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TYPESP3220EBCA

型号：

TYPESP3220EBCA

描述：

+ 3.0V至+ 5.5V的RS - 232驱动器/接收器对[ +3.0V to +5.5V RS-232 Driver/Receiver Pair ]

品牌：

SIPEX[ SIPEX CORPORATION ]

页数：

21 页

PDF大小：

486 K

下载PDF手册
®
SP3220E/EB/EU  
+3.0V to +5.5V RS-232 Driver/Receiver Pair  
■ MeetsAllEIA-232andITUV.28Specifications  
fromawide+3.0Vto+5.5Vpowersupply  
EN  
1
2
3
4
5
6
16  
15  
14  
13  
12  
11  
SHDN  
● InteroperablewithRS232andV.28at2.7V  
C1+  
V+  
V
CC  
■ SupportsHighSerialDataRates:  
● 120kbps SP3220E  
GND  
● 250kbps SP3220EB  
● 1Mbps SP3220EU  
C1-  
SP3220  
T1OUT  
E/EB/EU  
■ 1µALowPowerShutdownMode  
■ FootprintCompatiblewithMAX3221E,ISL3221  
■ 4x0.1µFExternalChargePumpCapacitors  
■ Tri–State/ReceiverEnable  
C2+  
C2-  
V-  
NoConnect  
T1IN  
7
8
10  
9
NoConnect  
R1OUT  
■ ImprovedESDSpecifications:  
● +15kVHumanBodyModel  
R1IN  
● +15kVIEC1000-4-2AirDischarge  
● +8kVIEC1000-4-2ContactDischarge  
Available in Lead Free Packaging  
DESCRIPTION  
TheSP3220E devicesareRS-232driver/receiversolutionsintendedforportableorhand-held  
applications such as palmtop computers, instrumentation and consumer products. These  
devices incorporate a high-efficiency charge-pump power supply that allows theSP3220E  
devicestodelivertrueRS-232performancefromasinglepowersupplyrangingfrom+3.0V  
to +5.0V. This charge pump requires only 0.1µF capacitors in 3.3V operation. The ESD  
toleranceofthesedevicesisover±15kVforbothHumanModelandIEC1000-4-2Airdischarge  
test methods. All devices have a low-power shutdown mode where the driver outputs and  
chargepumpsaredisabled.Duringshutdown,thesupplycurrentfallstolessthan1µA.  
V
CC  
+
15  
0.1µF  
C5  
V
CC  
3
7
2
C1+  
V+  
V-  
+
+
C1 0.1µF  
0.1µF  
*C3  
4
C1-  
5
C2+  
SP3220  
+
E/EB/EU  
C4 0.1µF  
C2  
0.1µF  
+
6
C2-  
T1OUT  
LOGIC  
13  
R1IN 8  
11  
T1IN  
RS-232  
INPUTS  
OUTPUTS  
R1OUT  
9
LOGIC  
RS-232  
OUTPUTS  
INPUTS  
5k1  
16  
1
SHDN  
EN  
GND  
14  
*canbereturnedto  
eitherVCC orGND  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢀ
Input Voltages  
ABSOLUTE MAXIMUM RATINGS  
Thesearestressratingsonlyandfunctionaloperation  
ofthedeviceattheseratingsoranyotherabovethose  
indicatedintheoperationsectionsofthespecifications  
belowisnotimplied. Exposuretoabsolutemaximum  
rating conditions for extended periods of time may  
affectreliabilityandcausepermanentdamagetothe  
device.  
TxIN,EN,SHUTDOWN................ -0.3VtoVCC+0.3V  
RxIN ...................................................................+25V  
Output Voltages  
TxOUT.............................................................+13.2V  
RxOUT .........................................-0.3Vto(V +0.3V)  
CC  
Short-Circuit Duration  
TxOUT...................................................... Continuous  
V .............................................................-0.3Vto+6.0V  
CC  
StorageTemperature.......................-65°Cto+150°C  
V+(NOTE1)..............................................-0.3Vto+7.0V  
V-(NOTE1).............................................+0.3Vto-7.0V  
V++|V-|(NOTE1)...................................................+13V  
Power Dissipation Per Package  
o
o
16-pinSSOP(derate9.69mW/Cabove+70C) ........ 775mW  
o
o
16-pinTSSOP(derate10.5mW/Cabove+70C)..... 840mW  
o
o
16-pinWideSOIC(derate11.2mW/Cabove+70C) 900mW  
I (DCV orGNDcurrent)..........................+100mA  
CC  
CC  
NOTE 1: V+andV-canhavemaximummagnitudesof7V,buttheirabsolutedifferencecannotexceed13V.  
SPECIFICATIONS  
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX  
.
Typical Values apply at VCC = +3.3V or +5.0V and TAMB = 25oC, C1-4=0.1µF.  
PARAMETER  
MIN.  
TYP.  
