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HYMP112S64CR6-S6

型号:

HYMP112S64CR6-S6

描述:

1200pin无缓冲DDR2 SDRAM SO- DIMM内存模块[ 1200pin Unbuffered DDR2 SDRAM SO-DIMMs ]

品牌:

HYNIX[ HYNIX SEMICONDUCTOR ]

页数:

23 页

PDF大小:

516 K

200pin Unbuffered DDR2 SDRAM SO-DIMMs based on 1Gb version C  
This Hynix unbuffered Small Outline Dual In-Line Memory Module(DIMM) series consists of 1Gb version C DDR2  
SDRAMs in Fine Ball Grid Array(FBGA) packages on a 200pin glass-epoxy substrate. This Hynix 1Gb version C based  
Unbuffered DDR2 SO-DIMM series provide a high performance 8 byte interface in 67.60mm width form factor of indus-  
try standard. It is suitable for easy interchange and addition.  
FEATURES  
JEDEC standard Double Data Rate 2 Synchronous  
DRAMs (DDR2 SDRAMs) with 1.8V +/- 0.1V Power  
Supply  
Programmable Burst Length 4 / 8 with both  
sequential and interleave mode  
Auto refresh and self refresh supported  
8192 refresh cycles / 64ms  
All inputs and outputs are compatible with SSTL_1.8  
interface  
Serial presence detect with EEPROM  
Posted CAS  
DDR2 SDRAM Package: 60 ball(x8) , 84 ball(x16)  
FBGA  
Programmable CAS Latency 3 ,4 ,5, and 6  
OCD (Off-Chip Driver Impedance Adjustment) and  
ODT (On-Die Termination)  
67.60 x 30.00 mm form factor  
RoHS compliant  
Fully differential clock operations (CK & CK)  
ORDERING INFORMATION  
# of  
DRAMs  
# of  
ranks  
Part Name  
Density  
Organization  
Materials  
HYMP164S64CP6-C4/Y5/S5/S6  
HYMP164S64CR6-C4/Y5/S5/S6  
HYMP112S64CP6-C4/Y5/S5/S6  
HYMP112S64CR6-C4/Y5/S5/S6  
HYMP125S64CP8-C4/Y5/S5/S6  
HYMP125S64CR8-C4/Y5/S5/S6  
512MB  
512MB  
1GB  
64Mx64  
64Mx64  
4
4
1
1
2
2
2
2
Lead free  
Halogen free  
Lead free  
128Mx64  
128Mx64  
256Mx64  
256Mx64  
8
1GB  
8
Halogen free  
Lead free  
2GB  
16  
16  
2GB  
Halogen free  
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  
Rev. 1.0 / Dec. 2009  
1
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
SPEED GRADE & KEY PARAMETERS  
C4  
Y5  
S6  
S5  
Unit  
(DDR2-533)  
(DDR2-667)  
(DDR2-800)  
(DDR2-800)  
Speed@CL3  
Speed@CL4  
Speed@CL5  
Speed@CL6  
CL-tRCD-tRP  
400  
533  
-
400  
533  
667  
-
-
400  
533  
800  
-
Mbps  
Mbps  
Mbps  
Mbps  
tCK  
533  
667  
800  
6-6-6  
-
4-4-4  
5-5-5  
5-5-5  
ADDRESS TABLE  
# of  
DRAMs  
Refresh  
Method  
Density Organization Ranks  
SDRAMs  
# of row/bank/column Address  
512MB  
1GB  
64M x 64  
128M x 64  
256M x 64  
1
2
2
64Mb x 16  
64Mb x 16  
128Mb x 8  
4
8
13(A0~A12)/3(BA0~BA2)/10(A0~A9)  
13(A0~A12)/3(BA0~BA2)/10(A0~A9)  
14(A0~A13)/3(BA0~BA2)/10(A0~A9)  
8K / 64ms  
8K / 64ms  
8K / 64ms  
2GB  
16  
Rev. 1.0 / Dec. 2009  
2
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PIN DESCRIPTION  
Symbol  
Type  
Polarity  
Pin Description  
The system clock inputs. All adress an commands lines are sampled on the cross point  
of the rising edge of CK and falling edge of CK. A Delay Locked Loop(DLL) circuit is  
driven from the clock inputs and output timing for read operations is synchronized to  
the input clock.  
Cross  
Point  
CK[1:0], CK[1:0]  
Input  
Activates the DDR2 SDRAM CK signal when high and deactivates the CK signal when  
low. By deactivating the clocks, CKE low initiates the Power Down mode or the Self  
Refresh mode.  
Active  
High  
CKE[1:0]  
S[1:0]  
Input  
Input  
Enables the associated DDR2 SDRAM command decoder when low and disables the  
command decoder when high. When the command decoder is disabled, new commands  
are ignored but previous operations continue. Rank 0 is selected by S0; Rank 1 is  
selected by S1  
Active  
Low  
Active  
Low  
When sampled at the cross point of the rising edge of CK and falling edge of CK, CAS,  
RAS and WE define the operation to be excecuted by the SDRAM.  
RAS, CAS, WE  
BA[2:0]  
Input  
Input  
Input  
Selects which DDR2 SDRAM internal bank of four or eight is activated.  
Active  
High  
Asserts on-die termination for DQ, DM, DQS and DQS signals if enabled via the DDR2  
SDRAM mode register.  
ODT[1:0]  
During a Bank Activate command cycle, difines the row address when sampled at the  
cross point of the rising edge of CK and falling edge of CK. During a Read or Write com-  
mand cycle, defines the column address when sampled at the cross point of the rising  
edge of CK and falling edge of CK. In addition to the column address, AP is used to  
invoke autoprecharge operation at the end of the burst read or write cycle. If AP is  
high., autoprecharge is selected and BA0-BAn defines the bank to be precharged. If AP  
is low, autoprecharge is disabled. During a Precharge command cycle., AP is used in  
conjunction with BA0-BAn to control which bank(s) to precharge. If AP is high, all banks  
will be precharged regardless of the state of BA0-BAn inputs. If AP is low, then BA0-BAn  
are used to define which bank to precharge.  
A[9:0], A10/AP,  
A[15:11]  
Input  
DQ[63:0]  
DM[7:0]  
In/Out  
Input  
Data Input/Output pins.  
The data write masks, associated with one data byte. In Write mode, DM operates as a  
byte mask by allowing input data to be written if it is low but blocks the write operation  
if it is high. In Read mode, DM lines have no effect.  
Active  
High  
The data strobe, associated with one data byte, sourced whit data transfers. In Write  
mode, the data strobe is sourced by the controller and is centered in the data window.  
In Read mode, the data strobe is sourced by the DDR2 SDRAMs and is sent at leading  
edge of the data window. DQS signals are complements, and timing is relative to the  
crosspoint of respective DQS and DQS. If the module is to be operated in single ended  
strobe mode, all DQS signals must be tied on the system board to VSS and DDR2  
SDRAM mode registers programmed approriately.  
Cross  
point  
DQS[7:0], DQS[7:0] In/Out  
VDD, VDDSPD,VSS  
SDA  
Supply  
In/Out  
Power supplies for core, I/O, Serial Presense Detect, and ground for the module.  
