SPECIFICATIONS
BGA 754 LP
BGA CPU Socket
BGA SMT Type
1.27X1.27mm [.05 X.05”] Pitch
754 Pos.
Mechanical
Contact Rentention Force: 0.13kgf min.
Durability: 50 Cycles min.
Solder Ball Shear Force: 1000gf min.
Electrical
Contact Resistance : 17 mW max.
Insulation Resistance: 1000mW min.
Dielectric Withstanding Voltage: 650 VAC min.
Self Inductance: 4 nH max.
Mutual Capacitance: 1 pF max.
Physical
Base: Thermoplastic, UL 94V-0 rated, Black Color
Cover: Thermoplastic, UL 94V-0 rated, Natural Color
Cam: Stainless Steel
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
Operating Temperature: -55℃ to +110℃
DRAWING
ORDERING INFORMATION
PRODUCT NO.: P Z 7 5 4 0 3 - 29 4 C - 0 1
Actual Loading
NO. of Pos.
754=754Pos.
Pick-up Design
1=Plastic Cap
Solder Ball Type:
0=Sn/Pb Type
Package
0=Hard Tray
Gold Plating On
Contact Area
3=30u" Gold Plating On Contact Area
Handle Design
C=For Low Profile
Metal Cam
Base Color
4=Black
Grid Array Type
29=29X29
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
