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UZXCT1010E5TA

型号:

UZXCT1010E5TA

品牌:

ZETEX[ ZETEX SEMICONDUCTORS ]

页数:

9 页

PDF大小:

178 K

ZXCT1010  
ENHANCED HIGH-SIDE CURRENT MONITOR  
DESCRIPTION  
APPLICATIONS  
The ZXCT1010 is a high side current sense monitor.  
Using this device eliminates the need to disrupt the  
ground plane when sensing a load current.  
Battery chargers  
Smart battery packs  
DC motor control  
It is an enhanced version of the ZXCT1009 offering  
reduced typical output offset and improved accuracy  
at low sense voltage.  
Over current monitor  
Power management  
Programmable current source  
The wide input voltage range of 20V down to as low as  
2.5V make it suitable for a range of applications. A  
minimum operating current of just 4µA, combined  
with its SOT23-5 package make suitable for portable  
battery equipment.  
APPLICATION CIRCUIT  
FEATURES  
Low cost, accurate high-side current sensing  
Output voltage scaling  
Up to 2.5V sense voltage  
2.5V – 20V supply range  
300nA typical offset current  
3.5µA quiescent current  
1% typical accuracy  
SOT23 -5 package  
ORDERING INFORMATION  
DEVICE  
REEL  
SIZE  
TAPE  
WIDTH  
QUANTITY PER  
REEL  
ZXCT1010E5TA  
7”  
8mm  
3,000 units  
PARTMARK  
PACKAGE  
101  
SOT23-5  
ISSUE 10 - JULY 2007  
1
SEMICONDUCTORS  
ZXCT1010  
ABSOLUTE MAXIMUM RATINGS  
Voltage on any pin  
-0.6V to 20V (relative to GND)  
Continuous output current, IOUT  
Continuous sense voltage, VSENSE  
,
25mA  
2
,
-0.5V to +5V  
-40 to 85°C  
-55 to 150°C  
(TA = 25°C)  
300mW  
Operating temperature, TA  
,
Storage temperature  
Package power dissipation  
SOT23-5  
Operation above the absolute maximum rating may cause device failure.  
Operation at the absolute maximum ratings, for extended periods, may reduce device reliability.  
ELECTRICAL CHARACTERISTICS  
Test Conditions TA = 25°C, Vin = 5V, Rout = 100Ω.  
SYMBOL  
PARAMETER  
Range  
CC  
CONDITIONS  
LIMITS  
Typ  
UNIT  
Min  
2.5  
Max  
20  
V
V
V
in  
1
I
I
Output current  
V
V
V
V
V
V
= 0V  
0
0.3  
10  
µA  
µA  
mA  
mA  
mA  
µA  
out  
sense  
sense  
sense  
sense  
sense  
sense  
= 10mV  
= 100mV  
= 200mV  
= 1V  
85  
100  
1.00  
2.00  
10.0  
3.5  
115  
1.025  
2.05  
10.3  
8
0.975  
1.95  
9.7  
Ground pin  
current  
= 0V  
q
2
-
V
Sense Voltage  
0
2500  
100  
mV  
nA  
sense  
I
V
-
sense  
sense  
input current  
Accuracy  
Acc  
Gm  
R
V
= 0.1Ω  
sense  
sense  
-2.5  
2.5  
%
= 200mV  
Transconducta  
nce,  
10000  
µA/V  
I
/ V  
sense  
out  
BW  
Bandwidth  
V
V
= 10mV, Pin = -40dBm ‡  
= 100mV, Pin = -20dBm ‡  
300  
2
kHz  
SENSE(DC)  
SENSE(DC)  
MHz  
1 Includes input offset voltage contribution  
2 VSENSE is defined as the differential voltage between VSENSE+ and VSENSE-  
.
VSENSE = VSENSE+ - VSENSE-  
= VIN - VLOAD  
= ILOAD x RSENSE  
3 -20dBm=63mVp-p into 50Ω  
ISSUE 10 - JULY 2007  
SEMICONDUCTORS  
ZXCT1010  
TYPICAL CHARACTERISTICS  
ISSUE 10 - JULY 2007  
3
SEMICONDUCTORS  
ZXCT1010  
PIN DESCRIPTION  
Pin Name  
Pin Function  
V
V
+
-
Supply voltage  
sense  
sense  
Connection to load/battery  
I
Output current, proportional to V -V  
in load  
out  
GND  
Ground  
CONNECTION DIAGRAM  
SOT23-5  
Package Suffix – E5  
Top View  
SCHEMATIC DIAGRAM  
ISSUE 10 - JULY 2007  
4
SEMICONDUCTORS  
ZXCT1010  
POWER DISSIPATION  
APPLICATIONS INFORMATION  
The maximum allowable power dissipation of the  
device for normal operation (Pmax), is a function of  
the package junction to ambient thermal resistance  
(θja), maximum junction temperature (Tjmax), and  
ambient temperature (Tamb), according to the  
expression:  
The following lines describe how to scale a load  
current to an output voltage.  
Vsense = Vin - Vload  
1
Vout = 0.01 x Vsense x Rout  
Pmax = (Tjmax – Tamb) / θja  
E.g.  
The device power dissipation, PD is given by the  
expression:  
A 1A current is to be represented by a 100mV output  