This is a bidirectional pin used to transfer data into or out of the SPD EEPROM. A  
resister must be connected to VDD to act as a pull up.  
This signals is used to clock data into and out of the SPD EEPROM. A resistor may be  
connected from SCL to VDD to act as a pull up.  
SCL  
Input  
Input  
In/Out  
SA[1:0]  
TEST  
Address pins used to select the Serial Presence Detect base address.  
The TEST pin is reserved for bus analysis tools and is not connected on normal memory  
modules(SODIMMs).  
Rev. 1.0 / Dec. 2009  
3
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PIN ASSIGNMENT  
Pin Front Pin Back Pin Front  
Pin  
NO.  
Back  
Side  
Pin  
NO.  
Front  
Side  
Pin  
NO.  
Back  
Side  
Pin  
NO.  
Front  
Side  
Pin  
NO.  
Back  
Side  
NO. Side NO. Side NO.  
Side  
DQS2  
VSS  
1
VREF  
VSS  
2
VSS  
DQ4  
DQ5  
VSS  
51  
53  
55  
57  
59  
61  
63  
65  
67  
69  
71  
73  
75  
77  
79  
81  
83  
85  
87  
89  
91  
93  
95  
97  
99  
52  
54  
56  
58  
60  
62  
64  
66  
68  
70  
72  
74  
76  
78  
DM2  
VSS  
101  
103  
A1  
102  
104  
106  
108  
110  
112  
114  
116  
118  
A0  
VDD  
BA1  
151  
153  
155  
157  
159  
161  
DQ42  
DQ43  
VSS  
152 DQ46  
154 DQ47  
3
4
VDD  
5
DQ0  
DQ1  
VSS  
6
DQ18  
DQ19  
VSS  
DQ22  
DQ23  
VSS  
105 A10/AP  
156  
VSS  
7
8
107  
109  
111  
113  
115  
117  
BA0  
WE  
RAS  
DQ48  
DQ49  
VSS  
158 DQ52  
160 DQ53  
9
10  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
40  
42  
44  
46  
48  
50  
DM0  
VSS  
S0  
11  
13  
15  
17  
19  
21  
23  
25  
27  
29  
31  
33  
35  
37  
39  
41  
43  
45  
47  
49  
DQS0  
DQS0  
VSS  
DQ24  
DQ25  
VSS  
DQ28  
DQ29  
VSS  
VDD  
CAS  
VDD  
ODT0  
A13  
162  
VSS  
CK1  
CK1  
VSS  
DM6  
VSS  
DQ6  
DQ7  
VSS  
163 NC,TEST 164  
NC/S1  
VDD  
165  
167  
169  
171  
173  
175  
177  
179  
181  
183  
185  
187  
189  
191  
193  
195  
197  
VSS  
DQS6  
DQS6  
VSS  
166  
168  
170  
172  
DQ2  
DQ3  
VSS  
DM3  
NC  
DQS3  
DQS3  
VSS  
VDD  
NC  
DQ12  
DQ13  
VSS  
119 NC/ODT1 120  
VSS  
121  
123  
125  
127  
VSS  
DQ32  
DQ33  
VSS  
122  
124  
126  
128  
130  
132  
134  
136  
138  
140  
142  
144  
146  
148  
150  
VSS  
DQ8  
DQ9  
VSS  
DQ26  
DQ27  
VSS  
DQ30  
DQ31  
VSS  
DQ36  
DQ37  
VSS  
DQ50  
DQ51  
VSS  
174 DQ54  
176 DQ55  
DM1  
VSS  
178  
VSS  
DQS1  
DQS1  
VSS  
CK0  
CKE0  
VDD  
NC  
80 NC/CKE1 129  
DQS4  
DQS4  
VSS  
DM4  
VSS  
DQ56  
DQ57  
VSS  
180 DQ60  
182 DQ61  
CK0  
82  
84  
86  
88  
90  
92  
94  
96  
98  
100  
VDD  
131  
VSS  
NC/A15 133  
NC/A14 135  
DQ38  
DQ39  
VSS  
184  
VSS  
DQ10  
DQ11  
VSS  
DQ14  
DQ15  
VSS  
BA2  
VDD  
A12  
DQ34  
DQ35  
VSS  
DM7  
VSS  
186 DQS7  
188 DQS7  
VDD  
A11  
A7  
137  
139  
141  
143  
145  
147  
149  
DQ44  
DQ45  
VSS  
DQ58  
DQ59  
VSS  
190  
VSS  
VSS  
VSS  
A9  
DQ40  
DQ41  
VSS  
192 DQ62  
194 DQ63  
DQ16  
DQ17  
VSS  
DQ20  
DQ21  
VSS  
A8  
A6  
VDD  
A5  
VDD  
A4  
DQS5  
DQS5  
VSS  
SDA  
196  
198  
VSS  
SA0  
SA1  
DM5  
VSS  
SCL  
DQS2  
NC  
A3  
A2  
199 VDDSPD 200  
Pin Location  
Pin #40  
Pin #2  
Pin #42  
Pin #200  
Front Side  
Back Side  
Pin #99  
Pin #1  
Pin #41  
Pin #39  
Rev. 1.0 / Dec. 2009  
4
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
FUNCTIONAL BLOCK DIAGRAM  
512MB(64Mbx64) : HYMP164S64CP(R)6  
/S1  
ODT1  
CKE1  
N.C.  
N.C.  
N.C.  
3+/-5%  
CKE0  
ODT0  
/S0  
/CS ODT  
/CS ODT  
CKE  
CKE  
DQS0  
/DQS0  
DQS4  
/DQS4  
LDQS  
/UDQS  
LDM  
LDQS  
/UDQS  
LDM  
DM0  
DM4  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
DQ32  
DQ33  
DQ34  
DQ35  
DQ36  
DQ37  
DQ38  
DQ39  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
DQS2  
/DQS2  
DQS5  
/DQS5  
D0  
D2  
DM2  
DM5  
DQ8  
DQ40  
DQ41  
DQ42  
DQ43  
DQ44  
DQ45  
DQ46  
DQ47  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
DQ9  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
/CS ODT  
/CS ODT  
CKE  
CKE  
DQS2  
/DQS2  
DQS6  
/DQS6  
LDQS  
/UDQS  
LDM  
LDQS  
/UDQS  
LDM  
DM2  
DM6  
DQ16  
DQ17  
DQ18  
DQ19  
DQ20  
DQ21  
DQ22  
DQ23  
DQ48  
DQ49  
DQ50  
DQ51  
DQ52  
DQ53  
DQ54  
DQ55  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
DQS3  
/DQS3  
DQS7  
/DQS7  
D1  
D3  
DM3  
DM7  
DQ24  
DQ25  
DQ26  
DQ27  
DQ28  
DQ29  
DQ30  
DQ56  
DQ57  
DQ58  
DQ59  
DQ60  
DQ61  
DQ62  
DQ63  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
SCL  
SA0  
SA1  
SCL  
SDA  
SDA  
A0  
A1  
A2  
3+/-5%  
Serial PD  
BA0-BA2  
SDRAMS D0-3  
SDRAMS D0-3  
SDRAMS D0-3  
SDRAMS D0-3  
SDRAMS D0-3  
WP  
A0-AN  
/RAS  
/CAS  
/WE  
VDDSPD  
Serial PD  
SDRAMS D0-D3  
V
REF  
DD  
SS  
SDRAMS D0-D3, VDD and VDDQ  
SDRAMS D0-D3, SPD  
CK0  
V
2 loads  
2 loads  
/CK0  
V
CK1  
Note:  
1.Resistor values are 22 ohm +/-5%.  
