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HYMP512S64CLP8-S5

型号:

HYMP512S64CLP8-S5

品牌:

HYNIX[ HYNIX SEMICONDUCTOR ]

页数:

24 页

PDF大小:

307 K

200pin Unbuffered DDR2 SDRAM SO-DIMMs based on 512 Mb C ver.  
This Hynix unbuffered Small Outline Dual In-Line Memory Module(DIMM) series consists of 512Mb C ver. DDR2  
SDRAMs in Fine Ball Grid Array(FBGA) packages on a 200pin glass-epoxy substrate. This Hynix 512Mb C ver. based  
Unbuffered DDR2 SO-DIMM series provide a high performance 8 byte interface in 67.60mm width form factor of indus-  
try standard. It is suitable for easy interchange and addition.  
FEATURES  
JEDEC standard Double Data Rate2 Synchronous  
DRAMs (DDR2 SDRAMs) with 1.8V +/- 0.1V Power  
Supply  
Programmable Burst Length 4 / 8 with both sequen-  
tial and interleave mode  
Auto refresh and self refresh supported  
8192 refresh cycles / 64ms  
All inputs and outputs are compatible with SSTL_1.8  
interface  
Serial presence detect with EEPROM  
Posted CAS  
DDR2 SDRAM Package: 60ball(x8), 84ball(x16)  
FBGA  
Programmable CAS Latency 3, 4, 5, 6  
OCD (Off-Chip Driver Impedance Adjustment) and  
ODT (On-Die Termination)  
67.60 x 30.00 mm form factor  
Lead-free Products are RoHS compliant  
Fully differential clock operations (CK & CK)  
ORDERING INFORMATION  
# of  
DRAMs  
# of  
ranks  
Power  
Consumption  
Part Name  
Density  
Organization  
Materials  
HYMP532S64CP6-E3/C4/Y5/S5/S6  
HYMP564S64CP6-E3/C4/Y5/S5/S6  
HYMP512S64CP8-E3/C4/Y5/S5/S6  
HYMP532S64CLP6-E3/C4/Y5/S5/S6  
HYMP564S64CLP6-E3/C4/Y5/S5/S6  
HYMP512S64CLP8-E3/C4/Y5/S5/S6  
256MB  
512MB  
1GB  
32Mx64  
64Mx64  
128Mx64  
32Mx64  
64Mx64  
128Mx64  
4
8
1
2
2
1
2
2
Lead free*  
Lead free  
Lead free  
Lead free  
Lead free  
Lead free  
Normal  
Normal  
Normal  
Low  
16  
4
256MB  
512MB  
1GB  
8
Low  
16  
Low  
Notes:  
1. All Hynix’ DDR2 Lead-free parts are compliant to RoHS.  
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  
Rev. 0.4 / Jul. 2007  
1
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
SPEED GRADE & KEY PARAMETERS  
E3  
C4  
Y5  
S6  
S5  
Unit  
(DDR2-400) (DDR2-533)  
(DDR2-667)  
(DDR2-800)  
(DDR2-800)  
Speed @CL3  
Speed @CL4  
Speed @CL5  
Speed @CL6  
CL-tRCD-tRP  
400  
533  
-
533  
533  
-
400  
533  
667  
-
-
-
Mbps  
Mbps  
Mbps  
Mbps  
tCK  
533  
667  
800  
5-5-5  
533  
800  
-
-
-
3-3-3  
4-4-4  
5-5-5  
5-5-5  
ADDRESS TABLE  
# of  
DRAMs  
Refresh  
Method  
Density Organization Ranks  
SDRAMs  
# of row/bank/column Address  
256MB  
512MB  
1GB  
32M x 64  
64M x 64  
128M x 64  
1
2
2
32Mb x 16  
32Mb x 16  
64Mb x 8  
4
8
13(A0~A12)/2(BA0~BA1)/10(A0~A9)  
13(A0~A12)/2(BA0~BA1)/10(A0~A9)  
14(A0~A13)/2(BA0~BA1)/10(A0~A9)  
8K / 64ms  
8K / 64ms  
8K / 64ms  
16  
Rev. 0.4 / Jul. 2007  
2
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PIN DESCRIPTION  
Symbol  
Type Polarity  
Pin Description  
The system clock inputs. All address and commands lines are sampled on the cross point  
of the rising edge of CK and falling edge of CK. A Delay Locked Loop(DLL) circuit is driven  
from the clock inputs and output timing for read operations is synchronized to the input  
clock.  
Cross  
Point  
CK[1:0], CK[1:0]  
Input  
Input  
Input  
Activates the DDR2 SDRAM CK signal when high and deactivates the CK signal when low.  
By deactivating the clocks, CKE low initiates the Power Down mode or the Self Refresh  
mode.  
Active  
High  
CKE[1:0]  
S[1:0]  
Enables the associated DDR2 SDRAM command decoder when low and disables the com-  
mand decoder when high. When the command decoder is disabled, new commands are  
ignored but previous operations continue. Rank 0 is selected by S0; Rank 1 is selected by  
S1  
Active  
Low  
Active  
Low  
When sampled at the cross point of the rising edge of CK and falling edge of CK, CAS, RAS  
and WE define the operation to be executed by the SDRAM.  
RAS, CAS, WE  
BA[1:0]  
Input  
Input  
Input  
Selects which DDR2 SDRAM internal bank of four is activated.  
Active  
High  
Asserts on-die termination for DQ, DM, DQS and DQS signals if enabled via the DDR2  
SDRAM mode register.  
ODT[1:0]  
During a Bank Activate command cycle, defines the row address when sampled at the  
cross point of the rising edge of CK and falling edge of CK. During a Read or Write com-  
mand cycle, defines the column address when sampled at the cross point of the rising  
edge of CK and falling edge of CK. In addition to the column address, AP is used to invoke  
autoprecharge operation at the end of the burst read or write cycle. If AP is high., autopre-  
charge is selected and BA0-BAn defines the bank to be precharged. If AP is low, autopre-  
charge is disabled. During a Precharge command cycle., AP is used in conjunction with  
BA0-BAn to control which bank(s) to precharge. If AP is high, all banks will be precharged  
regardless of the state of BA0-BAn inputs. If AP is low, then BA0-BAn are used to define  
which bank to precharge.  
A[9:0], A10/AP,  
A[15:11]  
Input  
DQ[63:0]  
DM[7:0]  
In/Out  
Input  
Data Input/Output pins.  
The data write masks, associated with one data byte. In Write mode, DM operates as a  
byte mask by allowing input data to be written if it is low but blocks the write operation if  
it is high. In Read mode, DM lines have no effect.  
Active  
High  
The data strobe, associated with one data byte, sourced whit data transfers. In Write  
mode, the data strobe is sourced by the controller and is centered in the data window. In  
Read mode, the data strobe is sourced by the DDR2 SDRAMs and is sent at leading edge  
of the data window. DQS signals are complements, and timing is relative to the crosspoint  
of respective DQS and DQS. If the module is to be operated in single ended strobe mode,  
all DQS signals must be tied on the system board to VSS and DDR2 SDRAM mode registers  
programmed appropriately.  
Cross  
point  
DQS[7:0], DQS[7:0] In/Out  
V
DD, VDDSPD,VSS  
Supply  
In/Out  
Power supplies for core, I/O, Serial Presense Detect, and ground for the module.  
This is a bidirectional pin used to transfer data into or out of the SPD EEPROM. A resister  
must be connected to VDD to act as a pull up.  
SDA  
This signals is used to clock data into and out of the SPD EEPROM. A resistor may be con-  
nected from SCL to VDD to act as a pull up.  
SCL  
Input  
Input  
In/Out  
SA[1:0]  
TEST  
Address pins used to select the Serial Presence Detect base address.  
The TEST pin is reserved for bus analysis tools and is not connected on normal memory  
modules(SODIMMs).  
