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UZXCL280E5

型号：

UZXCL280E5

品牌：

DIODES[ DIODES INCORPORATED ]

页数：

14 页

PDF大小：

421 K

下载PDF手册
ZXCL SERIES  
Micropower SC70-5 & SOT23-5 low dropout regulators  
ZXCL5213V25, ZXCL5213V26, ZXCL5213V28, ZXCL5213V30, ZXCL5213V33,  
ZXCL250, ZXCL260, ZXCL280, ZXCL300, ZXCL330  
Description  
Features  
The ZXCL series have been designed with space  
sensitive systems in mind. They are available in  
the ultra small SC70-5 package, which is half the  
size of SOT23 based regulators.  
•
•
•
•
•
•
Low 85mV dropout at 50mA load  
50 A ground pin current with full 150mA load  
␮
2.5, 2.6, 2.8, 3, & 3.3 volts output  
Very low noise, without bypass capacitor  
5-pin SC70 and SOT23 package  
No-load stable  
The devices can be used with all types of output  
capacitors including low ESR ceramics and  
typical dropout voltage, is only 85mV at 50mA  
load. Supply current is minimised with a ground  
pin current of only 50␮A at full 150mA load.  
Applications  
Logic control allows the devices to be shut  
down, consuming typically less than 10nA.  
These features make the device ideal for battery  
powered applications where power economy is  
critical.  
•
•
•
•
•
•
Cellular and Cordless phones  
PDA  
Hand held instruments  
Camera, Camcorder, Personal stereo  
PC cards  
For  
applications  
requiring  
improved  
performance over alternative devices, the  
ZXCL is also offered in the 5 pin SOT23  
package with an industry standard pinout.  
Portable and battery-powered equipment  
The devices feature thermal overload and  
over-current protection and are available with  
output voltages of 2.5V, 2.6V, 2.8V, 3V, 3.3V.  
No-Load Stability, the ZXCL device will maintain regulation and  
is stable with no external load. e.g. CMOS RAM applacations.  
Typical application circuit  
Package footprint  
SOT23-5 (see P7 for SC70-5)  
Package suffix - E5  
VIN  
GND  
EN  
VO  
NC  
Top view  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
1
www.zetex.com  
ZXCL SERIES  
Ordering information  
Order reference  
Voltage  
Package  
Part  
marking  
Status  
Reel size  
(inches)  
Tape  
width  
(mm)  
Quantity  
per reel  
(V)  
ZXCL250H5TA  
2.5  
2.6  
2.8  
3.0  
3.3  
4.0  
2.5  
2.6  
2.8  
3.0  
3.3  
4.0  
SC70-5  
SC70-5  
SC70-5  
SC70-5  
SC70-5  
SC70-5  
SC70-5  
SC70-5  
SC70-5  
SC70-5  
SC70-5  
SC70-5  
L25A  
L26A  
L28A  
L30A  
L33A  
L40A  
L25C  
L26C  
L28C  
L30C  
L33C  
L40C  
Active  
Active  
Active  
Active  
Active  
Obsolete  
Active  
Active  
Active  
Active  
Active  
7
7
7
7
7
7
7
7
7
7
7
7
8
8
8
8
8
8
8
8
8
8
8
8
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
ZXCL260H5TA  
ZXCL280H5TA  
ZXCL300H5TA  
ZXCL330H5TA  
ZXCL400H5TA  
ZXCL5213V25H5TA  
ZXCL5213V26H5TA  
ZXCL5213V28H5TA  
ZXCL5213V30H5TA  
ZXCL5213V33H5TA  
ZXCL5213V40H5TA  
Not rec.  
for new  
designs  
ZXCL250E5TA  
ZXCL260E5TA  
ZXCL280E5TA  
ZXCL300E5TA  
ZXCL330E5TA  
ZXCL400E5TA  
2.5  
2.6  
2.8  
3.0  
3.3  
4.0  
SOT23-5  
SOT23-5  
SOT23-5  
SOT23-5  
SOT23-5  
SOT23-5  
L25B  
L26B  
L28B  
L30B  
L33B  
L40B  
Active  
Active  
7
7
7
7
7
7
8
8
8
8
8
8
3000  
3000  
3000  
3000  
3000  
3000  
Active  
Active  
Active  
Obsolete  
Absolute maximum rating  
Terminal Voltage with respect to GND  
Output short circuit duration Infinite  
V
-0.3V to 7.0V  
-0.3V to 10V  
-0.3V to 5.5V  
Continuous power dissipation Internally limited  
Operating temperature range -40°C to +85°C  
IN  
N
E
V
Storage temperature range  
-55°C to +125°C  
O
Package power dissipation (T =25°C)  
A
SC70-5  
300mW (Note 1)  
450mW (Note 1)  
SOT23-5  
Stresses beyond those listed under “Absolute maximum ratings” may cause permanent damage  
to the device. These are stress ratings only, and functional operation of the device at these or any  
other conditions beyond those indicated in the operational sections of the specifications is not  
implied. Exposure to absolute maximum conditions for extended periods may affect device  
reliability.  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
2
www.zetex.com  
ZXCL SERIES  
Recommended operating conditions  
Symbol Parameter  
Min  
Max  
Units  
V
V
V
Input voltage range  
2.0*  
5.5  
V
IN  
Enable pin logic level High pin  
Enable pin logic level Low pin  
Ambient temperature range  
2.2  
0
10  
0.8  
85  
V
V
ENH  
ENL  
T
-40  
°C  
A
*