/CK1  
Rev. 1.0 / Dec. 2009  
5
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
FUNCTIONAL BLOCK DIAGRAM  
1GB(128Mbx64): HYMP112S64CP(R)6  
3+/-5%  
ODT1  
ODT0  
CKE1  
CKE0  
/S1  
/S0  
/CS  
/CS  
/CS  
/CS  
DQS0  
/DQS0  
DQS4  
/DQS4  
LDQS  
/UDQS  
LDM  
LDQS  
/UDQS  
LDM  
LDQS  
/UDQS  
LDM  
LDQS  
/UDQS  
LDM  
DM0  
DM4  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
DQ32  
DQ33  
DQ34  
DQ35  
DQ36  
DQ37  
DQ38  
DQ39  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
D0  
D4  
D2  
D6  
DQS2  
/DQS2  
DQS5  
/DQS5  
DM2  
DM5  
DQ8  
DQ40  
DQ41  
DQ42  
DQ43  
DQ44  
DQ45  
DQ46  
DQ47  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
DQ9  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
/CS  
/CS  
/CS  
/CS  
DQS2  
/DQS2  
DQS6  
/DQS6  
LDQS  
/UDQS  
LDM  
LDQS  
/UDQS  
LDM  
LDQS  
/UDQS  
LDM  
LDQS  
/UDQS  
LDM  
DM2  
DM6  
DQ16  
DQ17  
DQ18  
DQ19  
DQ20  
DQ21  
DQ22  
DQ23  
DQ48  
DQ49  
DQ50  
DQ51  
DQ52  
DQ53  
DQ54  
DQ55  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
/UDQS  
UDM  
D1  
D5  
D3  
D7  
DQS3  
/DQS3  
DQS7  
/DQS7  
DM3  
DM7  
DQ24  
DQ25  
DQ26  
DQ27  
DQ28  
DQ29  
DQ30  
DQ56  
DQ57  
DQ58  
DQ59  
DQ60  
DQ61  
DQ62  
DQ63  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
I/O 8  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/O 14  
I/O 15  
SCL  
SA0  
SA1  
SCL  
SDA  
SDA  
A0  
A1  
A2  
Serial PD  
WP  
3+/-5%  
BA0-BA2  
SDRAMS D0-15  
SDRAMS D0-15  
SDRAMS D0-15  
SDRAMS D0-15  
SDRAMS D0-15  
A0-AN  
/RAS  
/CAS  
/WE  
VDDSPD  
Serial PD  
SDRAMS D0-D3  
V
REF  
DD  
SS  
CK0  
SDRAMS D0-D3, VDD and VDD  
Q
V
4 loads  
4 loads  
/CK0  
SDRAMS D0-D3, SPD  
V
CK1  
Note:  
1.Resistor values are 22 ohm +/-5%.  
/CK1  
Rev. 1.0 / Dec. 2009  
6
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
FUNCTIONAL BLOCK DIAGRAM  
2GB(256Mbx64) : HYMP125S64CP(R)8  
3+/-5%  
CKE1  
ODT1  
/S1  
CKE0  
ODT0  
/S0  
/CS0  
DQS  
/CS0  
ODT0 CKE0  
DQS  
ODT0 CKE0  
/CS1 ODT1 CKE1  
DQS  
/CS1 ODT1 CKE1  
DQS  
DQS0  
DQS4  
/DQS0  
/DQS4  
/DQS  
DM  
/DQS  
DM  
/DQS  
DM  
/DQS  
DM  
DM0  
DM4  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
DQ32  
DQ33  
DQ34  
DQ35  
DQ36  
DQ37  
DQ38  
DQ39  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
D0  
D8  
D1  
D9  
/CS0  
DQS  
/CS0  
ODT0 CKE0  
DQS  
ODT0 CKE0  
/CS1 ODT1 CKE1  
DQS  
/CS1 ODT1 CKE1  
DQS  
DQS1  
DQS5  
/DQS1  
/DQS5  
/DQS  
DM  
/DQS  
DM  
/DQS  
DM  
/DQS  
DM  
DM1  
DM5  
DQ8  
DQ9  
DQ40  
DQ41  
DQ42  
DQ43  
DQ44  
DQ45  
DQ46  
DQ47  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
D2  
D10  
ODT1 CKE1  
D12  
D3  
D11  
ODT1 CKE1  
D13  
/CS0  
DQS  
/DQS  
DM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
/CS1  
DQS  
/DQS  
DM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
/CS0  
DQS  
/DQS  
DM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
/CS1  
DQS  
/DQS  
DM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
ODT0 CKE0  
ODT0 CKE0  
DQS2  
/DQS2  
DQS6  
/DQS6  
DM2  
DM6  
DQ16  
DQ17  
DQ18  
DQ19  
DQ20  
DQ21  
DQ22  
DQ23  
DQ48  
DQ49  
DQ50  
DQ51  
DQ52  
DQ53  
DQ54  
DQ55  
D4  
D5  
/CS0  
DQS  
/CS0  
ODT0 CKE0  
DQS  
ODT0 CKE0  
/CS1 ODT1 CKE1  
DQS  
/CS1 ODT1 CKE1  
DQS  
DQS3  
DQS7  
/DQS3  
/DQS7  
/DQS  
DM  
/DQS  
DM  
/DQS  
DM  
/DQS  
DM  
DM3  
DM7  
DQ24  
DQ25  
DQ26  
DQ27  
DQ28  
DQ29  
DQ30  
DQ31  
DQ56  
DQ57  
DQ58  
DQ59  
DQ60  
DQ61  
DQ62  
DQ63  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
D6  
D14  
D7  
D15  
SCL  
SA0  
SA1  
SCL  
10+/-5%  
SDA  
SDA  
BA0-BA2  
SDRAMS D0-15  
SDRAMS D0-15  
SDRAMS D0-15  
SDRAMS D0-15  
SDRAMS D0-15  
A0  
A1  
A2  
Serial PD  
WP  
A0-AN  
/RAS  
/CAS  
/WE  
VDDSPD  
Serial PD  
SDRAMS D0-D15  
V
REF  
DD  
SS  
CK0  
SDRAMS D0-D15, VDD and VDD  
Q
V
8 loads  
8 loads  
5.6pF  
5.6pF  
/CK0  
SDRAMS D0-D15, SPD  
V
CK1  
Note:  
1.Resistor values are 22 ohm +/-5%  
unless otherwide stated.  
