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8T73S208B-01

型号:

8T73S208B-01

品牌:

IDT[ INTEGRATED DEVICE TECHNOLOGY ]

页数:

22 页

PDF大小:

508 K

2.5 V, 3.3 V Differential LVPECL Clock  
Divider and Fanout Buffer  
8T73S208B-01  
Datasheet  
General Description  
Features  
The 8T73S208B-01 is a high-performance differential LVPECL clock  
divider and fanout buffer. The device is designed for the frequency  
division and signal fanout of high-frequency, low phase-noise clocks.  
The 8T73S208B-01 is characterized to operate from a 2.5V and 3.3V  
power supply. Guaranteed output-to-output and part-to-part skew  
characteristics make the 8T73S208B-01 ideal for those clock  
distribution applications demanding well-defined performance and  
repeatability. The integrated input termination resistors make  
interfacing to the reference source easy and reduce passive  
component count. Each output can be individually enabled or  
disabled in the high-impedance state controlled by a I2C register. On  
power-up, all outputs are disabled.  
One differential input reference clock  
Differential pair can accept the following differential input  
levels: LVDS, LVPECL, CML  
Integrated input termination resistors  
Eight LVPECL outputs  
Selectable clock frequency division of ÷1, ÷2, ÷4 and ÷8  
Maximum input clock frequency: 1GHz  
LVCMOS interface levels for the control inputs  
Individual output enable/disabled by I2C interface  
Power-up state: all outputs disabled  
Output skew: 60ps (maximum)  
Output rise/fall times: 350ps (maximum)  
Low additive phase jitter, RMS: 182fs (typical)  
Full 2.5V and 3.3V supply voltages  
Lead-free (RoHS 6) 32-Lead VFQFN packaging  
-40°C to 85°C ambient operating temperature  
Block Diagram  
Pin Assignment  
Q0  
nQ0  
31 30 29 28 27 26 25  
32  
Q1  
nQ1  
fREF  
1
2
3
4
5
6
7
8
24  
23  
22  
21  
20  
19  
18  
17  
ADR1  
VEE  
FSEL0  
VEE  
IN  
nIN  
÷1, ÷2,  
÷4, ÷8  
Q2  
nQ2  
50  
50  
Q0  
nQ7  
Q7  
VT  
Q3  
nQ3  
nQ0  
Q1  
Pulldown (2)  
FSEL[1:0]  
2
nQ6  
Q6  
Q4  
nQ4  
nQ1  
VEE  
VEE  
Q5  
nQ5  
Pullup  
VCCO  
VCCO  
SDA  
SCL  
I2C  
9
10 11 12 13 14 15 16  
Pullup  
8
Q6  
Pulldown (2)  
nQ6  
ADR[1:0]  
2
Q7  
nQ7  
5mm x 5mm, 32-pin VFQFN  
©2016 Integrated Device Technology, Inc.  
1
April 28, 2016  
8T73S208B-01 Datasheet  
Pin Descriptions and Pin Characteristics  
Table 1. Pin Descriptions  
Number  
Name  
Type  
Description  
1,  
32  
I2C Address inputs. LVCMOS/LVTTL interface levels.  
ADR1, ADR0  
Input  
Pulldown  
2, 7, 18, 23  
3, 4  
VEE  
Power  
Output  
Output  
Power  
Output  
Output  
Output  
Output  
Output  
Output  
Negative supply pins.  
Q0, nQ0  
Q1, nQ1  
VCCO  
Differential output pair 0. LVPECL interface levels.  
Differential output pair 1. LVPECL interface levels.  
Output supply pins.  
5, 6  
8, 17  
9, 10  
Q2, nQ2  
Q3, nQ3  
Q4, nQ4  
Q5, nQ5  
Q6, nQ6  
Q7, nQ7  
Differential output pair 2. LVPECL interface levels.  
Differential output pair 3. LVPECL interface levels.  
Differential output pair 4. LVPECL interface levels.  
Differential output pair 5. LVPECL interface levels.  
Differential output pair 6. LVPECL interface levels.  
Differential output pair 7. LVPECL interface levels.  