MAX. UNITS  
CONDITIONS  
DCCHARACTERISTICS  
SupplyCurrent  
o
noload,TAMB =+25C,V =3.3V,TxIN=  
CC  
0.3  
1.0  
1.0  
10  
mA  
GNDorV  
CC  
_____  
o
SHDN=GND, TAMB =+25C,V =+3.3V,  
µA  
ShutdownSupplyCurrent  
CC  
TxIN=GNDorV  
CC  
LOGICINPUTSANDRECEIVEROUTPUTS  
InputLogicThresholdLOW GND  
___ _______  
0.8  
V
TxIN,EN,SHDN,Note2  
2.0  
InputLogicThresholdHIGH  
2.4  
V
V = 3.3V,Note2  
CC  
V
V = 5.0V,Note2  
CC  
__ _____  
TxIN,EN,SHDN,  
µA  
InputLeakageCurrent  
±0.01 ±1.0  
±0.05 ±10  
o
T
AMB =+25CV =GNDtoV  
IN  
CC  
µA  
OutputLeakageCurrent  
OutputVoltageLOW  
OutputVoltageHIGH  
DRIVEROUTPUTS  
ReceiversDisabledV =GNDtoV  
OUT  
CC  
0.4  
V
I
OUT =1.6mA  
V -0.6 V -0.1  
V
I
OUT =-1.0mA  
CC  
CC  
3kΩ loadtogroundatalldriveroutputs,  
OutputVoltageSwing  
±5.0  
300  
±5.4  
V
o
T
AMB =+25C  
Ω
OutputResistance  
V =V+=V-=GND,TOUT =+2V  
CC  
OutputShort-CircuitCurrent  
±35  
±60  
±25  
mA V =GND  
OUT  
µA  
OutputLeakageCurrent  
V =+12V,V =GNDto5.5V,driversdisabled  
OUT  
CC  
NOTE 2: Driver input hysteresis is typically 250mV.  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
2
SPECIFICATIONS (continued)  
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX  
Typical Values apply at VCC = +3.3V or +5.0V and TAMB = 25oC, C1-4=0.1µF.  
.
PARAMETER  
MIN. TYP. MAX. UNITS  
CONDITIONS  
RECEIVERINPUTS  
InputVoltageRange  
-25  
+25  
V
InputThresholdLOW  
0.6 1.2  
0.8 1.5  
V V =3.3V  
C
C
V =5.0V  
C
C
InputThresholdHIGH  
1.5 2.4  
1.8 2.4  
V V =3.3V  
C
C
V =5.0V  
C
C
InputHysteresis  
0.3  
V
InputResistance  
3
5
7
kΩ  
TIMINGCHARACTERISTICS  
DataRateSP3220E  
DataRateSP3220EB  
DataRateSP3220EU  
ReceiverPropagationDelay  
120 235  
250  
Kbps R=3kΩ,C=1000pF,onedriverswitching  
L
L
Kbps R=3kΩ,C=1000pF  
L
L
1000  
Kbps R=3kΩ,C=250pF  
L
0.15  
0.15  
t LHL,RxINtoRxOUT,C =150pF  
µs  
P
L
µs  
ns  
ns  
t HL,RxINtoRxOUT,C =150pF  
P
L
ReceiverOutputEnableTime  
ReceiverOutputDisableTime  
DriverSkew  
200  
200  
100  
50  
o
ns |t HL -t H |,T MB =25C  
P
PL  
A
ReceiverSkew  
ns |t HL -t H |  
P
PL  
o
Transition-RegionSlewRate  
30  
V/µs V =3.3V,R =3KΩ,T MB =25C,  
C
L
A
orC+3.0Vto-3.0V(SP3220EandEB)  
measurementstakenfrom-3.0Vto+3.0V  
90  
V/µs (SP3220EU)  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
3
TYPICAL PERFORMANCE CHARACTERISTICS  
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rates, all drivers  
loaded with 3k1, 0.1µF charge pump capacitors, and TAMB = +25°C.  
6
4
2
30  
25  
20  
15  
10  
5
T
1atFullDataRate  
1
2
5
Kbps  
T
2at1/16FullDataRate  
TxOUT+  
TxOUT-  
T
1
+
T
2L  
o
a
d
e
dwith3k/C  
L
o
a
d
T1at2  
5
0
Kbps  
60  
Kbps  
0
2
0
Kbps  
-2  
-4  
-6  
0
0
1000 2000 3000 4000  
5000  
0
1000 2000 3000 4000 5000  
LoadCapacitance(pF)  
LoadCapacitance(pF)  
Figure 2. Transmitter Output Voltage vs Load Capaci-  
tance for the SP3220EB.  
Figure 1. ICC vs Load Capacitance for the SP3220EB.  
12  
10  
8
6
4
6
TxOUT+  
4
2
0
-2  
-4  
2
TxOUT-  
-6  
T1L  
o
a
d
e
dwith3K//1  
0
0
0
pf@2  
5
0
Kbps  
0
2.7  
3
3.5  
4
4.5  
5
2.7  
3
3.5  
4
4.5  
5
Supply Voltage (V)  
SupplyVoltage(V)  
Figure 4. Supply Current vs Supply Voltage for the  
SP3220EB.  
Figure 3. Transmitter Output Voltage vs Supply Voltage  
for the SP3220EB.  
40  
25  
1
Mbps  
-Sle  
w
+Sle  
w
20  
15  
10  
5
30  
20  
10  
0
2Mbps  
5
0
0
Kbps  
0
0
500 1000 2000 3000 4000 5000  
0
250 500 1000 2000 3000 4000  
LoadCapacitance(pF)  
LoadCapacitance(pF)  
Figure 4. Supply Current vs Supply Voltage for the  
SP3220EU.  