/CK1  
Rev. 1.0 / Dec. 2009  
7
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Voltage on VDD pin relative to Vss  
Voltage on VDDQ pin relative to Vss  
Symbol  
VDD  
Value  
Unit  
Note  
- 1.0 V ~ 2.3 V  
V
1
VDDQ  
- 0.5 V ~ 2.3 V  
-0.5V ~ 2.3 V  
- 0.5 V ~ 2.3 V  
V
V
V
1
1
1
VDDL  
Voltage on VDDL pin relative to Vss  
Voltage on any pin relative to Vss  
VIN, VOUT  
Operating Conditions and Environmental Parameters  
Parameter  
Symbol  
TOPR  
Rating  
Units  
Notes  
0 ~ +65  
-50 ~ +100  
5 to 95  
oC  
DIMM Operating temperature(ambient)  
Storage Temperature  
oC  
%
TSTG  
HSTG  
PBAR  
1
1
2
3
Storage Humidity(without condensation)  
DIMM Barometric Pressure(operating & storage)  
DRAM Component Case Temperature Range  
105 to 69  
0 ~+95  
K Pascal  
oC  
TCASE  
Notes:  
1. Stress greater than those listed may cause permanent damage to the device. This is a stress rating only, and device  
functional operation at or above the conditions indicated is not implied. Exposure to absolute maximum rating con  
ditions for extended periods may affect reliability.  
2. Up to 9850 ft.  
3. If the DRAM case temperature is Above 85oC, the Auto-Refresh command interval has to be reduced to  
tREFI=3.9us. For Measurement conditions of TCASE, please refer to the JEDEC document JESD51-2.  
DC OPERATING CONDITIONS (SSTL_1.8)  
Rating  
Symbol  
Parameter  
Supply Voltage  
Units  
Notes  
Min.  
Typ.  
Max.  
VDD  
VDDL  
VDDQ  
VREF  
1.7  
1.8  
1.9  
V
V
1
1.7  
1.7  
1.8  
1.9  
1.9  
1,2  
1,2  
3,4  
5
Supply Voltage for DLL  
Supply Voltage for Output  
Input Reference Voltage  
Termination Voltage  
1.8  
0.50*VDDQ  
VREF  
V
0.49*VDDQ  
VREF-0.04  
1.8  
0.51*VDDQ  
VREF+0.04  
3.3  
mV  
V
VTT  
VDDSPD  
-
V
EEPROM Supply Voltage  
Note:  
1. Min. Typ. and Max. values increase by 100mV for C3(DDR2-533 3-3-3) speed option.  
2. VDDQ tracks with VDD,VDDL tracks with VDD. AC parameters are measured with VDD,VDDQ and VDD.  
3. The value of VREF may be selected by the user to provide optimum noise margin in the system. Typically the  
value of VREF is expected to be about 0.5 x VDDQ of the transmitting device and VREF is expected to track varia-  
tions in VDDQ.  
4. Peak to peak ac noise on VREF may not exceed +/-2% VREF (dc).  
5. VTT of transmitting device must track VREF of receiving device.  
Rev. 1.0 / Dec. 2009  
8
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
INPUT DC LOGIC LEVEL  
Parameter  
dc Input logic HIGH  
dc Input logic LOW  
Symbol  
VIH(DC)  
VIL(DC)  
Min  
VREF + 0.125  
-0.30  
Max  
Unit  
V
Note  
VDDQ + 0.3  
VREF - 0.125  
V
INPUT AC LOGIC LEVEL  
DDR2 400/533  
DDR2 667/800  
Parameter  
Symbol  
Unit  
Min  
Max  
Min  
Max  
AC Input logic HIGH VIH(AC)  
AC Input logic LOW VIL(AC)  
V
V
V
REF + 0.250  
-
VREF + 0.200  
-
-
-
V
REF - 0.250  
VREF - 0.200  
AC INPUT TEST CONDITIONS  
Symbol  
VREF  
Condition  
Input reference voltage  
Value  
Units  
Notes  
0.5 * VDDQ  
1.0  
V
V
1
1
VSWING(MAX)  
SLEW  
Input signal maximum peak to peak swing  
Input signal minimum slew rate  
1.0  
V/ns  
2, 3  
Notes:  
1. Input waveform timing is referenced to the input signal crossing through the VREF level applied to the device  
under test.  
2. The input signal minimum slew rate is to be maintained over the range from VREF to VIH(ac) min for rising edges  
and the range from VREF to VIL(ac) max for falling edges as shown in the below figure.  
3. AC timings are referenced with input waveforms switching from VIL(ac) to VIH(ac) on the positive transitions  
and VIH(ac) to VIL(ac) on the negative transitions.  
V
V
V
V
V
V
V
DDQ  
IH(ac)  
IH(dc)  
REF  
min  
min  
V
SWING(MAX)  
max  
max  
IL(dc)  
IL(ac)  
SS  
delta TF  
delta TR  
Rising Slew =  
V
min - V  
REF  
V
-
V
max  
IL(ac)  
IH(ac)  
REF  
Falling Slew =  
delta TF  
delta TR  
< Figure : AC Input Test Signal Waveform>  
Rev. 1.0 / Dec. 2009  
9
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
Differential Input AC logic Level  
Symbol  
Parameter  
Min.  
Max.  
Units  
Note  
VID (ac)  
0.5  
VDDQ + 0.6  
V
1
ac differential input voltage  
ac differential cross point voltage  
VIX (ac)  
0.5 * VDDQ - 0.175  
0.5 * VDDQ + 0.175  
V
2
1. VIN(DC) specifies the allowable DC execution of each input of differential pair such as CK, CK, DQS, DQS, LDQS,  
LDQS, UDQS and UDQS.  
2. VID(DC) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input  
(such as CK, DQS, LDQS or UDQS) level and VCP is the complementary input (such as CK, DQS, LDQS or UDQS) level.  
The minimum value is equal to VIH(DC) - VIL(DC).  
V
TR  
Crossing point  
V
ID  
V
V
IX or OX  
V
CP  
V
SSQ  
< Differential signal levels >  
Notes:  
1. VID(AC) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input signal  
(such as CK, DQS, LDQS or UDQS) and VCP is the complementary input signal (such as CK, DQS, LDQS or UDQS).  
The minimum value is equal to V IH(AC) - VIL(AC).  
2. The typical value of VIX(AC) is expected to be about 0.5 * VDDQ of the transmitting device and VIX(AC) is expected to  
track variations in VDDQ . VIX(AC) indicates the voltage at whitch differential input signals must cross.  
DIFFERENTIAL AC OUTPUT PARAMETERS  
Symbol  
OX (ac)  
Parameter  
Min.  
Max.  
Units  
Note  
V
0.5 * VDDQ - 0.125  
0.5 * VDDQ + 0.125  
V
1
ac differential cross point voltage  
Notes:  
1. The typical value of VOX(AC) is expected to be about 0.5 * VDDQ of the transmitting device and VOX(AC) is expected to  
track variations in VDDQ . VOX(AC) indicates the voltage at whitch differential output signals must cross.  
