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SZMM5Z16VST1G

型号:

SZMM5Z16VST1G

品牌:

ONSEMI[ ONSEMI ]

页数:

4 页

PDF大小:

93 K

MM5ZxxxST1G Series,  
SZMM5ZxxxST1G Series  
Zener Voltage Regulators  
500 mW SOD523 Surface Mount  
This series of Zener diodes is packaged in a SOD523 surface  
mount package. They are designed to provide voltage regulation  
protection and are especially attractive in situations where space is at a  
premium. They are well suited for applications such as cellular  
phones, hand held portables, and high density PC boards.  
http://onsemi.com  
SOD523  
CASE 502  
STYLE 1  
Specification Features  
Standard Zener Breakdown Voltage Range 2.4 V to 18 V  
Steady State Power Rating of 500 mW  
Small Body Outline Dimensions:  
0.047x 0.032(1.20 mm x 0.80 mm)  
1
2
Low Body Height: 0.028(0.7 mm)  
Cathode  
Anode  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
Tight Tolerance V  
Z
MARKING DIAGRAM  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AECQ101 Qualified and  
PPAP Capable  
These Devices are PbFree and are RoHS Compliant*  
XX MG  
G
2
1
XX = Specific Device Code  
Mechanical Characteristics  
M
Date Code*  
G
= PbFree Package  
(Note: Microdot may be in either location)  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94, V0  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
*Date Code orientation may vary depending  
upon manufacturing location.  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
ORDERING INFORMATION  
MAXIMUM RATINGS  
Device  
Package  
Shipping  
Rating  
Symbol  
Max  
Unit  
MM5ZxxxST1G  
SOD523  
(PbFree)  
3,000 /  
Tape & Reel  
Total Device Dissipation FR4 Board,  
P
D
(Note 1) @ T = 25°C  
500  
4.0  
mW  
mW/°C  
A
SZMM5ZxxxST1G SOD523  
(PbFree)  
3,000 /  
Tape & Reel  
Derate above 25°C  
Thermal Resistance from  
JunctiontoAmbient (Note 1)  
R
250  
°C/W  
SZMM5ZxxxST5G  
SOD523  
(PbFree)  
8,000 /  
Tape & Reel  
q
JA  
Junction and Storage Temperature Range  
T , T  
65 to  
°C  
J
stg  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
+150  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. FR4 printed circuit board, singlesided copper, mounting pad 1 cm .  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
January, 2014 Rev. 11  
MM5Z2V4ST1/D  
 
