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NXS0102GT

型号：

NXS0102GT

品牌：

NXP[ NXP ]

页数：

24 页

PDF大小：

195 K

下载PDF手册
NXS0102  
Dual supply translating transceiver; open drain; auto  
direction sensing  
Rev. 01 — 2 June 2010  
Product data sheet  
1. General description  
The NXS0102 is a 2-bit, dual supply translating transceiver with auto direction sensing,  
that enables bidirectional voltage level translation. It features two data input-output ports  
(An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A)  
can be supplied at any voltage between 1.65 V and 3.6 V and VCC(B) can be supplied at  
any voltage between 2.3 V and 5.5 V, making the device suitable for translating between  
any of the voltage nodes (1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to  
V
CC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to  
assume a high-impedance OFF-state. This device is fully specified for partial power-down  
applications using IOFF. The IOFF circuitry disables the output, preventing the damaging  
backflow current through the device when it is powered down.  
2. Features and benefits  
„ Wide supply voltage range:  
‹ VCC(A): 1.65 V to 3.6 V and VCC(B): 2.3 V to 5.5 V  
„ Maximum data rates:  
‹ Push-pull: 50 Mbps  
„ IOFF circuitry provides partial Power-down mode operation  
„ Inputs accept voltages up to 5.5 V  
„ ESD protection:  
‹ HBM JESD22-A114E Class 2 exceeds 2500 V for A port  
‹ HBM JESD22-A114E Class 3B exceeds 8000 V for B port  
‹ MM JESD22-A115-A exceeds 200 V  
‹ CDM JESD22-C101E exceeds 1500 V  
„ Latch-up performance exceeds 100 mA per JESD 78B Class II  
„ Multiple package options  
„ Specified from −40 °C to +85 °C and −40 °C to +125 °C  
3. Applications  
„ I2C/SMBus  
„ UART  
„ GPIO  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
4. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
NXS0102DP  
NXS0102GT  
NXS0102GD  
NXS0102GF  
−40 °C to +125 °C  
−40 °C to +125 °C  
−40 °C to +125 °C  
−40 °C to +125 °C  
TSSOP8 plastic thin shrink small outline package; 8 leads;  
body width 3 mm; lead length 0.5 mm  
SOT505-2  
XSON8  
plastic extremely thin small outline package; no leads; SOT833-1  
8 terminals; body 1 × 1.95 × 0.5 mm  
XSON8U plastic extremely thin small outline package; no leads; SOT996-2  
8 terminals; UTLP based; body 3 × 2 × 0.5 mm  
XSON8  
extremely thin small outline package; no leads;  
SOT1089  
8 terminals; body 1.35 × 1 × 0.5 mm  
5. Marking  
Table 2.  
Marking  
Type number  
NXS0102DP  
NXS0102GT  
NXS0102GD  
NXS0102GF  
Marking code  
s02  
s02  
s02  
s2  
6. Functional diagram  
GATE BIAS  
6
4
OE  
A2  
1
B2  
5
A1  
8
B1  
V
CC(A)  
V
CC(B)  
GATE BIAS  
001aal905  
Fig 1. Logic symbol  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
2 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
7. Pinning information  
7.1 Pinning  
NXS0102  
B2  
1
2
3
4
8
7
6
5
B1  
GND  
V
CC(B)  
NXS0102  
V
OE  
A1  
CC(A)  
A2  
1
2
3
4
8
7
6
5
B2  
B1  
GND  
V
CC(B)  
V
OE  
A1  
CC(A)  
A2  
001aal961  
Transparent top view  
001aal959  
Fig 2. Pin configuration SOT505-2 (TSSOP8)  
Fig 3. Pin configuration SOT833-1 (XSON8) and  
SOT1089 (XSON8)  
NXS0102  
B2  
1
2
3
4
8
7
6
5
B1  
GND  
V
CC(B)  
V
OE  
A1  
CC(A)  
A2  
001aal962  
Transparent top view  
Fig 4. Pin configuration SOT996-2 (XSON8U)  
7.2 Pin description  
Table 3.  
Symbol  
B2, B1  
GND  
Pin description  
Pin  
1, 8  
2
Description  
data input or output (referenced to VCC(B)  
)
)
ground (0 V)  
VCC(A)  
A2, A1  
OE  
3
supply voltage A  
4, 5  
6
data input or output (referenced to VCC(A)  
output enable input (active HIGH; referenced to VCC(A)  
)
VCC(B)  
7
supply voltage B  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
3 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
8. Functional description  
Table 4.  
Function table[1]  
Supply voltage  
VCC(A)  
Input  
OE  
L
Input/output  
VCC(B)  
An  
Bn  
1.65 V to VCC(B)  
1.65 V to VCC(B)  
GND[2]  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
GND[2]  
Z
Z
H
input or output  
Z
output or input  
Z
X
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.  