Figure 5. Slew Rate vs Load Capacitance for the  
SP3220EB.  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢁ
TYPICAL PERFORMANCE CHARACTERISTICS: Continued  
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rates, all drivers  
loaded with 3k1, 0.1µF charge pump capacitors, and TAMB = +25°C.  
6
6
1.5Mbps  
TxOUT+  
2Mbps  
1Mbps  
4
2
4
2
0
0
-2  
-4  
-6  
-2  
-4  
1.5Mbps  
1000  
2Mbps  
1Mbps  
TxOUT-  
2.5  
2.7  
3
3.5  
4
4.5  
5
-6  
0
250  
500  
1500 2000  
Supply Voltage (V)  
Load Capacitance (pF)  
Figure 8. Transmitter Output Voltage vs Supply Voltage  
for the SP3220EU.  
Figure 7. Transmitter Output Voltage vs Load Capaci-  
tance for the SP3220EU.  
16  
14  
12  
10  
8
6
4
T1Loadedwith3K//1000pf@1Mbps  
2
0
2.7  
3
3.5  
4
4.5  
5
SupplyVoltage(V)  
Figure 9. Supply Current vs Supply Voltage for the  
SP3220EU.  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
5
NAME  
FUNCTION  
PIN NUMBER  
ReceiverEnableControl. DriveLOWfornormaloperation. DriveHIGHtoTri-  
Statethereceiveroutputs(high-Zstate).  
EN  
1
C1+  
V+  
C1-  
C2+  
C2-  
V-  
Positiveterminalofthevoltagedoublercharge-pumpcapacitor.  
+5.5Vgeneratedbythechargepump.  
2
3
Negativeterminalofthevoltagedoublercharge-pumpcapacitor.  
Positiveterminaloftheinvertingcharge-pumpcapacitor.  
Negativeterminaloftheinvertingcharge-pumpcapacitor.  
-5.5Vgeneratedbythechargepump.  
4
5
6
7
R1IN RS-232receiverinput.  
8
R1OUT TTL/CMOSrecieveroutput.  
9
N.C.  
NoConnect.  
10,12  
11  
13  
14  
15  
T1IN TTL/CMOSdriverinput.  
T1OUT RS-232driveroutput.  
GND Ground.  
V
+3.0Vto+5.5Vsupplyvoltage  
C
C
ShutdownControlInput. DriveHIGHfornormaldeviceoperation. DriveLOWto  
SHDN shutdownthedrivers(high-Zoutput)andtheon-boardchargepumppower  
supply.  
16  
Table 1. Device Pin Description  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢂ
EN  
16  
15  
14  
13  
12  
11  
1
2
3
4
5
6
7
SHDN  
C1+  
V+  
V
CC  
GND  
C1-  
SP3220  
T1OUT  
E/EB/EU  
C2+  
C2-  
V-  
NoConnect  
T1IN  
10  
9
NoConnect  
R1OUT  
R1IN  
8
Figure 10. Pinout Configurations for the SP3220E/EB/  
EU  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢃ
V
CC  
+
15  
0.1µF  
C5  
C1  
V
CC  
3
7
2
C1+  
V+  
V-  
+
+
0.1µF  
0.1µF  
*C3  
4
C1-  
5
C2+  
SP3220  
+
E/EB/EU  
C4 0.1µF  
C2  
0.1µF  
+
6
C2-  
T1OUT  
R1IN  
13  
8
LOGIC  
11  
T1IN  
RS-232  
RS-232  
INPUTS  
INPUTS  
OUTPUTS  
R1OUT  
9
LOGIC  
OUTPUTS  
5k1  
16  
1
SHDN  
EN  
GND  
14  
*canbereturnedto  
eitherVCC orGND  
Figure 11. SP3220E/EB/EU Typical Operating Circuits  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
8
DESCRIPTION  
TheSP3220E/EB/EUdevicesmeettheEIA/TIA-  
232andV.28/V.24communicationprotocolsand  
canbeimplementedinbattery-powered,portable,  
or hand-held applications such as notebook or  
palmtop computers. The SP3220E/EB/EU de-  
vicesfeatureSipex'sproprietaryon-boardcharge  
pumpcircuitrythatgenerates2xV forRS-232  
PC-to-PC communication software. The  
SP3220EU driver can guarantee a data rate of  
1000Kbps fully loaded with 31 in parallel with  
250pF.  
The slew rate of the SP3220E and SP3220EB  
outputsareinternallylimitedtoamaximumof30V/  
µsinordertomeettheEIAstandards(EIARS-  
232D2.1.7, Paragraph5). Thetransitionofthe  
loadedoutputfromHIGHtoLOWalsomeetsthe  
monotonicityrequirementsofthestandard. The  
slewrateoftheSP3220EUisnotinternallylimited.  
Thisallowsittotransmitatmuchfasterdatarates.  
Figure12showsaloopbackcircuitusedtotestthe  
RS-232driver.Figure13showsthetestresultsof  
the loopback circuit with the SP3220EB driver  
activeat250KbpswithanRS-232loadinparallel  
witha1000pFcapacitor.Figure14showsthetest  
resultswheretheSP3220EUdriverwasactiveat  
1000KbpsandloadedwithanRS-232receiverin  
parallel with a 250pF capacitor. A solid RS-232  
datatransmissionrateof250Kbpsprovidescom-  
patibilitywithmanydesignsinpersonalcomputer  
peripheralsandLANapplications.  