Rev. 1.0 / Dec. 2009  
10  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
OUTPUT BUFFER LEVELS  
OUTPUT AC TEST CONDITIONS  
Symbol  
Parameter  
SSTL_18  
Units  
Notes  
VOTR  
Output Timing Measurement Reference Level  
0.5 * VDDQ  
V
1
Notes:  
1. The VDDQ of the device under test is referenced.  
OUTPUT DC CURRENT DRIVE  
Symbol  
IOH(dc)  
IOL(dc)  
Parameter  
Output Minimum Source DC Current  
Output Minimum Sink DC Current  
SSTl_18  
Units  
Notes  
- 13.4  
13.4  
mA  
mA  
1, 3, 4  
2, 3, 4  
Notes:  
1. VDDQ = 1.7 V; VOUT = 1420 mV. (VOUT - VDDQ)/IOH must be less than 21 ohm for values of VOUT between VDDQ and  
DDQ - 280 mV.  
V
2. VDDQ = 1.7 V; VOUT = 280 mV. VOUT/IOL must be less than 21 ohm for values of VOUT between 0 V and 280 mV.  
3. The dc value of VREF applied to the receiving device is set to VTT  
4. The values of IOH(dc) and IOL(dc) are based on the conditions given in Notes 1 and 2. They are used to test device  
drive current capability to ensure VIH min plus a noise margin and VIL max minus a noise margin are delivered to an  
SSTL_18 receiver.  
The actual current values are derived by shifting the desired driver operating point along a 21 ohm load line to define  
a convenient driver current for measurement.  
Rev. 1.0 / Dec. 2009  
11  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PIN Capacitance (VDD=1.8V,VDDQ=1.8V, TA=25°…)  
512MB : HYMP164S64CP(R)6  
Pin  
Symbol  
Min  
Max  
Unit  
CK, CK  
CCK  
CI1  
CI2  
CIO  
12.5  
27  
25  
6
15  
30  
32  
7.5  
pF  
pF  
pF  
pF  
CKE, ODT,CS  
Address, RAS, CAS, WE  
DQ, DM, DQS, DQS  
1GB : HYMP112S64CP(R)6  
Pin  
Symbol  
Min  
Max  
Unit  
CK, CK  
CCK  
CI1  
CI2  
CIO  
17  
22  
20  
25  
37  
12  
pF  
pF  
pF  
pF  
CKE, ODT,CS  
Address, RAS, CAS, WE  
DQ, DM, DQS, DQS  
28.5  
10  
2GB : HYMP125S64CP(R)8  
Pin  
Symbol  
Min  
Max  
Unit  
CK, CK  
CCK  
CI1  
CI2  
CIO  
17  
24  
31  
7
29  
38  
56  
12  
pF  
pF  
pF  
pF  
CKE, ODT,CS  
Address, RAS, CAS, WE  
DQ, DM, DQS, DQS  
Notes:  
1. Pins not under test are tied to GND.  
2. These value are guaranteed by design and tested on a sample basis only.  
Rev. 1.0 / Dec. 2009  
12  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
IDD SPECIFICATIONS (TCASE : 0 to 95oC)  
512MB, 64M x 64 SO-DIMM : HYMP164S64CP(R)6  
C4  
Y5  
S5/S6  
(DDR2 800@CL5&6)  
Symbol  
Unit  
Note  
(DDR2 533@CL4)  
(DDR2 667@CL5)  
IDD0  
IDD1  
340  
440  
40  
360  
460  
40  
380  
480  
40  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
IDD2P  
IDD2Q  
IDD2N  
IDD3P(F)  
IDD3P(S)  
IDD3N  
IDD4R  
IDD4W  
IDD5B  
IDD6  
108  
140  
80  
120  
160  
100  
48  
128  
180  
100  
48  
48  
180  
640  
640  
660  
40  
200  
780  
780  
700  
40  
220  
900  
900  
700  
40  
1
1
IDD6(L)  
IDD7  
20  
20  
20  
1040  
1060  
1080  
1GB, 128M x 64 SO-DIMM : HYMP112S64CP(R)6  
C4  
Y5  
S5/S6  
(DDR2 800@CL5&6)  
Symbol  
Unit  
Note  
(DDR2 533@CL4)  
(DDR2 667@CL5)  
IDD0  
IDD1  
520  
620  
80  
560  
660  
80  
600  
700  
80  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
IDD2P  
IDD2Q  
IDD2N  
IDD3P(F)  
IDD3P(S)  
IDD3N  
IDD4R  
IDD4W  
IDD5B  
IDD6  
216  
280  
160  
96  
240  
320  
200  
96  
256  
360  
200  
96  
360  
820  
820  
840  
80  
400  
980  
980  
900  
80  
440  
1120  
1120  
920  
80  
1
1
IDD6(L)  
IDD7  
40  
40  
40  
1220  
1260  
1300  
Notes:  
1. IDD6 current values are guaranteed up to Tcase of 85°… max.  
Rev. 1.0 / Dec. 2009  
13  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
2GB, 256M x 64 SO-DIMM : HYMP125S64CP(R)8  
C4  
Y5  
S5/S6  
(DDR2 800@CL5&6)  
Symbol  
Unit  
Note  
(DDR2 533@CL4)  
(DDR2 667@CL5)  
IDD0  
IDD1  
840  
920  
160  
432  
560  
320  
192  
640  
1320  
1320  
1640  
160  
80  
960  
1040  
160  
1040  
1120  
160  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
IDD2P  
IDD2Q  
IDD2N  
IDD3P(F)  
IDD3P(S)  
IDD3N  
IDD4R  
IDD4W  
IDD5B  
IDD6  
480  
512  
640  
720  
400  
400  
192  
192  
800  
880  
1600  
1600  
1800  
160  
1800  
1800  
1840  
160  
1
1
IDD6(L)  
IDD7  
80  
80  
1720  
1840  
1920  
Notes:  
