找货询价

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

QQ咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

技术支持

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

售后咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

8T73S208_16

型号:

8T73S208_16

品牌:

IDT[ INTEGRATED DEVICE TECHNOLOGY ]

页数:

22 页

PDF大小:

532 K

2.5 V, 3.3 V Differential LVPECL  
Clock Divider and Fanout Buffer  
8T73S208  
Datasheet  
General Description  
Features  
The 8T73S208 is a high-performance differential LVPECL clock  
divider and fanout buffer. The device is designed for the frequency  
division and signal fanout of high-frequency, low phase-noise clocks.  
The 8T73S208 is characterized to operate from a 2.5V and 3.3V  
power supply. Guaranteed output-to-output and part-to-part skew  
characteristics make the 8T73S208 ideal for those clock distribution  
applications demanding well-defined performance and repeatability.  
The integrated input termination resistors make interfacing to the  
reference source easy and reduce passive component count. Each  
output can be individually enabled or disabled in the high-impedance  
state controlled by a I2C register. On power-up, all outputs are  
enabled.  
One differential input reference clock  
Differential pair can accept the following differential input  
levels: LVDS, LVPECL, CML  
Integrated input termination resistors  
Eight LVPECL outputs  
Selectable clock frequency division of ÷1, ÷2, ÷4 and ÷8  
Maximum input clock frequency: 1000MHz  
LVCMOS interface levels for the control inputs  
Individual output enable/disabled by I2C interface  
Output skew: 15ps (typical)  
Output rise/fall times: 350ps (maximum)  
Low additive phase jitter, RMS: 0.182ps (typical)  
Full 2.5V and 3.3V supply voltages  
Lead-free (RoHS 6) 32-Lead VFQFN packaging  
-40°C to 85°C ambient operating temperature  
Block Diagram  
Pin Assignment  
Q0  
nQ0  
23 22 21 20 19 18 17  
Q1  
24  
nQ1  
25  
26  
27  
28  
29  
30  
31  
32  
16  
15  
14  
13  
12  
11  
10  
9
FSEL1  
IN  
nQ5  
Q5  
fREF  
IN  
nIN  
Q2  
nQ2  
÷1, ÷2,  
÷4, ÷8  
VT  
nQ4  
Q4  
50  
50  
Q3  
nQ3  
nIN  
VT  
8T73S208  
VCC  
nQ3  
Q3  
Pulldown (2)  
FSEL[1:0]  
Q4  
nQ4  
2
SDA  
SCL  
ADR0  
nQ2  
Q5  
nQ5  
Q2  
I2C  
Pullup  
SDA  
SCL  
ADR[1:0]  
1
2
3
4
5
6
7
8
Pullup  
8
Q6  
Pulldown (2)  
nQ6  
2
Q7  
nQ7  
32-pin, 5mm x 5mm VFQFN  
©2016 Integrated Device Technology, Inc.  
1
Revision D, June 15, 2016  
8T73S208 Datasheet  
Pin Description and Pin Characteristic Tables  
Table 1. Pin Descriptions  
Number  
Name  
Type  
Description  
1,  
32  
I2C Address inputs. LVCMOS/LVTTL interface levels.  
ADR1, ADR0  
Input  
Pulldown  
2, 7, 18, 23  
3, 4  
VEE  
Power  
Output  
Output  
Power  
Output  
Output  
Output  
Output  
Output  
Output  
Negative supply pins.  
Q0, nQ0  
Q1, nQ1  
VCCO  
Differential output pair 0. LVPECL interface levels.  
Differential output pair 1. LVPECL interface levels.  
Output supply pins.  
5, 6  
8, 17  
9, 10  
Q2, nQ2  
Q3, nQ3  
Q4, nQ4  
Q5, nQ5  
Q6, nQ6  
Q7, nQ7  
Differential output pair 2. LVPECL interface levels.  
Differential output pair 3. LVPECL interface levels.  
Differential output pair 4. LVPECL interface levels.  
Differential output pair 5. LVPECL interface levels.  
Differential output pair 6. LVPECL interface levels.  
Differential output pair 7. LVPECL interface levels.  
11, 12  
13, 14  
15, 16  
19, 20  
21, 22  
24,  
25  
FSEL0,  
FSEL1  
Frequency divider select controls. See Table 3A for function.  
LVCMOS/LVTTL interface levels.  
Input  
Input  
Pulldown  
26  
27  
IN  
Non-inverting differential clock input. RT = 50termination to VT.  
Termination  
Input  
Input for termination. Both IN and nIN inputs are internally terminated 50  
to this pin. See input termination information in the applications section.  
VT  
28  
29  
nIN  
Input  
Inverting differential clock input. RT = 50termination to VT.  
VCC  
Power  
Power supply pin.  
I2C Data Input/Output. Input: LVCMOS/LVTTL interface levels. Output:  
open drain.  
30  
31  
SDA  
SCL  
I/O  
Pullup  
Pullup  
I2C Clock Input. LVCMOS/LVTTL interface levels.  
Input  
NOTE: Pulldown and Pullup refers to an internal input resistors. See Table 2, Pin Characteristics, for typical values.  
Table 2. Pin Characteristics  
Symbol  
