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XZCB14X160S

型号：

XZCB14X160S

品牌：

SUNLED[ SUNLED CORPORATION ]

页数：

9 页

PDF大小：

365 K

下载PDF手册
Part Number: XZCB14X160S  
3.45X3.45mm SMD LED WITH CERAMIC SUB-  
STRATE  
ATTENTION  
OBSERVE PRECAUTIONS  
FOR HANDLING  
ELECTROSTATIC  
DISCHARGE  
Features  
SENSITIVE  
DEVICES  
● 3.45mm X 3.45mm X 2.0mm SMD LED  
● Zener diode provided for ESD Protection  
● IR-reflow compatible  
● White ceramic package with silicone resin  
● Standard Package: 1,000pcs / Reel  
● MSL (Moisture Sensitivity Level): 1  
● RoHS compliant  
Sep 17, 2016  
XDSB7939 V4-Z Layout: Maggie L.  
P. 1/9  
Part Number: XZCB14X160S  
3.45X3.45mm SMD LED WITH CERAMIC SUB-  
STRATE  
Flux Characteristics at 350mA Ambient Temperature, Ta = 25°C  
Φv (lm) [2]  
CIE127-2007*  
(IF=350mA)  
Viewing  
Angle  
2θ1/2 [1]  
Part  
Number  
Emitting Color  
(Material)  
Lens-color  
Code.  
Min.  
Max.  
typ.  
B4*  
B5*  
B6*  
B7*  
17*  
20*  
24*  
29*  
20*  
24*  
29*  
35*  
XZCB14X160S  
Blue (InGaN)  
Water Clear  
23.7*  
120°  
Notes:  
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.  
2. Luminous intensity/Luminous flux: +/-15%.  
*Luminous flux is in accordance with CIE127-2007 standards.  
Absolute Maximum Ratings at TA = 25°C  
Parameter  
Symbol  
IF  
Value  
Unit  
DC Forward Current [1]  
700  
mA  
mA  
W
Peak Forward Current [2]  
Power dissipation  
IFM  
1000  
PD  
2.8  
Reverse Voltage  
VR  
5
-40 To +100  
-40 To +110  
110  
V
Operating Temperature  
Storage Temperature  
Top  
Tstg  
TJ  
°C  
°C  
Junction temperature[1]  
Thermal resistance [1] (Junction/ambient)  
°C  
Rth j-a  
Rth j-s  
30  
°C/W  
°C/W  
Thermal resistance [1] (Junction/solder point)  
Notes:  
15  
1. Results from mounting on metal core PCB, mounted on pc board-metal core PCB is recommend for lowest thermal resistance.  
2. 1/10 Duty Cycle, 0.1ms Pulse Width.  
3. A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process  
(Reference JEDEC/JESD625-A and JEDEC/J-STD-033).  
Electrical / Optical Characteristics at TA = 25°C  
Parameter  
Symbol  
λ peak  
λ dom [1]  
Δλ  
Value  
455*  
460*  
25  
Unit  
nm  
Wavelength at peak emission CIE127-2007* IF = 350mA [Typ.]  
Dominant Wavelength CIE127-2007* IF = 350mA [Typ.]  
nm  
nm  
Spectral bandwidth at 50%Φ REL MAX IF = 350mA [Typ.]  
Allowable Reverse Current [Max.]  
IR  
85  
2.8  
3.3  
4.0  
mA  
Forward Voltage IF = 350mA [Min.]  
Forward Voltage IF = 350mA [Typ.]  
VF [2]  
V
Forward Voltage IF = 350mA [Max.]  
Temperature coefficient of λ peak  
IF = 350mA, -10°C ≤ T ≤ 100°C [Typ.]  
TC λ peak  
TC λ dom  
TCV  
0.06  
0.03  
-2.3  
nm/°C  
nm/°C  
mV/°C  
Temperature coefficient of λ dom  
IF = 350mA, -10°C ≤ T ≤100°C [Typ.]  
Temperature coefficient of VF  
IF = 350mA, -10°C ≤ T ≤ 100°C [Typ.]  
Notes:  
1.Wavelength: +/-1nm.  
2.Forward Voltage : + / - 0.1V.  
*Wavelength is in accordance with CIE127-2007 standards.  
Sep 17, 2016  
XDSB7939 V4-Z Layout: Maggie L.  
P. 2/9  
Part Number: XZCB14X160S  
3.45X3.45mm SMD LED WITH CERAMIC SUB-  
STRATE  
XZCB14X160S  
Blue  
Sep 17, 2016  
XDSB7939 V4-Z Layout: Maggie L.  
P. 3/9  
Part Number: XZCB14X160S  
3.45X3.45mm SMD LED WITH CERAMIC SUB-  
STRATE  
™ Reflow soldering is recommended and the soldering profile is shown below.  
Other soldering methods are not recommended as they might cause damage to the product.  
Heat Generation:  
1.Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design.  
The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED  
placement on the board ,as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings  
given in this specification.  
2.Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Permissible  
Forward current vs. Ambient temperature on CHARACTERISTICS in this specification. Please Also take meas ures to remove heat from the area  