[2] When either VCC(A) or VCC(B) is at GND level, the device goes into power-down mode.  
9. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC(A)  
VCC(B)  
VI  
Parameter  
Conditions  
Min  
Max  
+6.5  
+6.5  
+6.5  
+6.5  
Unit  
V
supply voltage A  
supply voltage B  
input voltage  
−0.5  
−0.5  
−0.5  
−0.5  
V
[1][2]  
[1][2]  
[1][2]  
A port and OE input  
B port  
V
V
VO  
output voltage  
Active mode  
A or B port  
−0.5  
VCCO + 0.5  
V
[1]  
Power-down or 3-state mode  
A port  
−0.5  
−0.5  
−50  
−50  
-
+4.6  
+6.5  
-
V
B port  
V
IIK  
input clamping current  
output clamping current  
output current  
VI < 0 V  
mA  
mA  
mA  
mA  
mA  
°C  
IOK  
IO  
VO < 0 V  
-
[2]  
[3]  
VO = 0 V to VCCO  
ICC(A) or ICC(B)  
±50  
100  
-
ICC  
IGND  
Tstg  
Ptot  
supply current  
-
ground current  
−100  
−65  
-
storage temperature  
total power dissipation  
+150  
250  
Tamb = −40 °C to +125 °C  
mW  
[1] The minimum input and minimum output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] VCCO is the supply voltage associated with the output.  
[3] For TSSOP8 package: above 55 °C the value of Ptot derates linearly with 2.5 mW/K.  
For XSON8, XSON8U and XQFN8U packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K.  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
4 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
10. Recommended operating conditions  
Table 6.  
Symbol  
VCC(A)  
VCC(B)  
Tamb  
Recommended operating conditions[1][2]  
Parameter  
Conditions  
Min  
1.65  
2.3  
Max  
3.6  
Unit  
V
supply voltage A  
supply voltage B  
5.5  
V
ambient temperature  
−40  
+125  
°C  
Δt/ΔV  
input transition rise and fall rate A or B port; push-pull driving  
VCC(A) = 1.65 V to 3.6 V;  
-
-
10  
10  
ns/V  
ns/V  
V
CC(B) = 2.3 V to 5.5 V  
OE input  
VCC(A) = 1.65 V to 3.6 V;  
VCC(B) = 2.3 V to 5.5 V  
[1] The A and B sides of an unused I/O pair must be held in the same state, both at VCCI or both at GND.  
[2] VCC(A) must be less than or equal to VCC(B)  
.
11. Static characteristics  
Table 7.  
Typical static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C.  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
II  
input leakage  
current  
OE input; VI = 0 V to 3.6 V; VCC(A) = 1.65 V to 3.6 V;  
VCC(B) = 2.3 V to 5.5 V  
-
-
±1  
μA  
μA  
μA  
μA  
pF  
[1]  
IOZ  
IOFF  
OFF-stateoutput A or B port; VO = 0 V or VCCO; VCC(A) = 1.65 V to 3.6 V;  
current  
-
-
-
-
-
±1  
±1  
±1  
-
VCC(B) = 2.3 V to 5.5 V  
power-off  
A port; VI or VO = 0 V to 3.6 V;  
-
leakage current VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V  
B port; VI or VO = 0 V to 5.5 V;  
VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V  
-
CI  
input  
OE input; VCC(A) = 3.3 V; VCC(B) = 3.3 V  
1
capacitance  
CI/O  
input/output  
capacitance  
A port  
-
-
-
5
-
-
-
pF  
pF  
pF  
B port  
8.5  
11  
A or B port; VCC(A) = 3.3 V; VCC(B) = 3.3 V  
[1] VCCO is the supply voltage associated with the output.  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
5 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
Table 8.  
