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SZWN5A0A

型号:

SZWN5A0A

品牌:

SEOUL[ Seoul Semiconductor ]

页数:

17 页

PDF大小:

424 K

Z5  
Specification  
Description  
Features  
• Super high Flux output  
and high Luminance  
• Designed for high  
current operation  
• SMT solderable  
• Lead Free product  
• RoHS compliant  
The Z-Power series is designed for high  
current operation and high flux output  
applications.  
It incorporates state of the art SMD  
design and low thermal resistant material.  
The Z Power LED is ideal light sources for general illumination  
applications, custom designed solutions, automotive, large  
LCD backlights and high performance torches.  
Applications  
• Mobile phone flash  
• Automotive interior /  
exterior lighting  
• Automotive signal  
lighting  
• Automotive forward  
lighting  
• General Torch  
• Architectural lighting  
• LCD TV / Monitor  
Backlight  
• Projector light source  
• Traffic signals  
• Task lighting  
• Decorative / Pathway  
lighting  
• Remote / Solar  
powered lighting  
* The appearance and specifications of the product can be changed  
for improvement without notice.  
Rev. 01  
August 2011  
1
www.Acriche.com  
: SSC- QP- 7- 07- 25 (Rev.00)  
Outline dimensions  
Top View  
Bottom View  
Circuit  
Side View  
Notes :  
[1] All dimensions are in millimeters.  
[2] Scale : none  
[3] Undefined tolerance is 0.1mm  
Rev. 01  
August 2011  
2
www.Acriche.com  
Characteristics of Z5 (Part no : SZWN5A0A)  
1. Neutral white  
1-1 Electro-Optical characteristics at 350mA  
Value  
Typ  
85  
Parameter  
Symbol  
Unit  
Min  
Max  
[1]  
[2]  
V
Luminous Flux  
lm  
K
[3]  
Correlated Color Temperature  
CRI  
CCT  
Ra  
-
4000  
-
-
-
80  
-
[4]  
Forward Voltage  
VF  
3.3  
12  
4
V
Thermal resistance (J to S)  
View Angle  
R
K /W  
deg.  
J-S  
2
½
120  
1-2 Absolute Maximum Ratings  
Parameter  
Forward Current  
Symbol  
Value  
Unit  
IF  
V
700  
5
mA  
V
Reverse Voltage  
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Pd  
Tj  
2.8  
W
ºC  
ºC  
ºC  
-
145(@ IF 700mA)  
-40 ~ +85  
Topr  
Tstg  
-
-40 ~ +100  
[5]  
ESD Sensitivity  
8,000V HBM  
*Notes :  
[1] SSC maintains a tolerance of 10% on flux and power measurements.  
[2] V is the total luminous flux output as measured with an integrating sphere.  
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.  
Color coordinate : 0.005, CCT 5% tolerance.  
[4] Tolerance is 0.06V on forward voltage measurements  
[5] A zener diode is included to protect the product from ESD.  
Rev. 01  
August 2011  
www.Acriche.com  
3
                                  