CIN  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
pF  
Input Capacitance  
Input Pulldown Resistor  
Input Pullup Resistor  
2
RPULLDOWN  
RPULLUP  
51  
51  
k  
k  
©2016 Integrated Device Technology, Inc.  
2
Revision D, June 15, 2016  
8T73S208 Datasheet  
Function Tables  
acknowledge or Not-Acknowledge bit and the stop bit. These  
Input Frequency Divider Operation  
elements are arranged to make up the complete I2C transactions as  
shown in Figure 2 and Figure 3. Figure 2 is a write transaction while  
Figure 3 is read transaction. The 7-bit I2C slave address of the  
8T73S208 is a combination of a 4-bit fixed addresses and two  
variable bits which are set by the hardware pins ADR[1:0] (binary  
11010, ADR1, ADR0). Bit 0 of slave address is used by the bus  
controller to select either the read or write mode. The hardware pins  
ADR1 and ADR0 and should be individually set by the user to avoid  
address conflicts of multiple 8T73S208 devices on the same bus.  
The FSEL1 and FSEL0 control pins configure the input frequency  
divider. In the default state (FSEL[1:0] are set to logic 0:0 or left open)  
the output frequency is equal to the input frequency (divide-by-1).  
The other FSEL[1:0] settings configure the input divider to  
divide-by-2, 4 or 8, respectively.  
Table 3A. FSEL[1:0] Input Selection Function Table  
Input  
FSEL1  
FSEL0  
Operation  
fQ[7:0] = fREF ÷ 1  
fQ[7:0] = fREF ÷ 2  
Q[7:0] = fREF ÷ 4  
fQ[7:0] = fREF ÷ 8  
Table 3D. I2C Slave Address  
0 (default)  
0 (default)  
7
1
6
1
5
0
4
1
3
0
2
1
0
0
1
1
1
0
1
ADR1 ADR0 R/W  
f
SCL  
NOTE: FSEL1, FSEL0 are asynchronous controls  
Output Enable Operation  
The output enable/disable state of each individual differential output  
Qx, nQx can be set by the content of the I2C register (see Table 3C).  
A logic zero to an I2C bit in register 0 enables the corresponding  
differential output, while a logic one disables the differential output  
(see Table 3B). After each power cycle, the device resets all I2C bits  
(Dn) to its default state (logic 0) and all Qx, nQx outputs are enabled.  
After the first valid I2C write, the output enable state is controlled by  
the I2C register. Setting and changing the output enable state through  
the I2C interface is asynchronous to the input reference clock.  
SDA  
START  
Valid Data  
Acknowledge  
STOP  
Figure 1: Standard I2C Transaction  
START (S) – defined as high-to-low transition on SDA while holding  
SCL HIGH.  
DATA – between START and STOP cycles, SDA is synchronous with  
SCL. Data may change only when SCL is LOW and must be stable  
when SCL is HIGH.  
The device supports the enable/disable of individual outputs.  
During an active operation of the device, enabling individual  
previously disabled outputs may degrade signal integrity of already  
enabled active outputs during the enabling transition. Disabling  
multiple outputs is supported without signal integrity constraints.  
ACKNOWLEDGE (A) – SDA is driven LOW before the SCL rising  
edge and held LOW until the SCL falling edge.  
Table 3B. Individual Output Enable Control  
STOP (S) – defined as low-to-high transition on SDA while holding  
SCL HIGH  
Bit  
Dn  
Operation  
Output Qx, nQx is enabled.  
0 (default)  
S
DevAdd W A Data Byte  
A P  
Output Qx, nQx is disabled in high-impedance  
state.  
Figure 2: Write Transaction  
1
Table 3C. Individual output enable control  
S
DevAdd R A  
Data Byte  
A P  
Bit  
D7  
Q7  
0
D6  
Q6  
0
D5  
Q5  
0
D4  
Q4  
0
D3  
Q3  
0
D2  
Q2  
0
D1  
Q1  
0
D0  
Q0  
0
Figure 3: Read Transaction  
Output  
Default  
S –  
Start or Repeated Start  
W –  
R/~W is set for Write  
R/~W is set for Read  
Ack  
I2C Interface Protocol  
R –  
The IDT8T73S208I uses an I2C slave interface for writing and  
reading the device configuration to and from the on-chip  
configuration registers. This device uses the standard I2C write  
A –  
DevAdd –  
P –  
7 bit Device Address  
Stop  
format for a write transaction, and a standard I2C read format for a  
read transaction. Figure 1 defines the I2C elements of the standard  
I2C transaction. These elements consist of a start bit, data bytes, an  
©2016 Integrated Device Technology, Inc.  
3
Revision D, June 15, 2016  
8T73S208 Datasheet  
Absolute Maximum Ratings  
