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IXTT82N25P

型号:

IXTT82N25P

描述:

PolarHT功率MOSFET[ PolarHT Power MOSFET ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

5 页

PDF大小:

610 K

PolarHTTM  
Power MOSFET  
IXTQ 82N25P  
IXTT 82N25P  
IXTK 82N25P  
VDSS = 250 V  
ID25 = 82  
RDS(on) = 35 mΩ  
A
N-Channel Enhancement Mode  
Preliminary Data Sheet  
TO-264 (IXTK)  
Symbol  
TestConditions  
Maximum Ratings  
VDSS  
VDGR  
T
= 25°C to 150°C  
250  
250  
V
V
TJJ = 25°C to 150°C; RGS = 1 MΩ  
VGSM  
20  
V
G
D
(TAB)  
S
ID25  
ID(RMS)  
T
= 25°C  
82  
75  
A
A
ECxternal lead current limit  
TO-3P(IXTQ)  
IDM  
IAR  
TC = 25°C, pulse width limited by TJM  
250  
60  
A
A
TC = 25°C  
EAR  
EAS  
TC = 25°C  
TC = 25°C  
40  
mJ  
J
1.0  
G
D
S
(TAB)  
dv/dt  
PD  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 4 Ω  
,
10  
V/ns  
TO-268 (IXTT)  
TC = 25°C  
500  
W
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
G
S
D (TAB)  
TL  
1.6 mm (0.062 in.) from case for 10 s  
Mounting torque  
300  
°C  
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
Md  
1.13/10 Nm/lb.in.  
Weight  
TO-3P  
TO-264  
TO-268  
5.5  
10  
5.0  
g
g
g
Features  
z
International standard packages  
Unclamped Inductive Switching (UIS)  
rated  
Low package inductance  
- easy to drive and to protect  
z
z
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Min. Typ.  
Max.  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 250µA  
VGS = 20 VDC, VDS = 0  
250  
V
V
Advantages  
2.5  
5.0  
z
Easy to mount  
100  
nA  
z
Space savings  
z
IDSS  
VDS = VDSS  
VGS = 0 V  
25  
250  
µA  
µA  
High power density  
TJ = 125°C  
PolarHTTM DMOStransistors  
utilize proprietary designs and  
process. US patent is pending.  
RDS(on)  
VGS = 10 V, ID = 0.5 ID25  
Pulse test, t 300 µs, duty cycle d 2 %  
35 mΩ  
DS99121B(04/04)  
© 2004 IXYS All rights reserved  
IXTK 82N25P IXTQ 82N25P  
IXTT 82N25P  
Symbol  
gfs  
TestConditions  
Characteristic Values  
TO-3P Outline  
TO-268 Outline  
6,404,065B1 6,162,665  
(TJ = 25°C, unless otherwise specified)  
Min.  
Typ.  
Max.  
VDS= 10 V; ID = 0.5 ID25, pulse test  
VGS = 0 V, VDS = 25 V, f = 1 MHz  
30  
52  
S
Ciss  
Coss  
Crss  
4800  
900  
pF  
pF  
pF  
210  
td(on)  
tr  
td(off)  
tf  
29  
20  
78  
22  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 VDSS, ID = 60 A  
RG = 4 (External)  
Qg(on)  
Qgs  
142  
32  
nC  
nC  
nC  
VGS= 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
Qgd  
74  
RthJC  
RthCH  
0.25 K/W  
TO-3P  
TO-264  
0.21  
0.15  
K/W  
K/W  
Source-Drain Diode  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Symbol  
IS  
TestConditions  
Min.  
typ.  
Max.  
VGS = 0 V  
82  
A
A
V
ISM  
Repetitive  
250  
1.5  
VSD  
IF = IS, VGS = 0 V,  
Pulse test, t 300 µs, duty cycle d 2 %  
trr  
IF = 25 A  
-di/dt = 100 A/µs  
VR = 100 V  
200  
2.0  
ns  
QRM  
µC  
TO-264 AA Outline  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered byoneormore  
