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SZMMBZ4252T1G

型号:

SZMMBZ4252T1G

描述:

24和40瓦的峰值功率齐纳瞬态电压抑制器[ 24 and 40 Watt Peak Power Zener Transient Voltage Suppressors ]

品牌:

ONSEMI[ ONSEMI ]

页数:

7 页

PDF大小:

142 K

MMBZxxxALT1G Series,  
SZMMBZxxxALT1G Series  
24 and 40 Watt Peak Power  
Zener Transient Voltage  
Suppressors  
http://onsemi.com  
SOT23 Dual Common Anode Zeners  
for ESD Protection  
These dual monolithic silicon Zener diodes are designed for  
applications requiring transient overvoltage protection capability. They  
are intended for use in voltage and ESD sensitive equipment such as  
computers, printers, business machines, communication systems,  
medical equipment and other applications. Their dual junction common  
anode design protects two separate lines using only one package. These  
devices are ideal for situations where board space is at a premium.  
SOT23  
CASE 318  
STYLE 12  
CATHODE 1  
CATHODE 2  
3 ANODE  
Features  
SOT23 Package Allows Either Two Separate Unidirectional  
Configurations or a Single Bidirectional Configuration  
Working Peak Reverse Voltage Range 3 V to 26 V  
MARKING DIAGRAM  
Standard Zener Breakdown Voltage Range 5.6 V to 33 V  
Peak Power 24 or 40 W @ 1.0 ms (Unidirectional),  
per Figure 6 Waveform  
ESD Rating:  
xxxMG  
G
Class 3B (> 16 kV) per the Human Body Model  
Class C (> 400 V) per the Machine Model  
1
Maximum Clamping Voltage @ Peak Pulse Current  
Low Leakage < 5.0 mA  
Flammability Rating UL 94 V0  
xxx = Specific Device Code  
M
= Date Code  
G
= PbFree Package  
(Note: Microdot may be in either location)  
AECQ101 Qualified and PPAP Capable  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
PbFree Packages are Available*  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Mechanical Characteristics  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the table on page 3 of this data sheet.  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260C for 10 Seconds  
Package designed for optimal automated board assembly  
Small package size for high density applications  
Available in 8 mm Tape and Reel  
Use the Device Number to order the 7 inch/3,000 unit reel.  
Replace the “T1” with “T3” in the Device Number to order the  
13 inch/10,000 unit reel.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
January, 2012 Rev. 13  
MMBZ5V6ALT1/D  
MMBZxxxALT1G Series, SZMMBZxxxALT1G Series  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Peak Power Dissipation @ 1.0 ms (Note 1)  
MMBZ5V6ALT1G thru MMBZ9V1ALT1G  
MMBZ12VALT1G thru MMBZ33VALT1G  
P
pk  
24  
40  
W
@ T 25C  
L
Total Power Dissipation on FR5 Board (Note 2)  
P   
D
@ T = 25C  
225  
1.8  
mW  
mW/C  
A
Derate above 25C  
Thermal Resistance JunctiontoAmbient  
R
556  
C/W  
q
JA  
Total Power Dissipation on Alumina Substrate (Note 3)  
P   
D
@ T = 25C  
300  
2.4  
mW  
mW/C  
A
Derate above 25C  
Thermal Resistance JunctiontoAmbient  
Junction and Storage Temperature Range  
Lead Solder Temperature Maximum (10 Second Duration)  
R
417  
55 to +150  
260  
C/W  
C  
q
JA  
T , T  
J
stg  
T
C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. Nonrepetitive current pulse per Figure 6 and derate above T = 25C per Figure 7.  
A
2. FR5 = 1.0 x 0.75 x 0.62 in.  
3. Alumina = 0.4 x 0.3 x 0.024 in, 99.5% alumina.  
*Other voltages may be available upon request.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MMBZ5V6ALT1G  
SOT23  
3,000 / Tape & Reel  
3,000 / Tape & Reel  
10,000 / Tape & Reel  
3,000 / Tape & Reel  
3,000 / Tape & Reel  
10,000 / Tape & Reel  
3,000 / Tape & Reel  
10,000 / Tape & Reel  
3,000 / Tape & Reel  
3,000 / Tape & Reel  
10,000 / Tape & Reel  
10,000 / Tape & Reel  
(PbFree)  
SZMMBZ5V6ALT1G  
MMBZ5V6ALT3G  
MMBZ6VxALT1G  
SZMMBZ6VxALT1G  
MMBZ6VxALT3G  
MMBZ9V1ALT1G  
MMBZ9V1ALT13G  
MMBZxxVALT1G  
SZMMBZxxVALT1G  
MMBZxxVALT3G  
SZMMBZxxVALT3G  
SOT23  
(PbFree)  
SOT23  
(PbFree)  
SOT23  
(PbFree)  
SOT23  
(PbFree)  
SOT23  
(PbFree)  
SOT23  
(PbFree)  
SOT23  
(PbFree)  
SOT23  
(PbFree)  
SOT23  
(PbFree)  
SOT23  
(PbFree)  
SOT23  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
2
 
