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IXTT60N10

型号:

IXTT60N10

品牌:

IXYS[ IXYS CORPORATION ]

页数:

2 页

PDF大小:

520 K

Advance Technical Information  
HiPerFETTM  
PowerMOSFETs  
IXTH 60N10  
IXTT 60N10  
VDSS  
ID25  
= 100 V  
= 60 A  
RDS(on) = 20 mΩ  
N-ChannelEnhancementMode  
Symbol Testconditions  
Maximum ratings  
TO-247AD(IXTH)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1.0 MΩ  
100  
100  
V
V
(TAB)  
VGS  
Continuous  
Transient  
±20  
±30  
V
V
VGSM  
ID25  
ID(RMS)  
IDM  
T
= 25°C MOSFET chip capability  
80  
75  
320  
80  
A
ECxternal lead current limit  
A
A
A
TO-268 (IXTT) Case Style  
T
= 25°C, pulse width limited by TJM  
IAR  
TCC = 25°C  
EAR  
EAS  
T
= 25°C  
45  
mJ  
J
TCC = 25°C  
1.5  
G
(TAB)  
S
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
5
V/ns  
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
PD  
TJ  
TC = 25°C  
300  
W
-55 ... +150  
°C  
TJM  
Tstg  
150  
-55 ... +150  
°C  
°C  
Features  
z
International standard packages  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
Unclamped Inductive Switching (UIS)  
rated  
Low package inductance  
- easy to drive and to protect  
Fast intrinsic Rectifier  
TL  
1.6 mm (0.063 in.) from case for 10 s  
Mounting torque  
300  
1.13/10  
6
°C  
Nm/lb.in.  
g
z
z
z
Md  
Weight  
TO-264  
z
z
Symbol  
TestConditions  
Characteristic Values  
Advantages  
(TJ = 25°C, unless otherwise specified)  
Min. Typ.  
Max.  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 250 µA  
VGS = 20 VDC, VDS = 0  
100  
V
V
z
Easy to mount  
Space savings  
High power density  
z
2.0  
4.0  
z
100  
nA  
IDSS  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
25  
250  
µA  
µA  
RDS(on)  
VGS = 10 V, ID = 0.5 ID25  
20 mΩ  
Pulse test, t 300 µs, duty cycle d 2 %  
DS99069(7/03)  
© 2003 IXYS All rights reserved  
IXTH 60N10  
IXTT 60N10  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Min. Typ. Max.  
TO-247 AD Outline  
VDS = 10 V; ID = 0.5 ID25, pulse test  
30  
45  
S
Ciss  
Coss  
Crss  
3200  
510  
pF  
pF  
pF  
1
2
3
VGS = 0 V, VDS = 25 V, f = 1 MHz  
180  
td(on)  
tr  
td(off)  
tf  
20  
20  
70  
18  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
Terminals: 1 - Gate  
3 - Source  
2 - Drain  
RG = 3.3 (External)  
Tab - Drain  
Dim.  
Millimeter  
Min. Max.  
Inches  
Min. Max.  
Qg(on)  
Qgs  
110  
18  
nC  
nC  
nC  
A
A12  
4.7  
2.2  
2.2  
5.3  
2.54  
2.6  
.185 .209  
.087 .102  
.059 .098  
A
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
Qgd  
48  
b
b12  
1.0  
1.65  
2.87  
1.4  
2.13  
3.12  
.040 .055  
.065 .084  
.113 .123  
b
RthJC  
RthCK  
0.42  
K/W  
K/W  
C
D
E
.4  
.8  
.016 .031  
.819 .845  
.610 .640  
(TO-247)  
0.25  
20.80 21.46  
15.75 16.26  
e
5.20  
5.72 0.205 0.225  
L
19.81 20.32  
4.50  
.780 .800  
.177  
L1  
P 3.55  
3.65  
.140 .144  
Q
5.89  
4.32  
6.40 0.232 0.252  
R
S
5.49  
.170 .216  
242 BSC  
Source-Drain Diode  
Ratings and Characteristics  
6.15 BSC  
(TJ = 25°C unless otherwise specified)  
Symbol  
IS  
Test Conditions  
Min.  
Typ.  
Max.  
TO-268 Outline  
VGS = 0V  
60  
A
A
V
ISM  
Repetitive; pulse width limited by TJM  
240  
1.5  
VSD  
IF = I , VGS = 0 V,  
PulsSe test, t 300 µs, duty cycle d 2 %  
trr  
IF = 30A, -di/dt = 100 A/µs, VR = 100V  
150  
3
ns  
Qrr  
µC  
Terminals: 1 - Gate  
3 - Source  
2 - Drain  
Tab - Drain  
Min Recommended Footprint  
IXYSreservestherighttochangelimits,testconditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered byoneormore  
ofthefollowingU.S.patents:  
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1  
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343  
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