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IXTT8P50

型号:

IXTT8P50

描述:

标准功率MOSFET - P沟道增强型额定雪崩[ Standard Power MOSFET - P-Channel Enhancement Mode Avalanche Rated ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

4 页

PDF大小:

574 K

VDSS = -500 V  
ID25 = -11 A  
RDS(on) = 0.75 Ω  
Standard Power MOSFET  
P-ChannelEnhancementMode  
IXTH 11P50  
IXTT 11P50  
Avalanche Rated  
TO-247AD(IXTH)  
Symbol  
TestConditions  
Maximum Ratings  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
-500  
-500  
V
V
VGS  
Continuous  
Transient  
20  
30  
V
V
(TAB)  
VGSM  
D
ID25  
IDM  
IAR  
TC = 25°C  
TC = 25°C, pulse width limited by TJ  
TC = 25°C  
-11  
-44  
-11  
A
A
A
TO-268 (IXTT) Case Style  
EAR  
PD  
TC = 25°C  
TC = 25°C  
30  
mJ  
W
300  
G
(TAB)  
D
TJ  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
S
TJM  
Tstg  
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
TL  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Md  
Mounting torque  
(TO-247)  
1.13/10 Nm/lb.in.  
Weight  
TO-247AD  
TO-268  
6
4
g
g
Features  
z
International standard packages  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
Unclamped Inductive Switching (UIS)  
rated  
z
z
z
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
z
Low package inductance  
- easy to drive and to protect  
VDSS  
VGS = 0 V, I = -250 µA  
-500  
-3.0  
V
BVDSS TempDerature Coefficient  
0.054  
%/K  
Advantages  
z
Easy to mount  
Space savings  
VGS(th)  
VDS = V , ID = -250 µA  
-5.0  
V
%/K  
VGS(th) TeGmS peratureCoefficient  
-0.122  
z
z
High power density  
IGSS  
IDSS  
VGS = 20 VDC, VDS = 0  
100  
nA  
VDS = 0.8 • VDSS  
VGS = 0 V  
T = 25°C  
TJJ = 125°C  
-200  
µA  
-1 mA  
RDS(on)  
VGS = -10 V, ID = 0.5 • ID25  
RDS(on) Temperature Coefficient  
0.75  
0.6 %/K  
DS94535J(01/05)  
© 2005 IXYS All rights reserved  
IXTH 11P50  
IXTT 11P50  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
TO-247 AD Outline  
VDS = -10 V; ID = ID25, pulse test  
5
9
S
1
2
3
Ciss  
Coss  
Crss  
4700  
430  
pF  
pF  
pF  
VGS = 0 V, VDS = -25 V, f = 1 MHz  
135  
td(on)  
tr  
td(off)  
tf  
33  
27  
35  
35  
ns  
ns  
ns  
ns  
VGS = -10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
Terminals: 1 - Gate  
3 - Source  
2 - Drain  
Tab - Drain  
RG = 4.7 (External)  
Dim.  
Millimeter  
Min.  
Inches  
Max.  
Min. Max.  
A
A12  
4.7  
2.2  
2.2  
1.0  
1.65  
2.87  
5.3  
2.54  
2.6  
1.4  
2.13  
3.12  
.185 .209  
.087 .102  
.059 .098  
.040 .055  
.065 .084  
.113 .123  
QG(on)  
QGS  
130  
46  
nC  
nC  
nC  
A
VGS = -10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
b
b
QGD  
92  
b12  
C
D
E
.4  
.8  
.016 .031  
.819 .845  
.610 .640  
RthJC  
RthCS  
0.42 K/W  
K/W  
20.80 21.46  
15.75 16.26  
(TO-247)  
0.25  