C
C
voltagelevelsfromasingle+3.0Vto+5.5Vpower  
supply.Thisseriesisidealfor+3.3V-onlysystems,  
mixed +3.0V to +5.5V systems, or +5.0V-only  
systems that require true RS-232 performance.  
TheSP3220EBdevicehasadriverthatcanoper-  
ate at a data rate of 250Kbps fully loaded. The  
SP3220EUcanoperateat1000Kbps;theSP3220E  
operates at a typical data rate of 235Kbps fully  
loaded.  
TheSP3220E/EB/EUisa1-driver/1-receiverde-  
viceidealforportableorhand-held applications.  
The SP3220E/EB/EU features a 1µA shutdown  
mode that reduces power consumption and ex-  
tendsbatterylifeinportablesystems.Itsreceivers  
remainsactiveinshutdownmode,allowing exter-  
naldevicestobemonitoredusingonly1µAsupply  
current.  
THEORY OF OPERATION  
TheSP3220E/EB/EUdriver'soutputstageisturned  
off(high-Z)whenthedeviceisinshutdownmode.  
Whenthepowerisoff,theSP3220E/EB/EU de-  
vicepermitstheoutputstobedrivenupto+12V.  
Thedriver'sinputdoesnothavepull-upresistors.  
DesignersshouldconnectanunusedinputtoV  
The SP3220E/EB/EU devices are made up of  
threebasiccircuitblocks:1.Driver,2. Receiver,  
and3. theSipexproprietarychargepump.  
CC  
Driver  
orGND.  
The driver is an inverting level transmitter that  
convertsTTLorCMOSlogiclevelsto+5.0VEIA/  
TIA-232levels, invertedrelativetotheinputlogic  
levels.Typically,theRS-232outputvoltageswing  
is+5.5Vwithnoloadandatleast+5Vminimum  
fullyloaded.Thedriveroutputsareprotectedagainst  
infinite short-circuits to ground without degrada-  
tioninreliability. DriveroutputswillmeetEIA/TIA-  
562levelsof+3.7Vwithsupplyvoltagesaslowas  
2.7V.  
Intheshutdownmode,thesupplycurrentfallsto  
lessthan1µA,whereSHDN=LOW. Whenthe  
SP3220E/EB/EUdeviceisshutdown,thedevice's  
driveroutputisdisabled(high-Z)andthecharge  
pumpisturnedoffwithV+pulleddowntoV and  
CC  
V- pulled to GND. The time required to exit  
shutdown is typically 100ms. Connect SHDN to  
V iftheshutdownmodeisnotused. SHDN has  
CC  
noeffectonRxOUT.Notethatthedriverisenabled  
onlywhenthemagnitudeofV-exceedsapproxi-  
mately3V.  
TheSP3220EBdrivertypicallycanoperateata  
data rate of 250Kbps fully loaded with 3K1 in  
pa
r
a
l
l
e
l
w
i
th
 
1
000pF, ensu
r
i
n
g co
m
p
a
t
i
b
i
lity
w
i
th  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢄ
V
C
C
+
0.1µF  
C5  
V
C
C
C1+  
V+  
V-  
+
+
C1 0.1µF  
C3 0.1µF  
C1-  
SP3220  
C2+  
+
E/EB/EU  
C4 0.1µF  
C2  
0.1µF  
+
C2-  
TxOUT  
RxIN  
TxIN  
LOGIC  
INPUTS  
RxOUT  
EN  
LOGIC  
OUTPUTS  
5k1  
V
C
C
*SHDN  
GND  
(SP3220EU250pF)  
(SP3220E/EB1000pF)  
Figure 12. SP3220E/EB/EU Driver Loopback Test Circuit  
Figure 13. SP3220EB Driver Loopback Test Results at  
250Kbps  
Figure 14. SP3220EU Driver Loopback Test Results at  
1Mbps  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢀ0  
Receivers  
In most circumstances, decoupling the power  
supplycanbeachievedadequatelyusinga0.1µF  
bypass capacitor at C5 (refer to Figure 11).  
In applications that are sensitive to power-  
supplynoise,decoupleV togroundwithaca-  
ThereceiverconvertsEIA/TIA-232levelstoTTLor  
CMOSlogicoutputlevels. Thereceiverhasan  
inverting high-impedance output. This receiver  
output (RxOUT) is at high-impedance when the  
enablecontrolEN=HIGH.Intheshutdownmode,  
thereceivercanbeactiveorinactive. ENhasno  
effect on TxOUT. The truth table logic of the  
SP3220E/EB/EU driverandreceiveroutputscan  
befoundinTable2.  
CC  
pacitorofthesamevalueascharge-pumpcapaci-  
torC1.Physicallyconnectbypass capacitorsas  
closetotheICaspossible.  
The charge pumps operate in a discontinuous  
mode using an internal oscillator. If the output  
voltagesarelessthanamagnitudeof5.5V, the  
chargepumpsareenabled;iftheoutputvoltages  
exceedamagnitudeof5.5V,thechargepumps  
are disabled. This oscillator controls the four  
phases of the voltage shifting. A description of  
eachphasefollows.  