Output voltage will start to rise when VIN exceeds a value or approximately 1.3V. For normal operation,  
IN(min) > VOUT(nom) + 0.5V.  
V
Pin description  
Symbol Parameter  
V
Supply voltage  
Ground  
IN  
G
ND  
E
Active HIGH enable input. TTL/CMOS logic compatible. Connect to V  
or logic high for normal operation  
N
IN  
N/C  
No connection  
V
Regulator output  
O
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
3
www.zetex.com  
ZXCL SERIES  
Electrical characteristics  
V = V = 0.5V, all values at T = 25°C (Unless otherwise stated)  
IN  
O
A
Symbol Parameter  
Conditions  
Limits  
Units  
Min. Typ. Max.  
V
Output voltage  
I =1mA  
-2%  
+2%  
V
O
O
I =100mA  
O
V +0.5V < V < V max  
-3%  
+3%  
V
O
IN  
IN  
⌬V /⌬T Output voltage  
-15  
ppm/°C  
O
temperature  
coefficient  
I
I
I
Output current  
150  
mA  
mA  
O(Max)  
OLIM  
O
XCL250/5213V25 only  
100  
160  
Over current limit  
800  
XCL250/5213V25 only  
No Load  
105  
230  
25  
50  
750  
50  
120  
Ground pin  
current  
␮A  
␮A  
I =150mA  
O
I =100mA  
40  
15  
100  
␮A  
mV  
mV  
mV  
mV  
mV  
mV  
mV  
mV  
%/V  
O
V
Dropout voltage  
note 3  
I =10mA  
All variants  
DO  
O
I =50mA  
85  
O
I =100mA ZXCL250 / 5213V25  
163  
155  
140  
140  
140  
140  
0.02  
325  
310  
280  
280  
280  
280  
0.1  
O
I =100mA ZXCL260 / 5213V26  
O
I =100mA ZXCL280 / 5213V28  
O
I =100mA ZXCL300 / 5213V30  
O
I =100mA ZXCL330 / 5213V33  
O
I =100mA ZXCL400 / 5213V40  
O
⌬V  
⌬V  
Line regulation  
Load regulation  
V =(V +0.5V) to 5.5V, I =1mA  
IN O O  
LNR  
LDR  
I =1mA to 100mA  
0.01 0.04 %/mA  
O
E
Output noise  
voltage  
f=10Hz to 100kHz, C =10␮F  
50  
␮V  
RMS  
N
O
V
Enable pin  
hysteresis  
150  
mV  
ENHS  
I
I
Enable pin input  
current  
Shutdown supply  
current  
Thermal shutdown  
temperature  
V
V
=5.5V  
=0V  
100  
1
nV  
␮A  
°C  
EN  
OSD  
EN  
EN  
T
125  
165  
SD  
Device testing is performed at TA=25°C. Device thermal performance is guaranteed by design.  
Note1: Maximum power dissipation is calculated assuming the device is mounted on a PCB measuring 2 inches square  
Note2:Output voltage will start to rise when VIN exceeds a value or approximately 1.3V. For normal operation,  
VIN(min) > VOUT(nom) + 0.5V.  
Note3:Dropout voltage is defined as the difference between VIN and VO, when VO has dropped 100mV below its nominal  
value. Nominal value of VO is defined at VIN=VO+0.5V.  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
4
www.zetex.com  
ZXCL SERIES  
Typical characteristics (ZXCL280 / 5213 shown)  
6
5
4
3
2
1
0
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
VIN  
IOUT = 100mA  
IOUT = 1mA  
0
1
2
3
4
5
6
100  
5
0
25  
50  
75  
100  
125  
150  
175  
Output Current (mA)  
Input Voltage (V)  
Input to Output Characteristics  
Dropout Voltage v Output Current  
25.0  
24.8  
24.6  
24.4  
24.2  
24.0  
23.8  
23.6  
23.4  
23.2  
23.0  
2.81  
2.80  
2.79  
VIN = 3.3V  
No Load  
VIN = 3.3V  
No Load  
-50  
-25  
0
25  
50  
75  
-50  
-25  
0
25  
50  
75  
100  
Temperature (˚C)  
Output Voltage v Temperature  
Temperature (˚C)  
Ground Current v Temperature  
30  
25  
20  
15  
10  
5
60  
No Load  
55  
50  
45  
40  
35  
30  
25  
20  
VIN = 5V  
VIN = 3.3V  
0
0
1
2
3
4
0
25  
50  
75  
100  
125  
150  
Input Voltage (V)  
Ground Current v Input Voltage  
Load Current (mA)  
Ground Current v Load Current  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
5
www.zetex.com  
ZXCL SERIES  
Typical characteristics  
6
100  
VIN = 5V  
IL = 1mA to 50mA  
COUT = 1μF  
Enable  
50  
5
4
3
2
1
0
0
VIN = 5V  
IL = 1mA  
IL = 100mA  
100  
50  
COUT = 1μF  
COUT = 10μF  
VIN = 3.3V  
IL = 1mA  
IL = 100mA  
0
COUT = 10μF  
-50  
COUT = 1μF  
-100  
0
10 20 30 40 50 60 70 80 90 100  
0.0  
0.1  
0.2  
0.3  
0.4  
0.5  
0.5  
1M  
Time (μs)  
Start-Up Response  
Time (ms)  
Load Response  
6
5
4
3
6
5
4
3
COUT = 1μF  
Tr & Tf = 2.5μs  
COUT = 1μF  
Tr & Tf = 2.5μs  
20  
10  
20  
10  
0
0
-10  
-10  
-20  
-20  
0.0  
0.1  
0.2  
0.3  
0.4  
0.5  
0.0  
0.1  
0.2  
0.3  
0.4  
Time (ms)  
Line Rejection IL = 1mA  
Time (ms)  
Line Rejection IL = 100mA  
80  
10  
1
All Caps Ceramic  
Surface Mount  
IL = 100mA, COUT = 1μF  
IL = 100mA, COUT = 10μF  
70  
60  
50  
40  
30  
20  
10  
0
IL = 50mA  
COUT = 10μF  
COUT = 2.2μF  
0.1  
0.01  
No Load, COUT = 1μF  
No Load, COUT = 10μF  
COUT = 1μF  
10  
100  
1k  
10k  
100k  
1M  
10  
100  
1k  