Static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
−40 °C to +85 °C  
−40 °C to +125 °C  
Unit  
Min  
Max  
Min  
Max  
VIH  
HIGH-level  
A port  
input voltage  
[1]  
[1]  
VCC(A) = 1.65 V to 1.95 V;  
VCCI − 0.2  
VCCI − 0.4  
-
-
VCCI − 0.2  
VCCI − 0.4  
-
-
V
V
VCC(B) = 2.3 V to 5.5 V  
VCC(A) = 2.3 V to 3.6 V;  
VCC(B) = 2.3 V to 5.5 V  
B port  
VCC(A) = 1.65 V to 3.6 V;  
CC(B) = 2.3 V to 5.5 V  
OE input  
VCC(A) = 1.65 V to 3.6 V;  
CC(B) = 2.3 V to 5.5 V  
[1]  
VCCI − 0.4  
-
VCCI − 0.4  
-
V
V
V
V
V
V
0.65VCC(A)  
-
0.65VCC(A)  
-
V
VIL  
LOW-level  
A or B port  
input voltage  
VCC(A) = 1.65 V to 3.6 V;  
VCC(B) = 2.3 V to 5.5 V  
-
0.15  
-
0.15  
OE input  
VCC(A) = 1.65 V to 3.6 V;  
-
0.35VCC(A)  
-
0.35VCC(A)  
VCC(B) = 2.3 V to 5.5 V  
VOH  
HIGH-level  
IO = −20 μA  
output voltage  
[2]  
[2]  
VCC(A) = 1.65 V to 3.6 V;  
VCC(B) = 2.3 V to 5.5 V  
0.67VCCO  
-
0.67VCCO  
-
VOL  
LOW-level  
A or B port; IO = 1 mA  
output voltage  
VCC(A) = 1.65 V to 3.6 V;  
VCC(B) = 2.3 V to 5.5 V  
-
-
0.4  
-
-
0.4  
V
II  
input leakage OE input; VI = 0 V to 3.6 V;  
±2  
±12  
μA  
current  
VCC(A) = 1.65 V to 3.6 V;  
VCC(B) = 2.3 V to 5.5 V  
[2]  
IOZ  
OFF-state  
A or B port; VO = 0 V or VCCO  
;
-
±2  
-
±12  
μA  
output current VCC(A) = 1.65 V to 3.6 V;  
VCC(B) = 2.3 V to 5.5 V  
IOFF  
power-off  
leakage  
current  
A port; VI or VO = 0 V to 3.6 V;  
VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V  
-
-
±2  
±2  
-
-
±12  
±12  
μA  
μA  
B port; VI or VO = 0 V to 3.6 V;  
VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
6 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
Table 8.  
Static characteristics …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter Conditions −40 °C to +85 °C  
−40 °C to +125 °C  
Unit  
Min  
Max  
Min  
Max  
[1]  
ICC  
supply current VI = 0 V or VCCI; IO = 0 A  
ICC(A)  
VCC(A) = 1.65 V to 3.6 V;  
VCC(B) = 2.3 V to 5.5 V  
-
2.4  
-
15  
μA  
VCC(A) = 3.6 V; VCC(B) = 0 V  
VCC(A) = 0 V; VCC(B) = 5.5 V  
ICC(B)  
-
-
2.2  
-
-
15  
μA  
μA  
−1  
−8  
VCC(A) = 1.65 V to 3.6 V;  
-
12  
-
30  
μA  
VCC(B) = 2.3 V to 5.5 V  
VCC(A) = 3.6 V; VCC(B) = 0 V  
VCC(A) = 0 V; VCC(B) = 5.5 V  
ICC(A) + ICC(B)  
-
-
−1  
-
-
−5  
μA  
μA  
1
6
VCC(A) = 1.65 V to 3.6 V;  
VCC(B) = 2.3 V to 5.5 V  
-
14.4  
-
30  
μA  
[1] VCCI is the supply voltage associated with the input.  
[2] VCCO is the supply voltage associated with the output.  
12. Dynamic characteristics  
Table 9.  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7; for wave forms see Figure 5 and Figure 6.  
Dynamic characteristics for temperature range −40 °C to +85 °C[1]  
Symbol Parameter  
Conditions  
VCC(B)  
Unit  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5.0 V ± 0.5 V  
Min  
Max  
Min  
Max  
Min  
Max  
VCC(A) = 1.8 V ± 0.15 V  
tPHL  
tPLH  
tPHL  
tPLH  
HIGH to LOW  
propagation delay  
A to B  
A to B  
B to A  
B to A  
-
-
-
-
4.6  
6.8  
4.4  
5.3  
-
-
-
-
4.7  
6.8  
4.5  
4.5  
-
-
-
-
5.8  
7.0  
4.7  
0.5  
ns  
ns  
ns  
ns  
LOW to HIGH  
propagation delay  
HIGH to LOW  
propagation delay  
LOW to HIGH  
propagation delay  
ten  
enable time  
disable time  
OE to A; B  
-
200  
25  
-
200  
25  
-
200  
25  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
[2]  
[2]  
tdis  
OE to A; no external load  
OE to B; no external load  
OE to A  
-
-
-
-
-
-
25  
25  
25  
-
230  
200  
9.5  
-
230  
200  
9.3  
9.1  
-
230  
200  
7.6  
7.6  
OE to B  
-
-
-
tTLH  
LOW to HIGH  
output transition  
time  
A port  
3.2  
3.3  
2.3  
2.7  
1.8  
2.7  
B port  
10.8  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
7 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
Table 9.  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7; for wave forms see Figure 5 and Figure 6.  
