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SZWW4A0A

型号:

SZWW4A0A

品牌:

SEOUL[ Seoul Semiconductor ]

页数:

20 页

PDF大小:

337 K

SZWW4A0A  
Specification  
Features  
• Super high Flux output  
and high Luminance  
• Designed for high  
current operation  
• SMT solderable  
• Lead Free product  
• RoHS compliant  
Description  
The Z-Power series is designed for high current operation and  
high flux output applications.  
It incorporates state of the art SMD design and low thermal  
resistant material.  
Applications  
The Z Power LED is ideal light sources for general illumination  
applications, custom designed solutions, automotive, large  
LCD backlights and high performance torches.  
• Bulb  
* The appearance and specifications of the product can be changed  
for improvement without notice.  
Rev. 01  
January. 2012  
1
www.seoulsemicon.com  
: SSC- QP- 7- 07- 25 (Rev.00)  
[ Contents ]  
1. Description  
------- 1  
------- 3  
------- 4  
------- 5  
------- 6  
------ 13  
------ 15  
------ 16  
------ 17  
------ 18  
------ 20  
2. Full code of Z4 series  
3. Outline demensions  
4. Characteristics of Z4 LED  
5. Characteristic diagrams  
4. Labeling  
5. Reel packing  
6. Recommended solder pad  
7. Soldering profile  
8. Precaution for use  
9. Revision history  
Rev. 01  
January. 2012  
2
www.seoulsemicon.com  
Part Number of Z4 (SZWW4A0A)  
1. Part Number Form : X1X2X3X4X5X6X7X8 – X9X10X11X12X13  
X1  
X2  
Company  
S
Z
W
W
4
A
0
A
-
SSC  
Package series  
Z-Power  
X3  
Color  
Warm White  
X4  
X5  
Z-Power series number  
Lens type  
Z4 series  
X6  
Dome type  
X7  
PCB type  
Emitter  
X8  
Revision No.  
Brightness bin  
Color bin  
Rev0  
X9X10  
X11X12  
X13  
-
-
-
-
VF bin  
-
2. Sticker Diagram on Reel & Aluminum Vinyl Bag  
RANK :  
X
9X  
10X  
11X  
12X13  
QUANTITY : 500  
LOT NUMBER : XXXXXXXXXX-XXX-XXX-XXXXXXX  
SSC PART NUMBER : X  
1X2X3X4X5X6X7X8  
X
1X  
2X  
3X  
4X  
5X  
6X  
7X  
8
Rev. 01  
January. 2012  
3
www.seoulsemicon.com  
Outline dimensions  
Top View  
Bottom View  
Side View  
Circuit  
Notes :  
[1] All dimensions are in millimeters.  
[2] Scale : none  
[3] Undefined tolerance is 0.20mm  
Rev. 01  
January. 2012  
4
www.seoulsemicon.com  
Characteristics of Z4 (SZWW4A0A)  
1. Warm white  
1-1 Electro-Optical characteristics at 120mA  
Value  
Typ  
Parameter  
Symbol  
Unit  
Min  
Max  
[1]  
[2]  
V
Luminous Flux  
100  
lm  
K
[3]  
Correlated Color Temperature  
CRI  
CCT  
Ra  
-
3000  
-
-
80  
8.1  
-
[4]  
Forward Voltage  
VF  
8.6  
9.8  
130  
9.1  
V
Thermal resistance (J to S)  
View Angle  
R
K /W  
deg.  
J-S  
2
½
1-2 Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
Forward Current  
IF  
Pd  
200  
2.0  
mA  
W
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Tj  
125(@ IF 240mA)  
-40 ~ +100  
ºC  
ºC  
ºC  
-
Topr  
Tstg  
-
-40 ~ +100  
[5]  
ESD Sensitivity  
6,000V HBM  
*Notes :  
[1] SSC maintains a tolerance of 10% on flux and power measurements.  
[2] V is the total luminous flux output as measured with an integrating sphere.  
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.  
CCT 5% tolerance.  
[4] Tolerance is 0.06V on forward voltage measurements  
[5] A zener diode is included to protect the product from ESD.  
Rev. 01  
January. 2012  
www.seoulsemicon.com  
5
                              
