE 5  
NOTE 3  
SOLDERING FOOTPRINT*  
0.63  
0.025  
0.83  
0.033  
1.60  
0.063  
2.85  
0.112  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
7
ESD7361, SZESD7361  
PACKAGE DIMENSIONS  
SOD−523  
CASE 502  
ISSUE E  
−X−  
D
NOTES:  
6. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.  
−Y−  
7. CONTROLLING DIMENSION: MILLIMETERS.  
8. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.  
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF  
BASE MATERIAL.  
E
9. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-  
TRUSIONS, OR GATE BURRS.  
1
2
2X b  
MILLIMETERS  
M
0.08  
X Y  
DIM  
A
b
c
D
E
HE  
L
MIN  
0.50  
0.25  
0.07  
1.10  
0.70  
1.50  
NOM  
0.60  
0.30  
0.14  
1.20  
MAX  
0.70  
0.35  
0.20  
1.30  
0.90  
1.70  
TOP VIEW  
0.80  
1.60  
A
0.30 REF  
0.20  
L2  
0.15  
0.25  
c
HE  
RECOMMENDED  
SOLDERING FOOTPRINT*  
SIDE VIEW  
1.80  
2X  
0.48  
2X  
0.40  
2X  
L
PACKAGE  
OUTLINE  
DIMENSION: MILLIMETERS  
2X  
L2  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
BOTTOM VIEW  
www.onsemi.com  
8
ESD7361, SZESD7361  
PACKAGE DIMENSIONS  
SOD−923  
CASE 514AB  
ISSUE C  
NOTES:  
−X−  
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.  
D
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.  
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF  
BASE MATERIAL.  
−Y−  
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-  
TRUSIONS, OR GATE BURRS.  
E
1
2
MILLIMETERS  
DIM MIN NOM MAX  
INCHES  
NOM MAX  
2X b  
MIN  
0.08 X  
Y
A
b
c
0.34  
0.15  
0.07  
0.75  
0.55  
0.95  
0.37  
0.20  
0.12  
0.80  
0.60  
0.40  
0.25  
0.17  
0.85  
0.65  
1.05  
0.013 0.015 0.016  
0.006 0.008 0.010  
0.003 0.005 0.007  
0.030 0.031 0.033  
0.022 0.024 0.026  
0.037 0.039 0.041  
0.007 REF  
TOP VIEW  
D
E
A
H
1.00  
E
L
0.19 REF  
0.10  
L2 0.05  
0.15  
0.002 0.004 0.006  
c
H
SOLDERING FOOTPRINT*  
E
SIDE VIEW  
1.20  
2X  
2X  
0.25  
0.36  
2X  
L
PACKAGE  
OUTLINE  
DIMENSIONS: MILLIMETERS  
2X  
L2  
See Application Note AND8455/D for more mounting details  
BOTTOM VIEW  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and the  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed  
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation  
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and  
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets  
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each  
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,  
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which  
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or  
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim  
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable  
copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5817−1050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
ESD7361/D  
厂商 型号 描述 页数 下载

ETC

 		SZE-002T-P0.3 1.5毫米俯仰/可撤离压接式连接器[ 1.5mm pitch/Disconnectable Crimp style connectors ] 4 页

ETC

 		SZE-003T-P0.3 1.5毫米俯仰/可撤离压接式连接器[ 1.5mm pitch/Disconnectable Crimp style connectors ] 4 页

ONSEMI

 		SZESD7016 低电容ESD保护的USB3.0[ Low Capacitance ESD Protection USB3.0 ] 8 页

ONSEMI

 		SZESD7016MUTAG 低电容ESD保护的USB3.0[ Low Capacitance ESD Protection USB3.0 ] 8 页

ONSEMI

 		SZESD7104MTWTAG [ Trans Voltage Suppressor Diode ] 11 页

ONSEMI

 		SZESD7205DT5G [ ESD Protection Diodes ] 8 页

ONSEMI

 		SZESD7205M3T5G [ ESD Protection Diodes ] 8 页

ONSEMI

 		SZESD7205WTT1G [ ESD Protection Diodes ] 8 页

ONSEMI

 		SZESD7351HT1G [ Transient Voltage Suppressors ] 8 页

ONSEMI

 		SZESD7351P2T5G [ Transient Voltage Suppressors ] 8 页

购物指南

支付方式

配送服务

售后服务

发票须知

优惠券使用规则

特色服务

PCBA制造

国产品牌推荐

国产料号替代

质量保证

技术资料

行业资讯

关于我们

关于达普

联系我们

联系我们

服务热线：400-618-9990

企业邮箱：smail@ic72.com

服务时间：周一至周六 8:30-17:30

达普官方微信号

PDF索引：

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

IC型号索引：

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

Copyright 2024 gkzhan.com Al Rights Reserved 京ICP备06008810号-21 京

深圳网络警察报警平台
公共信息安全网络监察
经营性网站备案信息
不良信息举报中心
工商网监电子标识
全国公安机关备案
0.158664s