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress  
specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC  
Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.  
Item  
Rating  
Supply Voltage, VCC  
Inputs, VI  
4.6V  
-0.5V to VCC + 0.5V  
35mA  
Input Termination Current, IVT  
Outputs, IO (LVPECL)  
Continuous Current  
Surge Current  
50mA  
100mA  
Package Thermal Impedance, JA  
Storage Temperature, TSTG  
42.7°C/W (0 mps)  
-65C to 150C  
125°C  
Maximum Junction Temperature, TJMAX  
ESD - Human Body Model1  
2000V  
ESD - Charged Device Model1  
500V  
NOTE 1. According to JEDEC/JS-001-2012-KJESD22- 22-C101E.  
DC Electrical Characteristics  
Table 4A. Power Supply DC Characteristics, VCC = VCCO = 2.5V 5ꢀ or 3.3V 5ꢀ, V = 0V, TA = -40°C to 85°C  
EE  
Symbol  
VCC  
Parameter  
Test Conditions  
Minimum  
2.375  
Typical  
2.5V  
Maximum  
2.625  
3.465  
2.625  
3.465  
95  
Units  
V
Power Supply Voltage  
Power Supply Voltage  
Output Supply Voltage  
Output Supply Voltage  
Power Supply Current  
VCC  
3.135  
3.3V  
V
VCCO  
VCCO  
IEE  
2.375  
2.5V  
V
3.135  
3.3V  
V
mA  
Table 4B. LVCMOS/LVTTL Input DC Characteristics, VCC = VCCO = 2.5V 5ꢀ or 3.3V 5ꢀ, V = 0V, TA = -40°C to 85°C  
EE  
Symbol  
VIH  
Parameter  
Test Conditions  
Minimum  
2.2  
Typical  
Maximum  
VCC + 0.3  
0.8  
Units  
Input High Voltage  
Input Low Voltage  
V
V
VIL  
-0.3  
FSEL[1:0],  
ADR[1:0]  
V
CC = VIN = 2.625 or 3.465V  
150  
10  
µA  
µA  
µA  
µA  
Input High  
Current  
IIH  
SCL, SDA  
VCC = VIN = 2.625 or 3.465V  
CC = 2.625 or 3.465V, VIN = 0V  
FSEL[1:0],  
ADR[1:0]  
V
-10  
Input Low  
Current  
IIL  
SCL, SDA  
VCC = 2.625 or 3.465V, VIN = 0V  
-150  
©2016 Integrated Device Technology, Inc.  
4
Revision D, June 15, 2016  
8T73S208 Datasheet  
Table 4C. DC Characteristics, V = V  
= 2.5V 5% or 3.3V 5%, V = 0V, T = -40°C to 85°C  
EE A  
CC  
CCO  
Symbol  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
VIN  
Input Voltage Swing1  
0.15  
1.2  
V
Input  
High Voltage  
VIH  
VIH  
VIL  
IN, nIN  
VIN<=1V  
VIN>1V  
VCC  
VCC  
V
V
V
Input  
High Voltage  
IN, nIN  
IN, nIN  
1.4  
0
Input  
Low Voltage  
V
IH – 0.15  
Differential Input Voltage  
Swing  
VDIFF_IN  
RIN  
0.3  
40  
80  
V
Input Resistance IN, nIN  
IN to VT  
50  
60  
Differential Input  
IN, nIN  
RIN_DIFF  
IN to nIN, VT = open  
100  
120  
Resistance  
NOTE 1. Refer to Parameter Measurement Information, Input Voltage Swing diagram.  
Table 4D. LVPECL DC Characteristics, V = V  
= 3.3V 5%, V = 0V, T = -40°C to 85°C  
CC  
CCO  
EE  
A
Symbol  
VOH  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
Output High Voltage1  
Output Low Voltage1  
VCCO – 1.102  
VCCO – 1.802  
VCCO – 0.95 VCCO – 0.775  
V
V
VOL  
VCCO – 1.6  
0.65  
VCCO – 1.367  
1.00  
Peak-to-Peak  
Output Voltage Swing  
VSWING  
0.60  
V
NOTE 1. Outputs terminated with 50to VCCO – 2V.  
Table 4E. LVPECL DC Characteristics, V = V  
= 2.5V 5%, V = 0V, T = -40°C to 85°C  
CC  
CCO  
EE  
A
Symbol  
VOH  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
Output High Voltage1  
Output Low Voltage1  
VCCO – 1.125  
VCCO – 1.799  
VCCO – 0.95 VCCO – 0.767  
V
V
VOL  
VCCO – 1.6  
0.65  
VCCO – 1.359  
1.00  
Peak-to-Peak Output  
Voltage Swing  
VSWING  
0.60  
V
NOTE 1. Outputs terminated with 50to VCCO – 2V.  
©2016 Integrated Device Technology, Inc.  
5
Revision D, June 15, 2016  
8T73S208 Datasheet  
AC Electrical Characteristics  
Table 5. AC Electrical Characteristics, V = V  
= 2.5V 5% or 3.3V 5%, T = -40°C to 85°C  
A
CC  
CCO  
Symbol1 Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
1000  
1000  
500  
Units  
MHz  
MHz  
MHz  
MHz  
MHz  
kHz  
fREF  
fOUT  
fSCL  
Input Frequency  
Output Frequency  
I2C Clock Frequency  
IN, nIN  
FSEL[1:0] = 00  
FSEL[1:0] = 01  
FSEL[1:0] = 10  
FSEL[1:0] = 11  
250  
125  
400  
fREF = 100MHz,  
Integration Range: 12kHz – 20MHz  
0.293  
0.219  
0.182  
0.338  
0.245  
0.207  
ps  
ps  
ps  
Buffer Additive Phase Jitter,  
RMS; refer to Additive Phase  
Jitter Section, measured with  
FSEL[1:0] = 00  
f
REF = 125MHz,  
tJIT  
Integration Range: 12kHz – 20MHz  
fREF =156.25MHz,  
Integration Range: 12kHz – 20MHz  
FSEL[1:0] = 00  
FSEL[1:0] = 01  
FSEL[1:0] = 10  
FSEL[1:0] = 11  
550  
675  
815  
930  
15  
750  
870  
1052  
1230  
60  
ps  
ps  
