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HZM6.2ZMWA

型号:

HZM6.2ZMWA

品牌:

HITACHI[ HITACHI SEMICONDUCTOR ]

页数:

6 页

PDF大小:

34 K

HZM6.2ZMWA  
Silicon Epitaxial Planar Zener Diode for Surge Absorb  
ADE-208-1514 (Z)  
Rev.0  
May. 2002  
Features  
HZM6.2ZMWA has two devices in a monolithic, and can absorb surge.  
Low capacitance (C = 8.5 pF max) and can protect ESD of signal line.  
MPAK Package is suitable for high density surface mounting and high speed assembly.  
Ordering Information  
Type No.  
Laser Mark  
Package Code  
HZM6.2ZMWA  
62N  
MPAK  
Pin Arrangement  
3
1. Cathode  
2. Cathode  
3. Anode  
2
1
(Top View)  
HZM6.2ZMWA  
Absolute Maximum Ratings  
(Ta = 25°C)  
Item  
Symbol  
Pd *  
Tj  
Value  
200  
Unit  
mW  
°C  
Power dissipation  
Junction temperature  
Storage temperature  
Note: Two device total, See Fig.2.  
150  
Tstg  
55 to +150  
°C  
Electrical Characteristics*1  
(Ta = 25°C)  
Item  
Symbol Min  
Typ  
Max  
6.50  
3
Unit Test Condition  
Zener voltage  
Reverse current  
Capacitance  
VZ  
IR  
5.90  
V
IZ = 5 mA, 40 ms pulse  
VR = 5.5 V  
µA  
pF  
C
rd  
8.5  
60  
VR = 0 V, f = 1 MHz  
IZ = 5 mA  
Dynamic resistance  
ESD-Capability *2  
13  
kV  
C = 150 pF, R = 330 , Both forward and  
reverse direction 10 pulse  
Notes: 1. Per one device.  
2. Failure criterion ; IR > 3 µA at VR = 5.5 V.  
Rev.0,May. 2002, page 2 of 6  
HZM6.2ZMWA  
Main Characteristics  
10–2  
250  
200  
150  
100  
50  
1.0mm  
Cu Foil  
10–3  
10–4  
10–5  
10–6  
Printed circuit board  
×
×
25 62 1.6t mm  
Material:  
Glass Epoxy Resin+Cu Foil  
0
0
2
4
6
8
10  
0
50  
Ambient Temperature Ta (°C)  
Fig.2 Power Dissipation vs. Ambient Temperature  
100  
150  
200  
Zener Voltage VZ (V)  
Fig.1 Zener current vs. Zener voltage  
104  
PRSM  
t
Ta = 25°C  
nonrepetitive  
103  
102  
10  
1.0  
10–5  
10–4  
10–3  
10–2  
10–1  
1.0  
Time t (s)  
Fig.3 Surge Reverse Power Ratings  
Rev.0, May. 2002, page 3 of 6  
HZM6.2ZMWA  
Main Characteristics (cont)  
104  
103  
102  
10  
1.0  
102  
101  
1.0  
10  
102  
103  
Time t (s)  
Fig.4 Transient Thermal Impedance *  
Note: Measurement value by forward bias.  
Rev.0,May. 2002, page 4 of 6  
HZM6.2ZMWA  
Package Dimensions  
As of January, 2002  
Unit: mm  
+ 0.10  
0.06  
+ 0.10  
0.05  
0.16  
30.4  
0 0.1  
(0.95) (0.95)  
1.9 ± 0.2  
+ 0.3  
0.1  
2.8  
Hitachi Code  
JEDEC  
MPAK  
JEITA  
Mass (reference value)  
Conforms  
0.011 g  
Rev.0, May. 2002, page 5 of 6  
HZM6.2ZMWA  
Disclaimer  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Sales Offices  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: (03) 3270-2111 Fax: (03) 3270-5109  
URL  
http://www.hitachisemiconductor.com/  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
179 East Tasman Drive Whitebrook Park  
Hitachi Europe Ltd.  
Electronic Components Group  
Hitachi Asia Ltd.  
Hitachi Tower  
16 Collyer Quay #20-00  
Singapore 049318  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower  
San Jose,CA 95134  
Lower Cookham Road  
World Finance Centre,  
Tel: <1> (408) 433-1990 Maidenhead  
Fax: <1>(408) 433-0223 Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Tel : <65>-6538-6533/6538-8577  
Fax : <65>-6538-6933/6538-3877  
URL : http://semiconductor.hitachi.com.sg  
Harbour City, Canton Road  
Tsim Sha Tsui, Kowloon Hong Kong  
Tel : <852>-2735-9218  
Fax: <44> (1628) 585200  
Fax : <852>-2730-0281  
URL : http://semiconductor.hitachi.com.hk  
Hitachi Asia Ltd.  
(Taipei Branch Office)  
4/F, No. 167, Tun Hwa North Road  
Hung-Kuo Building  
Taipei (105), Taiwan  
Tel : <886>-(2)-2718-3666  
Fax : <886>-(2)-2718-8180  
Telex : 23222 HAS-TP  
URL : http://www.hitachi.com.tw  
Hitachi Europe GmbH  
Electronic Components Group  
Dornacher Straße 3  
D-85622 Feldkirchen  
Postfach 201, D-85619 Feldkirchen  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
Copyright © Hitachi, Ltd., 2002. All rights reserved. Printed in Japan.  
Colophon 6.0  
Rev.0,May. 2002, page 6 of 6  
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