near the LED to improve the operational characteristics on the LED.  
3.The equation ① indicates correlation between Tj and Ta ,and the equation ② indicates correlation between Tj and Ts  
Tj = Ta + Rthj-a *W ………  
Tj = Ts + Rthj-s *W ………  
①
②
Tj = dice junction temperature: °C  
Ta = ambient temperature:°C  
Ts = solder point temperature:°C  
Rthj-a = heat resistance from dice junction temperature to ambient temperature : °C/ W  
Rthj-s = heat resistance from dice junction temperature to Ts measuring point : °C/ W  
W = inputting power (IFx VF) : W  
Sep 17, 2016  
XDSB7939 V4-Z Layout: Maggie L.  
P. 4/9  
Part Number: XZCB14X160S  
3.45X3.45mm SMD LED WITH CERAMIC SUB-  
STRATE  
™ The device has a single mounting surface.  
The device must be mounted according to  
the specifications.  
™ Reel Dimension  
™ Recommended Soldering Pattern  
(Units : mm; Tolerance: ±0.1)  
™ Tape Specification (Units : mm)  
Sep 17, 2016  
XDSB7939 V4-Z Layout: Maggie L.  
P. 5/9  
Part Number: XZCB14X160S  
3.45X3.45mm SMD LED WITH CERAMIC SUB-  
STRATE  
PACKING & LABEL SPECIFICATIONS  
XZxxx160x  
TERMS OF USE  
1. Data presented in this document reflect statistical figures and should be treated as technical reference only.  
2. Contents within this document are subject to improvement and enhancement changes without notice.  
3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet.  
User accepts full risk and responsibility when operating the product(s) beyond their intended specifications.  
4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please  
consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life.  
5. The contents within this document may not be altered without prior consent by SunLED.  
6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp  
Sep 17, 2016  
XDSB7939 V4-Z Layout: Maggie L.  
P. 6/9  
Part Number: XZCB14X160S  
3.45X3.45mm SMD LED WITH CERAMIC SUB-  
STRATE  
Handling Precautions  
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic  
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.  
As a result, special handling precautions need to be observed during assembly using silicone encapsulated  
LED products. Failure to comply might lead to damage and premature failure of the LED.  
1. Handle the component along the side surfaces by using forceps or appropriate tools.  
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.  
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or  
damage the internal circuitry.  
4.1. There should be enough space inside the nozzle to avoid contact with the dome lens during pick up.  
4.2. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.  
4.3. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.  
4.4. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise  
pickup and avoid damage during production.  
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of lead-  
frame. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.  
Sep 17, 2016  
XDSB7939 V4-Z Layout: Maggie L.  
P. 7/9  
Part Number: XZCB14X160S  
3.45X3.45mm SMD LED WITH CERAMIC SUB-  
STRATE  
Designing the Position of LED on a Board.  
1.No twist/warp/bent/or other stress shall be applied to the board after mounting LED with  
solder to avoid a crack of LED package.  
Refer to the following recommended position and direction of LED.  
Appropriate LED mounting is to place perpendicularly against the stress affected side.  
2.Depending on the position and direction of LED,the mechanical stress on the LED package can be changed.  
Refer to the following figure.  
3.Do not split board by hand.Split with exclusive special tool.  
4.If an aluminum circuit board is used,a large stress by thermal shock might cause a solder crack.  
For this reason,it is recommended an appropriate verification should be taken before use.  