ps  
ps  
ps  
ps  
ps  
%
Propagation  
Delay2  
IN, nIN to  
Qx, nQx  
tPD  
tsk(o)  
tsk(p)  
tsk(pp)  
Output Skew3 4  
Pulse Skew  
Part-to-Part Skew3 5 6  
10  
50  
500  
Any Frequency  
at fREF = 100MHz  
at fREF = 125MHz  
at fREF = 156.25MHz  
50  
50  
50  
50  
48  
48  
48  
52  
52  
52  
%
odc  
Output Duty Cycle7  
%
%
Output Enable and Disable  
Time8  
Output Enable/Disable State from/to  
Active/Inactive  
tPDZ  
1
µs  
20% to 80%  
10% to 90%  
140  
180  
205  
350  
ps  
ps  
tR / tF  
Output Rise/ Fall Time  
NOTE 1. Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device  
is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal  
equilibrium has been reached under these conditions.  
NOTE 2. Measured from the differential input crossing point to the differential output cross point.  
NOTE 3. Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the differential cross point.  
NOTE 4. This parameter is defined in accordance with JEDEC Standard 65.  
NOTE 5. Defined as skew between outputs on different devices operating at the same supply voltage, same temperature, same frequency and  
with equal load conditions. Using the same type of inputs on each device, the outputs are measured at the differential cross point.  
NOTE 6. Part-to-part skew specification does not guarantee divider synchronization between devices.  
NOTE 7. If FSEL[1:0] = 00 (divide-by-one), the output duty cycle will depend on the input duty cycle.  
NOTE 8. Measured from SDA rising edge of I2C stop command.  
©2016 Integrated Device Technology, Inc.  
6
Revision D, June 15, 2016  
8T73S208 Datasheet  
Additive Phase Jitter  
The spectral purity in a band at a specific offset from the fundamental  
compared to the power of the fundamental is called the dBc Phase  
Noise. This value is normally expressed using a Phase noise plot  
and is most often the specified plot in many applications. Phase noise  
is defined as the ratio of the noise power present in a 1Hz band at a  
specified offset from the fundamental frequency to the power value of  
the fundamental. This ratio is expressed in decibels (dBm) or a ratio  
of the power in the 1Hz band to the power in the fundamental. When  
the required offset is specified, the phase noise is called a dBc value,  
which simply means dBm at a specified offset from the fundamental.  
By investigating jitter in the frequency domain, we get a better  
understanding of its effects on the desired application over the entire  
time record of the signal. It is mathematically possible to calculate an  
expected bit error rate given a phase noise plot.  
Typical Phase Jitter at 156.25MHz  
Additive Phase Jitter @ 156.25MHz  
12kHz to 20MHz = 0.182ps (typical)  
Offset from Carrier Frequency (Hz)  
The input source is 156.25MHz Wenzel Oscillator.  
©2016 Integrated Device Technology, Inc.  
7
Revision D, June 15, 2016  
8T73S208 Datasheet  
Parameter Measurement Information  
2V  
2V  
SCOPE  
SCOPE  
V
V
CC,  
CC,  
Qx  
Qx  
V
V
CCO  
CCO  
nQx  
nQx  
VEE  
VEE  
-0.5V 0.125V  
-1.3V 0.165V  
3.3 Core/3.3V LVPECL Output Load AC Test Circuit  
2.5V Core/2.5V LVPECL Output Load AC Test Circuit  
V
CC  
nIN  
IN  
nIN  
IN  
VIN  
Cross Points  
nQ[0:7]  
Q[0:7]  
VDIF  
tPD  
V
EE  
Differential Input Level  
Propagation Delay  
nQx  
Qx  
nQx  
Qx  
nQy  
Qy  
nQy  
Qy  
tPLH  
tPHL  
tsk(p)= |tPHL - tPLH  
|
Output Skew  
Pulse Skew  
©2016 Integrated Device Technology, Inc.  
8
Revision D, June 15, 2016  
8T73S208 Datasheet  
Parameter Measurement Information, continued  
nQ[0:7]  
Q[0:7]  
Part 1  
nQx  
Qx  
Part 2  
nQy  
Qy  
tsk(pp)  
Part-to-Part Skew  
Output Duty Cycle/Pulse Width/Period  
nQ[0:7]  
Q[0:7]  
VDIFF_IN  
VIN  
nQ[0:7]  
90%  
tF  
90%  
tR  
VSWING  
10%  
Differential Voltage Swing = 2 x Single-ended VIN  
10%  
Q[0:7]  
Output Rise/Fall Time  
Single-Ended & Differential Input, Output Voltage Swing  
©2016 Integrated Device Technology, Inc.  
9
Revision D, June 15, 2016  
8T73S208 Datasheet  
Applications Information  
3.3V Differential Input with Built-In 50Termination Interface  
The IN /nIN with built-in 50terminations accept LVDS, LVPECL,  
CML and other differential signals. Both signals must meet the VIN  
and VIH input requirements. Figures 4A to 4D show interface  