voltage:  
PD=Iout.(Vin-Vout) Watts  
1)Choose the value of Rsense to give 50mV > Vsense  
500mV at full load.  
>
For example Vsense = 100mV at 1.0A. Rsense = 0.1/1.0  
=> 0.1 ohms.  
2)Choose Rout to give Vout = 100mV, when Vsense  
100mV.  
=
Rearranging 1 for Rout gives:  
R
out = Vout /(Vsense x 0.01)  
Rout = 0.1 / (0.1 x 0.01) = 100 Ω  
TYPICAL CIRCUIT APPLICATION  
Where Rload represents any load including DC motors,  
a charging battery or further circuitry that requires  
monitoring, Rsense can be selected on specific  
requirements of accuracy, size and power rating.  
ISSUE 10 - JULY 2007  
5
SEMICONDUCTORS  
ZXCT1010  
APPLICATIONS INFORMATION (Continued)  
Bi-Directional Current Sensing  
The ZXCT1010 can be used to measure current  
bi-directionally, if two devices are connected as  
shown below.  
FZT789A140µH  
Charger Input  
To Battery +  
0.2Ω  
ZHCS1000  
BC81725  
1kΩ  
V
Load  
in  
100Ω  
BAS16  
10µH  
-
+
5V  
bq2954  
MOD pin  
ZXCT1010  
FMMT451  
I
out  
220Ω  
SNS pin  
100Ω  
support components omitted for clarity  
Li-Ion Charger Circuit  
The above figure shows the ZXCT1010 supporting  
the Benchmarq bq2954 Charge Management IC.  
Most of the support components for the bq2954 are  
omitted for clarity. This design also uses the Zetex  
FZT789A high current Super-PNP as the switching  
transistor in the DC-DC step down converter and the  
FMMT451 as the drive NPN for the FZT789A. The  
circuit can be configured to charge up to four Li-Ion  
cells at a charge current of 1.25A. Charge can be  
terminated on maximum voltage, selectable  
minimum current, or maximum time out. Switching  
frequency of the PWM loop is approximately 120kHz.  
If the voltage V1 is positive with respect to the  
voltage V2 the lower device will be active, delivering  
a proportional output current to Rout. Due to the  
polarity of the voltage across Rsense, the upper  
device will be inactive and will not contribute to the  
current delivered to Rout. When V2 is more positive  
than V1, current will be flowing in the opposite  
direction, causing the upper device to be active  
instead.  
Non-linearity will be apparent at small values of  
Vsense due to offset current contribution. Devices  
can use separate output resistors if the current  
direction is to be monitored independently.  
Bi-directional Transfer Function  
5
4
3
2
1
0
-400  
-200  
0
200  
400  
Sense Voltage (mV)  
Output Current v Sense Voltage  
ISSUE 10 - JULY 2007  
6
SEMICONDUCTORS  
ZXCT1010  
APPLICATIONS INFORMATION (Continued)  
PCB trace shunt resistor for low cost  
solution  
The figure below shows output characteristics of the  
devicewhen usinga PCB resistivetracefor a low cost  
solution in replacement for a conventional shunt  
resistor. The graph shows the linear rise in voltage  
across the resistor due to the PTC of the material and  
demonstrates how this rise in resistance value over  
temperature compensatesfortheNTCofthedevice.  
The figure opposite shows a PCB layout suggestion.  
The resistor section is 25mm x 0.25mm giving  
approximately 150mΩ using 1oz copper. The data  
for the normalised graph was obtained using a 1A  
load current and a 100Ω output resistor. An  
electronic version of the PCB layout is available at  
www.zetex.com/isense  
Actual Size  
Layout shows area of shunt  
resistor compared to SOT23-5  
package. Not actual size  
ISSUE 10 - JULY 2007  
7
SEMICONDUCTORS  
ZXCT1010  
Definitions  
Product change  
Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service.  
Customers are solely responsible for obtaining the latest relevant information before placing orders.  
Applications disclaimer  
The circuits in thisdesign/application note are offered as design ideas. It is the responsibility ofthe user toensure thatthe circuit is fitforthe user's  
application and meets with the user's requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with  
respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or  
otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence),  
breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use  
of these circuit applications, under any circumstances.  
Life support  
Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written  
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body  
or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions  
for use provided in the labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Reproduction  
The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in  
writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating  
to the products or services concerned.  
Terms and Conditions  
All products are sold subjects to Zetex' terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the  
terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.  
For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.  
Quality of product  
Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.  
To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally  
authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork  
Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales  
channels.  
ESD (Electrostatic discharge)  
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The  
possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage  
can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of  
being affected should be replaced.  
Green compliance  
Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory  
requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of  
hazardous substances and/or emissions.  
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and  
ELV directives.  
Product status key:  
"Preview"Future device intended for production at some point. Samples may be available  
"Active"Product status recommended for new designs  
"Last time buy (LTB)"Device will be discontinued and last time buy period and delivery is in effect  
"Not recommended for new designs"Device is still in production to support existing designs and production  
"Obsolete"Production has been discontinued  
Datasheet status key:  
"Draft version"This term denotes a very early datasheet version and contains highly provisional  
information, which may change in any manner without notice.  
"Provisional version"This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to  
ISSUE 10 - JULY 2007  
8
SEMICONDUCTORS  
ZXCT1010  
PAD LAYOUT DETAILS  
PACKAGE DIMENSIONS  
Controlling dimensions are in millimeters. Approximate conversions are given in inches  
PACKAGE DIMENSIONS  
DIM  
Millimeters  
Inches  
DIM  
Millimeters  
Inches  
MIN  
MAX  
1.45  
0.15  
1.3  
MIN  
MAX  
0.057  
0.006  
0.051  
0.020  
0.008  
0.118  
MIN  
MAX  
3.00  
1.75  
MIN  
0.102  
0.059  
MAX  
0.118  
0.069  
A
0.90  
0.00  
0.90  
0.35  
0.09  
2.80  
0.035  
0.00  
E
2.60  
1.50  
A1  
A2  
b
E1  
e
0.035  
0.014  
0.0035  
0.110  
0.95 REF  
1.90 REF  
0.037 REF  
0.075 REF  
0.50  
0.20  
3.00  
e1  
L
C
0.10  
0.60  
10  
0.004  
0.024  
10  
D
a°  
0
0
© Zetex Semiconductors plc 2007  
Europe  
Americas  
Asia Pacific  
Corporate Headquarters  
Zetex GmbH  
Kustermann-Park  
Balanstraße 59  
D-81541 München  
Germany  
Zetex Inc  
Zetex (Asia) Ltd  
Zetex Semiconductors plc  
Zetex Technology Park  
Chadderton, Oldham, OL9 9LL  
United Kingdom  
700 Veterans Memorial Hwy  
Hauppauge, NY 11788  
USA  
3701-04 Metroplaza Tower 1  
Hing Fong Road, Kwai Fong  
Hong Kong  
Telefon: (49) 89 45 49 49 0  
Fax: (49) 89 45 49 49 49  
europe.sales@zetex.com  
Telephone: (1) 631 360 2222  
Fax: (1) 631 360 8222  
usa.sales@zetex.com  
Telephone: (852) 26100 611  
Fax: (852) 24250 494  
asia.sales@zetex.com  
Telephone (44) 161 622 4444  
Fax: (44) 161 622 4446  
hq@zetex.com  
ISSUE 10 - JULY 2007  
SEMICONDUCTORS  
9
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