11, 12  
13, 14  
15, 16  
19, 20  
21, 22  
24,  
25  
FSEL0,  
FSEL1  
Frequency divider select controls. See Table 3A for function.  
LVCMOS/LVTTL interface levels.  
Input  
Input  
Pulldown  
26  
IN  
Non-inverting differential clock input. RT = 50termination to VT.  
Input for termination. Both IN and nIN inputs are internally terminated 50  
to this pin. See input termination information in Section, “Applications  
Information”.  
Termination  
Input  
27  
VT  
28  
29  
nIN  
Input  
Inverting differential clock input. RT = 50termination to VT.  
VCC  
Power  
Power supply pin.  
I2C Data Input/Output. Input: LVCMOS/LVTTL interface levels. Output:  
open drain.  
30  
31  
SDA  
SCL  
I/O  
Pullup  
Pullup  
I2C Clock Input. LVCMOS/LVTTL interface levels.  
Input  
NOTE: Pulldown and Pullup refers to an internal input resistors. See Section, “Table 2. Pin Characteristics” values.  
Table 2. Pin Characteristics  
Symbol  
CIN  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
pF  
Input Capacitance  
Input Pulldown Resistor  
Input Pullup Resistor  
2
RPULLDOWN  
RPULLUP  
51  
51  
k  
k  
©2016 Integrated Device Technology, Inc.  
2
April 28, 2016  
8T73S208B-01 Datasheet  
Function Tables  
variable bits which are set by the hardware pins ADR[1:0] (binary  
11010, ADR1, ADR0). Bit 0 of slave address is used by the bus  
controller to select either the read or write mode. The hardware pins  
ADR1 and ADR0 and should be individually set by the user to avoid  
address conflicts of multiple 8T73S208B-01 devices on the same  
bus.  
Input Frequency Divider Operation  
The FSEL1 and FSEL0 control pins configure the input frequency  
divider. In the default state (FSEL[1:0] are set to logic 0:0 or left open)  
the output frequency is equal to the input frequency (divide-by-1).  
The other FSEL[1:0] settings configure the input divider to  
divide-by-2, 4 or 8, respectively.  
2
Table 3D. I C Slave Address  
Table 3A. FSEL[1:0] Input Selection Function Table  
Input  
7
1
6
1
5
0
4
1
3
0
2
1
0
ADR1 ADR0 R/W  
FSEL1  
FSEL0  
Operation  
fQ[7:0] = fREF ÷ 1  
0 (default)  
0 (default)  
0
1
1
1
0
1
fQ[7:0] = fREF ÷ 2  
fQ[7:0] = fREF ÷ 4  
SCL  
fQ[7:0] = fREF ÷ 8  
SDA  
NOTE: FSEL1, FSEL0 are asynchronous controls  
Output Enable Operation  
START  
Valid Data  
Acknowledge  
STOP  
The output enable/disable state of each individual differential output  
Qx, nQx can be set by the content of the I2C register (see Table 3C).  
A logic zero to an I2C bit in register 0 enables the corresponding  
differential output, while a logic one disables the differential output  
(see Table 3B). After each power cycle, the device resets all I2C bits  
(Dn) to its default state (logic 1) and all Qx, nQx outputs are disabled.  
After the first valid I2C write, the output enable state is controlled by  
the I2C register. Setting and changing the output enable state through  
the I2C interface is asynchronous to the input reference clock.  
Figure 1: Standard I2C Transaction  
START (S) – defined as high-to-low transition on SDA while holding  
SCL HIGH.  
DATA – between START and STOP cycles, SDA is synchronous with  
SCL. Data may change only when SCL is LOW and must be stable  
when SCL is HIGH.  
ACKNOWLEDGE (A) – SDA is driven LOW before the SCL rising  
edge and held LOW until the SCL falling edge.  
Table 3B. Individual Output Enable Control  
Bit  
STOP (S) – defined as low-to-high transition on SDA while holding  
SCL HIGH  
Dn  
Operation  
Output Qx, nQx is enabled.  
0
Output Qx, nQx is disabled in high-impedance  
state.  