examples for the IN/nIN input with built-in 50terminations driven by  
the most common driver types. The input interfaces suggested here  
are examples only. If the driver is from another vendor, use their  
termination recommendation. Please consult with the vendor of the  
driver component to confirm the driver termination requirements.  
Figure 4A. N/nIN Input with Built-In 50  
Figure 4B. IN/nIN Input with Built-In 50  
Driven by an LVDS Driver  
Driven by an LVPECL Driver  
3.3V  
3.3V  
3.3V CML with  
Built-In Pullup  
Zo = 50Ω  
Zo = 50Ω  
C1  
C2  
IN  
50Ω  
50Ω  
VT  
nIN  
V_REF_AC  
Receiver with  
Built-In 50Ω  
Figure 4C. IN/nIN Input with Built-In 50  
Figure 4D. IN/nIN Input with Built-In 50Driven by a  
CML Driver with Built-In 50Pullup  
Driven by a CML Driver  
©2016 Integrated Device Technology, Inc.  
10  
Revision D, June 15, 2016  
8T73S208 Datasheet  
2.5V LVPECL Input with Built-In 50Termination Interface  
The IN /nIN with built-in 50terminations accept LVDS, LVPECL,  
CML and other differential signals. Both signals must meet the VIN  
and VIH input requirements. Figures 5A to 5D show interface  
examples for the IN/nIN with built-in 50termination input driven by  
the most common driver types. The input interfaces suggested here  
are examples only. If the driver is from another vendor, use their  
termination recommendation. Please consult with the vendor of the  
driver component to confirm the driver termination requirements.  
2.5V  
2.5V  
Zo = 50  
IN  
VT  
Zo = 5  
LVPECL  
nIN  
V_REF_AC  
R1  
18  
Figure 5A. IN/nIN Input with Built-In 50  
Figure 5B. IN/nIN Input with Built-In 50  
Driven by an LVDS Driver  
Driven by an LVPECL Driver  
Figure 5C. IN/nIN Input with Built-In 50  
Figure 5D. IN/nIN Input with Built-In 50Driven by a  
CML Driver with Built-In 50Pullup  
Driven by a CML Driver  
©2016 Integrated Device Technology, Inc.  
11  
Revision D, June 15, 2016  
8T73S208 Datasheet  
VFQFN EPAD Thermal Release Path  
In order to maximize both the removal of heat from the package and  
the electrical performance, a land pattern must be incorporated on  
the Printed Circuit Board (PCB) within the footprint of the package  
corresponding to the exposed metal pad or exposed heat slug on the  
package, as shown in Figure 6. The solderable area on the PCB, as  
defined by the solder mask, should be at least the same size/shape  
as the exposed pad/slug area on the package to maximize the  
thermal/electrical performance. Sufficient clearance should be  
designed on the PCB between the outer edges of the land pattern  
and the inner edges of pad pattern for the leads to avoid any shorts.  
and dependent upon the package power dissipation as well as  
electrical conductivity requirements. Thus, thermal and electrical  
analysis and/or testing are recommended to determine the minimum  
number needed. Maximum thermal and electrical performance is  
achieved when an array of vias is incorporated in the land pattern. It  
is recommended to use as many vias connected to ground as  
possible. It is also recommended that the via diameter should be 12  
to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is  
desirable to avoid any solder wicking inside the via during the  
soldering process which may result in voids in solder between the  
exposed pad/slug and the thermal land. Precautions should be taken  
to eliminate any solder voids between the exposed heat slug and the  
land pattern. Note: These recommendations are to be used as a  
guideline only. For further information, please refer to the Application  
Note on the Surface Mount Assembly of Amkor’s Thermally/  
Electrically Enhance Lead frame Base Package, Amkor Technology.  
While the land pattern on the PCB provides a means of heat transfer  
and electrical grounding from the package to the board through a  
solder joint, thermal vias are necessary to effectively conduct from  
the surface of the PCB to the ground plane(s). The land pattern must  
be connected to ground through these vias. The vias act as “heat  
pipes”. The number of vias (i.e. “heat pipes”) are application specific  
SOLDER  
SOLDER  
PIN  
PIN  
EXPOSED HEAT SLUG  
PIN PAD  
GROUND PLANE  
LAND PATTERN  
(GROUND PAD)  
PIN PAD  
THERMAL VIA  
Figure 6. P.C. Assembly for Exposed Pad Thermal Release Path – Side View (drawing not to scale)  