Sincereceiverinputisusuallyfromatransmission  
line where long cable lengths and system  
interference can degrade the signal, the inputs  
have a typical hysteresis margin of 300mV.  
This ensures that the receiver is virtually  
immune to noisy transmission lines. Should an  
input be left unconnected, a 5k1 pulldown  
resistor to ground will commit the output of the  
receivertoaHIGH state.  
Phase 1  
—V chargestorage—Duringthisphaseofthe  
S
S
clockcycle,thepositivesideofcapacitorsC and  
1
+
CHARGE PUMP  
C areinitiallychargedtoV . C isthenswitched  
2
CC  
l
–
The charge pump is a Sipex–patented design  
(U.S. 5,306,954) and uses a unique approach  
compared to older less–efficient designs. The  
charge pump still requires four external  
capacitors,butusesafour–phasevoltageshifting  
techniquetoattainsymmetrical5.5Vpowersup-  
plies. The internal power supply consists of a  
regulateddualchargepumpthatprovidesoutput  
voltages5.5Vregardlessoftheinputvoltage(V )  
to GND and the charge in C is  
1
–
+
transferredtoC . SinceC isconnectedtoV ,  
2
2
CC  
thevoltagepotentialacrosscapacitorC isnow2  
2
timesV .  
CC  
Phase 2  
— V transfer — Phase two of the clock  
S
S
connects the negative terminal of C to the V  
2
SS  
storagecapacitorandthepositiveterminalofC to  
C
C
2
overthe+3.0Vto+5.5Vrange.  
GND.Thistransfersanegativegeneratedvoltage  
to C . This generated voltage is  
3
regulated to a minimum voltage of -5.5V.  
SimultaneouswiththetransferofthevoltagetoC,  
3
thepositivesideofcapacitorC isswitchedtoV  
1
C
C
andthenegativesideisconnectedtoGND.  
SHDN  
0
EN  
0
1
0
1
TxOUT  
RxOUT  
Phase 3  
Tri-state  
Active  
—V chargestorage—Thethirdphaseofthe  
DD  
0
Tri-state Tri-state  
clockisidenticaltothefirstphase—thecharge  
transferred in C produces –V in the negative  
1
C
C
1
Active  
Active  
Active  
terminalofC,whichisappliedtothenegativeside  
1
+
1
Tri-state  
ofcapacitorC. SinceC isatV , thevoltage  
potentialacrossC is2timesV .CC  
2
2
2
CC  
Table 2. Truth Table Logic for Shutdown and  
Enable Control  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢀꢀ  
Phase 4  
—V transfer—Thefourthphaseoftheclock  
Thechargepumposcillatortypicallyoperates  
atgreaterthan250kHzallowingthepumpto  
run efficiently with small 0.1µF capacitors.  
Efficientoperationdependsonrapidlycharg-  
ing and discharging C and C, therefore  
DD  
connectsthenegativeterminalofC toGND,and  
2
transfersthispositivegeneratedvoltageacrossC  
2
to C, the V storage capacitor. This voltage is  
4
D
regulated toD+5.5V. At this voltage, the internal  
1
2
oscillatorisdisabled. Simultaneouswiththetrans-  
capacitorsshouldbemountedclosetotheIC  
andhavelowESR(equivalentseriesresis-  
tance).  
ferofthevoltagetoC,thepositivesideofcapaci-  
4
torC isswitchedtoV andthenegativesideis  
1
C
connected to GND, allCowing the charge pump  
cycletobeginagain.Thechargepumpcyclewill  
continueaslongastheoperationalconditionsfor  
theinternaloscillatorarepresent.  
Lowcostsurfacemountceramiccapacitors  
(such as are widely used for power-supply  
decoupling)areidealforuseonthecharge  
pump. Howeverthechargepumpsarede-  
signedtobeabletofunctionproperlywitha  
widerangeofcapacitorstylesandvalues. If  
polarizedcapacitorsareusedthepositiveand  
negative terminals should be connected as  
shownintheTypicalOperatingCircuit.  
+
–
Inano–loadconditionV andV willbesymmetri-  
+
–
cal,sincebothV andV areseparatelygenerated  
fromV . Olderchargepumpapproachesthat  
CC  
–
+
generateV fromV willshowadecreaseinthe  
–
+
magnitude of V compared to V due to the  
inherentinefficienciesinthedesign.  
Voltagepotentialacrossanyofthecapacitors  
willneverexceed2xV . Thereforecapaci-  
CC  
CHARGE PUMP DESIGN GUIDELINES  
tors with working voltages as low as 6.3V  
ratingmaybeusedwitha3.0V V supply.  
CC  
The reference terminal of the V+ capacitor  
maybeconnectedeithertoV orground,but  
The charge pump operates with 0.1µF ca-  
pacitorsfor3.3Voperation. Forothersupply  
voltages,seethetableforrequiredcapacitor  
values.Donotusevaluessmallerthanthose  
listed.Increasingthecapacitorvalues(e.g.,  
by doubling in value) reduces ripple on the  
transmitteroutputsandmayslightlyreduce  
powerconsumption.C2,C3,andC4maybe  
CC  
ifconnectedtogroundaminimum10Vwork-  
ingvoltageisrequired. Higherworkingvolt-  
agesand/orcapacitancevaluesmaybead-  
visedifoperatingathigherV ortoprovide  
CC  
greaterstabilityasthecapacitorsage.  
