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NXSX064XT

型号：

NXSX064XT

描述：

规格FOR NICHIA片式蓝光LED[ SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED ]

品牌：

NICHIA[ NICHIA CORPORATION ]

页数：

14 页

PDF大小：

579 K

下载PDF手册
Nichia STS-DA1-0226  
<Cat.No.080519>  
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED  
MODEL : NSSB064T  
NICHIA CORPORATION  
Nichia STS-DA1-0226  
<Cat.No.080519>  
1.SPECIFICATIONS  
(1) Absolute Maximum Ratings  
Item  
(Ta=25°C)  
Symbol  
IF  
Absolute Maximum Rating  
Unit  
mA  
Forward Current  
35  
Pulse Forward Current  
Allowable Reverse Current  
Power Dissipation  
IFP  
100  
mA  
IR  
85  
133  
mA  
PD  
mW  
Operating Temperature  
Storage Temperature  
Dice Temperature  
Topr  
Tstg  
Tj  
-40 ~ +110  
°C  
-40 ~ +110  
°C  
125  
°C  
Soldering Temperature  
Tsld  
Reflow Soldering : 260°C  
Hand Soldering : 350°C  
for 10sec.  
for 3sec.  
IFP Conditions  
:
Pulse Width ≤ 10msec. and Duty ≤ 1/10  
(2) Thermal Characteristics  
(Ta=25°C)  
Unit  
Item  
Symbol  
Typ.  
300  
120  
Rja  
Rjs  
°C/W  
Heat resistance  
°C/W  
½ Rja = Heat resistance from Dice to Ambient temperature (Ta)  
Rjs = Heat resistance from Dice to Solder temperature of Cathode Side (Ts)  
½ Using Nichia standard circuit board FR4, t=1.6mm, Copper foil, t=35µm  
(3) Initial Electrical/Optical Characteristics  
(Ta=25°C)  
Item  
Forward Voltage  
Symbol Condition  
Typ.  
(3.4)  
Max.  
Unit  
V
VF  
Iv  
Iv  
-
IF=30[mA]  
IF=30[mA]  
IF=20[mA]  
IF=30[mA]  
IF=30[mA]  
3.8  
Luminous Intensity  
Luminous Intensity  
(600)  
(440)  
0.133  
0.075  
-
-
-
-
mcd  
mcd  
-
½
x
y
Chromaticity Coordinate  
-
-
½ Please refer to CIE 1931 chromaticity diagram.  
(4) Ranking  
(Ta=25°C)  
Unit  
Item  
Symbol Condition  
Min.  
600  
426  
300  
Max.  
852  
600  
426  
Rank X  
Rank W  
Rank V  
Iv  
Iv  
Iv  
IF=30[mA]  
IF=30[mA]  
IF=30[mA]  
mcd  
Luminous Intensity  
mcd  
mcd  
½ Luminous Intensity Measurement allowance is ± 10%.  
-1-  
Nichia STS-DA1-0226  
<Cat.No.080519>  
Color Rank  
(IF=30mA,Ta=25°C)  
Rank W  
x
y
0.137  
0.037  
0.124  
0.058  
0.110  
0.087  
0.132  
0.112  
0.142  
0.081  
0.151  
0.058  
½ Color Coordinates Measurement allowance is ± 0.01.  
½ Basically, a shipment shall consist of the LEDs of a combination of the above ranks.  
The percentage of each rank in the shipment shall be determined by Nichia.  
2. INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS  
Please refer to “CHARACTERISTICS” on the following pages.  
3.OUTLINE DIMENSIONS AND MATERIALS  
Please refer to “OUTLINE DIMENSIONS” on the following page.  
Package  
Encapsulating Resin  
Electrodes  
:
:
:
Heat-Resistant Polymer  
Silicone Resin (with Diffused)  
Ag Plating Copper Alloy  
Material as follows ;  
4.PACKAGING  
· The LEDs are packed in cardboard boxes after taping.  
Please refer to “PACKING” on the following pages.  
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity  
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.  
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,  
so precautions must be taken to prevent any damage.  
· The boxes are not water resistant and therefore must be kept away from water and moisture.  
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.  
5.LOT NUMBER  
The first six digits number shows lot number.  
The lot number is composed of the following characters;  
{ꢀ¯¯¯¯ - U„  
{ - Year  
( 7 for 2007, 8 for 2008 )  
ꢀ - Month ( 1 for Jan., 9 for Sep., A for Oct., B for Nov. )  
¯¯¯¯ - Nichia's Product Number  
U - Ranking by Color Coordinates  
„ - Ranking by Luminous Intensity  
-2-  
Nichia STS-DA1-0226  
<Cat.No.080519>  
6.RELIABILITY  
(1) TEST ITEMS AND RESULTS  
Standard  
Number of  
Test Item  
Resistance to  
Soldering Heat  
Test Method  
JEITA ED-4701  
300 301  
Test Conditions  
Tsld=260°C, 10sec.  
(Pre treatment 30°C,70%,168hrs.)  
Note  
2 times  
Damaged  
0/22  
(Reflow Soldering)  
Solderability  
(Reflow Soldering)  
JEITA ED-4701  
300 303  
Tsld=215 ± 5°C,  
(using flux, Lead Solder)  
-40°C 110°C  
3sec.  
1 time  
over 95%  
0/22  
Thermal Shock  
JEITA ED-4701  
300 307  
~
100 cycles  
0/100  
1min. (10sec.) 1min.  
(Pre treatment 30°C,70%,168hrs.)  
-40°C ~ 25°C ~ 110°C ~ 25°C  
30min. 5min. 30min. 5min.  
25°C ~ 65°C ~ -10°C  
90%RH 24hrs./1cycle  
Ta=110°C  
Temperature Cycle  
JEITA ED-4701  
100 105  
JEITA ED-4701  
200 203  
JEITA ED-4701  
200 201  
JEITA ED-4701  
100 103  
100 cycles  
10 cycles  
1000 hrs.  
1000 hrs.  
1000 hrs.  
1000 hrs.  
1000 hrs.  
1000 hrs.  
1000 hrs.  
1 time  
0/100  
0/100  
0/100  
0/100  
0/100  
0/100  
0/100  
0/100  