Rev. 0.4 / Jul. 2007  
3
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PIN ASSIGNMENT  
Pin Front Pin Back Pin Front  
Pin  
NO.  
Back  
Side  
Pin  
NO.  
Front  
Side  
Pin  
NO.  
Back  
Side  
Pin  
NO.  
Front  
Side  
Pin  
NO.  
Back  
Side  
NO. Side  
NO. Side NO.  
Side  
DQS2  
VSS  
1
VREF  
VSS  
2
VSS  
DQ4  
DQ5  
VSS  
51  
53  
55  
57  
59  
61  
63  
65  
67  
69  
71  
73  
75  
77  
79  
81  
83  
85  
87  
89  
91  
93  
95  
97  
99  
52  
54  
56  
58  
60  
62  
64  
66  
68  
70  
72  
74  
76  
78  
DM2  
VSS  
101  
103  
A1  
102  
104  
106  
108  
110  
112  
114  
116  
118  
A0  
VDD  
BA1  
151  
153  
155  
157  
159  
161  
DQ42  
DQ43  
VSS  
152 DQ46  
154 DQ47  
3
4
VDD  
5
DQ0  
DQ1  
VSS  
6
DQ18  
DQ19  
VSS  
DQ22  
DQ23  
VSS  
105 A10/AP  
156  
VSS  
7
8
107  
109  
111  
113  
115  
117  
BA0  
WE  
RAS  
DQ48  
DQ49  
VSS  
158 DQ52  
160 DQ53  
9
10  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
40  
42  
44  
46  
48  
50  
DM0  
VSS  
S0  
11  
13  
15  
17  
19  
21  
23  
25  
27  
29  
31  
33  
35  
37  
39  
41  
43  
45  
47  
49  
DQS0  
DQS0  
VSS  
DQ24  
DQ25  
VSS  
DQ28  
DQ29  
VSS  
VDD  
CAS  
VDD  
ODT0  
A13  
162  
VSS  
CK1  
CK1  
VSS  
DM6  
VSS  
DQ6  
DQ7  
VSS  
163 NC,TEST 164  
NC/S1  
VDD  
165  
167  
169  
171  
173  
175  
177  
179  
181  
183  
185  
187  
189  
191  
193  
195  
197  
VSS  
DQS6  
DQS6  
VSS  
166  
168  
170  
172  
DQ2  
DQ3  
VSS  
DM3  
NC  
DQS3  
DQS3  
VSS  
VDD  
NC  
DQ12  
DQ13  
VSS  
119 NC/ODT1 120  
VSS  
121  
123  
125  
127  
VSS  
DQ32  
DQ33  
VSS  
122  
124  
126  
128  
130  
132  
134  
136  
138  
140  
142  
144  
146  
148  
150  
VSS  
DQ8  
DQ9  
VSS  
DQ26  
DQ27  
VSS  
DQ30  
DQ31  
VSS  
DQ36  
DQ37  
VSS  
DQ50  
DQ51  
VSS  
174 DQ54  
176 DQ55  
DM1  
VSS  
178  
VSS  
DQS1  
DQS1  
VSS  
CK0  
CKE0  
VDD  
NC  
80 NC/CKE1 129  
DQS4  
DQS4  
VSS  
DM4  
VSS  
DQ56  
DQ57  
VSS  
180 DQ60  
182 DQ61  
CK0  
82  
84  
86  
88  
90  
92  
94  
96  
98  
100  
VDD  
131  
VSS  
NC/A15 133  
NC/A14 135  
DQ38  
DQ39  
VSS  
184  
VSS  
DQ10  
DQ11  
VSS  
DQ14  
DQ15  
VSS  
BA2  
VDD  
A12  
DQ34  
DQ35  
VSS  
DM7  
VSS  
186 DQS7  
188 DQS7  
VDD  
A11  
A7  
137  
139  
141  
143  
145  
147  
149  
DQ44  
DQ45  
VSS  
DQ58  
DQ59  
VSS  
190  
VSS  
VSS  
VSS  
A9  
DQ40  
DQ41  
VSS  
192 DQ62  
194 DQ63  
DQ16  
DQ17  
VSS  
DQ20  
DQ21  
VSS  
A8  
A6  
VDD  
A5  
VDD  
A4  
DQS5  
DQS5  
VSS  
SDA  
196  
198  
VSS  
SA0  
SA1  
DM5  
VSS  
SCL  
DQS2  
NC  
A3  
A2  
199 VDDSPD 200  
Pin Location  
200  
42  
2
40  
Back  
Front  
1
199  
39  
41  
Rev. 0.4 / Jul. 2007  
4
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
FUNCTIONAL BLOCK DIAGRAM  
256MB(32Mbx64) : HYMP532S64C(L)P6  
N .C .  
N .C .  
N .C .  
/S 1  
O D T 1  
3 Ω + / 5 %  
C K E 1  
C K E 0  
O D T 0  
/S 0  
D Q S 0  
/D Q S 0  
D M 0  
D Q S 4  
/D Q S 4  
D M 4  
L D Q S  
/U D Q S  
L D M  
L D Q S  
/L D Q S  
L D M  
/C S  
O D T C K E  
/C S  
O D T C K E  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
1
2
3
4
5
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
1
2
3
4
5
D Q 0  
D Q 3 2  
D Q 3 3  
D Q 3 4  
D Q 3 5  
D Q 3 6  
D Q 1  
D Q 2  
D Q 3  
D Q 4  
D Q 5  
D Q 6  
D Q 7  
D Q 3 7  
D Q 3 8  
D Q 3 9  
I/O  
I/O  
6
7
I/O  
I/O  
6
7
D 2  
D 0  
U D Q S  
/U D Q S  
U D M  
U D Q S  
/U D Q S  
U D M  
D Q S 1  
/D Q S 1  
D M 1  
D Q S 5  
/D Q S 5  
D M 5  
I/O  
I/O  
8
9
D Q 8  
D Q 8  
D Q 4 0  
D Q 4 1  
D Q 4 2  
D Q 4 3  
I/O  
I/O  
8
9
I/O 1 0  
I/O 1 1  
I/O 1 2  
I/O 1 3  
D Q 1 0  
D Q 1 1  
I/O 1 0  
I/O 1 1  
I/O 1 2  
I/O 1 3  
D Q 1 2  
D Q 1 3  
D Q 1 4  
D Q 1 5  
D Q 4 4  
D Q 4 5  
D Q 4 6  
D Q 4 7  
I/O 1 4  
I/O 1 5  
I/O 1 4  
I/O 1 5  
D Q S 2  
/D Q S 2  
D M 2  
L D Q S  
/L D Q S  
L D M  
D Q S 6  
/D Q S 6  
D M 6  
L D Q S  
/L D Q S  
L D M  
/C S  
O D T C K E  
/C S  
O D T C K E  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
1
2
3
4
5
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
1
2
3
4
5
D Q 1 6  
D Q 1 7  
D Q 1 8  
D Q 1 9  
D Q 2 0  
D Q 2 1  
D Q 2 2  
D Q 2 3  
D Q 4 8  
D Q 4 9  
D Q 5 0  
D Q 5 1  
D Q 5 2  
D Q 5 3  
D Q 5 4  
D Q 5 5  
I/O  
I/O  
6
7
I/O  
I/O  
6
7
D 1  
D 3  
D Q S 3  
/D Q S 3  
D M 3  
U D Q S  
/U D Q S  
U D M  
D Q S 7  
/D Q S 7  
D M 7  
U D Q S  
/U D Q S  
U D M  
I/O  
I/O  
8
9
I/O  
I/O  
8
9
D Q 2 4  
D Q 2 5  
D Q 2 6  
D Q 2 7  
D Q 2 8  
D Q 2 9  
D Q 3 0  
D Q 3 1  
D Q 5 6  
D Q 5 7  
D Q 5 8  
D Q 5 9  