Underlightlyloadedconditionstheintelligent  
increasedwithoutchangingC1’svalue.  
pumposcillatormaximizesefficiencybyrun-  
-
ningonlyasneededtomaintainV+andV.  
Sinceinterfacetransceiversoftenspendmuch  
oftheirtimeatidle,thispower-efficientinno-  
vation can greatly reduce total power con-  
sumption. This improvement is made pos-  
siblebytheindependentphasesequenceof  
Minimum recommended  
charge pump capacitor value  
ChargepumpCapacitor  
Input  
theSipex charge-pumpdesign.  
valueforSP3220E/EB/EU  
VoltageVcc  
3.0Vto3.6V  
3.0Vto5.5V  
C1– C4=0.1uF  
C1– C4=0.22uF  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢀ2  
V
=+5V  
C
C
C
4
+5V  
+
+
–
–
V
SS  
StorageCapacitor  
D
V
D
+
C
C
1
2
–
–
+
StorageCapacitor  
C
–5V  
–5V  
3
Figure 15. Charge Pump — Phase 1  
V
=+5V  
C
C
C
4
+
–
–
V
SS  
StorageCapacitor  
D
V
D
+
+
C
C
1
2
–
–
+
StorageCapacitor  
C
3
–10V  
Figure 16. Charge Pump — Phase 2  
[
T
]
+6V  
a) C2+  
T
T
GND  
1
2
GND  
b) C -  
2
-6V  
Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V  
Figure 17. Charge Pump Waveforms  
V
=+5V  
C
C
C
4
+5V  
+
+
–
–
V
SS  
StorageCapacitor  
D
V
D
+
C
C
1
2
–
–
+
StorageCapacitor  
C
–5V  
–5V  
3
Figure 18. Charge Pump — Phase 3  
V
=+5V  
C
C
C
+10V  
+
4
+
–
–
V
SS  
StorageCapacitor  
D
V
D
+
C
C
1
2
–
–
+
StorageCapacitor  
C
3
Figure 19. Charge Pump — Phase 4  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢀ3  
ESD TOLERANCE  
TheSP3220E/EB/EU deviceincorporatesrugge-  
dizedESDcellsonalldriveroutputandreceiver  
inputpins.TheESDstructureisimprovedoverour  
previousfamilyformoreruggedapplicationsand  
environments sensitive to electro-static  
discharges and associated transients. The im-  
proved ESD tolerance is at least ±15kV without  
damagenorlatch-up.  
exposedtotheoutsideenvironmentandhuman  
presence. ThepremisewithIEC1000-4-2isthat  
thesystemisrequiredtowithstandanamountof  
staticelectricitywhenESDisappliedtopointsand  
surfacesoftheequipmentthatareaccessibleto  
personnelduringnormalusage. Thetransceiver  
ICreceivesmostoftheESDcurrentwhentheESD  
sourceisappliedtotheconnectorpins.Thetest  
circuit for IEC-1000-4-2 is shown in Figure 21.  
There are two methods within IEC-4-2: the Air  
Discharge method and the Contact Discharge  
method.  
There are different methods of ESD testing ap-  
plied:  
a)MIL-STD-883,Method3015.7  
b)IEC1000-4-2AirDischarge  
c)IEC1000-4-2DirectContact  
WiththeAirDischargeMethod,anESDvoltageis  
appliedtotheequipmentundertest(EUT)through  
air. Thissimulatesanelectricallychargedperson  
ready to connect a cable onto the rear of the  
systemonlytofindanunpleasantzapjustbefore  
the person touches the back panel. The high  
energypotentialonthepersondischargesthrough  
anarcingpathtotherearpanelsystembeforehe  
or she even touches the system. This energy,  
whetherdischargeddirectlyorthroughair,ispre-  
dominantly a function of the discharge current  
ratherthanthedischargevoltage.  
TheHumanBodyModelhasbeenthegenerally  
acceptedESDtestingmethodforsemiconductors.  
This method is also specified in MIL-STD-883,  
Method 3015.7 for ESD testing. The premise of  
this ESD test is to simulate the human body’s  
potential to store electro-static energy and  
discharge it to an integrated circuit. The  
simulationisperformedbyusingatestmodelas  
showninFigure20.ThismethodwilltesttheIC’s  
capability to withstand an ESD transient during  
normalhandlingsuchasinmanufacturingareas  
Variables with an air discharge -- such as ap-  
proach speed of the object carrying the ESD  
potentialtothesystemandhumidity--willtendto  
change the discharge current. For example, the  
risetimeofthedischargecurrentvarieswiththe  
approachspeed.  
wheretheICstendtobehandledfrequently.  
