SPECIFICATIONS
BGA 940 AM2
BGA CPU Socket
BGA SMT Type
1.27X1.27mm [.05X.05”] Pitch
940 Pos.
Mechanical
Contact Rentention Force: 0.13kgf min.
Durability: 50 Cycles min.
Solder Ball Shear Force: 750gf min.
Unlatch Force: 240gf min.
Electrical
Contact Resistance : 25 mW max.
Insulation Resistance: 1000mW min.
Dielectric Withstanding Voltage: 650 VAC min.
Physical
Base: Thermoplastic, UL 94V-0 rated, Black Color
Cover: Thermoplastic, UL 94V-0 rated, Natural Color
Cam:Stainless Steel
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
Operating Temperature: -55℃ to +110℃
DRAWING
LF
ORDERING INFORMATION
PRODUCT NO.: P Z 9 4 0 2 A - 31 5 6 - 0 1 F
Actual Loading
NO. of Pos.
940=940 Pos.
F=Lead Free
Identification Code
Pick-up Design
3=PI Film
Solder Ball Type:
2=Sn/Ag/Cu Type
Package
0=Hard Tray
Gold Plating On
Contact Area
A=8~12u" Pd/Ni +Gold Flash Plating
On Contact Area
Handle Design
6=Metal Cam
Base Color
5=Black Color for BGA 940 AM2
Grid Array Type
31=31X31
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