Dynamic characteristics for temperature range −40 °C to +85 °C[1]  
Symbol Parameter  
Conditions  
VCC(B)  
Unit  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5.0 V ± 0.5 V  
Min  
2.0  
2.9  
Max  
5.9  
Min  
1.9  
2.8  
Max  
6.0  
Min  
1.7  
2.8  
Max  
tTHL  
HIGH to LOW  
output transition  
time  
A port  
B port  
13.3 ns  
10.0 ns  
7.6  
7.5  
[3]  
tsk(0)  
tW  
skew  
between channels  
data inputs  
-
20  
-
0.7  
-
-
20  
-
0.7  
-
-
20  
-
0.7  
-
ns  
pulse width  
data rate  
ns  
fdata  
50  
50  
50  
Mbps  
VCC(A) = 2.5 V ± 0.2 V  
tPHL  
tPLH  
tPHL  
tPLH  
HIGH to LOW  
propagation delay  
A to B  
A to B  
B to A  
B to A  
-
-
-
-
3.2  
3.5  
3.0  
2.5  
-
-
-
-
3.3  
4.1  
3.6  
1.6  
-
-
-
-
3.4  
4.4  
4.3  
0.7  
ns  
ns  
ns  
ns  
LOW to HIGH  
propagation delay  
HIGH to LOW  
propagation delay  
LOW to HIGH  
propagation delay  
ten  
enable time  
disable time  
OE to A; B  
-
200  
20  
-
200  
20  
-
200  
20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
[2]  
[2]  
tdis  
OE to A; no external load  
OE to B; no external load  
OE to A  
-
-
-
-
-
-
20  
20  
20  
-
200  
200  
7.4  
8.3  
-
200  
200  
6.6  
7.9  
-
200  
200  
6.2  
6.8  
OE to B  
-
-
-
tTLH  
LOW to HIGH  
output transition  
time  
A port  
2.8  
3.2  
2.6  
2.9  
1.8  
2.4  
B port  
tTHL  
HIGH to LOW  
output transition  
time  
A port  
B port  
1.9  
2.2  
5.7  
7.8  
1.9  
2.4  
5.5  
6.7  
1.8  
2.6  
5.3  
6.6  
ns  
ns  
[3]  
tsk(0)  
tW  
skew  
between channels  
data inputs  
-
20  
-
0.7  
-
-
20  
-
0.7  
-
-
20  
-
0.7  
-
ns  
pulse width  
data rate  
ns  
fdata  
50  
50  
50  
Mbps  
VCC(A) = 3.3 V ± 0.3 V  
tPHL  
tPLH  
tPHL  
tPLH  
ten  
HIGH to LOW  
propagation delay  
A to B  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
2.4  
4.2  
2.5  
2.5  
200  
-
-
-
-
-
3.1  
4.4  
3.3  
2.6  
200  
ns  
ns  
ns  
ns  
ns  
LOW to HIGH  
propagation delay  
A to B  
HIGH to LOW  
propagation delay  
B to A  
LOW to HIGH  
propagation delay  
B to A  
enable time  
OE to A; B  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
8 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
Table 9.  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7; for wave forms see Figure 5 and Figure 6.  
Dynamic characteristics for temperature range −40 °C to +85 °C[1]  
Symbol Parameter  
Conditions  
VCC(B)  
Unit  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5.0 V ± 0.5 V  
Min  
Max  
Min  
Max  
15  
Min  
Max  
15  
[2]  
[2]  
tdis  
disable time  
OE to A; no external load  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
OE to B; no external load  
15  
15  
OE to A  
OE to B  
A port  
-
260  
200  
5.6  
6.4  
-
260  
200  
5.9  
7.4  
-
-
tTLH  
LOW to HIGH  
output transition  
time  
2.3  
2.5  
1.9  
2.1  
B port  
tTHL  
HIGH to LOW  
output transition  
time  
A port  
B port  
-
-
-
-
2.0  
2.3  
5.4  
7.4  
1.9  
2.4  
5.0  
7.6  
ns  
ns  
[3]  
tsk(0)  
tW  
skew  
between channels  
data inputs  
-
-
-
-
-
-
-
20  
-
0.7  
-
-
20  
-
0.7  
-
ns  
pulse width  
data rate  
ns  
fdata  
50  
50  
Mbps  
[1] ten is the same as tPZL and tPZH  
tdis is the same as tPLZ and tPHZ  
[2] Delay between OE going LOW and when the outputs are actually disabled.  
[3] Skew between any two outputs of the same package switching in the same direction.  
.
.
Table 10. Dynamic characteristics for temperature range −40 °C to +125 °C[1]  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7; for wave forms see Figure 5 and Figure 6.  