The IEC-1000-4-2, formerly IEC801-2, is gener-  
allyusedfortestingESDonequipmentandsystem  
manufacturers; they must guarantee a certain  
amountofESDprotectionsincethesystemitselfis  
R
R
R
R
S
C
S
C
SW2  
SW2  
SW1  
SW1  
Device  
Under  
Test  
DCPower  
Source  
C
C
S
S
Figure 20. ESD Test Circuit for Human Body Model  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢀꢁ  
The circuit models in Figure 20 and 21  
TheContactDischargeMethodappliesthe  
ESDcurrentdirectlytotheEUT.Thismethod  
wasdevisedtoreducetheunpredictability  
oftheESDarc.Thedischargecurrentrise  
timeisconstantsincetheenergyisdirectly  
transferedwithouttheair-gaparc.Insitua-  
tionssuchashandheldsystems,theESD  
charge can be directly discharged to the  
equipmentfromapersonincontactwiththe  
equipment.Thecurrentistransferredonto  
thekeypadortheserialportoftheequip-  
mentdirectlyandthentravelsthroughthe  
PCBandfinallytotheIC.  
represent the typical ESD testing circuits  
usedforallthreemethods.TheC isinitially  
S
charged with the DC power supply when  
the first switch (SW1) is on. Now that the  
capacitor is charged, the second switch  
(SW2) is on while SW1 switches off. The  
voltagestoredinthecapacitoristhenap-  
pliedthroughR ,thecurrentlimitingresis-  
S
tor, onto the device under test (DUT). In  
ESDtests,theSW2switchispulsedsothat  
thedeviceundertestrecivesadurationof  
voltage.  
Contact-DischargeModule  
R
R
R
R
R
S
V
C
S
C
SW2  
SW2  
SW1  
SW1  
Device  
Under  
Test  
DCPower  
Source  
C
C
S
S
R andR addupto3301 forIEC1000-4-2.  
S
V
Figure 21. ESD Test Circuit for IEC1000-4-2  
For the Human Body Model, the current  
limitingresistor(R )andthesourcecapaci-  
ForIEC-1000-4-2,thecurrentlimitingresis-  
tor(RS)andthesourcecapacitor(CS)are  
3301 and150pF,respectively.  
ThehigherCSvalueandlowerRSvaluein  
theIEC1000-4-2modelaremorestringent  
than the Human Body Model. The larger  
storagecapacitorinjectsahighervoltageto  
thetestpointwhenSW2isswitchedon.The  
lowercurrentlimitingresistorincreasesthe  
currentchargeontothetestpoint.  
30A  
15A  
0A  
tor(C )are1.5k1 Sand100pF,respectively.  
S
t=30nS  
t
t=0nS  
Figure 22. ESD Test Waveform for IEC1000-4-2  
Device Pin  
Tested  
Human Body  
Model  
IEC1000-4-2  
Air Discharge Direct Contact Level  
DriverOuputs  
±15kV  
±15kV  
±8kV  
4
ReceiverInputs  
±15kV  
±15kV  
±8kV  
4
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢀ5  
PACKAGE: PLASTIC SHRINK�  
SMALL OUTLINE�  
(SSOP)  
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Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢀꢂ  
PACKAGE: PLASTIC�  
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Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢀꢃ  
PACKAGE: PLASTIC THIN SMALL  
OUTLINE  
(TSSOP)  
E2  
E
D
B
A
Ø
L
A1  
e
DIMENSIONS  
in inches (mm)  
16–PIN  
20–PIN  
Minimum/Maximum  
- /0.043  
(- /1.10)  
- /0.043  
(- /1.10)  
A
0.002/0.006  
(0.05/0.15)  
0.002/0.006  
(0.05/0.15)  
A1  
B
0.007/0.012  
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E2  
L
0.020/0.030  
(0.50/0.75)  
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0°/8°  
0°/8°  
Ø
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢀ8  
RECOMMENDED UPGRADES  
Contactfactoryforavailabilityofthefollowinglegacypartnumbers.Forlongtermavail-  
abilitySipexrecommendsupgradesaslistedbelow.Allupgradepartnumbersshownare  
fullypinoutandfunctioncompatiblewithlegacypartnumbers.Upgradepartnumbers  
maycontainfeatureand/orperformanceenhancementsorotherchangestodatasheet  
parameters.  
Legacy Part  
Number  
Recommended  
Upgrade  
SP3220CA..................SP3220ECA  
SP3220CA-L...............SP3220ECA-L  
SP3220CT ..................SP3220ECT  
SP3220CY..................SP3220ECY  
SP3220EA ..................SP3220EEA  
SP3220ET...................SP3220EET  
SP3220EY ..................SP3220EEY  
SP3220BCA................SP3220EBCA  
SP3220BCT................SP3220EBCT  
SP3220BCY................SP3220EBCY  
SP3220BEA................SP3220EBEA  
SP3220BET................SP3220EBET  
SP3220BEY................SP3220EBEY  
SP3220UCA................SP3220EUCA  
SP3220UCT................SP3220EUCT  
SP3220UCY................SP3220EUCY  
SP3220UEA................SP3220EUEA  
SP3220UET................SP3220EUET  
SP3220UEY................SP3220EUEY  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
ꢀꢄ  
ORDERING INFORMATION  
Temperature Range  
Model  
Package Type  
SP3220EBCA .......................................... 0˚Cto+70˚C..........................................16-PinSSOP  
SP3220EBCA/TR..................................... 0˚Cto+70˚C..........................................16-PinSSOP  
SP3220EBCT........................................... 0˚Cto+70˚C..................................16-PinWideSOIC  
SP3220EBCT/TR..................................... 0˚Cto+70˚C..................................16-PinWideSOIC  
SP3220EBCY .......................................... 0˚Cto+70˚C........................................16-PinTSSOP  
SP3220EBCY/TR..................................... 0˚Cto+70˚C........................................16-PinTSSOP  
SP3220EBEA..........................................-40˚Cto+85˚C ........................................16-PinSSOP  
SP3220EBEA/TR....................................-40˚Cto+85˚C ........................................16-PinSSOP  
SP3220EBET..........................................-40˚Cto+85˚C ................................16-PinWideSOIC  
SP3220EBET/TR....................................-40˚Cto+85˚C ................................16-PinWideSOIC  
SP3220EBEY..........................................-40˚Cto+85˚C ......................................16-PinTSSOP  
SP3220EBEY/TR....................................-40˚Cto+85˚C ......................................16-PinTSSOP  
SP3220ECA............................................. 0˚Cto+70˚C..........................................16-PinSSOP  
SP3220ECA/TR....................................... 0˚Cto+70˚C..........................................16-PinSSOP  
SP3220ECT............................................. 0˚Cto+70˚C........................................16-PinWSOIC  
SP3220ECT/TR....................................... 0˚Cto+70˚C........................................16-PinWSOIC  
SP3220ECY............................................. 0˚Cto+70˚C........................................16-PinTSSOP  
SP3220ECY/TR....................................... 0˚Cto+70˚C........................................16-PinTSSOP  
Availableinleadfreepackaging. Toorderadd“-L”suffixtopartnumber.  