S
DevAdd W A Data Byte  
A P  
1 (default)  
Figure 2: Write Transaction  
Table 3C. Individual output enable control  
Bit  
D7  
Q7  
1
D6  
Q6  
1
D5  
Q5  
1
D4  
Q4  
1
D3  
Q3  
1
D2  
Q2  
1
D1  
Q1  
1
D0  
Q0  
1
S
DevAdd R A  
Data Byte  
A P  
Output  
Default  
Figure 3: Read Transaction  
S –  
Start or Repeated Start  
2
I C Interface Protocol  
W –  
R/W is set for Write  
R/W is set for Read  
Ack  
The 8T73S208B-01 uses an I2C slave interface for writing and  
reading the device configuration to and from the on-chip  
configuration registers. This device uses the standard I2C write  
R –  
A –  
format for a write transaction, and a standard I2C read format for a  
read transaction. Figure 1 defines the I2C elements of the standard  
I2C transaction. These elements consist of a start bit, data bytes, an  
acknowledge or Not-Acknowledge bit and the stop bit. These  
elements are arranged to make up the complete I2C transactions as  
shown in Figure 2 and Figure 3. Figure 2 is a write transaction while  
Figure 3 is read transaction. The 7-bit I2C slave address of the  
8T73S208B-01 is a combination of a 5-bit fixed addresses and two  
DevAdd –  
P –  
7 bit Device Address  
Stop  
©2016 Integrated Device Technology, Inc.  
3
April 28, 2016  
8T73S208B-01 Datasheet  
Absolute Maximum Ratings  
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress  
specifications only. Functional operation of the product at these conditions or any conditions beyond those listed in the DC Characteristics or  
AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.  
Item  
Rating  
Supply Voltage, VCC  
Inputs, VI  
4.6V  
-0.5V to VCC + 0.5V  
35mA  
Input Termination Current, IVT  
Outputs, IO (LVPECL)  
Continuous Current  
Surge Current  
50mA  
100mA  
Storage Temperature, TSTG  
-65C to 150C  
125°C  
Maximum Junction Temperature, TJMAX  
ESD - Human Body Model1  
2000V  
ESD - Charged Device Model  
500V  
NOTE 1:According to JEDEC/JS-001-2012/JESD22-C101E.  
DC Electrical Characteristics  
Table 4A. Power Supply DC Characteristics, V = V  
= 2.5V 5% or 3.3V 5%, V = 0V, T = -40°C to 85°C  
EE A  
CC  
CCO  
Symbol Parameter  
Test Conditions  
Minimum  
2.375  
Typical  
Maximum  
2.625  
3.465  
2.625  
3.465  
110  
Units  
V
VCC  
VCC  
VCCO  
VCCO  
IEE  
Power Supply Voltage  
2.5V  
3.3V  
2.5V  
3.3V  
92  
Power Supply Voltage  
Output Supply Voltage  
Output Supply Voltage  
Power Supply Current  
3.135  
V
2.375  
V
3.135  
V
mA  
©2016 Integrated Device Technology, Inc.  
4
April 28, 2016  
8T73S208B-01 Datasheet  
Table 4B. LVCMOS/LVTTL Input DC Characteristics, V = V  
= 2.5V 5% or 3.3V 5%, V = 0V, T = -40°C to 85°C  
CC  
CCO  
EE  
A
Symbol Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
FSEL[1:0], ADR[1:0]  
SCL, SDA  
V
CC = 3.3V 5%  
2.2  
VCC + 0.3V  
VCC + 0.3V  
V
Input  
VIH  
VCC = 3.3V 5%  
2.4  
V
High Voltage1  
FSEL[1:0], ADR[1:0]  
SCL, SDA  
VCC = 2.5V 5%  
VCC = 2.5V 5%  
VCC = 3.3V 5%  
1.7  
1.9  
VCC + 0.3V  
V
V
VCC + 0.3V  
FSEL[1:0], ADR[1:0]  
SCL, SDA  
-0.3  
-0.3  
-0.3  
-0.3  
0.8  
0.8  
0.7  
0.5  
150  
10  
V
VCC = 3.3V 5%  
V
Input  
VIL  
Low Voltage1  
FSEL[1:0], ADR[1:0]  
SCL, SDA  
VCC = 2.5V 5%  
VCC = 2.5V 5%  
V
V
FSEL[1:0], ADR[1:0]  
SCL, SDA  
VCC = VIN = 2.625 or 3.465V  
VCC = VIN = 2.625 or 3.465V  
VCC = 2.625 or 3.465V, VIN = 0V  
µA  
µA  
µA  
µA  
Input  
IIH  
High Current  
FSEL[1:0], ADR[1:0]  
SCL, SDA  
-10  
Input  
IIL  
Low Current  
V
CC = 2.625 or 3.465V, VIN = 0V  
-150  
NOTE 1:VIL should not be lower than -0.3V and VIH should not be higher than VCC + 0.3V.  