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series  
ELECTRICAL CHARACTERISTICS  
(T = 25°C unless otherwise noted,  
A
I
V = 0.9 V Max. @ I = 10 mA for all types)  
F
F
I
F
Symbol  
Parameter  
V
Reverse Zener Voltage @ I  
Reverse Current  
Z
ZT  
I
ZT  
Z
Maximum Zener Impedance @ I  
Reverse Current  
ZT  
ZK  
ZT  
V
Z
V
R
V
I
V
F
R
ZT  
I
I
Z
ZK  
Maximum Zener Impedance @ I  
ZK  
I
Reverse Leakage Current @ V  
Reverse Voltage  
R
R
V
R
I
F
Forward Current  
V
Forward Voltage @ I  
F
F
Figure 1. Zener Voltage Regulator  
QV  
Maximum Temperature Coefficient of V  
Z
Z
C
Max. Capacitance @V = 0 and f = 1 MHz  
R
ELECTRICAL CHARACTERISTICS (V = 0.9 Max @ I = 10 mA for all types)  
F
F
Z
ZT  
Zener Voltage  
VZ  
Max  
IR @ VR  
d
@ I  
/dt (mV/k)  
VZ  
I = IZT  
Z
I
Z
Z
ZK  
= 5 mA  
ZT1  
@ 10%  
Mod W  
Max  
Test  
Current  
Izt mA  
C pF Max @  
= 1.0  
mA W  
Max  
Device  
Marking  
V = 0  
R
Min  
2.43  
2.67  
3.32  
3.60  
3.89  
4.17  
4.55  
4.98  
5.49  
6.06  
6.65  
7.28  
8.02  
8.85  
11.74  
15.85  
17.56  
Max  
2.63  
2.91  
3.53  
3.85  
4.16  
4.43  
4.75  
5.2  
mA  
V
Min  
3.5  
3.5  
3.5  
3.5  
3.5  
3.5  
3.5  
2.7  
2.0  
0.4  
Max  
0
f = 1 MHz  
450  
450  
450  
450  
450  
450  
260  
225  
200  
185  
155  
140  
135  
130  
130  
105  
100  
Device*  
MM5Z2V4ST1G  
MM5Z2V7ST1G  
MM5Z3V3ST1G  
MM5Z3V6ST1G  
MM5Z3V9ST1G  
MM5Z4V3ST1G  
MM5Z4V7ST1G/T5G  
MM5Z5V1ST1G  
MM5Z5V6ST1G  
MM5Z6V2ST1G  
MM5Z6V8ST1G  
MM5Z7V5ST1G  
MM5Z8V2ST1G  
MM5Z9V1ST1G  
MM5Z12VST1G  
MM5Z16VST1G  
MM5Z18VST1G  
T2  
T3  
T5  
T6  
T7  
T8  
T9  
TA  
TC  
TE  
TF  
TG  
TH  
TK  
TN  
TU  
TW  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
1000  
1000  
1000  
1000  
1000  
1000  
800  
500  
200  
100  
160  
160  
160  
160  
80  
100  
100  
95  
90  
90  
90  
80  
60  
40  
10  
15  
15  
15  
15  
25  
40  
45  
120  
100  
5.0  
5.0  
3.0  
3.0  
3.0  
2.0  
1.0  
3.0  
2.0  
1.0  
0.7  
0.5  
0.1  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
2.0  
2.0  
2.0  
4.0  
4.0  
5.0  
5.0  
6.0  
8.0  
0
0
0
2.5  
0
0.2  
1.2  
2.5  
3.7  
4.5  
5.3  
6.2  
7.0  
10  
14  
16  
5.73  
6.33  
6.93  
7.6  
1.2  
2.5  
8.36  
9.23  
12.24  
16.51  
18.35  
3.2  
3.8  
6.0  
80  
0.05 11.2  
0.05 12.6  
10.4  
12.4  
80  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
*Include SZ-prefix devices where applicable.  
http://onsemi.com  
2
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series  
TYPICAL CHARACTERISTICS  
100  
80  
60  
40  
20  
0
0
25  
50  
75  
100  
125  
150  
TEMPERATURE (°C)  
Figure 2. Steady State Power Derating  
http://onsemi.com  
3
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series  
PACKAGE DIMENSIONS  
SOD523  
CASE 502  
ISSUE E  
X−  
D
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.  
Y−  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.  
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF  
BASE MATERIAL.  
E
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-  
TRUSIONS, OR GATE BURRS.  
1
2
2X b  
MILLIMETERS  
M
0.08  
X Y  
DIM  
A
b
c
D
E
HE  
L
MIN  
0.50  
0.25  
0.07  
1.10  
0.70  
1.50  
NOM  
0.60  
0.30  
0.14  
1.20  
0.80  
1.60  
0.30 REF  
0.20  
MAX  
0.70  
0.35  
0.20  
1.30  
0.90  
1.70  
TOP VIEW  
A
L2  
0.15  
0.25  
STYLE 1:  
c
HE  
PIN 1. CATHODE (POLARITY BAND)  
2. ANODE  
SIDE VIEW  
RECOMMENDED  
SOLDERING FOOTPRINT*  
2X  
L
1.80  
2X  
0.48  
2X  
0.40  
2X  
L2  
PACKAGE  
OUTLINE  
BOTTOM VIEW  
DIMENSION: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81358171050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MM5Z2V4ST1/D  
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