e
5.20  
19.81 20.32  
4.50  
5.72 0.205 0.225  
L
.780 .800  
.177  
L1  
P 3.55  
3.65  
.140 .144  
Q
5.89  
4.32  
6.40 0.232 0.252  
R
S
5.49  
.170 .216  
242 BSC  
6.15 BSC  
Source-DrainDiode  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
TO-268 Outline  
Symbol  
IS  
TestConditions  
VGS = 0  
10P50  
11P50  
-10  
-11  
A
A
ISM  
VSD  
trr  
Repetitive; pulse width limited by TJM 10P50  
11P50  
-40  
-44  
A
A
IF = IS, VGS = 0 V,  
Pulse test, t 300 µs, duty cycle d 2 %  
-3  
V
IF = IS, di/dt = 100 A/µs  
500  
ns  
Terminals: 1 - Gate  
3 - Source  
2 - Drain  
Tab - Drain  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered by  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,381,025  
5,486,715  
6,162,665  
6,259,123B1  
6,306,728 B1  
6,404,065B1  
6,534,343  
6,583,505  
6,683,344  
6,710,405B2  
6,710,463  
6,727,585  
6,759,692  
6771478B2  
oneormoreofthefollowingU.S.patents:  
IXTH 11P50  
IXTT 11P50  
Fig. 1. Output Characteristics  
@ 25 Deg. C  
Fig. 2. Extended Output Characteristics  
@ 25 Deg. C  
-12  
-10  
-8  
-24  
-20  
-16  
-12  
-8  
VGS= -10V  
-9V  
VGS= -10V  
-9V  
-8V  
-8V  
-7V  
-6  
-7V  
-6V  
-5V  
-4  
-6V  
-5V  
-2  
-4  
0
0
0
-4  
-8  
-12  
-16  
-20  
0
-2  
-4  
-6  
-8  
-10  
VDS - Volts  
VDS - Volts  
Fig. 3. Output Characteristics  
@ 125 Deg. C  
Fig. 4. RDS(ON) Normalized to ID25 Value  
vs. Junction Temperature  
-12  
-10  
-8  
2.5  
2.2  
1.9  
1.6  
1.3  
1
VGS= -10V  
-9V  
VGS= -10V  
-8V  
-7V  
-6  
ID= -11A  
ID= -5.5A  
-6V  
-5V  
-4  
-2  
0.7  
0.4  
0
0
-3  
-6  
-9  
-12  
-15  
-18  
-50 -25  
0
25  
50 75 100 125 150  
VDS - Volts  
TJ - Degrees Centigrade  
Fig. 5. RDS(ON ) Norm alized to ID25  
Value vs. ID  
Fig. 6. Input Admittance  
2.6  
2.2  
1.8  
1.4  
1
-18  
-15  
-12  
-9  
VGS= -10V  
TJ=125°C  
T = -40 C  
°
J
25 C  
°
125 C  
°
-6  
-3  
TJ=25°C  
0.6  
0
0
-5  
-10  
-15  
-20  
-25  
-4.5  
-5  
-5.5  
-6  
-6.5  
-7  
-7.5  
ID - Am peres  
VGS - Volts  
© 2005 IXYS All rights reserved  
IXTH 11P50  
IXTT 11P50  
Fig. 8. Source Current vs. Source-To-  
Drain Voltage  
Fig. 7. Transconductance  
25  
20  
15  
10  
5
50  
40  
30  
20  
10  
0
T = -40 C  
°
J
TJ = 25°C  
T = 125 C  
°
J
T =125 C  
°
J
T =25 C  
°
J
0
0
-5  
-10  
-15  
-20  
-25  
-30  
0.5  
1
1.5  
2
2.5  
3
3.5  
ID - Amperes  
VSD - Volts  
Fig. 9. Gate Charge  
Fig. 10. Capacitance  
-10  
-8  
-6  
-4  
-2  
0
10000  
1000  
100  
VDS= -250V  
ID= -5.5A  
IG= -1mA  
Ciss  
f=1Mhz  
Coss  
Crss  
0
25  
50  
75  
100  
125  
0
-10  
-20  
-30  
-40  
QG - nanoCoulombs  
V
DS - Volts  
Fig. 14. Maximum Transient Thermal Resistance  
1
0.1  
0.01  
1
10  
100  
1000  
Pulse W idth - milliseconds  
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