D Q 6 0  
D Q 6 1  
D Q 6 2  
D Q 6 3  
I/O 1 0  
I/O 1 1  
I/O 1 2  
I/O 1 3  
I/O 1 0  
I/O 1 1  
I/O 1 2  
I/O 1 3  
I/O 1 4  
I/O 1 5  
I/O 1 4  
I/O 1 5  
S C L  
S C L  
A 0  
A 1  
3 Ω + /- 5 %  
S D A  
S D A  
S A 0  
S A 1  
S e ria l P D  
W P  
B A 0 -B A 1  
A 0 -A N  
/R A S  
/C A S  
/W E  
S D R A M S D 0 -3  
S D R A M S D 0 -3  
S D R A M S D 0 -3  
S D R A M S D 0 -3  
S D R A M S D 0 -3  
A 2  
V D D S P D  
V R E F  
S e ria l P D  
S D R A M S D O -D 3  
C K 0  
2
2
lo a d s  
lo a d s  
/C K 0  
V D D  
S D R A M S D O -D 3 , V D D a n d V D D Q  
S D R A M S D O -D 3 , S P D  
C K 1  
VS S  
/C K 1  
N o te s  
:
1 . R e sisto r va lu e s a re 2 2 O h m + /- 5 %  
Rev. 0.4 / Jul. 2007  
5
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
FUNCTIONAL BLOCK DIAGRAM  
512MB(64Mbx64): HYMP564S64C(L)P6  
3 Ω+/− 5%  
ODT1  
ODT0  
CKE1  
CKE0  
/S1  
/S0  
DQS0  
/ DQS0  
DM0  
LDQS  
/ UDQS  
LDM  
LDQS  
/ UDQS  
LDM  
DQS4  
/ DQS4  
DM 4  
LDQS  
/ UDQS  
LDM  
LDQS  
/ UDQS  
LDM  
/CS  
/CS  
/CS  
/CS  
I/ O 0  
I/ O 1  
I/ O 2  
I/ O 3  
I/ O 0  
I/ O 1  
I/ O 2  
I/ O 3  
I/ O 0  
I/ O 1  
I/ O 2  
I/ O 3  
I/ O 4  
I/ O 5  
I/ O 0  
I/ O 1  
I/ O 2  
I/ O 3  
I/ O 4  
I/ O 5  
DQ 0  
DQ 1  
DQ 2  
DQ 3  
DQ 32  
DQ 33  
DQ 34  
DQ 35  
DQ 36  
I/ O 4  
I/ O 5  
I/ O 4  
I/ O 5  
DQ 4  
DQ 5  
DQ 6  
DQ7  
DQ 37  
DQ 38  
DQ 39  
I/ O 6  
I/ O 7  
I/ O 6  
I/ O 7  
I/ O 6  
I/ O 7  
I/ O 6  
I/ O 7  
D4  
D6  
D0  
D2  
UDQS  
/ UDQS  
UDM  
UDQS  
/ UDQS  
UDM  
UDQS  
/ UDQS  
UDM  
UDQS  
/ UDQS  
UDM  
DQS1  
/ DQS1  
DM1  
DQS5  
/ DQS5  
DM 5  
DQ 8  
DQ 8  
I/ O 8  
I/ O 9  
DQ 40  
DQ 41  
DQ 42  
DQ 43  
I/ O 8  
I/ O 9  
I/ O 8  
I/ O 9  
I/ O 8  
I/ O 9  
DQ 10  
DQ 11  
I/ O 10  
I/ O 11  
I/ O 12  
I/ O 13  
I/ O 10  
I/ O 11  
I/ O 12  
I/ O 13  
I/ O 10  
I/ O 11  
I/ O 12  
I/ O 13  
I/ O 10  
I/ O 11  
I/ O 12  
I/ O 13  
DQ 12  
DQ 13  
DQ 14  
DQ 15  
DQ 44  
DQ 45  
DQ 46  
DQ 47  
I/ O 14  
I/ O 15  
I/ O 14  
I/ O 15  
I/ O 14  
I/ O 15  
I/ O 14  
I/ O 15  
DQS2  
/ DQS2  
DM 2  
LDQS  
/ LDQS  
LDM  
DQS6  
/ DQS6  
DM6  
LDQS  
/ LDQS  
LDM  
/CS  
/CS  
LDQS  
/ UDQS  
LDM  
LDQS  
/ UDQS  
LDM  
/CS  
/CS  
I/ O 0  
I/ O 0  
DQ 16  
DQ 17  
DQ 18  
DQ 19  
DQ 48  
DQ 49  
DQ 50  
DQ 51  
I/ O 0  
I/ O 1  
I/ O 2  
I/ O 3  
I/ O 0  
I/ O 1  
I/ O 2  
I/ O 3  
I/ O 1  
I/ O 1  
I/ O 2  
I/ O 3  
I/ O 4  
I/ O 5  
I/ O 2  
I/ O 3  
I/ O 4  
I/ O 5  
DQ 20  
DQ 21  
DQ 22  
DQ 23  
DQ 52  
DQ 53  
DQ 54  
DQ 55  
I/ O 4  
I/ O 5  
I/ O 4  
I/ O 5  
I/ O 6  
I/ O 7  
I/ O 6  
I/ O 7  
I/ O 6  
I/ O 7  
I/ O 6  
I/ O 7  
D1  
D3  
D5  
D7  
DQS3  
/ DQS3  
DM 3  
DQS7  
/ DQS7  
DM7  
UDQS  
UDQS  
/ UDQS  
UDM  
UDQS  
UDQS  
/ UDQS  
UDM  
/ UDQS  
/ UDQS  
UDM  
I/ O 8  
UDM  
I/ O 8  
DQ 24  
DQ 25  
DQ 26  
DQ 27  
DQ 56  
DQ 57  
DQ 58  
DQ 59  
I/ O 8  
I/ O 8  
I/ O 9  
I/ O 10  
I/ O 11  
I/ O 12  
I/ O 13  
I/ O 9  
I/ O 10  
I/ O 11  
I/ O 12  
I/ O 13  
I/ O 9  
I/ O 9  
I/ O 10  
I/ O 11  
I/ O 10  
I/ O 11  
DQ 28  
DQ 29  
DQ 30  
DQ 31  
I/ O 12  
I/ O 13  
DQ 60  
DQ 61  
DQ 62  
DQ 63  
I/ O 12  
I/ O 13  
I/ O 14  
I/ O 15  
I/ O 14  
I/ O 15  
I/ O 14  
I/ O 15  
I/ O 14  
I/ O 15  
3Ω +/- 5%  
SCL  
SCL  
SDA  
BA0 - BA1  
A0-AN  
/ RAS  
SDRAMS D0-7  
SDRAMS D0-7  
SDRAMS D0-7  
SDRAMS D0-7  
SDRAMS D0-7  
SDA  
SA0  
SA1  
A0  
A1  
A2  
Serial PD  
WP  
/ CAS  
Notes :  
1. Resistor values are 22 Ohm +/- 5%  
/ WE  
VDD SPD  
VREF  
Serial PD  
SDRAMS DO-D3  
SDRAMS DO-D3 , VDD and VDD  
-D3 , SPD  
CK0  
4
4
loads  
loads  
/ CK0  
VDD  
Q
CK1  
/ CK1  
SDRAMS DO  
VSS  
Rev. 0.4 / Jul. 2007  
6
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
FUNCTIONAL BLOCK DIAGRAM  
1GB(128Mbx64) : HYMP512S64C(L)P8  
3 Ω +/- 5%  
CKE1  
ODT1  
/S1  
CKE0  
ODT1  
/
S0  
DQS4  
DQS4  
DM4  
DQS  
DQS  
DQS  
DQS  
DQS  
DQS  
DQS  
/DQS0  
DQS0  
DM0  
/CS0  
ODT0 CKE0  
CS1 ODT1 CKE1  
CS0 ODT0 CKE0  
CS1 ODT1 CKE1  
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/DQS  
/
/
/
DM  
I/ O0  
DM  
I/ O0  
DM  
I/ O0  
DM  
I/ O0  
DQ0  
DQ32  
DQ33  
DQ34  
DQ35  
DQ36  
DQ37  
DQ38  
DQ39  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
D1  
D9  
D2  
D10  
I/ O5  
I/ O6  
I/ O7  
I/ O5  
I/ O6  
I/ O7  
I/ O5  
I/ O6  
I/ O7  
I/ O5  
I/ O6  
I/ O7  
DQS1  
DQS5  
DQS5  
DM5  
DQS  
DQS  
DQS  
DQS  
/
CS0 ODT0 CKE0  
CS1 ODT1 CKE1  
CS0 ODT0 CKE0  
CS1 ODT1 CKE1  
/
/
/
DQS1  
DM1  
/DQS  
DM  
I/ O0  
DQS  
DQS  
DQS  
/
DM  
I/ O0  
/
/
DM  
I/ O0  
DM  
I/ O0  
DQ8  
