SPECIFICATIONS
BGA 939
BGA CPU Socket
BGA SMT Type
1.27X1.27mm [.05 X.05”]Pitch
939 Pos.
Mechanical
Contact Rentention Force: 0.13kgf min.
Durability: 50 Cycles min.
Solder Ball Shear Force: 750gf min.
Unlatch Force: 240gf min.
Electrical
Contact Resistance : 20 mW max.
Insulation Resistance: 1000mW min.
Dielectric Withstanding Voltage: 650 VAC min.
Physical
Base: Thermoplastic, UL 94V-0 rated, Black Color
Cover: Thermoplastic, UL 94V-0 rated, Natural Color
Cam: Stainless Steel
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
Operating Temperature: -55℃ to +110℃
DRAWING
ORDERING INFORMATION
PRODUCT NO.: P Z 9 3 9 0 7 - 31 4 6 - 0 1
Actual Loading
NO. of Pos.
939=939 Pos.
Pick-up Design
1=Plastic Cap
Solder Ball Type:
0=Sn/Pb Type
Package
0=Hard Tray
Gold Plating On
Contact Area
7=15u" Gold Plating On Contact Area
Handle Design
6=Metal Cam
Base Color
4=Black
Grid Array Type
31=31X31
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