Symbol Parameter  
Conditions  
VCC(B)  
Unit  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5.0 V ± 0.5 V  
Min  
Max  
Min  
Max  
Min  
Max  
VCC(A) = 1.8 V ± 0.15 V  
tPHL  
tPLH  
tPHL  
tPLH  
HIGH to LOW  
propagation delay  
A to B  
A to B  
B to A  
B to A  
-
-
-
-
5.8  
8.5  
5.5  
6.7  
-
-
-
-
5.9  
8.5  
5.7  
5.7  
-
-
-
-
7.3  
8.8  
5.9  
0.7  
ns  
ns  
ns  
ns  
LOW to HIGH  
propagation delay  
HIGH to LOW  
propagation delay  
LOW to HIGH  
propagation delay  
ten  
enable time  
disable time  
OE to A; B  
-
200  
30  
-
200  
30  
-
200  
30  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
[2]  
[2]  
tdis  
OE to A; no external load  
OE to B; no external load  
OE to A  
-
-
-
-
-
-
30  
30  
30  
-
250  
220  
11.9  
13.5  
-
250  
220  
11.7  
11.4  
-
250  
220  
9.5  
9.5  
OE to B  
-
-
-
tTLH  
LOW to HIGH  
output transition  
time  
A port  
3.2  
3.3  
2.3  
2.7  
1.8  
2.7  
B port  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
9 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
Table 10. Dynamic characteristics for temperature range −40 °C to +125 °C[1] …continued  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7; for wave forms see Figure 5 and Figure 6.  
Symbol Parameter  
Conditions  
VCC(B)  
Unit  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5.0 V ± 0.5 V  
Min  
2.0  
2.9  
Max  
7.4  
Min  
1.9  
2.8  
Max  
7.5  
Min  
1.7  
2.8  
Max  
tTHL  
HIGH to LOW  
output transition  
time  
A port  
B port  
16.7 ns  
12.5 ns  
9.5  
9.4  
[3]  
tsk(0)  
tW  
skew  
between channels  
data inputs  
-
20  
-
0.8  
-
-
20  
-
0.8  
-
-
20  
-
0.8  
-
ns  
pulse width  
data rate  
ns  
fdata  
50  
50  
50  
Mbps  
VCC(A) = 2.5 V ± 0.2 V  
tPHL  
tPLH  
tPHL  
tPLH  
HIGH to LOW  
propagation delay  
A to B  
A to B  
B to A  
B to A  
-
-
-
-
4.0  
4.4  
3.8  
3.2  
-
-
-
-
4.2  
5.2  
4.5  
2.0  
-
-
-
-
4.3  
5.5  
5.4  
0.9  
ns  
ns  
ns  
ns  
LOW to HIGH  
propagation delay  
HIGH to LOW  
propagation delay  
LOW to HIGH  
propagation delay  
ten  
enable time  
disable time  
OE to A; B  
-
200  
25  
-
200  
25  
-
200  
25  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
[2]  
[2]  
tdis  
OE to A; no external load  
OE to B; no external load  
OE to A  
-
-
-
-
-
-
25  
25  
25  
-
220  
220  
9.3  
10.4  
-
220  
220  
8.3  
9.7  
-
220  
220  
7.8  
8.3  
OE to B  
-
-
-
tTLH  
LOW to HIGH  
output transition  
time  
A port  
2.8  
3.2  
2.6  
2.9  
1.8  
2.4  
B port  
tTHL  
HIGH to LOW  
output transition  
time  
A port  
B port  
1.9  
2.2  
7.2  
9.8  
1.9  
2.4  
6.9  
8.4  
1.8  
2.6  
6.7  
8.3  
ns  
ns  
[3]  
tsk(0)  
tW  
skew  
between channels  
data inputs  
-
20  
-
0.8  
-
-
20  
-
0.8  
-
-
20  
-
0.8  
-
ns  
pulse width  
data rate  
ns  
fdata  
50  
50  
50  
Mbps  
VCC(A) = 3.3 V ± 0.3 V  
tPHL  
tPLH  
tPHL  
tPLH  
ten  
HIGH to LOW  
propagation delay  
A to B  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
3.0  
5.3  
3.2  
3.2  
200  
-
-
-
-
-
3.9  
5.5  
4.2  
3.3  
200  
ns  
ns  
ns  
ns  
ns  
LOW to HIGH  
propagation delay  
A to B  
HIGH to LOW  
propagation delay  
B to A  
LOW to HIGH  
propagation delay  
B to A  
enable time  
OE to A; B  
NXS0102_1  
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© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
10 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
Table 10. Dynamic characteristics for temperature range −40 °C to +125 °C[1] …continued  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7; for wave forms see Figure 5 and Figure 6.  
Symbol Parameter  
Conditions  
VCC(B)  
Unit  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5.0 V ± 0.5 V  
Min  
Max  
Min  
Max  
20  
Min  
Max  
20  
[2]  
[2]  
tdis  
disable time  
OE to A; no external load  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
OE to B; no external load  
20  
20  
OE to A  
OE to B  
A port  
-
280  
220  
7.0  
8.0  
-
280  
220  
7.4  
9.3  
-
-
tTLH  
LOW to HIGH  
output transition  
time  
2.3  
2.5  
1.9  
2.1  
B port  
tTHL  
HIGH to LOW  
output transition  
time  
A port  
B port  
-
-
-
-
2.0  
2.3  
6.8  
9.3  
1.9  
2.4  
6.3  
9.5  
ns  
ns  
[3]  
tsk(0)  
tW  
skew  
between channels  
data inputs  
-
-
-
-
-
-
-
20  
-
0.8  
-
-
20  
-
0.8  
-
ns  
pulse width  
data rate  
ns  
fdata  
50  
50  
Mbps  
[1] ten is the same as tPZL and tPZH  
tdis is the same as tPLZ and tPHZ  
[2] Delay between OE going LOW and when the outputs are actually disabled.  