10k  
100k  
Frequency (Hz)  
Power Supply Rejection v Frequency  
Frequency (Hz)  
Output Noise v Frequency  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
6
www.zetex.com  
ZXCL SERIES  
Connection diagrams  
SC70-5 (H5)  
SC70-5 (H5)  
EN  
N/C*  
GND  
VIN  
VIN  
VO  
GND  
VO  
EN  
NC  
Top view  
Top view  
* Should be left open circuit  
or connected to pin 3  
ZXCLxxx  
ZXCL5213Vxx  
Schematic diagram  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
7
www.zetex.com  
ZXCL SERIES  
Input to Output Diode  
Increased Output current  
In common with many other LDO regulators, the  
ZXCL device has an inherent diode associated  
with the output series pass transistor. This diode  
has its anode connected to the output and its  
cathode to the input. The internal diode is  
normally reverse biased, but will conduct if the  
output is forced above the input by more than a  
VBE (approximately 0.6V). Current will then flow  
Any ZXCL series device may be used in  
conjunction with an external PNP transistor to  
boost the output current capability. In the  
application circuit shown below, a FMMT717  
device is employed as the external pass  
element. This SOT23 device can supply up to  
2.5A maximum current subject to the thermal  
dissipation limits of the package (625mW).  
Alternative devices may be used to supply  
higher levels of current. Note that with this  
arrangement, the dropout voltage will be  
from V  
to V . For safe operation, the  
out  
in  
maximum current in this diode should be  
limited to 5mA continuous and 30mA peak. An  
external schottky diode may be used to provide  
protection when this condition cannot be  
satisfied.  
increased by the V drop of the external device.  
BE  
Also, care should be taken to protect the pass  
transistor in the event of excessive output  
current.  
Scheme to boost output current to 2A  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
8
www.zetex.com  
ZXCL SERIES  
Applications information  
Enable control  
A TTL compatible input is provided to allow the  
regulator to be shut down. A low voltage on the  
Enable pin puts the device into shutdown mode.  
In this mode the regulator circuit is switched off  
and the quiescent current reduces to virtually  
zero (typically less than 10nA) for input voltages  
above the minimum operating threshold of the  
device. A high voltage on the Enable pin ensures  
normal operation.  
R
C
The Enable pin can be connected to V or  
IN  
driven from an independent source of up to 10V  
maximum. (e.g. CMOS logic) for normal  
operation. There is no clamp diode from the  
Figure 1 Circuit Connection  
Enable pin to V , so the V pin may be at any  
IN  
IN  
voltage within its operating range irrespective  
of the voltage on the Enable pin. However input  
voltage rise time should be kept below 5ms to  
ensure consistent start-up response.  
Current Limit  
The ZXCL devices include a current limit circuit  
which restricts the maximum output current  
flow to typically 230mA. Practically the range of  
over-current should be considered as minimum  
160mA to maximum 800mA. The device’s  
robust design means that an output short circuit  
T
d
to any voltage between ground and V  
tolerated for an indefinite period.  
can be  
Figure 2 Start up delay (T )  
OUT  
d
Thermal Overload  
Thermal overload protection is included on  
chip. When the device junction temperature  
exceeds a minimum 125°C the device will shut  
down. The sense circuit will re-activate the  
output as the device cools. It will then cycle until  
the overload is removed. The thermal overload  
protection will be activated when high load  
currents or high input to output voltage  
differentials cause excess dissipation in the  
device.  
VIN  
− 1.5  
⎛
⎜
⎝
⎞
⎟
⎠
Td(NOM) = RCIn  
V
IN  
Calculation of start up delay as above  
Start up delay  
A small amount of hysteresis is provided on the  
Enable pin to ensure clean switching. This  
feature can be used to introduce a start up delay  
if required. Addition of a simple RC network on  
the Enable pin provides this function. The  
following diagram illustrates this circuit  
connection. The equation provided enables  
calculation of the delay period.  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
9
www.zetex.com  
ZXCL SERIES  
Applications information (Cont)  
Power dissipation  
The dielectric of the ceramic capacitance is an  