Table 4C. Differential Input DC Characteristics, V = V  
= 2.5V 5% or 3.3V 5%, V = 0V, T = -40°C to 85°C  
EE A  
CC  
CCO  
Symbol Parameter  
Test Conditions  
Minimum  
0.15  
1.2  
Typical  
Maximum  
Units  
VIN  
Input Voltage Swing1 IN, nIN  
Common Mode Input Voltage1, 2  
1.2  
CC – (VIN/2)  
2.4  
V
V
V
VCMR  
V
VDIFF_IN Differential Input Voltage Swing  
0.3  
RIN  
Input Resistance  
IN, nIN  
IN, nIN  
IN, nIN to VT  
40  
50  
60  
Differential  
Input Resistance  
RIN_DIFF  
IN to nIN, VT = Open  
80  
100  
120  
NOTE 1: VIL should not be less than -0.3V and VIH should not be greater than VCC  
NOTE 2:Common Mode Input Voltage is defined as the cross point.  
©2016 Integrated Device Technology, Inc.  
5
April 28, 2016  
8T73S208B-01 Datasheet  
Table 4D. LVPECL DC Characteristics, V = V  
= 3.3V 5%, V = 0V, T = -40°C to 85°C  
CC  
CCO  
EE  
A
Symbol Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
VCCO – 0.775  
VCCO – 1.367  
Units  
VOH  
VOL  
Output High Voltage1  
VCCO – 1.102  
VCCO – 1.802  
VCCO – 0.95  
VCCO – 1.6  
V
V
Output Low Voltage1  
Peak-to-Peak  
Output Voltage Swing  
VSWING  
0.6  
0.7  
1.0  
V
NOTE 1:Outputs terminated with 50to VCCO – 2V.  
Table 4E. LVPECL DC Characteristics, V = V  
= 2.5V 5%, V = 0V, T = -40°C to 85°C  
CC  
CCO  
EE  
A
Symbol Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
VCCO – 0.767  
VCCO – 1.359  
Units  
VOH  
VOL  
Output High Voltage1  
VCCO – 1.125  
VCCO – 1.799  
VCCO – 0.95  
VCCO – 1.6  
V
V
Output Low Voltage  
Peak-to-Peak  
Output Voltage Swing  
VSWING  
0.60  
0.65  
1.00  
V
NOTE 1:Outputs terminated with 50to VCCO – 2V.  
©2016 Integrated Device Technology, Inc.  
6
April 28, 2016  
8T73S208B-01 Datasheet  
AC Electrical Characteristics  
Table 5. AC Electrical Characteristics, VCC = V  
Symbol Parameter1  
= 2.5V 5% or 3.3V 5%, T = -40°C to 85°C  
CCO  
A
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
GHz  
kHz  
fREF  
fSCL  
Input Frequency  
IN, nIN  
1
I2C Clock Frequency  
400  
Buffer Additive Phase Jitter,  
RMS; refer to Additive Phase  
Jitter Section, measured with  
FSEL[1:0] = 00  
fREF =156.25MHz,  
Integration Range: 12kHz – 20MHz  
tJIT  
182  
207  
fs  
FSEL[1:0] = 00  
FSEL[1:0] = 01  
FSEL[1:0] = 10  
FSEL[1:0] = 11  
350  
500  
550  
650  
750  
870  
1052  
1230  
60  
ps  
ps  
ps  
ps  
ps  
ps  
ps  
%
IN, nIN to  
Propagation Delay2  
Qx, nQx  
tPD  
tsk(o)  
tsk(p)  
tsk(pp)  
Output Skew3, 4  
Pulse Skew  
50  
Part-to-Part Skew3, 5, 6  
500  
Any Frequency  
at fREF = 100MHz  
at fREF = 125MHz  
at fREF = 156.25MHz  
50  
50  
50  
50  
48  
48  
48  
52  
52  
52  
%
odc  
Output Duty Cycle7  
%
%
Output Enable and Disable  
Time8  
Output Enable/ Disable State from/ to  
Active/ Inactive  
tPDZ  
1
µs  
20% to 80%  
10% to 90%  
140  
180  
205  
350  
ps  
ps  
tR / tF  
Output Rise/Fall Time  
NOTE 1:Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device  
is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal  
equilibrium has been reached under these conditions.  