0/100  
0/22  
Moisture Resistance Cyclic  
High Temperature Storage  
Temperature Humidity  
Storage  
Low Temperature Storage  
Ta=60°C, RH=90%  
Ta=-40°C  
JEITA ED-4701  
200 202  
Steady State Operating Life  
ꢀꢀ  
Ta=25°C, IF=35mA  
Steady State Operating Life  
of High Temperature ꢀꢀ  
Ta=85°C, IF=30mA  
Steady State Operating Life  
of High Humidity Heat ꢀꢀ  
60°C, RH=90%, IF=30mA  
Ta=-40°C, IF=30mA  
Steady State Operating Life  
of Low Temperature ꢀꢀ  
Permanence of Marking  
JEITA ED-4701  
500 501  
Solvent : Isopropyl Alcohol  
Solvent Temperature : 20 ~ 25°C  
Dipping Time : 5 min.  
100 ~ 2000 ~ 100Hz Sweep 4min.  
200m/s2  
Vibration  
JEITA ED-4701  
400 403  
48min.  
3 times  
0/10  
3directions, 4cycles  
75cm  
Drop  
0/10  
0/22  
Electrostatic Discharge  
JEITA ED-4701  
300 304  
3 times  
Negative/Positive  
R=1.5kΩ, C=100pF  
Test Voltage=2kV  
(2) CRITERIA FOR JUDGING DAMAGE  
Criteria for Judgement  
Item  
Symbol  
VF  
Test Conditions  
Min.  
-
Max.  
Forward Voltage  
IF=30mA  
IF=30mA  
U.S.L.*)ꢁ1.1  
Luminous Intensity  
Condition 1  
Luminous Intensity  
Condition 2 ꢀꢀ  
IV  
IV  
L.S.L.**)ꢁ0.7  
L.S.L.**)ꢁ0.5  
-
-
IF=30mA  
*) U.S.L. : Upper Standard Level  
**) L.S.L. : Lower Standard Level  
ꢀꢀThese test items are judged by the criteria of Luminous Intensity Condition 2.  
-3-  
Nichia STS-DA1-0226  
<Cat.No.080519>  
7.CAUTIONS  
(1) Moisture Proof Package  
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.  
There is a possibility that this can cause exfoliation of the contacts and damage to the optical  
characteristics of the LEDs.  
to a minimum in the package.  
For this reason, the moisture proof package is used to keep moisture  
· The moisture proof package is made of an aluminum moisture proof bag.  
A package of  
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.  
The silica gel changes its color from blue to pink as it absorbs moisture.  
(2) Storage  
· Storage Conditions  
Before opening the package :  
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a  
year.  
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)  
is recommended.  
After opening the package :  
The LEDs should be kept at 30°C or less and 70%RH or less.  
The LEDs should be soldered  
within 168 hours (7days) after opening the package.  
If unused LEDs remain, they should be  
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent  
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag  
and to reseal the moisture proof bag again.  
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage  
time, baking treatment should be performed using the following conditions.  
Baking treatment : more than 24 hours at 65 ± 5°C  
· This product has silver plated metal parts that are inside and/or outside the package body. The silver  
plating becomes tarnished when being exposed to an environment which contains corrosive gases.  
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.  
Please do not expose the LEDs to corrosive atmosphere during storage.  
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by  
components and materials in close proximity of the LEDs within an end product, and the gases entering  
into the product from the external atmosphere. The above should be taken into consideration when  
designing.  
Resin materials, in particular, may contain substances which affects on silver plating,  
such as halogen.  
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where  
condensation can occur.  
-4-  
Nichia STS-DA1-0226  
<Cat.No.080519>  
(3) Recommended circuit  
· In designing a circuit, the current through each LED must not exceed the absolute maximum rating  
specified for each LED. It is recommended to use Circuit B which regulates the current flowing  
through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the  
current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the  
worst case, some LED may be subjected to stresses in excess of the absolute maximum rating.  
(B)  
(A)  
· This product should be operated in forward bias. A driving circuit must be designed so that the product  
is not subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is  
continuously applied to the product, such operation can cause migration resulting in LED damage.  
(4) Heat Generation  
· Thermal design of the end product is of paramount importance.  
Please consider the heat generation  
of the LED when making the system design. The coefficient of temperature increase per input  
electric power is affected by the thermal resistance of the circuit board and density of LED placement  