important consideration for the ZXCL Series  
operation over temperature. Zetex recommends  
minimum dielectric specification of X7R for the  
input and output capacitors. For example a  
ceramic capacitor with X7R dielectric will lose 20%  
The maximum allowable power dissipation of  
the device for normal operation (P  
), is a  
max  
function of the package junction to ambient  
thermal resistance ( ), maximum junction  
θ
ja  
temperature (Tj  
), and ambient temperature  
max  
of its capacitance over a -40  
range, whereas a capacitor with a Y5V dielectric  
loses 80% of its capacitance at -40 C and 75% at  
85 C.  
ЊC to 85ЊC temperature  
(T  
), according to the expression:  
amb  
Њ
P
= (Tj  
– T  
) / θ  
max  
max  
amb ja  
Њ
The maximum output current (I  
) at a given  
max  
An input capacitor of 1␮F (ceramic or tantalum) is  
recommended to filter supply noise at the device  
input and will improve ripple rejection.  
value of Input voltage (V ) and output voltage  
IN  
(V  
) is then given by  
OUT  
The input and output capacitors should be  
positioned close to the device, and a ground plane  
board layout should be used to minimise the  
I
= P  
/ (V - V  
)
max  
max  
IN  
OUT  
The value of qja is strongly dependent upon the  
type of PC board used. Using the SC70 package effects of parasitic track resistance.  
it will range from approximately 280°C/W for a  
Dropout voltage  
multi-layer board to around 450°C/W for a single  
sided board. It will range from 180°C/W to  
300°C/W for the SOT23-5 package. To avoid  
entering the thermal shutdo wn state, Tjmax  
should be assumed to be 125°C and Imax less  
The output pass transistor is a large PMOS device,  
which acts like a resistor when the regulator enters  
the dropout region. The dropout voltage is  
therefore proportional to output current as shown  
in the typical characteristics.  
than the over-current limit,(I  
). Power  
OLIM  
derating for the SC70 and SOT23-5 packages is  
shown in the following graph.  
Ground current  
500  
The use of a PMOS device ensures a low value of  
ground current under all conditions including  
dropout, start-up and maximum load.  
400  
SOT23  
300  
Power supply rejection and load transient  
response  
200  
SC70  
Line and Load transient response graphs are  
shown in the typical characteristics.  
100  
These show both the DC and dynamic shift in the  
output voltage with step changes of input voltage  
and load current, and how this is affected by the  
output capacitor.  
0
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature (°C)  
Derating Curve  
Capacitor selection and regulator stability  
If improved transient response is required, then an  
output capacitor with lower ESR value should be  
used. Larger capacitors will reduce over/  
The device is designed to operate with all types  
of output capacitor, including tantalum and low  
ESR ceramic. For stability over the full operating undershoot, but will increase the settling time.  
range from no load to maximum load, an output  
capacitor with a minimum value of 1 F is  
Best results are obtained using a ground plane  
layout to minimise board parasitics.  
μ
recommended, although this can be increased  
without limit to improve load transient  
performance. Higher values of output capacitor  
will also reduce output noise. Capacitors with  
ESR less than 0.5V are recommended for best  
results.  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
10  
www.zetex.com  
ZXCL SERIES  
S70-5 Package outline  
␣
Dim.  
Millimeters  
Inches  
Dim.  
Millimeters  
Min. Max.  
2.10 BSC  
Inches  
Max. Max.  
Min.  
Max.  
1.10  
0.10  
1.00  
0.30  
0.25  
Min.  
0.0315 0.0433  
0.0039  
0.0315 0.0039  
0.006 0.0118  
Max.  
A
A1  
A2  
b
0.80  
-
E
E1  
e
0.0826 BSC  
0.0492 BSC  
0.0255 BSC  
0.0511 BSC  
-
1.25 BSC  
0.65 BSC  
1.30 BSC  
0.80  
0.15  
0.08  
e1  
L
C
0.0031 0.0098  
0.0787 BSC  
0.26  
0°  
0.46  
8°  
0.010  
0°  
0.018  
8°  
D
2.00 BSC  
␣
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
11  
www.zetex.com  
ZXCL SERIES  
SOT23-5 Package outline  
DIM  
Millimeters  
Inches  
Max.  
Min.  
Max.  
1.45  
0.15  
1.30  
0.50  
0.26  
3.10  
3.20  
1.80  
Min.  
0.0354  
0.00  
0.0354  
0.0078  
0.0035  
0.1062  
0.0866  
0.0511  
A
A1  
A2  
b
C
D
E
E1  
e
e1  
L
a°  
0.90  
0.00  
0.90  
0.20  
0.09  
2.70  
2.20  
1.30  
