SPECIFICATIONS
mPGA700 Socket
BGA Series CPU Socket
Vertical, SMT Type
1.27mm [.050”] Pitch
700 Pos.
Mechanical
Contact Retention Force: 0.065Kg min.
Durability: 50 Cycles
Electrical
Contact Resistance: 35mW max.
Dielectric Withstanding Voltage:
400V RMS min.
Insulation Resistance: 800MW min.
Physical
Cover: Thermoplastic, UL 94V-0 rated, Natural Color
Base: Thermoplastic, UL 94V-0 rated, Black Color
Cam: Zinc Alloy
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
Operating Temperature: -40℃ to +105℃
DRAWING
ORDERING INFORMATION
DIM A.
The Socket Height:
4.15±.20mm Before Soldering On Board
4.00±.20mm After Soldering On Board.
PRODUCT NO.: P Z 700 * 3 - 0 0 3 - S
P=PGA Socket
ZIF
DIM B.
7.00 Max After Reflow.
S=Standard Type
Actual Loading Contacts No.
700=700 Pos.
Termination Type
0=63/37 Sn/Pb;1=Lead Free Type
Contact Area Plating
003=W/ Indicator
3=30m" Gold
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