Temperature Characteristics Points  
T
a
Ceramic  
Lens  
T
j
Ts  
T
b
Solder  
Metal-PCB  
T
a
Color Spectrum TA=25  
1.00  
0.75  
0.50  
0.25  
0.00  
400  
500  
600  
700  
800  
Wavelength (nm)  
Rev. 01  
August 2011  
www.Acriche.com  
4
Forward Current Characteristics  
Forward Voltage vs. Forward Current, Ta=25  
1000  
800  
600  
400  
200  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
Forward Voltage [V]  
Forward Current vs. Normalized Relative Luminous Flux, Ta=25  
Rev. 01  
August 2011  
5
www.Acriche.com  
Junction Temperature Characteristics  
Relative Light Output vs. Junction Temperature at IF=350mA, Ta=25  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
40  
60  
80  
100  
120  
140  
Forward Voltage Shift vs. Junction Temperature at IF=350mA, Ta=25  
0.00  
-0.05  
-0.10  
-0.15  
-0.20  
-0.25  
20  
40  
60  
80  
100  
120  
140  
160  
Junction Temperature [oC]  
Rev. 01  
August 2011  
6
www.Acriche.com  
Radiation pattern  
0
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
30  
60  
90  
-80  
-60  
-40  
-20  
0
Angle(deg.)  
Maximum Forward Current vs. Ambient Temperature  
800  
600  
Rth=15K/W  
Rth=20K/W  
400  
200  
0
145  
0
30  
60  
90  
120  
Ambient Temperature(C)  
Rev. 01  
August 2011  
7
www.Acriche.com  
Binning Structure  
IF=350mA, Ta=25  
0.42  
0.40  
0.38  
0.36  
0.34  
3700K  
BBL  
4000K  
E9  
E1  
4200K  
E8  
E0  
E2  
4500K  
D9  
4700K  
E3  
E5  
D8  
D0  
D1  
D3  
D5  
D7  
E4  
E6  
E7  
D2  
D4  
D6  
0.34  
0.36  
0.38  
0.40  
CIE X  
* Note  
Red area is ANSI bin.  
Rev. 01  
August 2011  
8
www.Acriche.com  
Color & Binning  
COLOR RANK  
<IF=350mA, Ta=25 >  
CIE x  
CIE y  
CIE x  
CIE y  
0.3548  
0.3536  
0.3625  
0.3641  
0.3641  
0.3625  
0.3714  
0.3736  
0.3536  
0.3524  
0.3608  
0.3625  
0.3625  
0.3608  
0.3692  
0.3714  
0.3524  
0.3512  
0.3590  
0.3608  
0.3736  
0.3646  
0.3711  
0.3804  
0.3804  
0.3711  
0.3775  
0.3874  
0.3646  
0.3555  
0.3616  
0.3711  
0.3711  
0.3616  
0.3677  
0.3775  
0.3555  
0.3465  
0.3521  
0.3616  
0.3608  
0.3590  
0.3670  
0.3692  
0.3512  
0.3497  
0.3575  
0.3590  
0.3590  
0.3575  
0.3650  
0.3670  
0.3562  
0.3548  
0.3641  
0.3661  
0.3661  
0.3641  
0.3736  
0.3760  
0.3616  
0.3521  
0.3578  
0.3677  
0.3465  
0.3385  
0.3441  
0.3521  
0.3521  
0.3441  
0.3489  
0.3578  
0.3826  
0.3736  
0.3804  
0.3900  
0.3900  
0.3804  
0.3874  
0.3974  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
D9  
Rev. 01  
August 2011  
* Measurement Uncertainty of the Color Coordinates :  
0.01  
9
www.Acriche.com  
COLOR RANK  
<IF=350mA, Ta=25 >  
CIE x  
CIE y  
CIE x  
CIE y  
0.3736  
0.3714  
0.3842  
0.3869  
0.3869  
0.3842  
0.3970  
0.4006  
0.3714  
0.3692  
0.3813  
0.3842  
0.3842  
0.3813  
0.3934  
0.3970  
0.3692  
0.3670  
0.3783  
0.3813  
0.3874  
0.3775  
0.3855  
0.3958  
0.3958  
0.3855  
0.3935  
0.4044  
0.3775  
0.3677  
0.3751  
0.3855  
0.3855  
0.3751  
0.3825  
0.3935  
0.3677  
0.3578  
0.3646  
0.3751  
0.3813  
0.3783  
0.3898  
0.3934  
0.3670  
0.3650  
0.3758  
0.3783  
0.3783  
0.3758  
0.3863  
0.3898  
0.3760  
0.3736  
0.3869  
0.3902  
0.3902  
0.3869  
0.4006  
0.4044  
0.3751  
0.3646  
0.3716  
0.3825  
0.3578  
0.3489  
0.3550  
0.3646  
0.3646  
0.3550  
0.3610  
0.3716  
0.3974  
0.3874  
0.3958  
0.4067  
0.4067  
0.3958  
0.4044  
0.4160  
E0  
E1  
E2  
E3  
E4  
E5  
E6  
E7  
E8  
E9  
Rev. 01  
August 2011  
* Measurement Uncertainty of the Color Coordinates :  
0.01  
10  
www.Acriche.com  
Luminous Flux & Forward Voltage  
T1  
T2  
U1  
71~ 80  
80~ 91  
91~ 100  
VF [V]  
Rev. 01  
August 2011  
11  
www.Acriche.com  
Labeling  
Rank :  
1
2
3
# # # #  
4
QUANTITY : 1000  
Lot No : # # # # # # # # #  
SSC PART NUMBER : SZWN5A0A  
SZWN5A0A  
Rank  
#
1
#
2
#
3
#
4
- #1 : Luminous Flux : LF [lm]  
- #2#3 : Color Coordinates : x, y  
- #4 : Forward Voltage : VF [V]  
Rev. 01  
August 2011  
12  
www.Acriche.com  
Emitter Carrier & Reel Packaging  
CATHODE MARK  
22  
13  
Rev. 01  
August 2011  
13  
www.Acriche.com  
Recommended solder pad  
SOLDER PAD  
ISOLATION  
Notes :  