.
.
[3] Skew between any two outputs of the same package switching in the same direction.  
13. Waveforms  
V
I
An, Bn  
input  
V
M
GND  
t
t
PHL  
PLH  
V
OH  
90 %  
Bn, An  
output  
V
M
10 %  
V
OL  
t
t
THL  
TLH  
001aal918  
Measurement points are given in Table 11.  
VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 5. The data input (An, Bn) to data output (Bn, An) propagation delay times  
NXS0102_1  
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© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
11 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
V
I
OE input  
V
M
GND  
t
t
PLZ  
PZL  
V
CCO  
output  
V
LOW-to-OFF  
OFF-to-LOW  
M
V
X
V
OL  
t
t
PHZ  
PZH  
V
OH  
V
Y
output  
HIGH-to-OFF  
OFF-to-HIGH  
V
M
GND  
outputs  
enabled  
outputs  
disabled  
outputs  
enabled  
001aal919  
Measurement points are given in Table 11.  
VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 6. Enable and disable times  
Table 11. Measurement points[1][2]  
Supply voltage  
VCCO  
Input  
Output  
VM  
VM  
VX  
VY  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5.0 V ± 0.5 V  
0.5VCCI  
0.5VCCI  
0.5VCCI  
0.5VCCI  
0.5VCCO  
0.5VCCO  
0.5VCCO  
0.5VCCO  
VOL + 0.15 V  
VOL + 0.15 V  
VOL + 0.3 V  
VOL + 0.3 V  
VOH − 0.15 V  
VOH − 0.15 V  
VOH − 0.3 V  
VOH − 0.3 V  
[1] VCCI is the supply voltage associated with the input.  
[2] VCCO is the supply voltage associated with the output.  
NXS0102_1  
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© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
12 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
t
W
V
I
90 %  
negative  
pulse  
V
M
V
M
10 %  
0 V  
t
f
t
r
t
r
t
f
V
I
90 %  
positive  
pulse  
V
M
V
M
10 %  
0 V  
t
W
V
EXT  
V
CC  
R
L
L
V
V
O
I
G
DUT  
C
R
L
001aal963  
Test data is given in Table 12.  
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; ZO = 50 Ω; dV/dt ≥ 1.0 V/ns.  
RL = Load resistance.  
CL = Load capacitance including jig and probe capacitance.  
VEXT = External voltage for measuring switching times.  
Fig 7. Test circuit for measuring switching times  
Table 12. Test data  
Supply voltage  
VCC(A)  
Input  
VI[1]  
Load  
CL  
VEXT  
[2]  
[3]  
VCC(B)  
Δt/ΔV  
RL  
tPLH, tPHL tPZH, tPHZ tPZL, tPLZ  
1.65 V to 3.6 V 2.3 V to 5.5 V VCCI  
≤ 1.0 ns/V  
15 pF  
50 kΩ, 1 MΩ open  
open  
2VCCO  
[1] VCCI is the supply voltage associated with the input.  
[2] For measuring data rate, pulse width, propagation delay and output rise and fall measurements, RL = 1 MΩ; for measuring enable and  
disable times, RL = 50 KΩ.  
[3] VCCO is the supply voltage associated with the output.  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
13 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
14. Application information  
14.1 Applications  
Voltage level-translation applications. The NXS0102 can be used in point-to-point  
applications to interface between devices or systems operating at different supply  
voltages. The device is primarily targeted at I2C or 1-wire which use open-drain drivers, it  
may also be used in applications where push-pull drivers are connected to the ports,  
however the NXB0102 may be more suitable.  
1.8 V  
3.3 V  
1.8 V  
V
CC(A)  
V
CC(B)  
3.3 V  
0.1 μF  
0.1 μF  
1 μF  
SYSTEM  
SYSTEM  
CONTROLLER  
OE  
NXS0102  
A1  
A2  
B1  
B2  
DATA  
DATA  
001aal964  
Fig 8. Typical operating circuit  
14.2 Architecture  
The architecture of the NXS0102 is shown in Figure 9. The device does not require an  
extra input signal to control the direction of data flow from A to B or B to A.  