1. IDD6 current values are guaranteed up to Tcase of 85°C max.  
Rev. 1.0 / Dec. 2009  
14  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
IDD Measurement Conditions  
Symbol  
Conditions  
Units  
t
t
t
t
t
t
Operating one bank active-precharge current; CK = CK(IDD), RC = RC(IDD), RAS = RAS-  
min(IDD);CKE is HIGH, CS is HIGH between valid commands;Address bus inputs are SWITCHING;Data bus  
inputs are SWITCHING  
IDD0  
IDD1  
mA  
Operating one bank active-read-precharge curren ; IOUT = 0mA;BL = 4, CL = CL(IDD), AL = 0;  
t
t
t
t
t
t
t
t
CK = CK(IDD), RC = RC (IDD), RAS = RASmin(IDD), RCD = RCD(IDD) ; CKE is HIGH, CS is HIGH  
between valid commands ; Address bus inputs are SWITCHING ; Data pattern is same as IDD4W  
mA  
t
t
Precharge power-down current ; All banks idle ; CK = CK(IDD) ; CKE is LOW ; Other control and address  
IDD2P  
IDD2Q  
IDD2N  
mA  
mA  
mA  
bus inputs are STABLE; Data bus inputs are FLOATING  
t
t
Precharge quiet standby current;All banks idle; CK = CK(IDD);CKE is HIGH, CS is HIGH; Other control and  
address bus inputs are STABLE; Data bus inputs are FLOATING  
t
t
Precharge standby current; All banks idle; CK = CK(IDD); CKE is HIGH, CS is HIGH; Other control and  
address bus inputs are SWITCHING; Data bus inputs are SWITCHING  
t
t
mA  
mA  
Active power-down current; All banks open; CK = CK(IDD); CKE is LOW;  
Fast PDN Exit MRS(12) = 0  
Slow PDN Exit MRS(12) = 1  
IDD3P  
IDD3N  
IDD4W  
IDD4R  
Other control and address bus inputs are STABLE; Data bus inputs are FLOAT-  
ING  
t
t
t
t
t
t
Active standby current; All banks open; CK = CK(IDD), RAS = RASmax(IDD), RP = RP(IDD); CKE is  
HIGH, CS is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus  
inputs are SWITCHING  
mA  
mA  
mA  
t
Operating burst write current; All banks open, Continuous burst writes; BL = 4, CL = CL(IDD), AL = 0; CK  
t
t
t
t
t
= CK(IDD), RAS = RASmax(IDD), RP = RP(IDD); CKE is HIGH, CS is HIGH between valid commands;  
Address bus inputs are SWITCHING; Data bus inputs are SWITCHING  
Operating burst read current; All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(IDD),  
t
t
t
t
t
t
AL = 0; CK = CK(IDD), RAS = RASmax(IDD), RP = RP(IDD); CKE is HIGH, CS is HIGH between valid com-  
mands; Address bus inputs are SWITCHING;; Data pattern is same as IDD4W  
t
t
t
Burst refresh current; CK = CK(IDD); Refresh command at every RFC(IDD) interval; CKE is HIGH, CS is  
HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are  
SWITCHING  
IDD5B  
IDD6  
mA  
Self refresh current; CK and CK at 0V; CKE 0.2V; Other control and address bus inputs are FLOATING;  
Data bus inputs are FLOATING. IDD6 current values are guaranted up to Tcase of 85 max.  
mA  
Operating bank interleave read current; All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(IDD),  
t
t
t
t
t
t
t
t
t
t
AL = RCD(IDD)-1* CK(IDD); CK = CK(IDD), RC = RC(IDD), RRD = RRD(IDD), RCD = 1* CK(IDD); CKE is  
HIGH, CS is HIGH between valid commands; Address bus inputs are STABLE during DESELECTs; Data pattern is  
same as IDD4R; - Refer to the following page for detailed timing conditions  
IDD7  
mA  
Notes:  
1. IDD specifications are tested after the device is properly initialized  
2. Input slew rate is specified by AC Parametric Test Condition  
3. IDD parameters are specified with ODT disabled.  
4. Data bus consists of DQ, DM, DQS, DQS, RDQS, RDQS, LDQS, LDQS, UDQS, and UDQS. IDD values must be met with all combina-  
tions of EMRS bits 10 and 11.  
5. Definitions for IDD  
LOW is defined as Vin £ VILAC(max)  
HIGH is defined as Vin Š VIHAC(min)  
STABLE is defined as inputs stable at a HIGH or LOW level  
FLOATING is defined as inputs at VREF = VDDQ/2  
SWITCHING is defined as: inputs changing between HIGH and LOW every other clock cycle (once per two clocks) for address and  
control signals, and inputs changing between HIGH and LOW every other data transfer (once per clock)  
for DQ signals not including masks or strobes.  
Rev. 1.0 / Dec. 2009  
15  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
Electrical Characteristics & AC Timings  
Speed Bins and CL,tRCD,tRP,tRC and tRAS for Corresponding Bin  
DDR2-800  
(S5)  
DDR2-800  
(S6)  
DDR2-667  
(Y5)  
DDR2-533  
(C4)  
DDR2-400  
(E3)  
Speed  
Unit  
Bin(CL-tRCD-tRP)  
Parameter  
CAS Latency  
tRCD  
5-5-5  
min  
5
6-6-6  
min  
6
5-5-5  
min  
5
4-4-4  
min  
4
3-3-3  
min  
3
tCK  
ns  
12.5  
12.5  
45  
15  
15  
15  
15  
tRP  
15  
15  
15  
15  
ns  
tRAS  
45  
45  
45  
40  
ns  
tRC  
57.5  
60  
60  
60  
55  
ns  
AC Timing Parameters by Speed Grade  
DDR2-400  
DDR2-533  
Parameter  
Symbol  
Unit Note  
Min  
-600  
-500  
0.45  
0.45  
Max  
Min  
-500  
-450  
0.45  
0.45  
Max  
500  
Data-Out edge to Clock edge Skew  
DQS-Out edge to Clock edge Skew  
Clock High Level Width  
tAC  
tDQSCK  
tCH  
600  
500  
ps  
ns  
450  
0.55  
0.55  
0.55  
0.55  
CK  
CK  
Clock Low Level Width  
tCL  
min  
(tCL,tCH)  
min  
(tCL,tCH)  
Clock Half Period  
tHP  
-
-
ns  
System Clock Cycle Time  
tCK  
tDS  
5000  
150  
275  
25  
8000  
3750  
100  
225  
-25  
8000  
ps  
DQ and DM input setup time  
-
-
-
-
-
-
-
-
-
-
ps  
ps  
1
1
1
1
DQ and DM input hold time  
tDH  
DQ and DM input setup time(single-ended strobe)  
DQ and DM input hold time(single-ended strobe)  
Control & Address input Pulse Width for each input  
tDS1  
tDH1  
tIPW  
ps  
25  
-25  
ps  
0.6  
0.6  
tCK  
DQ and DM input pulse witdth for each input pulse  
