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SZAF07

型号:

SZAF07

描述:

WHITE SIDE VIEW LED[ WHITE SIDE VIEW LED ]

品牌:

SEOUL[ Seoul Semiconductor ]

页数:

15 页

PDF大小:

818 K

SPECIFICATION  
ITEM  
MODEL  
WHITE SIDE VIEW LED  
SZAF07  
CUSTOMER  
Customer  
Approved by Approved by Approved by  
/
/
/
Supplier  
Drawn by  
Checked by Approved by  
/
/
/
SEOUL SEMICONDUCTOR CO., LTD.  
SZAF07  
Rev. 1.00  
Contents  
1. Features  
02  
02  
03  
03  
04  
06  
09  
10  
11  
12  
13  
14  
15  
2. Applications  
3. Absolute Maximum Ratings  
4. Electro-Optical Characteristics  
5. CIE Chromaticity Diagram  
6. Characteristic Diagram  
7. Reliability  
8. Precautions  
9. Soldering Profile  
10. Outline Dimension  
11. Packing  
12. Reel Packing Structure  
13. History  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
1
SZAF07  
Rev. 1.00  
1. Features  
Package: SMT Solderability  
Dimension : 3.8 × 1.05 × 0.6 (mm)  
Low Thermal Resistance  
RoHS Compliant, Lead Free  
Suitable for Small Applications  
High ESD Voltage  
Own Patent Reserved  
SZAF07 is Very Useful Side View LED in Back Light Unit Application  
2. Applications  
Flat Backlighting (LCD, Display)  
Mobile Phone, Camera, PDA, Notebook  
Coupling into Light Guide Panel  
AV Systems  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
2
SZAF07  
Rev. 1.00  
3. Absolute Maximum Ratings  
(Ta = 25°C)  
Parameter  
Symbol  
Value  
Unit  
Pd*1  
IF  
Power Dissipation  
Forward Current  
120  
30  
mW  
mA  
mA  
V
*2  
Peak Forward Current  
Reverse Voltage  
100  
IFM  
5
VR  
Operating Temperature  
Storage Temperature  
Junction Temperature  
-30 ~ +85  
-40 ~ +100  
125  
°C  
Topr  
Tstg  
Tj  
°C  
°C  
*1 Care is to be taken that Power Dissipation does not exceed the Absolute Maximum Rating of the product.  
*2 FM conditions : Pulse width TW 0.1ms, Duty ratio 1/10  
I
4. Electro-Optical Characteristics  
(Ta = 25°C)  
Item  
Forward Voltage*  
Symbol  
Condition  
IF = 20 mA  
VR = 5 V  
Min  
Typ  
Max  
Unit  
Rank Y  
Rank Z  
Rank A  
2.7  
3.0  
3.3  
-
800  
900  
1000  
1100  
1200  
1300  
-
-
-
-
-
-
-
-
-
-
3.0  
3.3  
3.7  
50  
V
VF  
IR  
Reverse Current  
µA  
Mcd  
˚
Rank I8  
Rank I9  
Rank J0  
Rank J1  
Rank J2  
Rank J3  
900  
1000  
1100  
1200  
1300  
1400  
Luminous Intensity*1  
Viewing Angle *2  
IV  
IF = 20 mA  
IF = 20 mA  
IF = 20 mA  
120  
2θ1/2  
x
y
x
y
x
y
0.264  
0.248  
0.287  
0.276  
0.307  
0.294  
-
-
-
-
-
-
0.296  
0.295  
0.311  
0.315  
0.330  
0.339  
Rank b  
Rank e  
Rank f  
Color Coordinates  
*3  
*1 luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED  
package. Luminous Intensity Measurement allowance is ±10%.  
*2 θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity.  
*3 Measurement Uncertainty of the Color Coordinates is ±0.01  
*
Note : All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at  
20mA within the maximum ratings shown above.  
All measurements were made under the standardized environment of Seoul Semiconductor.  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
3
SZAF07  
Rev. 1.00  
5. CIE Chromaticity Diagram  
0.9  
0.40  
0.38  
0.36  
0.34  
0.32  
0.30  
0.28  
0.26  
0.24  
0.22  
520  
525  
515  
510  
530  
535  
540  
545  
550  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
g
h
555  
560  
565  
570  
575  
580  
585  
590  
595  
600  
610  
620  
505  
500  
d
f
c
495  
e
490  
630  
830  
b
485  
480  
475  
470  
460  
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8  
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38  
x Co o r d .  
x C o o r d .  
Luminous Intensity  
Ranking by Color Coordinates  
b1  
b2  
b3  
b4  
Ranking by Luminous Intensity  
D
I8  
I9  
J0  
J1  
J2  
J3  
E
F
G
H
I
*
The Checked ranks are available  
Color Rank  
(I  
F = 20 mA, Ta = 25°C)  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
4
SZAF07  
Rev. 1.00  
6. Characteristic Diagram  
Forward Current vs. Forward Voltage  