0.0570  
0.0059  
0.0511  
0.0196  
0.0102  
0.1220  
0.1181  
0.0708  
0.0374 REF  
0.0748 REF  
0.0236  
30°  
0.95 REF  
1.90 REF  
0.10  
0°  
0.60  
30°  
0.0039  
0°  
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
12  
www.zetex.com  
ZXCL SERIES  
Intentionally left blank  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
13  
www.zetex.com  
ZXCL SERIES  
Definitions  
Product change  
Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or  
service. Customers are solely responsible for obtaining the latest relevant information before placing orders.  
Applications disclaimer  
The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for  
the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is  
assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights  
arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,  
tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,  
opportunity or consequential loss in the use of these circuit applications, under any circumstances.  
Life support  
Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written  
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body  
or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labelling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to  
cause the failure of the life support device or to affect its safety or effectiveness.  
Reproduction  
The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the  
company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a  
representation relating to the products or services concerned.  
Terms and Conditions  
All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two  
when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.  
For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.  
Quality of product  
Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.  
To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our  
regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork  
Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels.  
ESD (Electrostatic discharge)  
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.  
The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent  
of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.  
Devices suspected of being affected should be replaced.  
Green compliance  
Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding  
regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to  
reduce the use of hazardous substances and/or emissions.  
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with  
WEEE and ELV directives.  
Product status key:  
“Preview”  
“Active”  
Future device intended for production at some point. Samples may be available  
Product status recommended for new designs  
“Last time buy (LTB)”  
Device will be discontinued and last time buy period and delivery is in effect  
“Not recommended for new designs” Device is still in production to support existing designs and production  
“Obsolete”  
Production has been discontinued  
Datasheet status key:  
“Draft version”  
This term denotes a very early datasheet version and contains highly provisional information, which  
may change in any manner without notice.  
“Provisional version”  
“Issue”  
This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.  
However, changes to the test conditions and specifications may occur, at any time and without notice.  
This term denotes an issued datasheet containing finalized specifications. However, changes to  
specifications may occur, at any time and without notice.  
Zetex sales offices  
Europe  
Americas  
Asia Pacific  
Corporate Headquarters  
Zetex GmbH  
Kustermann-park  
Balanstraße 59  
D-81541 München  
Germany  
Zetex Inc  
Zetex (Asia Ltd)  
Zetex Semiconductors plc  
Zetex Technology Park, Chadderton  
Oldham, OL9 9LL  
700 Veterans Memorial Highway  
Hauppauge, NY 11788  
USA  
3701-04 Metroplaza Tower 1  
Hing Fong Road, Kwai Fong  
Hong Kong  
United Kingdom  
Telefon: (49) 89 45 49 49 0  
Fax: (49) 89 45 49 49 49  
europe.sales@zetex.com  
Telephone: (1) 631 360 2222  
Fax: (1) 631 360 8222  
usa.sales@zetex.com  
Telephone: (852) 26100 611  
Fax: (852) 24250 494  
asia.sales@zetex.com  
Telephone: (44) 161 622 4444  
Fax: (44) 161 622 4446  
hq@zetex.com  
© 2007 Published by Zetex Semiconductors plc  
Issue 8 - October 2007  
© Zetex Semiconductors plc 2007  
14  
www.zetex.com  
厂商 型号 描述 页数 下载