DQ9  
DQ40  
DQ41  
DQ42  
DQ43  
DQ44  
DQ45  
DQ46  
DQ47  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
D3  
D11  
D4  
D12  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
DQS2  
DQS2  
DM2  
DQS6  
DQS6  
DM6  
DQS  
DQS  
DQS  
DQS  
CS0 ODT0 CKE0  
CS1 ODT1 CKE1  
CS0 ODT0 CKE0  
CS1 ODT1 CKE1  
/
DQS  
DQS  
DQS  
DQS  
/
DM  
I/ O0  
/
/
/
DM  
I/ O0  
DM  
I/ O0  
DM  
I/ O0  
DQ16  
DQ17  
DQ18  
DQ19  
DQ20  
DQ21  
DQ22  
DQ23  
DQ48  
DQ49  
DQ50  
DQ51  
DQ52  
DQ53  
DQ54  
DQ55  
1
1
1
1
I/ O  
I/ O  
I/ O  
I/ O  
D5  
D13  
D6  
D14  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
DQS3  
DQS3  
DM3  
DQS7  
DQS7  
DM7  
DQS  
DQS  
DQS  
DQS  
DQS  
DQS  
DQS  
CS0 ODT0 CKE0  
CS1 ODT1 CKE1  
CS0 ODT0 CKE0  
CS1 ODT1 CKE1  
/
/
DQS  
/
/
/
/
DM  
DM  
DM  
DM  
DQ24  
DQ25  
DQ26  
DQ27  
DQ28  
DQ29  
DQ30  
DQ31  
I/ O0  
I/ O0  
DQ56  
DQ57  
DQ58  
DQ59  
DQ60  
DQ61  
DQ62  
DQ63  
I/ O0  
I/ O0  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
I/ O1  
I/ O2  
I/ O3  
I/ O4  
I/ O5  
I/ O6  
I/ O7  
D7  
D15  
D8  
D16  
Serial Presense  
Detect (SPD)  
SCL  
10  
5%  
Ω +/-  
SDA  
SA0  
A0  
A1  
BA0 - BA 2  
A0- AN  
/ RAS  
SDRAMS D0-D15  
SA1  
SA2  
SDRAMS D0-D15  
SDRAMS D0-D15  
SDRAMS D0-D15  
SDRAMS D0-D15  
A2  
Event/WP  
R(WP) = 0Ω  
WP  
Event  
/ CAS  
/WE  
Notes:  
For normal operation only R(WP) is placed.  
For the SPD temperture sensor option  
only R(Event) is placed.  
R(Event) = 0Ω  
VDD SPD  
VREF  
SPD  
CK0  
#Unless otherwise noted, resistor values  
are 22 Ω9+/- 5% DQ wiring may differ from  
that described in this drawing;described  
in this drawing; however, DQ/DM/DQS/DQS  
relationships are maintained as shown  
5.6 pF  
8
8
loads  
loads  
-
SDRAMS DO D15  
/ CK0  
CK1  
VDD  
-
SDRAMS DO D15,V  
Q
DD and VDD  
5.6 pF  
/ CK1  
SDRAMS DO -D15, SPD  
Rev. 0.4 / Jul. 2007  
7
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
Unit  
Note  
VDD  
VDDL  
VDDQ  
- 1.0 ~ 2.3  
-0.5 ~ 2.3  
- 0.5 ~ 2.3  
- 0.5 ~ 2.3  
-50 ~ +100  
5 ~ 95  
V
V
V
V
1
1
1
1
1
1
Voltage on VDD pin relative to Vss  
Voltage on VDDL pin relative to Vss  
Voltage on VDDQ pin relative to Vss  
VIN, VOUT  
TSTG  
Voltage on any pin relative to Vss  
Storage Temperature  
oC  
HSTG  
Storage Humidity(without condensation)  
%
Notes:  
1. Stress greater than those listed may cause permanent damage to the device. This is a stress rating only, and device  
functional operation at or above the conditions indicated is not implied. Exposure to absolute maximum rating con  
ditions for extended periods may affect reliability.  
OPERATING CONDITIONS  
Parameter  
Symbol  
Rating  
Units  
Notes  
oC  
TOPR  
0 ~ +55  
DIMM Operating temperature(ambient)  
PBAR  
DIMM Barometric Pressure(operating & storage)  
105 ~ 69  
0 ~+95  
K Pascal  
1
2
DRAM Component Case Temperature Range  
oC  
TCASE  
Notes:  
1. Up to 9850 ft.  
2. If the DRAM case temperature is Above 85oC, the Auto-Refresh command interval has to be reduced to  
tREFI=3.9us. For Measurement conditions of TCASE, please refer to the JEDEC document JESD51-2.  
DC OPERATING CONDITIONS (SSTL_1.8)  
Parameter  
Symbol  
Min  
1.7  
Max  
1.9  
Unit  
V
Note  
VDD  
1.7  
1.9  
V
Power Supply Voltage  
VDDL  
VDDQ  
1.7  
1.9  
V
1
2
Input Reference Voltage  
EEPROM Supply Voltage  
VREF  
0.49 x VDDQ  
1.7  
0.51 x VDDQ  
3.6  
V
VDDSPD  
VTT  
V
VREF+0.04  
V
3
VREF-0.04  
Termination Voltage  
Notes:  
1. VDDQ must be less than or equal to VDD  
.
2. Peak to peak ac noise on VREF may not exceed +/-2% VREF(dc)  
3. VTT of transmitting device must track VREF of receiving device.  
Rev. 0.4 / Jul. 2007  
8
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
INPUT DC LOGIC LEVEL  
Parameter  
Input High Voltage  
Input Low Voltage  
Symbol  
VIH(DC)  
VIL(DC)  
Min  
VREF + 0.125  
-0.30  
Max  
Unit  
V
Note  
VDDQ + 0.3  
VREF - 0.125  
V
INPUT AC LOGIC LEVEL  
DDR2 400/533  
DDR2 667/800  
Parameter  
Symbol  
Unit  
Min  
VREF + 0.250  
Max  
Min  
Max  
AC Input logic High  
AC Input logic Low  
VIH(AC)  
VIL(AC)  
V
V
-
VREF + 0.200  
-
-
-
V
REF - 0.250  
VREF - 0.200  
AC INPUT TEST CONDITIONS  
Symbol  
VREF  
Condition  
Input reference voltage  
Value  
Units  
Notes  
0.5 * VDDQ  
V
1
1
VSWING(MAX)  
SLEW  
Input signal maximum peak to peak swing  
Input signal minimum slew rate  
1.0  
1.0  
V
V/ns  
2, 3  
Notes:  
1. Input waveform timing is referenced to the input signal crossing through the VREF level applied to the device  
under test.  