V
CC(A)  
V
CC(B)  
T1  
T2  
ONE  
ONE  
SHOT  
SHOT  
10 kΩ  
10 kΩ  
GATE BIAS  
T3  
A
B
001aal965  
Fig 9. Architecture of NXS0102 I/O cell (one channel)  
The NXS0102 is a "switch" type voltage translator, it employs two key circuits to enable  
voltage translation:  
1. A pass-gate transistor (N-channel) that ties the ports together.  
2. An output edge-rate accelerator that detects and accelerates rising edges on the I/O  
pins.  
NXS0102_1  
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© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
14 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
The gate bias voltage of the pass gate transistor (T3) is set at approximately one  
threshold voltage above the VCC level of the low-voltage side. During a LOW-to-HIGH  
transition the output one-shot accelerates the output transition by switching on the PMOS  
transistors (T1, T2) bypassing the 10 kΩ pull-up resistors and increasing current drive  
capability. The one-shot is activated once the input transition reaches approximately  
V
CCI/2; it is de-activated approximately 50 ns after the output reaches VCCO/2. During the  
acceleration time the driver output resistance is between approximately 50 Ω and 70 Ω. To  
avoid signal contention and minimize dynamic ICC, the user should wait for the one-shot  
circuit to turn-off before applying a signal in the opposite direction. Pull-up resistors are  
included in the device for DC current sourcing capability.  
14.3 Input driver requirements  
As the NXS0102 is a switch type translator, properties of the input driver directly effect the  
output signal. The external open-drain or push-pull driver applied to an I/O determines the  
static current sinking capability of the system; the max data rate, HIGH-to-LOW output  
transition time (tTHL) and propagation delay (tPHL) are dependent upon the output  
impedance and edge-rate of the external driver. The limits provided for these parameters  
in the datasheet assume a driver with output impedance below 50 Ω is used.  
14.4 Output load considerations  
The maximum lumped capacitive load that can be driven is dependant upon the one-shot  
pulse duration. In cases with very heavy capacitive loading there is a risk that the output  
will not reach the positive rail within the one-shot pulse duration.  
To avoid excessive capacitive loading and to ensure correct triggering of the one-shot it's  
recommended to use short trace lengths and low capacitance connectors on NXS0102  
PCB layouts. To ensure low impedance termination and avoid output signal oscillations  
and one-shot re-triggering, the length of the PCB trace should be such that the round trip  
delay of any reflection is within the one-shot pulse duration (approximately 50 ns).  
14.5 Power up  
During operation VCC(A) must never be higher than VCC(B), however during power-up  
VCC(A) ≥ VCC(B) does not damage the device, so either power supply can be ramped up  
first. There is no special power-up sequencing required. The NXS0102 includes circuitry  
that disables all output ports when either VCC(A) or VCC(B) is switched off.  
14.6 Enable and disable  
An output enable input (OE) is used to disable the device. Setting OE = LOW  
causes all I/Os to assume the high-impedance OFF-state. The disable time (tdis with no  
external load) indicates the delay between when OE goes LOW and when outputs  
actually become disabled. The enable time (ten) indicates the amount of time the user  
must allow for one one-shot circuitry to become operational after OE is taken HIGH. To  
ensure the high-impedance OFF-state during power-up or power-down, pin OE should be  
tied to GND through a pull-down resistor, the minimum value of the resistor is determined  
by the current-sourcing capability of the driver.  
NXS0102_1  
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© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
15 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
14.7 Pull-up or pull-down resistors on I/Os lines  
Each A port I/O has an internal 10 kΩ pull-up resistor to VCC(A), and each B port I/O has  
an internal 10 kΩ pull-up resistor to VCC(B). If a smaller value of pull-up resistor is required,  
an external resistor must be added parallel to the internal 10 kΩ, this will effect the VOL  
level. When OE goes LOW the internal pull-ups of the NXS0102 are disabled.  
NXS0102_1  
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© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
16 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
15. Package outline  
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm  
SOT505-2  
D
E
A
X
c
H
v
M
y
A
E
Z
5
8
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
detail X  
1
4
e
w
M
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT  
v
w
y
Z
θ
1
2
3
p
max.  
0.15  
0.00  
0.95  
0.75  
0.38  
0.22  
0.18  
0.08  
3.1  
2.9  
3.1  
2.9  
4.1  
3.9  
0.47  
0.33  
0.70  
0.35  
8°  
0°  
mm  
1.1  
0.65  
0.25  
0.5  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-01-16  
SOT505-2  
- - -  
Fig 10. Package outline SOT505-2 (TSSOP8)  
NXS0102_1  
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© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
17 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm  
SOT833-1  
b
1
2
3
4
4×  
(2)  
L
L
1
e
8
7
6
5
e
1
e
1
e
1
8×  
A
(2)  