Recommendations for Unused Input and Output Pins  
Inputs:  
Outputs:  
LVPECL Outputs  
LVCMOS Control Pins  
Any unused LVPECL output pair can be left floating. We recommend  
that there is no trace attached. Both sides of the differential output  
pair should either be left floating or terminated.  
All control pins have internal pull-ups or pull-downs; additional  
resistance is not required but can be added for additional protection.  
A 1kresistor can be used.  
©2016 Integrated Device Technology, Inc.  
12  
Revision D, June 15, 2016  
8T73S208 Datasheet  
Termination for 3.3V LVPECL Outputs  
The clock layout topology shown below is a typical termination for  
LVPECL outputs. The two different layouts mentioned are  
recommended only as guidelines.  
transmission lines. Matched impedance techniques should be used  
to maximize operating frequency and minimize signal distortion.  
Figures 7A and 7B show two different layouts which are  
recommended only as guidelines. Other suitable clock layouts may  
exist and it would be recommended that the board designers  
simulate to guarantee compatibility across all printed circuit and clock  
component process variations.  
The differential outputs are low impedance follower outputs that  
generate ECL/LVPECL compatible outputs. Therefore, terminating  
resistors (DC current path to ground) or current sources must be  
used for functionality. These outputs are designed to drive 50  
3.3V  
R3  
R4  
125  
125  
3.3V  
3.3V  
Z
o = 50  
+
_
Input  
Zo = 50  
R1  
84  
R2  
84  
Figure 7A. 3.3V LVPECL Output Termination  
Figure 7B. 3.3V LVPECL Output Termination  
©2016 Integrated Device Technology, Inc.  
13  
Revision D, June 15, 2016  
8T73S208 Datasheet  
Termination for 2.5V LVPECL Outputs  
Figure 8A and Figure 8B show examples of termination for 2.5V  
LVPECL driver. These terminations are equivalent to terminating 50  
to VCCO – 2V. For VCCO = 2.5V, the VCCO – 2V is very close to ground  
level. The R3 in Figure 8B can be eliminated and the termination is  
shown in Figure 8C.  
2.5V  
VCCO = 2.5V  
2.5V  
2.5V  
VCCO = 2.5V  
R1  
R3  
50  
250  
250  
+
50  
50  
+
50  
2.5V LVPECL Driver  
R1  
50  
R2  
50  
2.5V LVPECL Driver  
R2  
62.5  
R4  
62.5  
R3  
18  
Figure 8A. 2.5V LVPECL Driver Termination Example  
Figure 8B. 2.5V LVPECL Driver Termination Example  
2.5V  
VCCO = 2.5V  
50  
+
50  
2.5V LVPECL Driver  
R1  
50  
R2  
50  
Figure 8C. 2.5V LVPECL Driver Termination Example  
©2016 Integrated Device Technology, Inc.  
14  
Revision D, June 15, 2016  
8T73S208 Datasheet  
Power Considerations  
This section provides information on power dissipation and junction temperature for the 8T73S208.  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the 8T73S208 is the sum of the core power plus the power dissipated in the load(s).  
The following is the power dissipation for VCC = 3.465V, which gives worst case results.  
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.  
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 95mA = 329.175mW  
Power (outputs)MAX = 36.3mW/Loaded Output pair  
If all outputs are loaded, the total power is 8 * 36.3mW = 290.4mW  
Power Dissipation for internal termination RT  
(Assuming VIN = 0.15V and VCMR = 3.225V VIH = 3.3V and VIL = 3.15V; and external 50is connected from VT pin to VEE.)  
Power (RT)MAX = 46.5mW  
Total Power_MAX = (3.465V, with all outputs switching) = 329.175mW + 290.4mW + 46.5mW = 666.08mW  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The  
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond  
wire and bond pad temperature remains below 125°C.  
The equation for Tj is as follows: Tj = JA * Pd_total + TA  
Tj = Junction Temperature  
JA = Junction-to-Ambient Thermal Resistance  
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)  
TA = Ambient Temperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and  
a multi-layer board, the appropriate value is 42.7°C/W per Table 6 below.  
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:  
85°C + 0.666W * 42.7°C/W = 113.4°C. This is below the limit of 125°C.  
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of  
board (multi-layer).  
Table 6. Thermal Resistance for 32 Lead VFQFN, Forced Convection  
JA  
JA vs. Air Flow  
Meters per Second  
0