2. The input signal minimum slew rate is to be maintained over the range from VREF to VIH(ac) min for rising edges  
and the range from VREF to VIL(ac) max for falling edges as shown in the below figure.  
3. AC timings are referenced with input waveforms switching from VIL(ac) to VIH(ac) on the positive transitions  
V
V
V
V
V
V
V
DDQ  
IH(ac)  
IH(dc)  
REF  
min  
min  
V
SWING(MAX)  
max  
max  
IL(dc)  
IL(ac)  
SS  
delta TF  
delta TR  
Rising Slew =  
V
min - V  
REF  
V
-
V
max  
IL(ac)  
IH(ac)  
REF  
Falling Slew =  
delta TF  
delta TR  
< Figure : AC Input Test Signal Waveform>  
Rev. 0.4 / Jul. 2007  
9
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
Differential Input AC logic Level  
Symbol  
Parameter  
Min.  
Max.  
Units  
Note  
VID (ac)  
0.5  
VDDQ + 0.6  
V
1
ac differential input voltage  
ac differential cross point voltage  
V
IX (ac)  
0.5 * VDDQ - 0.175  
0.5 * VDDQ + 0.175  
V
2
1. VIN(DC) specifies the allowable DC execution of each input of differential pair such as CK, CK, DQS, DQS, LDQS,  
LDQS, UDQS and UDQS.  
2. VID(DC) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input  
(such as CK, DQS, LDQS or UDQS) level and VCP is the complementary input (such as CK, DQS, LDQS or UDQS) level.  
The minimum value is equal to VIH(DC) - VIL(DC).  
V
DDQ  
V
TR  
Crossing point  
V
ID  
V
V
IX or OX  
V
CP  
V
SSQ  
< Differential signal levels >  
Notes:  
1. VID(AC) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input signal  
(such as CK, DQS, LDQS or UDQS) and VCP is the complementary input signal (such as CK, DQS, LDQS or UDQS).  
The minimum value is equal to V IH(AC) - VIL(AC).  
2. The typical value of VIX(AC) is expected to be about 0.5 * VDDQ of the transmitting device and VIX(AC) is expected to  
track variations in VDDQ. VIX(AC) indicates the voltage at which differential input signals must cross.  
DIFFERENTIAL AC OUTPUT PARAMETERS  
Symbol  
Parameter  
Min.  
Max.  
Units  
Note  
VOX (ac)  
0.5 * VDDQ - 0.125  
0.5 * VDDQ + 0.125  
V
1
ac differential cross point voltage  
Notes:  
1. The typical value of VOX(AC) is expected to be about 0.5 * VDDQ of the transmitting device and VOX(AC) is expected to  
track variations in VDDQ . VOX(AC) indicates the voltage at whitch differential output signals must cross.  
Rev. 0.4 / Jul. 2007  
10  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
OUTPUT BUFFER LEVELS  
OUTPUT AC TEST CONDITIONS  
Symbol  
Parameter  
SSTl_18  
Units  
Notes  
VOTR  
Output Timing Measurement Reference Level  
0.5 * VDDQ  
V
1
Notes:  
1. The VDDQ of the device under test is referenced.  
OUTPUT DC CURRENT DRIVE  
Symbol  
IOH(dc)  
IOL(dc)  
Parameter  
SSTl_18  
Units  
Notes  
Output Minimum Source DC Current  
Output Minimum Sink DC Current  
- 13.4  
13.4  
mA  
mA  
1, 3, 4  
2, 3, 4  
Notes:  
1. VDDQ = 1.7 V; VOUT = 1420 mV. (VOUT - VDDQ)/IOH must be less than 21 ohm for values of VOUT between VDDQ and  
DDQ - 280 mV.  
V
2. VDDQ = 1.7 V; VOUT = 280 mV. VOUT/IOL must be less than 21 ohm for values of VOUT between 0 V and 280 mV.  
3. The dc value of VREF applied to the receiving device is set to VTT  
4. The values of IOH(dc) and IOL(dc) are based on the conditions given in Notes 1 and 2. They are used to test device  
drive current capability to ensure VIH min plus a noise margin and VIL max minus a noise margin are delivered to an  
SSTL_18 receiver.  
The actual current values are derived by shifting the desired driver operating point along a 21 ohm load line to define  
a convenient driver current for measurement.  
Rev. 0.4 / Jul. 2007  
11  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PIN Capacitance (VDD=1.8V,VDDQ=1.8V, TA=25℃. f=1MHz )  
256MB : HYMP532S64C[L]P6  
Pin  
Symbol  
Min  
Max  
Unit  
CK, CK  
CCK  
CI1  
CI2  
CIO  
12  
27  
15  
30  
32  
7.5  
pF  
pF  
pF  
pF  
CKE, ODT,CS  
Address, RAS, CAS, WE  
DQ, DM, DQS, DQS  
25  
6.0  
512MB : HYMP564S64C[L]P6  
Pin  
Symbol  
Min  
Max  
Unit  
CK, CK  
CCK  
CI1  
CI2  
CIO  
17  
22  
20  
25  
pF  
pF  
pF  
pF  
CKE, ODT,CS  
Address, RAS, CAS, WE  
DQ, DM, DQS, DQS  
28.5  
10.0  
37.0  
12.0  
1GB : HYMP512S64C[L]P8  
Pin  
Symbol  
Min  
Max  
Unit  
CK, CK  
CCK  
CI1  
CI2  
CIO  
25  
32  
47  
16  
49  
58  
96  
20  
pF  
pF  
pF  
pF  
CKE, ODT,CS  
Address, RAS, CAS, WE  
DQ, DM, DQS, DQS  
Notes:  
1. Pins not under test are tied to GND.  
2. These values are guaranteed by design and tested on a sample basis only.  
Rev. 0.4 / Jul. 2007  
12  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
o
IDD SPECIFICATIONS (T  
: 0 to 95 C)  
CASE  
256MB, 32M x 64 SO- DIMM : HYMP532S64C[L]P6  
E3  
C4  
Y5  
S5  
Symbol  
Unit  
note  
(DDR 400@CL 3)  
(DDR 533@CL 4) (DDR 667@CL 5) (DDR 800@CL 5)  
IDD0  
IDD1  
400  
440  
32  
400  
440  
32  
400  
480  
32  
480  
520  
32  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
IDD2P  
IDD2Q  
IDD2N  
IDD3P(F)  
IDD3P(S)  
IDD3N  
IDD4W  
IDD4R  
IDD5B  
IDD6  
120  
120  
120  
48  
120  
160  
120  
48  
160  
160  
120  
48  
160  
200  
140  
48  
160  
520  
440  
600  
32  
200  
680  
600  
600  
32  
200  
800  
680  
640  
32  
240  
960  
800  
660  
32  
1
1
IDD6(L)  
IDD7  
16  
16  
16  
16  
1280  
1280  
1280  
1360  
512MB, 64M x 64 SO - DIMM : HYMP564S64C[L]P6  
E3  
C4  
Y5  
S5  
Symbol  
Unit  
note  
(DDR 400@CL 3)  
(DDR 533@CL 4) (DDR 667@CL 5) (DDR 800@CL 5)  
IDD0  
IDD1  
560  
600  
64  
600  
640  
64  
640  
680  
64  
720  
760  
64  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
IDD2P  
IDD2Q  
IDD2N  
IDD3P(F)  
IDD3P(S)  
IDD3N  
IDD4W  
IDD4R  
IDD5B  
IDD6  
240  
240  
240  
96  
240  
320  
240  
96  
320  
320  
240  
96  
320  
400  
280  
96  
320  
680  
600  
760  
64  
400  
880  
800  
800  
64  
400  
1000  
880  
840  
64  
480  
1200  
1040  
900  
64  
1
1
IDD6(L)  
IDD7  
32  
32  
32  
32  
1440  
1480  
1480  
1600  
Notes:  