NOTE 2:Measured from the differential input crossing point to the differential output cross point.  
NOTE 3:Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the differential cross point.  
NOTE 4:This parameter is defined in accordance with JEDEC Standard 65.  
NOTE 5:Defined as skew between outputs on different devices operating at the same supply voltage, same temperature, same frequency and  
with equal load conditions. Using the same type of inputs on each device, the outputs are measured at the differential cross point.  
NOTE 6:Part-to-part skew specification does not guarantee divider synchronization among devices.  
NOTE 7:If FSEL[1:0] = 00 (divide-by-one), the output duty cycle will depend on the input duty cycle.  
NOTE 8:Measured from SDA rising edge of I2C stop command.  
©2016 Integrated Device Technology, Inc.  
7
April 28, 2016  
8T73S208B-01 Datasheet  
Additive Phase Jitter  
The spectral purity in a band at a specific offset from the fundamental  
compared to the power of the fundamental is called the dBc Phase  
Noise. This value is normally expressed using a Phase noise plot  
and is most often the specified plot in many applications. Phase noise  
is defined as the ratio of the noise power present in a 1Hz band at a  
specified offset from the fundamental frequency to the power value of  
the fundamental. This ratio is expressed in decibels (dBm) or a ratio  
of the power in the 1Hz band to the power in the fundamental. When  
the required offset is specified, the phase noise is called a dBc value,  
which simply means dBm at a specified offset from the fundamental.  
By investigating jitter in the frequency domain, we get a better  
understanding of its effects on the desired application over the entire  
time record of the signal. It is mathematically possible to calculate an  
expected bit error rate given a phase noise plot.  
Typical Phase Jitter at 156.25MHz  
Additive Phase: 182fs (typical)  
Offset from Carrier Frequency (Hz)  
The input source is 156.25MHz Wenzel Oscillator.  
©2016 Integrated Device Technology, Inc.  
8
April 28, 2016  
8T73S208B-01 Datasheet  
Parameter Measurement Information  
2V  
2V  
SCOPE  
SCOPE  
V
V
CC,  
CC,  
Qx  
Qx  
V
V
CCO  
CCO  
nQx  
nQx  
VEE  
VEE  
-1.3V 0.165V  
-0.5V 0.125V  
3.3 Core/3.3V LVPECL Output Load AC Test Circuit  
2.5V Core/2.5V LVPECL Output Load AC Test Circuit  
V
CC  
nIN  
IN  
nIN  
IN  
VIN  
Cross Points  
nQ[0:7]  
VCMR  
Q[0:7]  
tPD  
V
EE  
Differential Input Level  
Propagation Delay  
nIN  
IN  
nQx  
Qx  
nQy  
Qy  
nQy  
Qy  
tPLH  
tPHL  
tsk(p)= |tPHL - tPLH  
|
Output Skew  
Pulse Skew  
©2016 Integrated Device Technology, Inc.  
9
April 28, 2016  
8T73S208B-01 Datasheet  
Parameter Measurement Information, continued  
Part 1  
nQx  
nQ[0:7]  
Q[0:7]  
Qx  
Part 2  
nQy  
Qy  
tsk(pp)  
Part-to-Part Skew  
Output Duty Cycle/Pulse Width/Period  
nQ[0:7]  
nIN  
Q[0:7]  
VDIFF_IN  
VIN  
IN  
nQ[0:7]  
90%  
tF  
90%  
tR  
VSWING  
10%  
Differential Voltage Swing = 2 x Single-ended VIN  
10%  
Q[0:7]  
Output Rise/Fall Times  
Single-Ended & Differential Input Voltage Swing  
©2016 Integrated Device Technology, Inc.  