on the board, as well as other components. It is necessary to avoid intense heat generation and operate  
within the maximum ratings given in this specification.  
· The operating current should be decided after considering the ambient maximum temperature of LEDs.  
-5-  
Nichia STS-DA1-0226  
<Cat.No.080519>  
(5) Soldering Conditions  
· The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a  
guarantee on the LEDs after they have been assembled using the dip soldering method.  
· Recommended soldering conditions  
Reflow Soldering  
Lead Solder  
120 ~ 150°C  
Hand Soldering  
Lead-free Solder  
180 ~ 200°C  
Pre-heat  
Temperature  
350°C Max.  
Pre-heat time  
Peak  
Soldering time 3 sec. Max.  
(one time only)  
120 sec. Max.  
240°C Max.  
120 sec. Max.  
260°C Max.  
temperature  
Soldering time  
Condition  
10 sec. Max.  
refer to  
10 sec. Max.  
refer to  
Temperature - profile 1. Temperature - profile 2.  
(N2 reflow is recommended.)  
ꢀ Although the recommended soldering conditions are specified in the above table, reflow or hand  
soldering at the lowest possible temperature is desirable for the LEDs.  
ꢀ A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.  
[Temperature-profile (Surface of circuit board)]  
Use the conditions shown to the under figure.  
<1 : Lead Solder>  
<2 : Lead-free Solder>  
1 ~ 5°C / sec.  
2.5 ~ 5°C / sec.  
260°C Max.  
240°C Max.  
10sec. Max.  
Pre-heating  
10sec. Max.  
Pre-heating  
2.5 ~ 5°C / sec.  
120 ~ 150°C  
1 ~ 5°C / sec.  
180 ~ 200°C  
60sec.Max.  
60sec.Max.  
Above 220°C  
Above 200°C  
120sec.Max.  
120sec.Max.  
[Recommended soldering pad design]  
Use the following conditions shown in the figure.  
9.5  
4
4
1.5  
1.5  
(Unit : mm)  
: Solder resist  
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere  
during air reflow. It is recommended that the User use the nitrogen reflow method.  
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the  
top of package. The pressure to the top surface will be influence to the reliability of the LEDs.  
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using  
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.  
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,  
a double-head soldering iron should be used. It should be confirmed beforehand whether the  
characteristics of the LEDs will or will not be damaged by repairing.  
· Reflow soldering should not be done more than two times.  
· When soldering, do not put stress on the LEDs during heating.  
· After soldering, do not warp the circuit board.  
-6-  
Nichia STS-DA1-0226  
<Cat.No.080519>  
(6) Cleaning  
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.  
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the  
resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations.  
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic  
When using  
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.  
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.  
(7) Static Electricity  
· Static electricity or surge voltage damages the LEDs.  
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.  
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions  
be taken against surge voltage to the equipment that mounts the LEDs.  
· When inspecting the final products in which LEDs were assembled, it is recommended to check  
whether the assembled LEDs are damaged by static electricity or not.  
It is easy to find  
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).  
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,  
or the LEDs do not light at the low current.  
Criteria : (VF > 2.0V at IF=0.5mA)  
(8) Others  
· NSSB064 complies with RoHS Directive.  
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent  
looking directly at the LEDs with unaided eyes for more than a few seconds.  
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking  
precautions during use. Also, people should be cautious when using equipment that has had LEDs  
incorporated into it.  
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such  
as office equipment, communications equipment, measurement instruments and household appliances).  
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality  
and reliability are required, particularly when the failure or malfunction of the LEDs may directly  
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor  
control systems, automobiles, traffic control equipment, life support systems and safety devices).  
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written  
consent from Nichia.  
When defective LEDs are found, the User shall inform Nichia directly before  
disassembling or analysis.  