1
2.5  
Multi-Layer PCB, JEDEC Standard Test Boards  
42.7°C/W  
37.3°C/W  
33.5°C/W  
©2016 Integrated Device Technology, Inc.  
15  
Revision D, June 15, 2016  
8T73S208 Datasheet  
3. Calculations and Equations.  
The purpose of this section is to calculate the power dissipation for the LVPECL output pairs.  
LVPECL output driver circuit and termination are shown in Figure 9.  
VCCO  
Q1  
VOUT  
RL  
50Ω  
VCCO - 2V  
Figure 9. LVPECL Driver Circuit and Termination  
To calculate worst case power dissipation into the load, use the following equations which assume a 50load, and a termination voltage of  
VCCO – 2V.  
For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.775V  
(VCCO_MAX – VOH_MAX) = 0.82V  
For logic low, VOUT = VOL_MAX = VCCO_MAX – 1.367V  
(VCCO_MAX – VOL_MAX) = 1.58V  
Pd_H is power dissipation when the output drives high.  
Pd_L is the power dissipation when the output drives low.  
Pd_H = [(VOH_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOH_MAX) = [(2V – (VCCO_MAX – VOH_MAX))/RL] * (VCCO_MAX – VOH_MAX) =  
[(2V – 0.775V)/50] * 0.775V = 18.99mW  
Pd_L = [(VOL_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOL_MAX) = [(2V – (VCCO_MAX – VOL_MAX))/RL] * (VCCO_MAX – VOL_MAX) =  
[(2V – 1.367V)/50] * 1.367V = 17.31mW  
Total Power Dissipation per output pair = Pd_H + Pd_L = 36.3mW  
©2016 Integrated Device Technology, Inc.  
16  
Revision D, June 15, 2016  
8T73S208 Datasheet  
Reliability Information  
Table 7. vs. Air Flow Table for a 32-Lead VFQFN  
JA  
JA vs. Air Flow  
Meters per Second  
0
1
2.5  
Multi-Layer PCB, JEDEC Standard Test Boards  
42.7°C/W  
37.3°C/W  
33.5°C/W  
Transistor Count  
The transistor count for 8T73S208 is: 4833  
©2016 Integrated Device Technology, Inc.  
17  
Revision D, June 15, 2016  
8T73S208 Datasheet  
32 Lead VFQFN Package Outline and Package Dimensions  
©2016 Integrated Device Technology, Inc.  
18  
Revision D, June 15, 2016  
8T73S208 Datasheet  
32 Lead VFQFN Package Outline and Package Dimensions  
©2016 Integrated Device Technology, Inc.  
19  
Revision D, June 15, 2016  
8T73S208 Datasheet  
Ordering Information  
Table 8. Ordering Information  
Part/Order Number  
8T73S208BNLGI  
8T73S208BNLGI8  
Marking  
Package  
Shipping Packaging  
Tray  
Temperature  
-40C to 85C  
-40C to 85C  
IDT8T73S208BNLGI  
IDT8T73S208BNLGI  
32 Lead VFQFN, Lead-Free  
32 Lead VFQFN, Lead-Free  
Tape & Reel  
©2016 Integrated Device Technology, Inc.  
20  
Revision D, June 15, 2016  
8T73S208 Datasheet  
Revision History Sheet  
Rev  
A
Table  
Page  
1
Description of Change  
Date  
Added ‘G’ in the part number in footer.  
Re-rendered to make the fonts legible.  
4/8/2013  
4/22/13  
A
12-13  
4
Absolute Maximum Ratings Table - added Input Termination Current row. Corrected  
NOTE 1.  
6
Changed Additive Phase Jitter plot.  
17  
Power Considerations section - updated Power Dissipation section.  
B
1/13/15  
20 - 21 Updated Package Outline and Dimensions section to Rev 5.  
Updated Header/Footer through-out the datasheet.  
Deleted “IDT” prefix and “I” suffix of the part number through-out the datasheet.  
C
D
3
Section , “Output Enable Operation” - added last paragraph.  
6/3/16  
3
20  
Section , “Output Enable Operation” - updated last paragraph.  
Updated datasheet header/footer.  
T8  
6/15/16  
Section , “Table 8. Ordering Information” - deleted table note.  
©2016 Integrated Device Technology, Inc.  
21  
Revision D, June 15, 2016  
8T73S208 Datasheet  
Corporate Headquarters  
6024 Silver Creek Valley Road  
San Jose, CA 95138 USA  
www.IDT.com  
Sales  
Tech Support  
www.idt.com/go/support  
1-800-345-7015 or 408-284-8200  
Fax: 408-284-2775  
www.IDT.com/go/sales  
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications  
and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein  
is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability,  
or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.  
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably  
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.  
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of  
IDT or their respective third party owners.  
For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary.  
Copyright ©2016 Integrated Device Technology, Inc. All rights reserved.  
厂商 型号 描述 页数 下载