MMBZxxxALT1G Series, SZMMBZxxxALT1G Series  
ELECTRICAL CHARACTERISTICS  
(T = 25C unless otherwise noted)  
A
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)  
Symbol  
Parameter  
I
I
PP  
Maximum Reverse Peak Pulse Current  
I
F
V
C
Clamping Voltage @ I  
PP  
V
RWM  
Working Peak Reverse Voltage  
I
R
Maximum Reverse Leakage Current @ V  
RWM  
V
Breakdown Voltage @ I  
Test Current  
BR  
T
V
C
V
V
BR RWM  
V
I
I
V
F
T
R
T
I
QV  
Maximum Temperature Coefficient of V  
BR  
BR  
I
F
Forward Current  
V
Forward Voltage @ I  
F
F
I
PP  
Z
ZT  
Maximum Zener Impedance @ I  
Reverse Current  
ZT  
I
ZK  
UniDirectional TVS  
Z
ZK  
Maximum Zener Impedance @ I  
ZK  
ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted)  
A
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)  
(V = 0.9 V Max @ I = 10 mA)  
24 WATTS  
F
F
Max Zener  
V @ I  
C PP  
Impedance (Note 5)  
(Note 6)  
Breakdown Voltage  
Z
@ I  
I
V
@
RWM  
mA  
ZT  
R
V
(Note 4) (V)  
@ I  
Z
ZK  
@ I  
V
C
I
PP  
V
RWM  
ZT  
QV  
BR  
BR  
T
ZK  
Device  
mV/5C  
1.26  
2.80  
3.4  
Volts  
3.0  
Min  
Nom  
5.6  
Max  
5.88  
6.51  
7.14  
9.56  
mA  
20  
W
11  
W
mA  
1600 0.25  
V
A
Marking  
Device*  
MMBZ5V6ALT1G/T3G  
MMBZ6V2ALT1G  
MMBZ6V8ALT1G  
MMBZ9V1ALT1G  
5A6  
6A2  
6A8  
9A1  
5.0  
0.5  
0.5  
0.3  
5.32  
5.89  
6.46  
8.65  
8.0  
3.0  
3.0  
6.2  
1.0  
1.0  
1.0  
8.7 2.76  
4.5  
6.8  
9.6  
14  
2.5  
1.7  
6.0  
9.1  
7.5  
(V = 0.9 V Max @ I = 10 mA)  
40 WATTS  
F
F
Breakdown Voltage  
V
V
@ I (Note 6)  
C
PP  
I
V
@
RWM  
nA  
R
V
Min  
(Note 4) (V)  
@ I  
I
PP  
V
RWM  
QV  
BR  
T
C
BR  
Device  
mV/5C  
Volts  
8.5  
12  
Nom  
12  
Max  
mA  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
V
A
Marking  
Device*  
MMBZ12VALT1G  
MMBZ15VALT1G  
MMBZ18VALT1G  
MMBZ20VALT1G  
12A  
15A  
18A  
20A  
27A  
33A  
200  
50  
50  
50  
50  
50  
11.40  
14.25  
17.10  
19.00  
25.65  
31.35  
12.60  
15.75  
18.90  
21.00  
28.35  
34.65  
17  
21  
25  
28  
40  
46  
2.35  
1.9  
7.5  
15  
12.3  
15.3  
17.2  
24.3  
30.4  
14.5  
17  
18  
1.6  
20  
1.4  
MMBZ27VALT1G/T3G  
MMBZ33VALT1G  
22  
27  
1.0  
26  
33  
0.87  
4. V measured at pulse test current I at an ambient temperature of 25C.  
BR  
T
5. Z and Z are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for I  
ZT  
= 0.1 I  
ZK  
Z(AC)  
, with the AC frequency = 1.0 kHz.  
Z(DC)  
6. Surge current waveform per Figure 6 and derate per Figure 7  
* Include SZ-prefix devices where applicable.  
http://onsemi.com  
3
 
