SZMD05C
150W, 5 V
Transient Voltage Suppressors
for ESD Protection
Elektronische Bauelemente
RATINGS AND CHARACTERISTICS CURVES
Clamping Voltage vs. Peak Pulse Current
Power Derating Curve
110
100
90
80
70
60
50
40
30
20
10
0
12
10
8
6
4
2
Waveform
Parameters
tr = 8µs
td = 20µS
0
0
3
6
9
12
15
0
25
50
75
100
125
150
Peak Pulse Current - IPP (A)
o
Ambient Temperature - TA ( C)
Applications Information
Pulse Waveform
110
100
90
80
70
60
50
40
30
20
10
0
Device Connection Options
The SZMD05C is designed to protect one
bi-directional or two uni-directional data or l/O lines
operating at 5 volts.Connection options are as
follows:
‧Bidirectional:Pin 1 is connected to the data line and
pin 2 is connected to ground (Since the device lls
symmetrical,these conmtions may be re- Ver3ed).For
best results,the ground connection should be made
directly to a ground plane on the board.The path
length should be kept as short as possible to minimize
parasitic inductance-Pin 3 is not connected.
‧Unidirectional:Data lines are connected
Wave form
Paramete rs:
tr = 8
s
td = 20
s
e-t
td = IPP /2
0
5
10
15
20
25
30
Time (us)
to pin1 and pin2.Pin 3 is connected to ground.For
best results,this pin should be connected directly to a
ground plane on the board.The path lengh should be
kept as short as possible to minimize parasitic
inductance. Circuit Board Layout Recommendations
for suppression of ESD. Good circuit board layout is
critical for the suppression of fast rise-time transients
such as ESD.The following guidelines are
recommended (Refer to application note Sl99.01 for
more detailed information): ‧Place the TVS near the
input terminals or connectors to restrict transient
coupling. ‧Minimize the path length between the
TVS and the protected line. ‧Minimize all conductive
loops including power and ground loops. ‧The ESD
transient return path toground should be kept as short
as possible. ‧Never run critical signals near board
edges
‧Use ground planes whenever possib|e.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
01-June-2002 Rev. A
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