Intensity vs. Forward Current  
Ta = 25OC  
1800  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
Ta = 25OC  
10  
1
0
5
10  
15  
20  
25  
30  
35  
2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4  
Forward Current [mA]  
Forward Voltage [V]  
Forward Current vs. Ambient Temperature  
Radiation Diagram  
30  
25  
20  
15  
10  
5
1.0  
0.5  
0.0  
Ta = 25OC  
x axis  
axis  
y
y
x
0
-30 -15  
0
15 30 45 60 75 90  
-100 -80 -60 -40 -20  
0
20 40 60 80 100  
Theta  
Ambient temperature [oC]  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
5
SZAF07  
Rev. 1.00  
Color Coordinate vs. Forward Current  
Spectrum  
0.266  
0.265  
0.264  
0.263  
Ta = 25OC  
30 mA  
Ta = 25OC  
IF = 20 mA  
1 mA  
0.274  
0.276  
0.278  
0.280  
400  
500  
600  
700  
800  
x Coord.  
Wavelength [nm]  
Forward Voltage vs. Ambient Temperature  
Color Coordinate vs. Ambient Temperature  
0.266  
1.06  
Ta = 25OC  
30 mA  
IF = 20 mA  
1.04  
0.265  
0.264  
1.02  
1.00  
0.98  
0.96  
0.94  
1 mA  
0.263  
0.274  
0.276  
0.278  
0.280  
-45 -30 -15  
0
15 30 45 60 75 90  
Ambient Temperature [oC]  
x Coord.  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
6
SZAF07  
Rev. 1.00  
Relative Luminosity vs. Ambient Temperature  
Allowable Forward Current vs. Duty Ratio  
120  
100  
80  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
Ta = 25OC  
60  
40  
20  
-30 -15  
0
15 30 45 60 75 90  
1
10  
100  
Ambient Temperature [oC]  
Duty Ratio [%]  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
7
SZAF07  
Rev. 1.00  
7. Reliability  
(1) TEST ITEMS AND RESULTS  
TEST ITEM  
Number of  
Damaged  
Test conditions  
Note  
Reference  
EIAJ ED-4701  
100 101  
EIAJ ED-4701  
100 101  
EIAJ ED-4701  
300 307  
Ta = 25°C; IF = 20 mA  
Ta = 25°C; IF = 30 mA  
Life Test 1  
1000 hr  
500 hr  
0/20  
0/20  
0/50  
0/20  
0/20  
0/50  
0/50  
0/20  
0/50  
0/50  
0/50  
0/50  
0/50  
Life Test 2  
-30°C ~ 85°C  
(30 min) (30 min)  
Thermal Shock  
20 cycle  
1000 hr  
1000 hr  
1000 hr  
1000 hr  
500 hr  
Ta = 85°C; IF = 5 mA  
Ta = - 30°C; IF = 20 mA  
Ta = 100°C  
High Temperature Life Test  
Low Temperature Life Test  
High Temperature Storage  
Low Temperature Storage  
High Humidity Heat Life Test  
Humidity Heat Load  
-
-
EIAJ ED-4701  
200 201  
EIAJ ED-4701  
200 202  
EIAJ ED-4701  
100 102  
EIAJ ED-4701  
100 103  
EIAJ ED-4701  
301 302  
EIAJ ED-4701  
303  
EIAJ ED-4701  
100 105  
EIAJ ED-4701  
200 203  
Ta = - 40°C  
Ta = 60°C; RH = 90%, IF = 20 mA  
Ta = 60°C; RH = 90%  
1000 hr  
2 time  
Tsld = 260°C, 10 sec  
Resistance to Soldering Heat  
Solder ability (Reflow Soldering)  
Temperature Cycle  
Pre treatment; 30°C, 70%, 168 hr  
Tsld = 215±5°C, 3 sec  
1 time  
over 95%  
(Lead Solder)  
- 40°C ~ 25°C ~ 100°C ~ 25°C  
100 cycle  
10 cycle  
(30 min) (5 min) (30 min) (5 min)  
25°C ~ 65°C ~ - 10°C  
RH = 90%, 24 hr / 1 cycle  
Moisture Resistance Cycle  
(2) CRITERIA FOR JUDGING THE DAMAGE  
Criteria for Judgment  
Min. Max.  
Item  
Symbol  
Test Condition  
Forward Voltage  
Reverse Current  
-
U.S.L × 1.2  
U.S.L × 2.0  
-
VF  
IR  
IV  
IF = 20 mA  
-
V = 5 V  
R
Luminous Intensity  
L.S.L × 0.5  
IF = 20 mA  
U.S.L. : Upper Standard Level,  
L.S.L. : Lower Standard Level  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
8
SZAF07  
Rev. 1.00  
8. Precautions  
(1) Storage conditions  
Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption.  
a. Keep it at a temperature in the range from 5°C to 30°C and at a humidity of less than 60% RH.  
In case of being stored for more than 3 months, the product should be sealed with Nitrogen gas.  
(2) After opening the package  
When soldering, this could result in a decrease of the photoelectric effect or light intensity.  
a. Soldering should be done right after mounting the product.  
b. Keep the temperature in the range from 5°C to 40°C and the humidity at less than 30%.  
Soldering should be done within 7 days after opening the desiccant package.  