10  
April 28, 2016  
8T73S208B-01 Datasheet  
Applications Information  
3.3V Differential Input with Built-In 50Termination Interface  
The IN /nIN with built-in 50terminations accept LVDS, LVPECL,  
CML and other differential signals. Both signals must meet the VIN  
and VCMR input requirements. Figures 4A to 4C show interface  
examples for the IN/nIN input with built-in 50terminations driven by  
the most common driver types. The input interfaces suggested here  
are examples only. If the driver is from another vendor, use their  
termination recommendation. Please consult with the vendor of the  
driver component to confirm the driver termination requirements.  
Figure 4A. IN/nIN Input with Built-In 50  
Figure 4B. IN/nIN Input with Built-In 50  
Driven by an LVDS Driver  
Driven by an LVPECL Driver  
Figure 4C. IN/nIN Input with Built-In 50  
Driven by a CML Driver  
©2016 Integrated Device Technology, Inc.  
11  
April 28, 2016  
8T73S208B-01 Datasheet  
2.5V LVPECL Input with Built-In 50Termination Interface  
The IN /nIN with built-in 50terminations accept LVDS, LVPECL,  
CML and other differential signals. Both signals must meet the VIN  
and VCMR input requirements. Figures 5A to 5C show interface  
examples for the IN/nIN with built-in 50termination input driven by  
the most common driver types. The input interfaces suggested here  
are examples only. If the driver is from another vendor, use their  
termination recommendation. Please consult with the vendor of the  
driver component to confirm the driver termination requirements.  
2.5V  
2.5V  
3.3V or 2.5V  
2.5V  
LVD  
S
Zo = 50  
Zo = 50  
Ω
Ω
Zo = 50  
Ω
Ω
IN  
IN  
50  
Ω
Ω
50  
Ω
Ω
Zo = 50  
VT  
nIN  
VT  
nIN  
50  
50  
LVPECL  
R1  
18  
Receiver  
w ith Built-in  
Ω
Receiver  
w ith Built-in  
50Ω  
50  
Ω
Figure 5A. IN/nIN Input with Built-In 50  
Figure 5B. IN/nIN Input with Built-In 50  
Driven by an LVDS Driver  
Driven by an LVPECL Driver  
2.5V  
2.5V  
Zo = 50  
Ω
Ω
IN  
50Ω  
VT  
nIN  
50Ω  
Zo = 50  
CML – Open Collector  
Receiver  
with Built-in  
50  
Ω
Figure 5C. IN/nIN Input with Built-In 50  
Driven by a CML Driver  
©2016 Integrated Device Technology, Inc.  
12  
April 28, 2016  
8T73S208B-01 Datasheet  
VFQFN EPAD Thermal Release Path  
In order to maximize both the removal of heat from the package and  
the electrical performance, a land pattern must be incorporated on  
the Printed Circuit Board (PCB) within the footprint of the package  
corresponding to the exposed metal pad or exposed heat slug on the  
package, as shown in Figure 6. The solderable area on the PCB, as  
defined by the solder mask, should be at least the same size/shape  
as the exposed pad/slug area on the package to maximize the  
thermal/electrical performance. Sufficient clearance should be  
designed on the PCB between the outer edges of the land pattern  
and the inner edges of pad pattern for the leads to avoid any shorts.  
and dependent upon the package power dissipation as well as  
electrical conductivity requirements. Thus, thermal and electrical  
analysis and/or testing are recommended to determine the minimum  
number needed. Maximum thermal and electrical performance is  
achieved when an array of vias is incorporated in the land pattern. It  
is recommended to use as many vias connected to ground as  
possible. It is also recommended that the via diameter should be 12  
to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is  
desirable to avoid any solder wicking inside the via during the  
soldering process which may result in voids in solder between the  
exposed pad/slug and the thermal land. Precautions should be taken  
to eliminate any solder voids between the exposed heat slug and the  
land pattern. Note: These recommendations are to be used as a  
guideline only. For further information, please refer to the Application  
Note on the Surface Mount Assembly of Amkor’s Thermally/  
Electrically Enhance Lead frame Base Package, Amkor Technology.  