ofthefollowingU.S.patents:  
4,850,072  
4,835,592  
4,931,844  
4,881,106  
5,034,796  
5,017,508  
5,063,307  
5,049,961  
5,237,481  
5,187,117  
5,381,025  
5,486,715  
6,534,343  
6,583,505  
6,306,728B1 6,259,123B1 6,306,728B1 6,683,344  
IXTK 82N25P IXTQ 82N25P  
IXTT 82N25P  
Fig. 2. Extended Output Characteristics  
Fig. 1. Output Characteristics  
@ 25  
@ 25ºC  
º
C
200  
180  
160  
140  
120  
100  
80  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
GS  
= 10V  
9V  
VGS = 10V  
9V  
8V  
8V  
7V  
7V  
6V  
60  
40  
6V  
20  
0
0
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
2
4
6
8
10 12 14 16 18 20  
VDS - Volts  
VDS - Volts  
Fig. 3. Output Characteristics  
@ 125  
Fig. 4. RDS(on Normalized to ID25 Value  
)
º
C
vs. Junction Temperature  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
2.6  
2.4  
2.2  
2
VGS = 10V  
VGS = 10V  
9V  
8V  
1.8  
1.6  
1.4  
1.2  
1
ID = 82A  
7V  
ID = 41A  
6V  
5V  
0.8  
0.6  
0.4  
1
2
3
4
5
6
7
8
-50  
-25  
0
25  
50  
75  
100 125 150  
VDS - Volts  
TJ - Degrees Centigrade  
Fig. 5. RDS(on) Normalized to  
ID25 Value vs. ID  
Fig. 6. Drain Current vs. Case  
Temperature  
3.7  
3.4  
3.1  
2.8  
2.5  
2.2  
1.9  
1.6  
1.3  
1
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
VGS = 10V  
TJ = 125ºC  
TJ = 25ºC  
0.7  
20 40 60 80 100 120 140 160 180 200  
-50  
-25  
0
25  
50  
75  
100 125 150  
ID - Amperes  
TC - Degrees Centigrade  
© 2004 IXYS All rights reserved  
IXTK 82N25P IXTQ 82N25P  
IXTT 82N25P  
Fig. 8. Transconductance  
Fig. 7. Input Admittance  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
TJ = -40ºC  
25ºC  
125ºC  
TJ = 125ºC  
25ºC  
-40ºC  
4
0.3  
0
4.5  
5
5.5  
6
6.5  
7
7.5  
8
0
20  
40  
60  
80 100 120 140 160 180  
ID - Amperes  
VGS - Volts  
Fig. 9. Source Current vs.  
Source-To-Drain Voltage  
Fig. 10. Gate Charge  
240  
200  
160  
120  
80  
10  
9
8
7
6
5
4
3
2
1
0
VDS = 125V  
ID = 41A  
G = 10mA  
I
TJ = 125ºC  
TJ = 25ºC  
40  
0
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
0
15 30 45 60 75 90 105 120 135 150  
VSD - Volts  
QG - nanoCoulombs  
Fig. 12. Forward-Bias  
Safe Operating Area  
Fig. 11. Capacitance  
1000  
100  
10  
10000  
1000  
100  
f = 1MHz  
TJ = 150ºC  
TC = 25ºC  
RDS(on) Limit  
C
iss  
25µs  
100µs  
1ms  
10ms  
C
oss  
DC  
C
rss  
1
5
10  
15  
20  
25  
30  
35  
40  
10  
100  
1000  
VDS - Volts  
VDS - Volts  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered byoneormore  
ofthefollowingU.S.patents:  
4,850,072  
4,835,592  
4,931,844  
4,881,106  
5,034,796  
5,017,508  
5,063,307  
5,049,961  
5,237,481  
5,187,117  
5,381,025  
5,486,715  
6,404,065B1 6,162,665  
6,534,343  
6,583,505  
6,306,728B1 6,259,123B1 6,306,728B1 6,683,344  
IXTK 82N25P IXTQ 82N25P  
IXTT 82N25P  
Fig. 13. M axim um Trans ie nt The rm al Re s is tance  
1.00  
0.10  
0.01  
1
10  
100  
1000  
Pulse Width - milliseconds  
© 2004 IXYS All rights reserved  
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