[1] All dimensions are in millimeters.  
[2] Scale : none  
[3] This drawing without tolerances are for reference only  
Rev. 01  
August 2011  
14  
www.Acriche.com  
Reflow Soldering Conditions / Profile  
Tm : Reflow machine setting temp (max 30 sec.)  
Ts : Surface temp of PCB (max)  
260  
Ts : Surface temp of PCB (recommend)  
Ts : Surface temp of PCB (min)  
240  
220  
200  
Cooling  
-5 °C/sec  
Rising  
5 °C/sec  
Pre-heating  
180  
150  
0
Time  
[Hr]  
* Caution  
1. Reflow soldering should not be done more than one time.  
2. Repairs should not be done after the LEDs have been soldered. When  
repair is unavoidable, suitable tools must be used.  
3. Die slug is to be soldered.  
4. When soldering, do not put stress on the LEDs during heating.  
5. After soldering, do not warp the circuit board.  
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.  
Rev. 01  
August 2011  
15  
www.Acriche.com  
Precaution for use  
• Storage  
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box  
with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum  
humidity of 50%.  
• Use Precaution after Opening the Packaging  
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may  
affect the light output efficiency.  
Pay attention to the following:  
a. Soldering should be done immediately after opening the package (within 24Hrs).  
b. Required conditions after opening the package  
- Sealing  
- Temperature : 5 ~ 40  
Humidity : less than 30%  
c. If the package has been opened more than 1 week or the color of the desiccant changes,  
components should be dried for 10-12hr at 60 5  
• Do not apply mechanical force or excess vibration during the cooling process to normal  
temperature after soldering.  
• Do not rapidly cool device after soldering.  
• Components should not be mounted on warped (non coplanar) portion of PCB.  
• Radioactive exposure is not considered for the products listed here in.  
• Gallium arsenide is used in some of the products listed in this publication. These products are  
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to  
drink the liquid or inhale the gas generated by such products when chemically disposed of.  
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.  
When washing is required, IPA (Isopropyl Alcohol) should be used.  
• When the LEDs are in operation the maximum current should be decided after measuring the  
package temperature.  
• LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or  
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used  
for storage.  
• The appearance and specifications of the product may be modified for improvement without  
notice.  
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.  
• The slug is isolated from anode electrically.  
Therefore, we recommend that you don’t isolate the heat sink.  
• Attaching LEDs, do not use adhesives that outgas organic vapor.  
Rev. 01  
August 2011  
16  
www.Acriche.com  
Handling of Silicone resin LEDs  
The Z-Power LED is encapsulated with a silicone resin for the highest flux efficiency.  
Notes for handling:  
• Avoid touching silicone resin parts especially with sharp tools such as Pincette  
(Tweezers)  
• Avoid leaving fingerprints on silicone resin parts.  
• Silicone resin will attract dust so use covered containers for storage.  
• When populating boards in SMT production, there are basically no restrictions  
regarding the form of the pick and place nozzle, except that excessive mechanical  
pressure on the surface of the resin must be prevented.  
• It is not recommend to cover the silicone resin of the LEDs with other resin  
(epoxy, urethane, etc)  
Rev. 01  
August 2011  
17  
www.Acriche.com  
厂商 型号 描述 页数 下载

SEOUL

SZW05A0A [ Single Color LED, Pure White, T-1, 2.9mm, ROHS COMPLIANT, CERAMIC, SMD, 2 PIN ] 19 页

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SEOUL

SZW07A0A [ Single Color LED, Pure White, 5.5mm, ROHS COMPLIANT, SMD, 8 PIN ] 23 页

SEOUL

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SEOUL

SZWW5A0B [ Single Color LED ] 22 页

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