SPECIFICATIONS
Socket 940
BGA Series CPU Socket
Mechanical
Contact Retention Force: 0.13Kg min.
Durability: 50 Cycles
Vertical, SMT Type
1.27mm [.050”] Pitch
940 Pos.
Electrical
Contact Resistance: 25mW max.
Dielectric Withstanding Voltage: 650V RMS min.
Insulation Resistance: 1000MW min.
Physical
Cover: Thermoplastic, UL 94V-0 rated, Natural Color
Base: Thermoplastic, UL 94V-0 rated, Black Color
Cam: Stainless Steel
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
Operating Temperature: -40℃ to +105℃
DRAWING
ORDERING INFORMATION
DIM A.
The Socket height:
PRODUCT NO.: P Z 940 * 3 - 31 4 6 - 0 3
Before Soldering Process:4.20±0.02mm
After Soldering Process:4.00±0.20mm
P=PGA Socket
Pick-Up Design
3=Pi-Film
ZIF
Package
0=Hard Tray
No. Of Pos.
6=Metal Lever
940=940 Pos.
Base Color
4=Black
Termination Type & Length
0=63/37 Sn/Pb;1=Lead Free Type
Grid Array Type
31=31*31 for SKT 940
Contact Area Pating
3=30m" Gold
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
