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EZ8590F

型号:

EZ8590F

品牌:

THINKISEMI[ Thinki Semiconductor Co., Ltd. ]

页数:

5 页

PDF大小:

1095 K

EZ8590  
EZ8590  
Pb Free Plating Product  
85V,92A N-Channel Trench Process Power MOSFETs  
General Description  
EZ8590  
(TO-220 HeatSink)  
TSP8592 series is N-channel MOS Field Effect Transistor  
designed for high current switching applications. Rugged  
EAS capability and ultra low RDS(ON) is suitable for PWM,  
load switching especially for E-Bike controller applications.  
S
D
G
Features  
VDS=85V; ID=92A@ VGS=10V;  
RDS(ON)<7.45mΩ @ VGS=10V  
Special Designed for E-Bike Controller Application  
EZ8590F  
(TO-220F FullPak)  
Schematic Diagram  
Ultra Low On-Resistance  
High UIS and UIS 100% Test  
S
D
Application  
G
VDS = 85 V  
ID = 92A  
64V E-Bike Controller Applications  
Hard Switched and High Frequency Circuits  
Uninterruptible Power Supply  
Inverter Application  
EZ8590B  
(TO-263/D2PAK)  
D
Amplifier Application  
S
RDS(ON) = 6.2 m  
G
Table 1. Absolute Maximum Ratings (TA=25)  
Symbol  
Parameter  
Value  
85  
Unit  
V
VDS  
Drain-Source Voltage (VGS=0V)  
±25  
92  
V
VGS  
Gate-Source Voltage (VDS=0V)  
Drain Current (DC) at Tc=25℃  
Drain Current (DC) at Tc=100℃  
A
ID (DC)  
ID (DC)  
IDM (pluse)  
dv/dt  
PD  
64.4  
368  
30  
A
(Note 1)  
A
Drain Current-Continuous@ Current-Pulsed  
Peak Diode Recovery Voltage  
Maximum Power Dissipation(Tc=25)  
Derating Factor  
V/ns  
W
139  
0.93  
625  
W/℃  
Single Pulse Avalanche Energy (Note 2)  
EAS  
mJ  
Operating Junction and Storage Temperature Range  
-55 To 175  
TJ,TSTG  
Notes 1.Repetitive Rating: Pulse width limited by maximum junction temperature  
2.EAS condition:T =25,VDD=40V,VG=10V,RG=25Ω  
J
Rev.09T  
© 1995 Thinki Semiconductor Co., Ltd.  
Page 1/5  
http://www.thinkisemi.com.tw/  
EZ8590  
Table 2. Thermal Characteristic  
Symbol  
Parameter  
Value  
Unit  
RJC  
Thermal Resistance,Junction-to-Case  
1.08  
/W  
Table 3. Electrical Characteristics (TA=25unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ Max Unit  
On/Off States  
BVDSS  
IDSS  
Drain-Source Breakdown Voltage  
VGS=0V ID=250μA  
VDS=82V,VGS=0V  
VDS=82V,VGS=0V  
75  
85  
V
Zero Gate Voltage Drain Current(Tc=25)  
Zero Gate Voltage Drain Current(Tc=125)  
1
μA  
μA  
IDSS  
10  
IGSS  
Gate-Body Leakage Current  
Gate Threshold Voltage  
VGS=±20V,VDS=0V  
VDS=VGS,ID=250μA  
VGS=10V, ID=40A  
±100  
4
nA  
V
VGS(th)  
RDS(ON)  
2
Drain-Source On-State Resistance  
6.2  
7.45  
mΩ  
Dynamic Characteristics  
gFS  
Ciss  
Coss  
Forward Transconductance  
VDS=10V,ID=15A  
20  
S
Input Capacitance  
Output Capacitance  
5053  
442  
PF  
PF  
VDS=25V,VGS=0V,  
f=1.0MHz  
Crss  
Qg  
Reverse Transfer Capacitance  
Total Gate Charge  
145  
106  
19  
PF  
nC  
nC  
VDS=50V,ID=40A,  
VGS=10V  
Qgs  
Gate-Source Charge  
Qgd  
Gate-Drain Charge  
47.9  
nC  
Switching Times  
td(on) Turn-on Delay Time  
tr  
td(off)  
tf  
15  
18  
31  
38  
nS  
nS  
nS  
nS  
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
VDD=30V,ID=40A,RL=15Ω  
VGS=10V,RG=2.5Ω  
Source-Drain Diode Characteristics  
ISD  
ISDM  
VSD  
trr  
Source-drain Current(Body Diode)  
92  
368  
0.78  
56  
A
A
Pulsed Source-Drain Current(Body Diode)  
(Note 1)  
TJ=25,ISD=40A,VGS=0V  
0.95  
V
Forward On Voltage  
(Note 1)  
nS  
Reverse Recovery Time  
TJ=25,IF=75A  
(Note 1)  
di/dt=100A/μs  
Qrr  
ton  
113  
nC  
Reverse Recovery Charge  
Forward Turn-on Time  
Intrinsic turn-on time is negligible(turn-on is dominated by LS+LD)  
Notes 1.Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 1.5%, RG=25Ω, Starting T =25℃  
J
Rev.09T  
© 1995 Thinki Semiconductor Co., Ltd.  
Page 2/5  
http://www.thinkisemi.com.tw/  
EZ8590  
Test Circuit  
1) EAS Test Circuits  
2) Gate Charge Test Circuit:  
3) Switch Time Test Circuit:  
Rev.09T  
© 1995 Thinki Semiconductor Co., Ltd.  
Page 3/5  
http://www.thinkisemi.com.tw/  
EZ8590  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS (Curves)  
Figure1. Output Characteristics  
Figure2. Transfer Characteristics  
VDS Drain-Source Voltage (V)  
VGS Gate-Source Voltage (V)  
Figure3. Rdson Vs Drain Current  
Figure4. Rdson Vs Junction Temperature  
3.0  
ID- Drain Current (A)  
TJ-Junction Temperature()  
Figure5. Gate Charge  
Figure6. Source- Drain Diode Forward  
Qg Gate Charge (nC)  
VSD Source-Drain Voltage (V)  
Rev.09T  
© 1995 Thinki Semiconductor Co., Ltd.  
Page 4/5  
http://www.thinkisemi.com.tw/  
EZ8590  
Figure7. Capacitance vs Vds  
Figure8. Safe Operation Area  
VDS Drain-Source Voltage (V)  
VDS Drain-Source Voltage (V)  
Figure9. BVDSS vs Junction Temperature  
Figure10. VGS(th) vs Junction Temperature  
TJ-Junction  
Temperature()  
TJ-Junction Temperature()  
Figure11. Normalized Maximum Transient Thermal Impedance  
Square Wave Pluse Duration(sec)  
Rev.09T  
© 1995 Thinki Semiconductor Co., Ltd.  
Page 5/5  
http://www.thinkisemi.com.tw/  
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