1. IDD6 current values are guaranteed up to Tcase of 85max.  
Rev. 0.4 / Jul. 2007  
13  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
1GB, 128M x 64 SO - DIMM : HYMP512S64C[L]P8  
E3  
C4  
Y5  
S5  
Symbol  
Unit  
note  
(DDR 400@CL 3)  
(DDR 533@CL 4)  
(DDR 667@CL 5)  
(DDR 800@CL 5)  
IDD0  
IDD1  
960  
960  
128  
480  
480  
480  
192  
640  
1120  
1040  
1520  
128  
64  
1040  
1120  
128  
1120  
1120  
128  
1280  
1280  
128  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
IDD2P  
IDD2Q  
IDD2N  
IDD3P(F)  
IDD3P(S)  
IDD3N  
IDD4W  
IDD4R  
IDD5B  
IDD6  
480  
640  
640  
640  
640  
800  
480  
480  
560  
192  
192  
192  
800  
800  
960  
1440  
1280  
1600  
128  
1600  
1520  
1680  
128  
1920  
1760  
1800  
128  
1
1
IDD6(L)  
IDD7  
64  
64  
64  
2000  
2080  
2160  
2320  
Notes:  
1. IDD6 current values are guaranteed up to Tcase of 85max.  
Rev. 0.4 / Jul. 2007  
14  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
IDD Measurement Conditions  
Symbol  
Conditions  
Units  
t
t
t
t
t
t
Operating one bank active-precharge current; CK = CK(IDD), RC = RC(IDD), RAS = RAS-  
min(IDD);CKE is HIGH, CS is HIGH between valid commands;Address bus inputs are SWITCHING;Data bus  
inputs are SWITCHING  
IDD0  
IDD1  
mA  
Operating one bank active-read-precharge current ; IOUT = 0mA;BL = 4, CL = CL(IDD), AL = 0;  
t
t
t
t
t
t
t
t
CK = CK(IDD), RC = RC (IDD), RAS = RASmin(IDD), RCD = RCD(IDD) ; CKE is HIGH, CS is HIGH  
between valid commands ; Address bus inputs are SWITCHING ; Data pattern is same as IDD4W  
mA  
t
t
Precharge power-down current ; All banks idle ; CK = CK(IDD) ; CKE is LOW ; Other control and address  
IDD2P  
IDD2Q  
IDD2N  
mA  
mA  
mA  
bus inputs are STABLE; Data bus inputs are FLOATING  
t
t
Precharge quiet standby current ; All banks idle; CK = CK(IDD);CKE is HIGH, CS is HIGH; Other control  
and address bus inputs are STABLE; Data bus inputs are FLOATING  
t
t
Precharge standby current ; All banks idle; CK = CK(IDD); CKE is HIGH, CS is HIGH; Other control and  
address bus inputs are SWITCHING; Data bus inputs are SWITCHING  
t
t
mA  
mA  
Active power-down current ; All banks open; CK = CK(IDD); CKE is LOW;  
Fast PDN Exit MRS(12) = 0  
Slow PDN Exit MRS(12) = 1  
IDD3P  
IDD3N  
IDD4W  
IDD4R  
Other control and address bus inputs are STABLE; Data bus inputs are FLOAT-  
ING  
t
t
t
t
t
t
Active standby current ; All banks open; CK = CK(IDD), RAS = RASmax(IDD), RP = RP(IDD); CKE is  
HIGH, CS is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus  
inputs are SWITCHING  
mA  
mA  
mA  
t
Operating burst write current ; All banks open, Continuous burst writes; BL = 4, CL = CL(IDD), AL = 0; CK  
t
t
t
t
t
= CK(IDD), RAS = RASmax(IDD), RP = RP(IDD); CKE is HIGH, CS is HIGH between valid commands;  
Address bus inputs are SWITCHING; Data bus inputs are SWITCHING  
Operating burst read current ; All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(IDD),  
t
t
t
t
t
t
AL = 0; CK = CK(IDD), RAS = RASmax(IDD), RP = RP(IDD); CKE is HIGH, CS is HIGH between valid com-  
mands; Address bus inputs are SWITCHING; Data pattern is same as IDD4W  
t
t
t
Burst refresh current ; CK = CK(IDD); Refresh command at every RFC(IDD) interval; CKE is HIGH, CS is  
HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are  
SWITCHING  
IDD5B  
IDD6  
mA  
mA  
Self refresh current ; CK and CK at 0V; CKE 0.2V; Other control and address bus inputs are FLOATING; Data  
bus inputs are FLOATING. IDD6 current values are guaranteed up to Tcase of 85max.  
Operating bank interleave read current ; All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(IDD),  
t
t
t
t
t
t
t
t
t
t
AL = RCD(IDD)-1* CK(IDD); CK = CK(IDD), RC = RC(IDD), RRD = RRD(IDD), RCD = 1* CK(IDD); CKE is  
HIGH, CS is HIGH between valid commands; Address bus inputs are STABLE during DESELECTs; Data pattern is  
same as IDD4R; - Refer to the following page for detailed timing conditions  
IDD7  
mA  
Notes:  
1. IDD specifications are tested after the device is properly initialized  
2. Input slew rate is specified by AC Parametric Test Condition  
3. IDD parameters are specified with ODT disabled.  
4. Data bus consists of DQ, DM, DQS, DQS, RDQS, RDQS, LDQS, LDQS, UDQS, and UDQS. IDD values must be met with all combinations  
of EMRS bits 10 and 11.  
5. Definitions for IDD  
LOW is defined as Vin VILAC(max)  
HIGH is defined as Vin VIHAC(min)  
STABLE is defined as inputs stable at a HIGH or LOW level  
FLOATING is defined as inputs at VREF = VDDQ/2  
SWITCHING is defined as: inputs changing between HIGH and LOW every other clock cycle (once per two clocks) for address and  
control signals, and inputs changing between HIGH and LOW every other data transfer (once per clock)  
for DQ signals not including masks or strobes.  