width for each input  
tDIPW  
tHZ  
0.35  
-
0.35  
-
tCK  
Data-out high-impedance window from CK, /CK  
-
tAC max  
-
tAC max  
ps  
DQS low-impedance time from CK/CK  
DQ low-impedance time from CK/CK  
DQS-DQ skew for DQS and associated DQ signals  
DQ hold skew factor  
tLZ(DQS)  
tLZ(DQ)  
tDQSQ  
tQHS  
tAC min  
2*tAC min  
tAC max  
tAC max  
350  
tAC min  
2*tAC min  
tAC max  
tAC max  
300  
ps  
ps  
ps  
-
-
-
-
450  
400  
ps  
DQ/DQS output hold time from DQS  
First DQS latching transition to associated clock  
edge  
tQH  
tDQSS  
tHP - tQHS  
-0.25  
-
tHP - tQHS  
-0.25  
-
ps  
tCK  
+0.25  
+0.25  
DQS input high pulse width  
DQS input low pulse width  
DQS falling edge to CK setup time  
DQS falling edge hold time from CK  
Mode register set command cycle time  
Write preamble  
tDQSH  
tDQSL  
tDSS  
0.35  
0.35  
0.2  
0.2  
2
0.35  
0.4  
-600  
-
-
-
-
-
0.35  
0.35  
0.2  
0.2  
2
0.35  
0.4  
-500  
-
-
-
-
-
tCK  
tCK  
tCK  
tCK  
tCK  
tCK  
tCK  
ps  
tDSH  
tMRD  
tWPRE  
tWPST  
tAC  
-
-
Write postamble  
Data-Out edge to Clock edge Skew  
0.6  
600  
0.6  
500  
Address and control input setup time  
tIS  
350  
-
250  
-
ps  
Rev. 1.0 / Dec. 2009  
16  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
- Continued -  
DDR2-400  
DDR2-533  
Parameter  
Symbol  
Unit Note  
Min  
Max  
Min  
Max  
Address and control input hold time  
Read preamble  
Read postamble  
tIH  
tRPRE  
tRPST  
475  
0.9  
0.4  
-
1.1  
0.6  
375  
0.9  
0.4  
-
1.1  
0.6  
ps  
tCK  
tCK  
Auto-Refresh to Active/Auto-Refresh command  
period  
tRFC  
127.5  
-
127.5  
-
ns  
Row Active to Row Active Delay for 1KB page size  
tRRD  
tRRD  
tFAW  
tFAW  
7.5  
10  
-
-
-
-
7.5  
10  
-
-
-
-
ns  
ns  
ns  
ns  
Row Active to Row Active Delay for 2KB page size  
Four Activate Window for 1KB page size  
Four Activate Window for 2KB page size  
37.5  
50  
37.5  
50  
CAS to CAS command delay  
Write recovery time  
Auto Precharge Write Recovery + Precharge Time  
tCCD  
tWR  
tDAL  
2
15  
tWR+tRP  
2
15  
tWR+tRP  
tCK  
ns  
tCK  
-
-
-
-
Write to Read Command Delay  
tWTR  
10  
-
ns  
7.5  
-
Internal read to precharge command delay  
Exit self refresh to a non-read command  
Exit self refresh to a read command  
Exit precharge power down to any non-read  
command  
tRTP  
tXSNR  
tXSRD  
7.5  
tRFC + 10  
200  
7.5  
tRFC + 10  
200  
ns  
ns  
tCK  
-
-
-
-
tXP  
2
2
2
2
tCK  
tCK  
tCK  
Exit active power down to read command  
Exit active power down to read command  
tXARD  
tXARDS  
6 - AL  
6 - AL  
(Slow exit, Lower power)  
CKE minimum pulse width  
(high and low pulse width)  
ODT turn-on delay  
tCKE  
tAOND  
tAON  
3
2
3
2
tCK  
tCK  
ns  
2
2
tAC(max)  
tAC(max)  
ODT turn-on  
tAC(min)  
tAC(min)  
+1  
+1  
2tCK+tAC  
(max)+1  
2.5  
2tCK+tAC  
(max)+1  
2.5  
ODT turn-on(Power-Down mode)  
ODT turn-off delay  
tAONPD tAC(min)+2  
tAC(min)+2  
2.5  
ns  
tCK  
ns  
tAOFD  
tAOF  
2.5  
tAC(max)+  
tAC(max)+  
ODT turn-off  
tAC(min)  
tAC(min)  
0.6  
0.6  
2.5tCK+tAC  
(max)+1  
2.5tCK+tAC  
(max)+1  
ODT turn-off (Power-Down mode)  
tAOFPD  
tAC(min)+2  
tAC(min)+2  
ns  
ODT to power down entry latency  
ODT power down exit latency  
OCD drive mode output delay  
tANPD  
tAXPD  
tOIT  
3
8
0
3
8
0
tCK  
tCK  
ns  
12  
12  
Minimum time clocks remains ON after CKE  
asynchronously drops LOW  
tDelay  
tIS+tCK+tIH  
tIS+tCK+tIH  
ns  
tREFI  
tREFI  
-
-
7.8  
3.9  
-
-
7.8  
3.9  
us  
us  
2
3
Average periodic Refresh Interval  
Notes:  
1. For details and notes, please refer to the relevant Hynix component datasheet(HY5PS1G8(16)31CFP).  
2. C TCASE ≤ 85°C  
3. 85°C TCASE ≤ 95°C  
Rev. 1.0 / Dec. 2009  
17  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
DDR2-667  
min  
DDR2-800  
min  
Symbol  
Unit Note  
Parameter  
max  
+450  
+400  
0.55  
0.55  
max  
+400  
+350  
0.52  
0.52  
DQ output access time from CK/CK  
DQS output access time from CK/CK  
CK high-level width  
tAC  
tDQSCK  
tCH  
-450  
-400  
0.45  
0.45  
-400  
-350  
0.48  
0.48  
ps  
ps  
tCK  
tCK  
CK low-level width  
tCL  
min(tCL,  
tCH)  
min(tCL,  
tCH)  
CK half period  
tHP  
tCK  
tDS  
-
8000  
-
-
8000  
-
ps  
ps  
Clock cycle time, CL=x  
3000  
2500  
DQ and DM input setup time  
(differential strobe)  
100  
50  
ps  
ps  
1
1
DQ and DM input hold time  
(differential strobe)  
tDH  
175  
0.6  
-
-
125  
-
-
Control & Address input pulse width for each  
input  
tIPW  
0.6  
tCK  
DQ and DM input pulse width for each input  
Data-out high-impedance time from CK/CK  
DQS low-impedance time from CK/CK  
DQ low-impedance time from CK/CK  
tDIPW  
tHZ  
0.35  
-
-
0.35  
-
tCK  
ps  
tAC max  
tAC max  
tAC max  
tAC max  
tAC max  
tAC max  
tLZ(DQS)  
tLZ(DQ)  
tAC min  
2*tAC min  
tAC min  
ps  
2*tAC min  
ps  
DQS-DQ skew for DQS and associated DQ  
signals  
tDQSQ  
-
240  
-
240  
ps  
DQ hold skew factor  
tQHS  
tQH  
-
340  
-
-
300  
-
ps  
ps  
DQ/DQS output hold time from DQS  
tHP - tQHS  
tHP - tQHS  
First DQS latching transition to associated  
clock edge  
tDQSS  
-0.25  
+0.25  
-0.25  
+0.25  
tCK  
DQS input high pulse width  
DQS input low pulse width  
DQS falling edge to CK setup time  
DQS falling edge hold time from CK  
Mode register set command cycle time  
Write preamble  
tDQSH  
tDQSL  
tDSS  
tDSH  
tMRD  
tWPRE  
tWPST  
tIS  
0.35  
0.35  
0.2  
0.2  
2
-
0.35  
0.35  
0.2  
0.2  