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.  
· The appearance and specifications of the product may be modified for improvement without notice.  
-7-  
Nichia STS-DA1-0226  
<Cat.No.080519>  
ICI Chromaticity Diagram  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
520  
530  
540  
510  
550  
560  
570  
500  
580  
590  
600  
610  
620  
630  
490  
480  
W
470  
460  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
x
ꢀColor Coordinates Measurement allowance is ± 0.01.  
-8-  
ꢀ Forward Voltage vs.  
ꢀ Forward Current vs.  
ꢀ Duty Ratio vs.  
Forward Current  
Relative Luminosity  
Allowable Forward Current  
3.0  
200  
200  
Ta=25°C  
100  
Ta=25°C  
2.5  
Ta=25°C  
100  
50  
2.0  
1.5  
1.0  
0.5  
0
30  
20  
50  
35  
10  
5
20  
10  
1
2.0 2.5 3.0 3.5 4.0 4.5 5.0  
0
20 40 60 80 100 120  
Forward Current IFP (mA)  
1
5
10 20  
50 100  
Forward Voltage VF (V)  
Duty Ratio (%)  
ꢀ Ambient Temperature vs.  
ꢀ Ambient Temperature vs.  
ꢀ
Ambient Temperature vs.  
Allowable Forward Current  
Forward Voltage  
Relative Luminosity  
5.0  
2.0  
50  
IFP=30mA  
IFP=30mA  
4.6  
40  
35  
30  
4.2  
3.8  
3.4  
3.0  
2.6  
2.2  
1.0  
0.5  
20  
Ts=Solder Temperature  
(Cathode Side)  
10  
Ta=Ambient Temperature  
0
0.2  
-60 -30  
0
30 60 90 120  
-60 -30  
0
30 60 90 120  
0
20 40 60 80 100 120  
Temperature T (°C)  
Ambient Temperature Ta (°C)  
Ambient Temperature Ta (°C)  
Model  
NSSB064  
Title  
No.  
CHARACTERISTICS  
080510816231  
NICHIA CORPORATION  
ꢀ Forward Current vs.  
ꢀ Spectrum  
Chromaticity Coordinate (λD)  
0.12  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
Ta=25°C  
1mA(476nm)  
Ta=25°C  
IF=30mA  
0.11  
0.10  
5mA(474nm)  
0.09  
0.08  
30mA(471nm)  
35mA(470nm)  
0.07  
100mA(469nm)  
0.06  
0.10 0.11 0.12 0.13 0.14 0.15 0.16  
350 400 450 500 550 600 650  
Wavelength λ (nm)  
x
ꢀ Ambient Temperature vs.  
ꢀ Forward Current vs.  
ꢀ Directivity  
Dominant Wavelength  
Dominant Wavelength  
0°  
10°  
20°  
486  
486  
1.0  
30°  
Ta=25°C  
481  
Ta=25°C  
IFP=30mA  
IFP=30mA  
481  
40°  
50°  
476  
471  
466  
461  
456  
476  
471  
466  
461  
456  
60°  
70°  
80°  
0.5  
90°  
1.0  
0
90°  
60°  
30°  
0°  
0.5  
1
5
10 20 50 100 200  
-60 -30  
0
30 60 90 120  
Radiation Angle  
Ambient Temperature Ta (°C)  
Forward Current IFP (mA)  
Model  
NSSB064  
Title  
No.  
CHARACTERISTICS  
080510816241  
NICHIA CORPORATION  
(2.4)  
Anode  
Internal Circuit  
A
Protection device  
K
Cathode mark  
(C 0.6)  
2.8  
Cathode  
ITEM  
MATERIALS  
PACKAGE  
Heat-Resistant Polymer  
Silicone Resin (Diffused)  
Ag Plating Copper Alloy  
ENCAPSULATING RESIN  
ELECTRODES  
½ NxSB064 has a protection device built in as a protection  
circuit against static electricity.  
(0.45)  
(1.05)  
2.2  
Unit  
mm  
Model  
Title  
NxSB064  
15/1  
Scale  
OUTLINE DIMENSIONS  
NICHIA CORPORATION  
Allow  
±0.2  
No.  
080510816171  
11.4±1  
9±0.3  
Reel part  
Taping part  
+0  
0.25±0.05  
φ 180  
-3  
4±0.1  
+0.1  
φ 1.5  
-0  
2±0.05  
Cathode mark  
Label  
2.15±0.1  
4±0.1  
+0.25  
XXXX LED  
φ 1  
-0  
TYPE NxSx064xT  
LOT xxxxxx-U„  
QTY  
pcs  
RoHS  
Reel End of tape  
2.85±0.1  
No LEDs  
LEDs mounting part  
No LEDs  
Pull direction  
Top cover  
tape  
Embossed carrier tape  
Reel Lead Min.100mm (No LEDs)  
Reel Lead Min.160mm (No LEDs)  
Reel Lead Min.400mm  
2,000pcs/Reel  
Unit  
mm  
NxSx064xT  
Model  
Title  
Taping is based on the JIS C 0806 : Packaging of Electronic  
Components on Continuous Tapes.  
TAPING DIMENSIONS  
080510816181  
NICHIA CORPORATION  
Scale  
Allow  
No.  
Nichia STS-DA1-0226  
<Cat.No.080519>  
The reel and moisture absorbent material are put in the moisture proof foil bag  
and then heat sealed.  
Reel  
Label  
NICHIA  
Seal  
XXXX LED  
TYPE  
LOT  
QTY  
NxSx064xT  
xxxxxx-U„  
PCS  
RoHS  
NICHIA CORPORATION  
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
Moisture proof foil bag  
Moisture  
absorbent material  
The box is partitioned with the  
cardboard.  
Label  
NICHIA  
XXXX LED  
Nichia LED  
TYPE  
RANK  
QTY  
NxSx064xT  
U„  
RoHS  
PCS  
NICHIA CORPORATION  
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
Packing unit  
Reel/bag  
1reel  
Quantity/bag (pcs)  
2,000 MAX.  
Moisture proof foil bag  
Cardboard box  
Cardboard box S  
Cardboard box M  
Cardboard box L  
Dimensions (mm)  
291¯237¯120¯8t  
259¯247¯243¯5t  
444¯262¯259¯8t  
Reel/box  
Quantity/box (pcs)  
14,000 MAX.  
30,000 MAX.  
60,000 MAX.  
7reel MAX.  
15reel MAX.  
30reel MAX.  
Model  
Title  
NxSx064xT  
PACKING  
NICHIA CORPORATION  
No.  
070802651612  
-13-  
厂商 型号 描述 页数 下载