Rev. 0.4 / Jul. 2007  
15  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
Electrical Characteristics & AC Timings  
Speed Bins and CL,tRCD,tRP,tRC and tRAS for Corresponding Bin  
Speed  
Unit  
DDR2-800  
DDR2-800  
5-5-5  
min  
DDR2-667  
DDR2-533  
3-3-3  
min  
DDR2-400  
Bin(CL-tRCD-tRP)  
Parameter  
CAS Latency  
tRCD  
6-6-6  
min  
6
5-5-5  
min  
5
4-4-4  
min  
5
tCK  
ns  
5
3
15  
12.5  
15  
11.25  
11.25  
45  
15  
tRP  
ns  
15  
12.5  
15  
15  
tRAS  
ns  
45  
45  
45  
40  
tRC  
ns  
60  
57.25  
60  
56.25  
55  
AC Timing Parameters by Speed Grade  
DDR2-400  
DDR2-533  
Parameter  
Symbol  
Unit Note  
Min  
Max  
+600  
+500  
0.55  
0.55  
Min  
-500  
-500  
0.45  
0.45  
Max  
500  
450  
0.55  
0.55  
Data-Out edge to Clock edge Skew  
DQS-Out edge to Clock edge Skew  
Clock High Level Width  
tAC  
tDQSCK  
tCH  
ps  
ns  
-600  
-500  
0.45  
0.45  
CK  
CK  
Clock Low Level Width  
tCL  
min  
(tCL,tCH)  
Clock Half Period  
tHP  
tCK  
ns  
ps  
-
min(tCL,tCH)  
5000  
-
System Clock Cycle Time  
3750  
8000  
8000  
ps  
ps  
1
1
1
1
DQ and DM input setup time(differential strobe)  
DQ and DM input hold time(differential strobe)  
DQ and DM input setup time(single ended strobe)  
tDS  
tDH  
150  
275  
25  
-
-
-
-
-
-
100  
225  
-25  
-
-
-
ps  
tDS1  
ps  
DQ and DM input hold time(single ended strobe)  
tDH1  
25  
-25  
0.6  
-
-
Control & Address input Pulse Width for each input  
tIPW  
tCK  
tCK  
ps  
0.6  
0.35  
DQ and DM input pulse width for each input  
Data-out high-impedance window from CK, /CK  
tDIPW  
tHZ  
0.35  
-
-
tAC max  
-
tAC min  
2*tAC min  
-
tAC max  
DQS low-impedance time from CK/CK  
DQ low-impedance time from CK/CK  
DQS-DQ skew for DQS and associated DQ signals  
DQ hold skew factor  
tLZ(DQS)  
tLZ(DQ)  
tDQSQ  
tQHS  
ps  
ps  
tAC max  
tAC min  
tAC max  
tAC max  
2*tAC min  
tAC max  
ps  
350  
-
-
300  
ps  
-
450  
400  
tQH  
ps  
DQ/DQS output hold time from DQS  
First DQS latching transition to associated clock edge  
DQS input high pulse width  
tHP - tQHS  
-0.25  
0.35  
-
tHP - tQHS  
-0.25  
0.35  
-
tCK  
tCK  
tCK  
tDQSS  
+ 0.25  
+ 0.25  
tDQSH  
-
-
-
-
tDQSL  
DQS input low pulse width  
0.35  
0.35  
Rev. 0.4 / Jul. 2007  
16  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
- continued -  
DDR2-400  
DDR2-533  
Parameter  
Symbol  
Unit Note  
Min  
Max  
Min  
Max  
tDSS  
tDSH  
tMRD  
tWPST  
tWPRE  
tIS  
tCK  
tCK  
tCK  
tCK  
tCK  
ps  
DQS falling edge to CK setup time  
DQS falling edge hold time from CK  
Mode register set command cycle time  
Write postamble  
0.2  
0.2  
2
-
-
0.2  
0.2  
2
-
-
-
-
0.4  
0.6  
-
0.4  
0.6  
-
Write preamble  
0.35  
350  
475  
0.9  
0.35  
250  
375  
0.9  
Address and control input setup time  
Address and control input hold time  
Read preamble  
-
-
tIH  
ps  
-
-
tRPRE  
tRPST  
tCK  
tCK  
1.1  
0.6  
1.1  
0.6  
Read postamble  
0.4  
0.4  
Auto-Refresh to Active/Auto-Refresh command  
period  
tRFC  
tRRD  
tRRD  
tFAW  
tFAW  
ns  
ns  
ns  
ns  
ns  
105  
-
105  
7.5  
10  
-
-
-
-
-
Row Active to Row Active Delay for 1KB page size  
Row Active to Row Active Delay for 2KB page size  
Four Activate Window for 1KB page size  
7.5  
10  
-
-
-
-
37.5  
50  
37.5  
Four Activate Window for 2KB page size  
50  
2
CAS to CAS command delay  
tCCD  
tWR  
tCK  
ns  
2
15  
Write recovery time  
15  
-
-
-
-
-
Auto Precharge Write Recovery + Precharge Time  
tDAL  
tCK  
tWR+tRP  
WR+tRP  
Write to Read Command Delay  
tWTR  
ns  
10  
7.5  
7.5  
7.5  
-
Internal read to precharge command delay  
Exit self refresh to a non-read command  
Exit self refresh to a read command  
tRTP  
ns  
ns  
tXSNR  
tXSRD  
tRFC + 10  
200  
tRFC + 10  
200  
tCK  
-
-
-
-
Exit precharge power down to any non-read  
command  
tXP  
tCK  
tCK  
tCK  
2
2
Exit active power down to read command  
tXARD  
tXARDS  
2
6 - AL  
3
2
6 - AL  
3
Exit active power down to read command  
(Slow exit, Lower power)  
CKE minimum pulse width  
(high and low pulse width)  
t
tCK  
CKE  
t
ODT turn-on delay  
ODT turn-on  
2
2
2
2
tCK  
ns  
AOND  
t
tAC(min)  
tAC(max)+1  
tAC(min)  
tAC(max)+1  
AON  
2tCK+  
tAC(max)+1  
2tCK+tAC(m  
ax)+1  
t
ODT turn-on(Power-Down mode)  
ODT turn-off delay  
ns  
tCK  
ns  
tAC(min)+2  
2.5  
tAC(min)+2  
2.5  
AONPD  
t
2.5  
2.5  
AOFD  
tAC(max)+0  
.6  
tAC(max)+  
0.6  
t
ODT turn-off  
tAC(min)  
tAC(min)  
AOF  
2.5tCK+tAC(  
max)+1  
t
ns  
ODT turn-off (Power-Down mode)  
2.5  
2.5  
tAC(min)+2  
AOFPD  
Rev. 0.4 / Jul. 2007  
17  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
- continued -  
DDR2-400  
DDR2-533  
Parameter  
Symbol  
Unit  
Note  
Min  
Max  
Min  
Max  
tAC(max)+0.  
6
ODT to power down entry latency  
tANPD  
tAC(min)  
3
tCK  
2.5tCK+  
tAC(max)+1  
ODT power down exit latency  
OCD drive mode output delay  
tAXPD  
tOIT  
tAC(min)+2  
8
0
tCK  
ns  
3
8
12  
Minimum time clocks remains ON after  
CKE asynchronously drops LOW  
tDelay  
ns  
tIS+tCK+tIH  
tREFI  
tREFI  
-
-
7.8  
3.9  
-
-
7.8  
3.9  
us  
us  
2
3
Average periodic Refresh Interval  
Note :  