DIODES

 		UZX3CD2S1M832TA [ Small Signal Bipolar Transistor, 3.5A I(C), 20V V(BR)CEO, 1-Element, PNP, Silicon, 3 X 2 MM, MLP832, 10 PIN ] 9 页

DIODES

 		UZX3CD2S1M832TC [ Small Signal Bipolar Transistor, 3.5A I(C), 20V V(BR)CEO, 1-Element, PNP, Silicon, 3 X 2 MM, MLP832, 10 PIN ] 9 页

DIODES

 		UZX3CDBS1M832TA [ Small Signal Bipolar Transistor, 4.5A I(C), 20V V(BR)CEO, 1-Element, NPN, Silicon, 3 X 2 MM, MLP832, 10 PIN ] 9 页

DIODES

 		UZX3CDBS1M832TC [ Small Signal Bipolar Transistor, 4.5A I(C), 20V V(BR)CEO, 1-Element, NPN, Silicon, 3 X 2 MM, MLP832, 10 PIN ] 9 页

DIODES

 		UZX5T2E6TA [ Small Signal Bipolar Transistor, 3.5A I(C), 20V V(BR)CEO, 1-Element, PNP, Silicon, SOT-23, 6 PIN ] 6 页

DIODES

 		UZX5T2E6TC [ Small Signal Bipolar Transistor, 3.5A I(C), 20V V(BR)CEO, 1-Element, PNP, Silicon, SOT-23, 6 PIN ] 6 页

DIODES

 		UZX5T849GTA [ Power Bipolar Transistor, 7A I(C), 30V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 4 Pin, SOT-223, 4 PIN ] 6 页

DIODES

 		UZX5T849GTC [ Power Bipolar Transistor, 7A I(C), 30V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 4 Pin, SOT-223, 4 PIN ] 6 页

DIODES

 		UZX5T853GTA [ Power Bipolar Transistor, 6A I(C), 100V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 4 Pin, SOT-223, 4 PIN ] 6 页

DIODES

 		UZX5T853GTC [ Power Bipolar Transistor, 6A I(C), 100V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 4 Pin, SOT-223, 4 PIN ] 6 页

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