ZX5T2E6
PACKAGE OUTLINE
PAD LAYOUT DETAILS
Controlling dimensions are in millimeters. Approximate conversions are given in inches
PACKAGE DIMENSIONS
Millimeters
Inches
Millimeters
Inches
Min Max
DIM
DIM
Min
Max
1.45
0.15
1.30
0.50
0.26
3.10
Min
Max
Min
Max
3.20
1.80
0.60
A
A1
A2
b
0.90
0.00
0.90
0.20
0.09
2.70
0.035
0.00
0.057
0.006
0.051
0.020
0.010
0.122
E
E1
L
2.20
1.30
0.10
0.0866 0.118
0.0511 0.071
0.035
0.008
0.003
0.106
0.004
0.037 REF
0.075 REF
0° 30°
0.024
e
0.95 REF
1.90 REF
0° 30°
C
e1
⍜
D
©Zetex Semiconductors plc 2004
Europe
Americas
Asia Pacific
Corporate Headquaters
Zetex GmbH
Zetex Inc
Zetex (Asia) Ltd
Zetex Semiconductors plc
Zetex Technology Park, Chadderton
Oldham, OL9 9LL
Streitfeldstraße 19
D-81673 München
Germany
700 Veterans Memorial Hwy
Hauppauge, NY 11788
USA
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
United Kingdom
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
Telephone (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for
any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves
the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to www.zetex.com
ISSUE 1 - MAY 2004
S E M IC O N D U C T O R S
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