1. For details and notes, please refer to the relevant Hynix component datasheet(HY5PS128(16)21C[L]FP).  
2. C TCASE ≤ 85°C  
3. 85°C TCASE ≤ 95°C  
Rev. 0.4 / Jul. 2007  
18  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
DDR2-667  
min  
DDR2-800  
Symbol  
Unit Note  
Parameter  
max  
+450  
+400  
0.55  
min  
max  
+400  
+350  
0.55  
DQ output access time from CK/CK  
DQS output access time from CK/CK  
CK high-level width  
tAC  
tDQSCK  
tCH  
-450  
-400  
0.45  
0.45  
-400  
-350  
0.45  
0.45  
ps  
ps  
tCK  
tCK  
CK low-level width  
tCL  
0.55  
0.55  
min(tCL,  
tCH)  
min(tCL,  
tCH)  
CK half period  
tHP  
tCK  
tDS  
-
8000  
-
-
ps  
ps  
Clock cycle time, CL=x  
3000  
2500  
DQ and DM input setup time  
(differential strobe)  
100  
50  
-
-
-
ps  
ps  
1
1
DQ and DM input hold time  
(differential strobe)  
tDH  
175  
0.6  
-
-
125  
0.6  
Control & Address input pulse width for each  
input  
tIPW  
tCK  
DQ and DM input pulse width for each input  
Data-out high-impedance time from CK/CK  
DQS low-impedance time from CK/CK  
DQ low-impedance time from CK/CK  
tDIPW  
tHZ  
0.35  
-
-
0.35  
-
-
tCK  
ps  
tAC max  
tAC max  
tAC max  
tAC max  
tAC max  
tAC max  
tLZ(DQS)  
tLZ(DQ)  
tAC min  
2*tAC min  
tAC min  
2*tAC min  
ps  
ps  
DQS-DQ skew for DQS and associated DQ  
signals  
tDQSQ  
-
240  
-
200  
ps  
DQ hold skew factor  
tQHS  
tQH  
-
340  
-
-
300  
-
ps  
ps  
DQ/DQS output hold time from DQS  
tHP - tQHS  
tHP - tQHS  
First DQS latching transition to associated  
clock edge  
tDQSS  
- 0.25  
+ 0.25  
- 0.25  
+ 0.25  
tCK  
DQS input high pulse width  
DQS input low pulse width  
DQS falling edge to CK setup time  
DQS falling edge hold time from CK  
Mode register set command cycle time  
Write postamble  
tDQSH  
tDQSL  
tDSS  
0.35  
0.35  
0.2  
0.2  
2
-
0.35  
0.35  
0.2  
0.2  
2
-
tCK  
tCK  
tCK  
tCK  
tCK  
tCK  
tCK  
ps  
-
-
-
-
tDSH  
tMRD  
tWPST  
tWPRE  
tIS  
-
-
-
0.6  
-
-
0.6  
-
0.4  
0.35  
200  
275  
0.9  
0.4  
45  
0.4  
0.35  
175  
250  
0.9  
0.4  
45  
Write preamble  
Address and control input setup time  
Address and control input hold time  
Read preamble  
-
-
tIH  
-
-
ps  
tRPRE  
tRPST  
tRAS  
1.1  
0.6  
70000  
1.1  
0.6  
70000  
tCK  
tCK  
ns  
Read postamble  
Activate to precharge command  
Active to active command period for 1KB page  
size products  
tRRD  
tRRD  
tFAW  
tFAW  
7.5  
10  
-
-
-
-
7.5  
10  
35  
45  
-
-
-
-
ns  
ns  
ns  
ns  
Active to active command period for 2KB page  
size products  
Four Active Window for 1KB page size  
products  
37.5  
50  
Four Active Window for 2KB page size  
products  
Rev. 0.4 / Jul. 2007  
19  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
- continued -  
DDR2-667  
max  
DDR2-800  
max  
Symbol  
Unit Note  
Parameter  
min  
2
min  
2
CAS to CAS command delay  
Write recovery time  
tCCD  
tWR  
tCK  
ns  
15  
-
-
-
15  
-
-
-
Auto precharge write recovery +  
precharge time  
tDAL  
tWTR  
tRTP  
WR+tRP  
7.5  
WR+tRP  
7.5  
tCK  
ns  
Internal write to read command delay  
Internal read to precharge command  
delay  
7.5  
7.5  
ns  
Exit self refresh to a non-read command  
Exit self refresh to a read command  
tXSNR  
tXSRD  
tRFC + 10  
200  
tRFC + 10  
200  
ns  
-
-
-
-
tCK  
Exit precharge power down to any non-  
read command  
tXP  
2
2
2
2
tCK  
tCK  
tCK  
Exit active power down to read command  
Exit active power down to read command  
tXARD  
tXARDS  
7 - AL  
8 - AL  
(Slow exit, Lower power)  
CKE minimum pulse width(high and low  
pulse width)  
t
3
3
tCK  
tCK  
CKE  
t
ODT turn-on delay  
ODT turn-on  
2
2
2
2
AOND  
t
tAC(min)  
tAC(max)+0.7  
tAC(min)  
tAC(max)+0.7 ns  
AON  
2tCK+  
tAC(max)+1  
2tCK+  
ns  
t
ODT turn-on(Power-Down mode)  
tAC(min)+2  
tAC(min)+2  
AONPD  
tAC(max)+1  
t
ODT turn-off delay  
ODT turn-off  
2.5  
2.5  
2.5  
2.5  
tCK  
AOFD  
t
tAC(min)  
tAC(max)+ 0.6  
tAC(min)  
tAC(max)+0.6 ns  
AOF  
2.5tCK+  
tAC(max)+1  
tAC(min)  
+2  
2.5tCK+  
ns  
t
ODT turn-off (Power-Down mode)  
tAC(min)+2  
AOFPD  
tAC(max)+1  
ODT to power down entry latency  
ODT power down exit latency  
OCD drive mode output delay  
tANPD  
tAXPD  
tOIT  
3
8
0
3
8
0
tCK  
tCK  
12  
12  
ns  
Minimum time clocks remains ON after  
CKE asynchronously drops LOW  
tDelay  
tIS+tCK+tIH  
tIS+tCK+tIH  
ns  
tREFI  
tREFI  
-
-
7.8  
3.9  
-
-
7.8  
3.9  
us  
us  
2
3
Average periodic Refresh Interval  
Note :  
1. For details and notes, please refer to the relevant Hynix component datasheet(HY5PS128(16)21C[L]FP).  
2. C TCASE ≤ 85°C  
3. 85°C TCASE ≤ 95°C  
Rev. 0.4 / Jul. 2007  
20  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PACKAGE OUTLINE  
32Mx64 - HYMP532S64C[L]P6  
Front  
67.60  
2.00 Min  
Side  
3.8 max  
4.00±0.10  
30.00  
20.00  
Detail-B  
Detail-A  
PIN 1  
PIN 39  
PIN 41  
PIN 199  
2.15  
2.45  
47.40  
11.40  
1.80±0.10  
4.20  
Back  
1.00 ± 0.10  
Detail-B  
47.40  
11.40  
1.50±0.10  
PIN 200  
PIN 2  
PIN 40 PIN 42  
Detail of Contacts A  
Detail of Contacts B (Front)  
Detail of Contacts B (Back)  
4.20  
2.70±0.10  
1.50  
0.45±0.03  
0.60  
2.40±0.10  
1.80  
1.0±0.05  
4.20  
note:  
1. All dimensions are in millimeters.  
2. All outline dimensions and tolerances follow the JEDEC standard.  
Rev. 0.4 / Jul. 2007  
21  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PACKAGE OUTLINE  
64Mx64 - HYMP564S64C[L]P6  
Front  
67.60  
2.00 Min  
Side  
3.8 max  
4.00±0.10  
30.00  
20.00  
Detail-B  
Detail-A  
PIN 1  
PIN 39  
PIN 41  
PIN 199  
2.15  
2.45  
11.40  
1.80±0.10  
47.40  
4.20  
Back  
1.00 ± 0.10  
Detail-B  
47.40  
11.40  
1.50±0.10  
PIN 200  
PIN 2  
PIN 40 PIN 42  
Detail of Contacts A  
Detail of Contacts B (Front)  
Detail of Contacts B (Back)  
4.20  
2.70±0.10  
1.50  
0.45±0.03  
0.60  
2.40±0.10  
1.80  
1.0±0.05  
4.20  
note:  
1. All dimensions are in millimeters.  
2. All outline dimensions and tolerances follow the JEDEC standard.  
Rev. 0.4 / Jul. 2007  
22  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
PACKAGE OUTLINE  
128Mx64 - HYMP512S64C[L]P8  
Front  
67.60  
2.00 Min  
Side  
3.8 max  
4.00 +/-0.10  
30.00  
20.00  
Detail-B  
Detail-A  
PIN 1  
PIN 39  
PIN 41  
PIN 199  
2.15  
2.45  
47.40  
11.40  
1.80±0.10  
1.00 ± 0.10  
4.20  
Back  
Detail-B  
47.40  
11.40  
1.50±0.10  
PIN 200  
PIN 2  
PIN 40 PIN 42  
Detail of Contacts A  
Detail of Contacts B (Front)  
Detail of Contacts B (Back)  
4.20  
2.70±0.10  
1.50  
0.45±0.03  
0.60  
2.40±0.10  
1.80  
1.0±0.05  
4.20  
note:  
1. All dimensions are in millimeters.  
2. All outline dimensions and tolerances follow the JEDEC standard.  
Rev. 0.4 / Jul. 2007  
23  
1200pin Unbuffered DDR2 SDRAM SO-DIMMs  
REVISION HISTORY  
Revision  
History  
Date  
Remark  
0.1  
0.2  
0.3  
0.4  
First Version Release  
Jul. 2006  
Aug. 2006  
Aug. 2006  
Jul. 2007  
Added IDD Spec for S5(800Mhz part)  
Updated IDD3P-S value  
Corrected DIMM Outline & Added Speed S6  
Rev. 0.4 / Jul. 2007  
24  
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