JEDEC Moisture Sensitivity:  
Soak Requirements  
Accelerated Equivalent  
Level  
Floor Life  
Standard  
Time (hours)  
Time  
Time  
Conditions  
Conditions  
Conditions  
(hours)  
168  
+ 5 / - 0  
1
Unlimited  
85 °C / 85% RH  
£ 30 °C / 85% RH  
SunLED recommends keeping the LEDs in the sealed moisture-barrier packaging until immediately prior to use. Any unused LEDs should be re-  
turned to the moisture-barrier bag and closed immediately after use.  
ESD Protection During Production  
Electric static discharge can result when static-sensitive products come in contact with the operator or other conductors.  
The following procedures may decrease the possibility of ESD damage:  
1.Minimize friction between the product and surroundings to avoid static buildup.  
2.All production machinery and test instruments must be electrically grounded.  
3.Operators must wear anti-static bracelets.  
4.Wear anti-static suit when entering work areas with conductive machinery.  
5.Set up ESD protection areas using grounded metal plating for component handling.  
6.All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less.  
7.Maintain a humidity level of 50% or higher in production areas.  
8.Use anti-static packaging for transport and storage.  
9.All anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality.  
Sep 17, 2016  
XDSB7939 V4-Z Layout: Maggie L.  
P. 8/9  
Part Number: XZCB14X160S  
3.45X3.45mm SMD LED WITH CERAMIC SUB-  
STRATE  
Reliability Test Items And Conditions  
The reliability of products shall be satisfied with items listed below  
Lot Tolerance Percent Defective (LTPD) : 10%  
Number of  
Damaged  
No. Test Item  
Standards  
Test Condition  
Test Times / Cycles  
1,000 h  
Ta =25°C +10/-5°C ,RH=55+/-20%RH  
IF = maximum rated current*  
1
2
3
Continuous operating test  
-
-
-
0 / 22  
Ta = 100°C(+/-10°C)  
IF = maximum rated current*  
High Temp. operating test  
Low Temp. operating test  
1,000 h  
0 / 22  
0 / 22  
Ta = -40°C+3/-5°C  
IF = maximum rated current*  
1,000 h  
Ta = 100°C(+/-10°C)  
Ta = maximum rated storage tempera-  
ture  
JEITA ED-  
4701/200 201  
4
High temp. storage test  
1,000 h  
0 / 22  
JEITA ED-  
4701/200 202  
5
6
Low temp. storage test  
Ta = -40°C+3/-5°C  
1,000 h  
1,000 h  
0 / 22  
0 / 22  
JEITA ED-  
4701/100 103  
High temp. & humidity storage test  
Ta = 60°C+5/-3°C, RH = 90+5/-10%RH  
Ta = 60°C+5/-3°C, RH = 90%+5/-10%RH  
IF = maximum rated current*  
7
8
9
High temp. & humidity operating test  
-
1,000h  
2 times  
0 / 22  
0 / 22  
0 / 22  
Resistance to Soldering Heat  
(Reflow Soldering)  
JEITA ED-  
4701/300 301  
Tsld=260°C,10sec  
Solderability  
(Reflow Soldering)  
JEITA ED-  
4701/303 303A  
Tsld=245°C+/-5°C,5+/-1sec  
1 time over 95%  
-40°C(30min) ~25°C(5min)~100°C  
(30min) ~25°C(5min)  
IF = derated current at 100°C  
10  
11  
12  
Temperature Cycle operating test  
Temperature Cycle  
-
10cycles  
100cycles  
500 cycles  
0 / 22  
0 / 22  
0 / 22  
JEITA ED-  
4701/100 105  
-40°C(30min) ~25°C(5min)~100°C  
(30min) ~25°C(5min)  
Thermal shock test  
MIL-STD-202G  
Ta = -40°C(15min) ~100°C(15min)  
JEITA ED-  
4701/300 304  
13  
14  
Electric Static Discharge (ESD)  
Vibration test  
C = 100pF , R= 1.5KΩ V = 8000 V  
3 times Negative/Positive  
48min.  
0 / 22  
0 / 22  
100~2000~100HZ Sweep 4min.  
200m/s²  
JEITA ED-  
4701/400 403  
3directions,4cycles  
Note : Refer to forward current vs. derating curve diagram.  
Failure Criteria  
Criteria for Judgement  
Item  
Symbol  
Test Conditions  
Min.  
Max.  
Forward Voltage  
Luminous Flux  
VF  
IF = 350mA  
IF = 350mA  
-
Initial Level x 1.1  
-
Φv  
Initial Level x 0.7  
Note: The test is performed after the board is cooled down to the room temperature.  
Sep 17, 2016  
XDSB7939 V4-Z Layout: Maggie L.  
P. 9/9  
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