MMBZxxxALT1G Series, SZMMBZxxxALT1G Series  
TYPICAL CHARACTERISTICS  
18  
15  
12  
9
1000  
100  
10  
1
6
3
0
0.1  
0.01  
40  
0
+50  
+100  
+150  
40  
+25  
+85  
+125  
TEMPERATURE (C)  
TEMPERATURE (C)  
Figure 1. Typical Breakdown Voltage  
versus Temperature  
Figure 2. Typical Leakage Current  
versus Temperature  
(Upper curve for each voltage is bidirectional mode,  
lower curve is unidirectional mode)  
320  
60  
280  
240  
200  
160  
120  
80  
50  
40  
30  
20  
10  
0
27 V  
5.6 V  
15 V  
33 V  
40  
0
0
1
2
3
0
1
2
3
BIAS (V)  
BIAS (V)  
Figure 3. Typical Capacitance versus Bias Voltage  
(Upper curve for each voltage is unidirectional mode,  
lower curve is bidirectional mode)  
Figure 4. Typical Capacitance versus Bias Voltage  
(Upper curve for each voltage is unidirectional mode,  
lower curve is bidirectional mode)  
300  
250  
ALUMINA SUBSTRATE  
200  
150  
100  
50  
FR5 BOARD  
0
0
25  
50  
75  
100  
125  
150  
175  
TEMPERATURE (C)  
Figure 5. Steady State Power Derating Curve  
http://onsemi.com  
4
MMBZxxxALT1G Series, SZMMBZxxxALT1G Series  
TYPICAL CHARACTERISTICS  
100  
PULSE WIDTH (t ) IS DEFINED  
P
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
AS THAT POINT WHERE THE  
PEAK CURRENT DECAYS TO  
t 10 ms  
r
50% OF I .  
PP  
100  
PEAK VALUE I  
PP  
I
PP  
HALF VALUE −  
2
50  
0
t
P
0
1
2
3
4
0
25  
50  
75  
100  
125  
150 175 200  
t, TIME (ms)  
T , AMBIENT TEMPERATURE (C)  
A
Figure 6. Pulse Waveform  
Figure 7. Pulse Derating Curve  
100  
100  
10  
1
RECTANGULAR  
WAVEFORM, T = 25C  
RECTANGULAR  
WAVEFORM, T = 25C  
A
A
BIDIRECTIONAL  
BIDIRECTIONAL  
10  
UNIDIRECTIONAL  
UNIDIRECTIONAL  
1
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
PW, PULSE WIDTH (ms)  
PW, PULSE WIDTH (ms)  
Figure 8. Maximum Nonrepetitive Surge  
Figure 9. Maximum Nonrepetitive Surge  
Power, Ppk versus PW  
Power, Ppk(NOM) versus PW  
Power is defined as V  
x I (pk) where V  
is  
Power is defined as V (NOM) x I (pk) where  
Z Z  
RSM  
Z
RSM  
the clamping voltage at I (pk).  
V (NOM) is the nominal Zener voltage measured at  
Z
Z
the low test current used for voltage classification.  
http://onsemi.com  
5
MMBZxxxALT1G Series, SZMMBZxxxALT1G Series  
TYPICAL COMMON ANODE APPLICATIONS  
A quad junction common anode design in a SOT23  
package protects four separate lines using only one package.  
This adds flexibility and creativity to PCB design especially  
when board space is at a premium. Two simplified examples  
of TVS applications are illustrated below.  
Computer Interface Protection  
A
B
C
D
KEYBOARD  
TERMINAL  
PRINTER  
ETC.  
FUNCTIONAL  
DECODER  
I/O  
GND  
MMBZ5V6ALT1G  
THRU  
MMBZ33VALT1G  
Microprocessor Protection  
V
V
DD  
GG  
ADDRESS BUS  
RAM  
ROM  
DATA BUS  
CPU  
MMBZ5V6ALT1G  
THRU  
I/O  
MMBZ33VALT1G  
CLOCK  
CONTROL BUS  
GND  
MMBZ5V6ALT1G  
THRU  
MMBZ33VALT1G  
http://onsemi.com  
6
MMBZxxxALT1G Series, SZMMBZxxxALT1G Series  
PACKAGE DIMENSIONS  
SOT23 (TO236)  
CASE 31808  
ISSUE AP  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
D
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH  
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM  
THICKNESS OF BASE MATERIAL.  
SEE VIEW C  
3
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS, OR GATE BURRS.  
H
E
MILLIMETERS  
INCHES  
E
DIM  
A
A1  
b
c
D
E
e
L
L1  
MIN  
0.89  
0.01  
0.37  
0.09  
2.80  
1.20  
1.78  
0.10  
0.35  
2.10  
0  
NOM  
1.00  
0.06  
0.44  
0.13  
2.90  
1.30  
1.90  
0.20  
0.54  
2.40  
−−−  
MAX  
MIN  
0.035  
0.001  
0.015  
0.003  
0.110  
0.047  
0.070  
0.004  
0.014  
0.083  
0  
NOM  
0.040  
0.002  
0.018  
0.005  
0.114  
0.051  
0.075  
0.008  
0.021  
0.094  
−−−  
MAX  
0.044  
0.004  
0.020  
0.007  
0.120  
0.055  
0.081  
0.012  
0.029  
0.104  
10  
1.11  
0.10  
0.50  
0.18  
3.04  
1.40  
2.04  
0.30  
0.69  
2.64  
10  
c
1
2
b
0.25  
e
q
H
A
E
q
L
STYLE 12:  
A1  
L1  
VIEW C  
PIN 1. CATHODE  
2. CATHODE  
3. ANODE  
SOLDERING FOOTPRINT  
0.95  
0.037  
0.95  
0.037  
2.0  
0.079  
0.9  
0.035  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
0.8  
0.031  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81358171050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MMBZ5V6ALT1/D  
厂商 型号 描述 页数 下载

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