2
-
tCK  
tCK  
tCK  
tCK  
tCK  
tCK  
tCK  
ps  
-
-
-
-
-
-
-
-
0.35  
0.4  
200  
275  
0.9  
0.4  
45  
-
0.6  
-
0.35  
0.4  
175  
250  
0.9  
0.4  
45  
-
0.6  
-
Write postamble  
Address and control input setup time  
Address and control input hold time  
Read preamble  
tIH  
-
-
ps  
tRPRE  
tRPST  
tRAS  
1.1  
0.6  
70000  
1.1  
0.6  
70000  
tCK  
tCK  
ns  
Read postamble  
Activate to precharge command  
Row Active to Row Active Delay for 1KB  
page size  
tRRD  
tRRD  
7.5  
10  
-
-
7.5  
10  
-
-
ns  
ns  
Row Active to Row Active Delay for 2KB  
page size  
Four Active Window for 1KB page size  
products  
tFAW  
tFAW  
37.5  
50  
-
-
35  
45  
-
-
ns  
ns  
Four Active Window for 2KB page size  
products  
Rev. 1.0 / Dec. 2009  
18  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
- continued -  
DDR2-667  
DDR2-800  
Symbol  
Unit Note  
Parameter  
min  
2
max  
min  
max  
CAS to CAS command delay  
Write recovery time  
tCCD  
tWR  
2
-
-
tCK  
ns  
15  
-
-
-
15  
Auto precharge write recovery + precharge  
time  
tDAL  
WR+tRP  
WR+tRP  
-
tCK  
Internal write to read command delay  
Internal read to precharge command delay  
Exit self refresh to a non-read command  
Exit self refresh to a read command  
tWTR  
tRTP  
7.5  
7.5  
7.5  
7.5  
-
-
-
-
ns  
ns  
tXSNR  
tXSRD  
tRFC + 10  
200  
-
-
tRFC + 10  
200  
ns  
tCK  
Exit precharge power down to any non-  
read command  
tXP  
2
2
-
-
-
2
2
-
-
-
tCK  
tCK  
tCK  
Exit active power down to read command  
tXARD  
tXARDS  
Exit active power down to read command  
(Slow exit, Lower power)  
7 - AL  
8 - AL  
CKE minimum pulse width  
(high and low pulse width)  
tCKE  
3
tCK  
tCK  
-
3
-
ODT turn-on delay  
ODT turn-on  
tAOND  
tAON  
2
2
2
2
tAC(min)  
tAC(max)+0.7  
tAC(min)  
tAC(max)+0.7 ns  
2tCK+  
tAC(max)+1  
2tCK+  
ns  
ODT turn-on(Power-Down mode)  
tAONPD  
tAC(min)+2  
tAC(min)+2  
tAC(max)+1  
ODT turn-off delay  
ODT turn-off  
tAOFD  
tAOF  
2.5  
2.5  
2.5  
2.5  
tCK  
tAC(min)  
tAC(max)+ 0.6  
tAC(min)  
tAC(max)+ 0.6 ns  
2.5tCK+  
tAC(max)+1  
2.5tCK+  
ns  
ODT turn-off (Power-Down mode)  
tAOFPD  
tAC(min)+2  
tAC(min)+2  
tAC(max)+1  
ODT to power down entry latency  
ODT power down exit latency  
OCD drive mode output delay  
tANPD  
tAXPD  
tOIT  
3
8
0
-
3
8
0
-
tCK  
tCK  
ns  
12  
-
12  
-
Minimum time clocks remains ON after CKE  
asynchronously drops LOW  
tDelay  
tIS+tCK+tIH  
tIS+tCK+tIH  
ns  
tREFI  
tREFI  
-
-
7.8  
3.9  
-
-
7.8  
3.9  
us  
us  
2
3
Average periodic Refresh Interval  
Notes:  
1. For details and notes, please refer to the relevant Hynix component datasheet(HY5PS1G8(16)31CFP).  
2. C TCASE ≤ 85°C  
3. 85°C TCASE ≤ 95°C  
Rev. 1.0 / Dec. 2009  
19  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PACKAGE OUTLINE  
64Mx64 - HYMP164S64CP(R)6  
Front  
67.60  
2.00 Min  
4.00 ± 0.10  
Detail B  
PIN 39  
Detail A  
PIN 199  
PIN 1  
PIN 41  
11.40  
2.15  
2.45  
1.80 ± 0.10  
47.40  
4.20  
SIDE  
3.8MAX  
Back  
Detail B  
11.40  
47.40  
1.50 ± 0.10  
PIN 2  
PIN42  
PIN 200  
PIN 40  
1.00 ± 0.10  
Detail of Contacts B (Front)  
Detail of Contacts B (Back)  
Detail of Contacts A  
0.03  
0.45  
±
4.20  
1.50  
2.70  
± 0.10  
0.60  
1.0  
±
0.05  
1.80  
2.40  
± 0.10  
4.20  
Note:  
1. All dimensions are in millimeters.  
2. All outline dimensions and tolerances follow the JEDEC standard.  
Rev. 1.0 / Dec. 2009  
20  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PACKAGE OUTLINE  
128Mx64 - HYMP112S64CP(R)6  
Front  
67.60  
2.00 Min  
4.00  
±
0.10  
Detail B  
PIN 39  
Detail A  
PIN 199  
PIN 1  
1.80  
PIN 41  
11.40  
.10  
2.15  
2.45  
±
0
47.40  
4.20  
SIDE  
Back  
11.40  
1.50 ± 0.10  
47.40  
3.8MAX  
PIN 2  
PIN42  
Detail B  
PIN 200  
PIN 40  
1.00 ± 0.10  
Detail of Contacts B (Back)  
Detail of Contacts B (Front)  
Detail of Contacts A  
4.20  
2.70  
± 0.10  
1.50  
0.60  
1.0  
±
0.05  
1.80  
0.45  
± 0.03  
2.40  
± 0.10  
4.20  
Note:  
1. All dimensions are in millimeters.  
2. All outline dimensions and tolerances follow the JEDEC standard.  
Rev. 1.0 / Dec. 2009  
21  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PACKAGE OUTLINE  
256Mx64 - HYMP125S64CP(R)8  
Front  
67.60  
2.00 Min  
4.00  
± 0.10  
Detail B  
PIN 39  
Detail A  
PIN 199  
PIN 1  
1.80  
PIN 41  
11.40  
2.15  
±
0
.10  
47.40  
4.20  
Back  
SIDE  
Detail B  
11.40  
± 0.10  
47.40  
2.45  
3.8MAX  
1.50  
PIN 2  
PIN 200  
PIN42  
PIN 40  
1.00 ± 0.10  
Detail of Contacts B (Front)  
Detail of Contacts B (Back)  
Detail of Contacts A  
0.03  
0.45  
±
4.20  
2.70  
± 0.10  
1.50  
0.60  
1.0  
±
0.05  
1.80  
± 0.10  
2.40  
4.20  
Note:  
1. All dimensions are in millimeters.  
2. All outline dimensions and tolerances follow the JEDEC standard.  
Rev. 1.0 / Dec. 2009  
22  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
REVISION HISTORY  
Revision  
History  
Date  
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
1.0  
Initial data sheet released  
Jan. 2007  
Feb. 2007  
May 2007  
Jun. 2007  
Aug. 2007  
Oct. 2007  
Jan. 2008  
Apr. 2008  
Dec. 2009  
Updated SPEED GRADE & KEY PARAMETERS  
Updated IDD Spec and corrected typos  
IDD updated  
DIMM outline corrected  
S6 items added  
DIMM outline corrected  
DIMM outline & typo corrected & Halogen-free included  
Udated AC Timing Parameters by Speed Grade  
Rev. 1.0 / Dec. 2009  
23  
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