While the land pattern on the PCB provides a means of heat transfer  
and electrical grounding from the package to the board through a  
solder joint, thermal vias are necessary to effectively conduct from  
the surface of the PCB to the ground plane(s). The land pattern must  
be connected to ground through these vias. The vias act as “heat  
pipes”. The number of vias (i.e. “heat pipes”) are application specific  
SOLDER  
PIN  
SOLDER  
EXPOSED HEAT SLUG  
PIN  
PIN PAD  
GROUND PLANE  
LAND PATTERN  
(GROUND PAD)  
PIN PAD  
THERMAL VIA  
Figure 6. P.C. Assembly for Exposed Pad Thermal Release Path – Side View (drawing not to scale)  
Recommendations for Unused Input and Output Pins  
Inputs:  
Outputs:  
LVPECL Outputs  
LVCMOS Control Pins  
Any unused LVPECL output pair can be left floating. We recommend  
that there is no trace attached.  
All control pins have internal pull-ups or pull-downs; additional  
resistance is not required but can be added for additional protection.  
A 1kresistor can be used.  
©2016 Integrated Device Technology, Inc.  
13  
April 28, 2016  
8T73S208B-01 Datasheet  
Termination for 3.3V LVPECL Outputs  
Figures 7A and 7B are examples of 3.3V LVPECL output DC terminations.  
3.3V  
R3  
R4  
125  
125  
3.3V  
3.3V  
Zo = 50  
+
_
Input  
Zo = 50  
R1  
84  
R2  
84  
Figure 7A. 3.3V LVPECL Output Termination  
Figure 7B. 3.3V LVPECL Output Termination  
©2016 Integrated Device Technology, Inc.  
14  
April 28, 2016  
8T73S208B-01 Datasheet  
Termination for 2.5V LVPECL Outputs  
Figure 8A and Figure 8B show examples of termination for 2.5V  
LVPECL driver. These terminations are equivalent to terminating 50  
to VCCO – 2V. For VCCO = 2.5V, the VCCO – 2V is very close to ground  
level. The R3 in Figure 8B can be eliminated and the termination is  
shown in Figure 8C.  
2.5V  
VCCO = 2.5V  
2.5V  
2.5V  
VCCO = 2.5V  
R1  
R3  
50  
250  
250  
+
50  
50  
+
50  
2.5V LVPECL Driver  
R1  
50  
R2  
50  
2.5V LVPECL Driver  
R2  
62.5  
R4  
62.5  
R3  
18  
Figure 8A. 2.5V LVPECL Driver Termination Example  
Figure 8B. 2.5V LVPECL Driver Termination Example  
2.5V  
VCCO = 2.5V  
50  
+
50  
2.5V LVPECL Driver  
R1  
50  
R2  
50  
Figure 8C. 2.5V LVPECL Driver Termination Example  
©2016 Integrated Device Technology, Inc.  
15  
April 28, 2016  
8T73S208B-01 Datasheet  
Power Considerations  
This section provides information on power dissipation and junction temperature for the 8T73S208B-01  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the 8T73S208B-01 is the sum of the core power plus the power dissipated due to loading.  
The following is the power dissipation for VCC = 3.465V, which gives worst case results.  
NOTE: Refer to Section, “3. Calculations and Equations.” for details on calculating power dissipated due to loading.  
IEE_MAX @ 85°C = 106.52mA  
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 106.52mA = 369.09mW  
Power (outputs)MAX = 36.3mW/Loaded Output pair  
If all outputs are loaded, the total power is 8 * 36.3mW = 290.4mW  
Power Dissipation for Internal Termination RT with VT floating  
Power (RT)Max = (VIN_MAX)2 / RT_MIN = (1.2)2 /80 = 18mW  
Total Power_MAX = (3.465V, with all outputs switching) = 369.09mW + 290.4mW + 18mW = 677.49mW  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The  
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond  
wire and bond pad temperature remains below 125°C.  
The equation for Tj is as follows: Tj = JA * Pd_total + TA  
Tj = Junction Temperature  
JA = Junction-to-Ambient Thermal Resistance  
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)  
TA = Ambient Temperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and  
a multi-layer board, the appropriate value is 42.7°C/W per Table 6 below.  
