SPECIFICATIONS
Socket 754
BGA Series CPU Socket
Mechanical
Vertical, SMT Type
1.27mm [.050”] Pitch
754 Pos.
Contact Retention Force: 0.13Kg min.
Durability: 50 Cycles
Electrical
Low Level Circuit Resistance (LLCR): 20mΩ max.
Insulation Resistance: 1000MΩ min.
Dielectric Withstanding Voltage(650 V AC): No Flashover or
Breakdown
Self–inductance: 4nH max.
Mutual Capacitance: 1pF max.
Physical
Cover: Thermoplastic, UL 94V-0 rated
Base: Thermoplastic, UL 94V-0 rated
Cam: Thermoplastic, UL 94V-0 rated
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
Operating Temperature: -55℃ to +125℃
DRAWING
Socket 754
ORDERING INFORMATION
PRODUCT NO.: P Z 7 5 4 0 3 - 2 9 4 8 - 0
1
Base Color
P=PGA Socket
ZIF
4=Black
Pick-up Design
Actual Loading Contacts No.
1=Cap
754=754 Pos
Package
Soldering Type
Grid Array Type
0=Hardtray
0= Solder Ball 63/37 Sn/Pb
29=29x29
Actuation&Body Type
Contact Plating
8=Handle Design
3=30u'' Au
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
10