If the product has been exposed for more than 7 days after opening the package or the indicating color  
of the desiccator changes, the product must be baked at a temperature between 60°C and 65°C for 10 to  
12 hours.  
An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry  
atmosphere.  
(3) Precautions for use  
Any external mechanical force or excessive vibration should not be applied to the product during cooling  
after soldering, and it is preferable to avoid rapid cooling.  
The product should not be mounted on a distorted part of PCB.  
Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to prevent ESD and  
surge damage, and all devices and equipments must be grounded to the earth.  
(4) Miscellaneous  
Radiation resistance is not considered.  
When cleaning the product, any kind of fluid such as water, oil and organic solvent must not be used  
and IPA(Isopropyl Alcohol) must be used.  
When using the product, operating current should be settled in consideration of the maximum ambient  
temperature.  
Its appearance or specification for improvement is subject to change without notice.  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
9
SZAF07  
Rev. 1.00  
9. Soldering Profile  
The LED can be soldered in place using the reflow soldering method.  
(1) Lead solder  
Preliminary heating to be at maximum 210°C for maximum 2 minutes.  
Soldering heat to be at maximum 240°C for maximum 10 seconds.  
280  
240  
200  
160  
120  
80  
40  
0
0
15  
30  
45  
60  
75  
90 105 120 135 150 165 180 195  
Soldering Times [sec]  
(2) Lead-free solder  
Preliminary heating to be at maximum 220°C for maximum 2 minutes.  
Soldering heat to be at maximum 260°C for maximum 10 seconds.  
280  
240  
200  
160  
120  
80  
40  
0
0
15  
30  
45  
60  
75  
90 105 120 135 150 165 180 195  
Soldering Times [sec]  
(3) Hand Soldering conditions  
Not more than 5 seconds @MAX 300°C, under Soldering iron.  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
10  
SZAF07  
Rev. 1.00  
10. Outline Dimension  
( Tolerance : ±0.2, Unit : mm )  
[Bottom View]  
Cathode  
Anode  
<Recommended solder Pattern>  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
11  
SZAF07  
Rev. 1.00  
11. Packing  
( Tolerance : ±0.2, Unit : mm )  
4.0±0.1  
+0.1  
-0  
2.0±0.05  
Cathode  
Anode  
4.0±0.1  
SECTION B-B'  
15.4±1.0  
+0.2  
+0  
-3  
180  
13  
-0  
2 ±0.2  
22  
13 ±0.3  
Label  
(1)  
(2)  
(3)  
Quantity: 3500 pcs / Reel  
Cumulative Tolerance: Cumulative Tolerance / 10 pitches to be ±0.2 mm  
Adhesion Strength of Cover Tape: Adhesion strength to be 0.1 - 0.7 N when the cover tape is turned off from  
the carrier tape at 10° angle to be the carrier tape  
(4)  
Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
12  
SZAF07  
Rev. 1.00  
12. Reel Packing Structure  
Reel  
Aluminum Vinyl Bag  
Desiccant  
Humidity indicator  
Barcode Label  
Outer Box Structure  
RANK :  
XXX  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXX  
142 (mm)  
TUV  
MADE IN KOREA  
SSC PART NUMBER : XXXXXXXX  
SIZE (mm)  
SWBK07 X  
SEOUL  
Acriche  
TYPE  
7inch  
Semiconductor EcoLight  
a
c
b
RoHS  
Material : Paper(SW3B(B))  
245 220 142  
245 220 80  
220 (mm)  
245 (mm)  
Lot Number  
The lot number is composed of the following characters;  
SZAF07 ◎ ◇◇◇  
Symbol  
Meaning  
Year  
Example  
8 for 2008, 9 for 2009, 10 for 2010 ‥‥  
01 for Jan., 02 for Feb., ‥‥ 12 for Dec.  
01, 02, 03, 04, 05, ‥‥ 27, 28, 29, 30, 31  
001, 002, 003, 004, 005, 006, 007 ‥‥  
□□  
Month  
Day  
◎◎  
◇◇◇  
Number  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
13  
SZAF07  
Rev. 1.00  
13. History  
Rev. No.  
1.00  
Contents  
Date  
- The institution of New Spec.  
2008. 05.16  
Published by  
SEOUL SEMICONDUCTOR CO., LTD.  
http://www.seoulsemicon.com  
148-29, Gasan-Dong, Geumcheon-Gu,  
Seoul, 153-801. South Korea  
© All Right Reserved.  
SSC-QP-7-03-44()  
SEOUL SEMICONDUCTOR CO., LTD.  
14  
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