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:  
85°C + 0.678W * 42.7°C/W = 113.93°C. This is below the limit of 125°C.  
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of  
board (multi-layer).  
Table 6. Thermal Resistance for 32-Lead VFQFN, Forced Convection  
JA  
JA vs. Air Flow  
Meters per Second  
0
1
2.5  
Multi-Layer PCB, JEDEC Standard Test Boards  
42.7°C/W  
37.3°C/W  
33.5°C/W  
©2016 Integrated Device Technology, Inc.  
16  
April 28, 2016  
8T73S208B-01 Datasheet  
3. Calculations and Equations.  
The purpose of this section is to calculate the power dissipation for the LVPECL output pairs.  
LVPECL output driver circuit and termination are shown in Figure 9.  
VCCO  
Q1  
VOUT  
RL  
50Ω  
VCCO - 2V  
Figure 9. LVPECL Driver Circuit and Termination  
To calculate power dissipation due to loading, use the following equations which assume a 50load, and a termination voltage of VCCO – 2V.  
For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.775V  
(VCCO_MAX – VOH_MAX) = 0.775V  
For logic low, VOUT = VOL_MAX = VCCO_MAX – 1.367V  
(VCCO_MAX – VOL_MAX) = 1.367V  
Pd_H is power dissipation when the output drives high.  
Pd_L is the power dissipation when the output drives low.  
Pd_H = [(VOH_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOH_MAX) = [(2V – (VCCO_MAX – VOH_MAX))/RL] * (VCCO_MAX – VOH_MAX) =  
[(2V – 0.775V)/50] * 0.775V = 18.99mW  
Pd_L = [(VOL_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOL_MAX) = [(2V – (VCCO_MAX – VOL_MAX))/RL] * (VCCO_MAX – VOL_MAX) =  
[(2V – 1.367V)/50] * 1.367V = 17.31mW  
Total Power Dissipation per output pair = Pd_H + Pd_L = 36.3mW  
©2016 Integrated Device Technology, Inc.  
17  
April 28, 2016  
8T73S208B-01 Datasheet  
Reliability Information  
Table 7. vs. Air Flow Table for a 32-Lead VFQFN  
JA  
JA vs. Air Flow  
Meters per Second  
0
1
2.5  
Multi-Layer PCB, JEDEC Standard Test Boards  
42.7°C/W  
37.3°C/W  
33.5°C/W  
Transistor Count  
The transistor count for 8T73S208B-01 is: 5153  
©2016 Integrated Device Technology, Inc.  
18  
April 28, 2016  
8T73S208B-01 Datasheet  
32-Lead VFQFN Package Outline and Package Dimensions  
©2016 Integrated Device Technology, Inc.  
19  
April 28, 2016  
8T73S208B-01 Datasheet  
32-Lead VFQFN Package Outline and Package Dimensions, continued  
©2016 Integrated Device Technology, Inc.  
20  
April 28, 2016  
8T73S208B-01 Datasheet  
Ordering Information  
Table 8. Ordering Information  
Part/Order Number  
Marking  
Package  
Shipping Packaging  
Tray  
Temperature  
-40C to 85C  
-40C to 85C  
8T73S208B-01NLGI  
8T73S208B-01NLGI8  
IDT8T73S208B-01NLGI  
IDT8T73S208B-01NLGI  
“Lead-Free” 32-Lead VFQFN  
“Lead-Free” 32-Lead VFQFN  
Tape & Reel  
©2016 Integrated Device Technology, Inc.  
21  
April 28, 2016  
8T73S208B-01 Datasheet  
Corporate Headquarters  
6024 Silver Creek Valley Road  
San Jose, CA 95138 USA  
www.IDT.com  
Sales  
Tech Support  
www.idt.com/go/support  
1-800-345-7015 or 408-284-8200  
Fax: 408-284-2775  
www.IDT.com/go/sales  
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications  
and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein  
is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability,  
or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.  
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably  
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.  
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of  
IDT or their respective third party owners.  
For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary.  
Copyright ©2016 Integrated Device Technology, Inc. All rights reserved.  
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