IDT

8T73S1802 [ 1:2 Clock Fanout Buffer and Frequency Divider ] 24 页

IDT

8T73S1802NLGI [ 1:2 Clock Fanout Buffer and Frequency Divider ] 25 页

IDT

8T73S1802NLGI/W [ 1:2 Clock Fanout Buffer and Frequency Divider ] 25 页

IDT

8T73S1802NLGI8 [ 1:2 Clock Fanout Buffer and Frequency Divider ] 25 页

IDT

8T73S1802_17 [ 1:2 Clock Fanout Buffer and Frequency Divider ] 25 页

IDT

8T73S1802_18 [ 1:2 Clock Fanout Buffer and Frequency Divider ] 24 页

IDT

8T73S208 [ 2.5 V, 3.3 V Differential LVPECL Clock Divider and Fanout Buffer ] 22 页

IDT

8T73S208A-01 [ 2.5V, 3.3V Differential LVPECL Clock Divider and Buffer ] 24 页

IDT

8T73S208A-01NLGI [ 2.5V, 3.3V Differential LVPECL Clock Divider and Buffer ] 24 页

IDT

8T73S208A-01NLGI8 [ 2.5V, 3.3V Differential LVPECL Clock Divider and Buffer ] 24 页

PDF索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

IC型号索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

Copyright 2024 gkzhan.com Al Rights Reserved 京ICP备06008810号-21 京

0.255880s