Example:SP3220ECA/TR=standard;SP3220ECA-L/TR=LeadFree  
/TR=TapeandReel  
Packquantityis1,500forWSOIC,orSSOP; packquantityis2,500for16-pinTSSOP.  
SipexCorporationreservestherighttomakechangestoanyproductsdescribedherein.Sipexdoesnotassumeanyliabilityarisingoutofthe  
applicationoruseofanyproductorcircuitdescribedhereing;neitherdoesitconveyanylicenseunderitspatentrightsnortherightsofothers.  
C
orporatio  
n
ANALOGEXCELLENCE  
Sipex Corporation  
Headquarters and  
Sales Office  
233SouthHillviewDrive  
Milpitas,CA95035  
TEL:(408)934-7500  
FAX:(408)935-7600  
Sales Office  
22LinnellCircle  
Billerica,MA 01821  
TEL:(978)667-8700  
FAX:(978)670-9001  
e-mail:sales@sipex.com  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
20  
ORDERING INFORMATION  
Temperature Range  
Model  
Package Type  
SP3220EEA............................................-40˚Cto+85˚C ........................................16-PinSSOP  
SP3220EEA/TR......................................-40˚Cto+85˚C ........................................16-PinSSOP  
SP3220EET............................................-40˚Cto+85˚C ......................................16-PinWSOIC  
SP3220EET/TR ......................................-40˚Cto+85˚C ......................................16-PinWSOIC  
SP3220EEY............................................-40˚Cto+85˚C ......................................16-PinTSSOP  
SP3220EEY/TR......................................-40˚Cto+85˚C ......................................16-PinTSSOP  
SP3220EUCA.......................................... 0˚Cto+70˚C..........................................16-PinSSOP  
SP3220EUCA/TR .................................... 0˚Cto+70˚C..........................................16-PinSSOP  
SP3220EUCT .......................................... 0˚Cto+70˚C..................................16-PinWideSOIC  
SP3220EUCT/TR..................................... 0˚Cto+70˚C..................................16-PinWideSOIC  
SP3220EUCY/TR .................................... 0˚Cto+70˚C........................................16-PinTSSOP  
SP3220EUCY.......................................... 0˚Cto+70˚C........................................16-PinTSSOP  
SP3220EUEA .........................................-40˚Cto+85˚C ........................................16-PinSSOP  
SP3220EUEA/TR....................................-40˚Cto+85˚C ........................................16-PinSSOP  
SP3220EUET..........................................-40˚Cto+85˚C ................................16-PinWideSOIC  
SP3220EUET/TR....................................-40˚Cto+85˚C ................................16-PinWideSOIC  
SP3220EUEY .........................................-40˚Cto+85˚C ......................................16-PinTSSOP  
SP3220EUEY/TR....................................-40˚Cto+85˚C ......................................16-PinTSSOP  
Availableinleadfreepackaging. Toorderadd“-L”suffixtopartnumber.  
Example:SP3220ECA/TR=standard;SP3220ECA-L/TR=LeadFree  
/TR=TapeandReel  
Packquantityis1,500forWSOIC,orSSOP; packquantityis2,500for16-pinTSSOP.  
SipexCorporationreservestherighttomakechangestoanyproductsdescribedherein.Sipexdoesnotassumeanyliabilityarisingoutofthe  
applicationoruseofanyproductorcircuitdescribedhereing;neitherdoesitconveyanylicenseunderitspatentrightsnortherightsofothers.  
C
orporatio  
n
ANALOGEXCELLENCE  
Sipex Corporation  
Headquarters and  
Sales Office  
233SouthHillviewDrive  
Milpitas,CA95035  
TEL:(408)934-7500  
FAX:(408)935-7600  
Sales Office  
22LinnellCircle  
Billerica,MA 01821  
TEL:(978)667-8700  
FAX:(978)670-9001  
e-mail:sales@sipex.com  
Date: 8/30/05  
SP3220E/EB/EU High ESD RS-232 Driver/Receiver  
© Copyright 2005 Sipex Corporation  
2ꢀ  
厂商 型号 描述 页数 下载

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