NXP

 		NXS0102DP [ IC NXS0102 SERIES, 2-BIT TRANSCEIVER, TRUE OUTPUT, PDSO8, 3 MM, PLASTIC, SOT505-2, TSSOP-8, Bus Driver/Transceiver ] 24 页

NXP

 		NXS0102GD [ IC NXS0102 SERIES, 2-BIT TRANSCEIVER, TRUE OUTPUT, PDSO8, 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8, Bus Driver/Transceiver ] 24 页

NXP

 		NXS0102GF [ IC TRANSCEIVER, PDSO8, 1.35 X 1 MM, 0.50 MM PITCH, PLASTIC, MO-252, SOT1089, XSON-8, Bus Driver/Transceiver ] 24 页

NXP

 		NXS0102GF,115 [ TXRX TRANSLATING DUAL XSON8 ] 24 页

NXP

 		NXS0102GT [ IC TRANSCEIVER, PDSO8, 1 X 1.95 MM, 0.50 MM PITCH, PLASTIC, MO-252, SOT833-1, XSON-8, Bus Driver/Transceiver ] 24 页

NXP

 		NXS0102GT,115 [ TXRX TRANSLATING DUAL XSON8 ] 24 页

NICHIA

 		NXSB064 规格FOR NICHIA片式蓝光LED[ SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED ] 14 页

NICHIA

 		NXSG426C 规格FOR NICHIA贴片式LED绿色[ SPECIFICATIONS FOR NICHIA CHIP TYPE GREEN LED ] 13 页

NICHIA

 		NXSW108 规格FOR NICHIA片式白光LED[ SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED ] 13 页

NICHIA

 		NXSW108T 规格FOR NICHIA片式白光LED[ SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED ] 13 页

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