A
1
D
E
terminal 1  
index area  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
A
1
UNIT  
b
D
E
e
e
1
L
L
1
max max  
0.25  
0.17  
2.0  
1.9  
1.05  
0.95  
0.35 0.40  
0.27 0.32  
mm  
0.5 0.04  
0.6  
0.5  
Notes  
1. Including plating thickness.  
2. Can be visible in some manufacturing processes.  
REFERENCES  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
- - -  
07-11-14  
07-12-07  
SOT833-1  
- - -  
MO-252  
Fig 11. Package outline SOT833-1 (XSON8)  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
18 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
XSON8U: plastic extremely thin small outline package; no leads;  
8 terminals; UTLP based; body 3 x 2 x 0.5 mm  
SOT996-2  
D
B
A
E
A
A
1
detail X  
terminal 1  
index area  
e
1
C
M
M
v
w
C A  
C
B
b
e
L
1
y
1
y
C
1
4
L
2
L
8
5
X
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
UNIT  
A
1
b
D
E
e
e
1
L
L
L
v
w
y
y
1
1
2
max  
0.05 0.35  
0.00 0.15  
2.1  
1.9  
3.1  
2.9  
0.5  
0.3  
0.15  
0.05  
0.6  
0.4  
mm  
0.5  
0.5  
1.5  
0.1  
0.05 0.05  
0.1  
REFERENCES  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
- - -  
JEDEC  
JEITA  
07-12-18  
07-12-21  
SOT996-2  
- - -  
Fig 12. Package outline SOT996-2 (XSON8U)  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
19 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
XSON8: extremely thin small outline package; no leads;  
8 terminals; body 1.35 x 1 x 0.5 mm  
SOT1089  
E
terminal 1  
index area  
D
A
A
1
detail X  
(2)  
(4×)  
e
L
(2)  
(8×)  
b
4
5
e
1
1
8
terminal 1  
index area  
L
1
X
0
0.5  
1 mm  
scale  
Dimensions  
Unit  
(1)  
A
A
1
b
D
E
e
e
1
L
L
1
max 0.5 0.04 0.20 1.40 1.05  
0.35 0.40  
0.15 1.35 1.00 0.55 0.35 0.30 0.35  
0.12 1.30 0.95 0.27 0.32  
mm nom  
min  
Note  
1. Including plating thickness.  
2. Visible depending upon used manufacturing technology.  
sot1089_po  
References  
Outline  
version  
European  
projection  
Issue date  
IEC  
JEDEC  
JEITA  
10-04-09  
10-04-12  
SOT1089  
MO-252  
Fig 13. Package outline SOT1089 (XSON8)  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
20 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
16. Abbreviations  
Table 13. Abbreviations  
Acronym  
CDM  
CMOS  
DUT  
Description  
Charged Device Model  
Complementary Metal Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
GPIO  
General Purpose Input Output  
Human Body Model  
HBM  
I2C  
Inter-Integrated Circuit  
MM  
Machine Model  
PCB  
Printed Circuit Board  
PMOS  
SMBus  
UART  
UTLP  
Positive Metal Oxide Semiconductor  
System Management Bus  
Universal Asynchronous Receiver Transmitter  
Ultra Thin Leadless Package  
17. Revision history  
Table 14. Revision history  
Document ID  
Release date  
20100602  
Data sheet status  
Change notice  
Supersedes  
NXS0102_1  
Product data sheet  
-
-
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
21 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
18. Legal information  
18.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
suitable for use in medical, military, aircraft, space or life support equipment,  
18.2 Definitions  
nor in applications where failure or malfunction of an NXP Semiconductors  
product can reasonably be expected to result in personal injury, death or  
severe property or environmental damage. NXP Semiconductors accepts no  
liability for inclusion and/or use of NXP Semiconductors products in such  
equipment or applications and therefore such inclusion and/or use is at the  
customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
18.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Suitability for use in automotive applications — This NXP  
Semiconductors product has been qualified for use in automotive  
applications. The product is not designed, authorized or warranted to be  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
22 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
18.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
19. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
NXS0102_1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 01 — 2 June 2010  
23 of 24  
NXS0102  
NXP Semiconductors  
Dual supply translating transceiver; open drain; auto direction sensing  
20. Contents  
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
7
7.1  
7.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
8
Functional description . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
9
10  
11  
12  
13  
14  
Application information. . . . . . . . . . . . . . . . . . 14  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Input driver requirements . . . . . . . . . . . . . . . . 15  
Output load considerations. . . . . . . . . . . . . . . 15  
Power up . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Enable and disable. . . . . . . . . . . . . . . . . . . . . 15  
Pull-up or pull-down resistors on I/Os lines . . 16  
14.1  
14.2  
14.3  
14.4  
14.5  
14.6  
14.7  
15  
16  
17  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 21  
18  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 22  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
18.1  
18.2  
18.3  
18.4  
19  
20  
Contact information. . . . . . . . . . . . . . . . . . . . . 23  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2010.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 2 June 2010  
Document identifier: NXS0102_1  
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