Color Spectrum TA=25  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
Standard eye response curve  
Z4 Warm white(SZWW4A0A)  
300  
400  
500  
600  
700  
800  
Wavelength [nm]  
Rev. 01  
January. 2012  
6
www.seoulsemicon.com  
Forward Current Characteristics  
Forward Voltage vs. Forward Current, Ta=25  
200  
160  
120  
80  
40  
0
2
4
6
8
10  
12  
Forward Voltage [V]  
Normalized Relative Luminous Flux vs. Forward Current, Ta=25  
2.0  
1.5  
1.0  
0.5  
0.0  
40  
80  
120  
160  
200  
Foward Current [mA]  
Rev. 01  
January. 2012  
7
www.seoulsemicon.com  
Forward Current Characteristics  
CCT vs. Forward Current, Ta=25  
3200  
3100  
3000  
2900  
2800  
2700  
2600  
2500  
40  
80  
120  
160  
200  
Forward Current[A]  
Rev. 01  
January. 2012  
8
www.seoulsemicon.com  
Junction Temperature Characteristics  
Relative Light Output vs. Junction Temperature at IF=120mA  
120  
100  
80  
60  
40  
20  
0
25  
50  
75  
100  
125  
Junction temperature [ ]  
oC  
Forward Voltage Shift vs. Junction Temperature at IF =120mA  
0.0  
-0.2  
-0.4  
-0.6  
-0.8  
-1.0  
-1.2  
-1.4  
-1.6  
-1.8  
-2.0  
25  
50  
75  
100  
125  
Junction temperature [ ]  
oC  
Rev. 01  
January. 2012  
9
www.seoulsemicon.com  
Junction Temperature Characteristics  
Color Coordinate Shift vs Junction Temperature at IF=120mA  
0.46  
0.44  
0.42  
125C  
100C  
80C  
60C  
40C  
25C  
0.40  
0.38  
0.36  
0.40  
0.42  
0.44  
0.46  
0.48  
CIE X  
CCT vs. Junction Temperature at IF=120mA  
3800  
3600  
3400  
3200  
3000  
2800  
2600  
25  
50  
75  
100  
125  
Junction Temperature[ ]  
oC  
Rev. 01  
January. 2012  
10  
www.seoulsemicon.com  
Radiation pattern  
0
1.0  
30  
0.8  
0.6  
0.4  
0.2  
0.0  
60  
90  
-80  
-60  
-40  
-20  
0
Angle(deg.)  
Rev. 01  
January. 2012  
www.seoulsemicon.com  
11  
Maximum Forward Current vs. Ambient Temperature  
240  
200  
160  
120  
RjaT = 15oC/W  
RjaT = 20oC/W  
80  
RjaT = 25oC/W  
40  
0
0
25  
50  
75  
100  
125  
Ambient Temperature [oC]  
160  
120  
80  
40  
0
RjaT = 30oC/W  
RjaT = 40oC/W  
RjaT = 50oC/W  
0
25  
50  
75  
100  
125  
Ambient Temperature [ ]  
oC  
Rev. 01  
January. 2012  
12  
www.seoulsemicon.com  
Label  
RANK :  
QUANTITY : 500  
LOT NUMBER : XXXXXXXXXX-XXX-XXX-XXXXXXX  
SSC PART NUMBER : X  
X
9X  
10  
X
11  
X
12  
X
13  
1X2X3X4X5X6X7X8  
X
1X2X  
3X  
4X  
5
X
6X  
7X  
8
Full code form (SZWW4A0A)  
1. Part Number Form : X1X2X3X4X5X6X7X8 – X9X10X11X12X13  
X1  
X2  
Company  
S
Z
W
W
4
A
0
A
-
SSC  
Package series  
Z-Power  
X3  
Color  
Warm White  
X4  
X5  
Z-Power series number  
Lens type  
Z4 series  
X6  
Dome type  
X7  
PCB type  
Emitter  
X8  
Revision No.  
Brightness bin  
Color bin  
Rev0  
X9X10  
X11X12  
X13  
-
-
-
-
VF bin  
-
Rev. 01  
January. 2012  
13  
www.seoulsemicon.com  
Binning Structure  
IF=120mA, Ta=25  
0.46  
2600K  
2700K  
2900K  
0.44  
0.42  
0.40  
H9  
H8  
H1  
H0  
H3  
H2  
H5  
H4  
H7  
H6  
0.38  
0.36  
0.42  
0.44  
0.46  
0.48  
0.50  
CIE X  
* Note  
Red area is ANSI bin.  
Rev. 01  
January. 2012  
14  
www.seoulsemicon.com  
Emitter Carrier & Reel Packaging  
CATHODE MARK  
22  
13  
Rev. 01  
January. 2012  
15  
www.seoulsemicon.com  
Recommended solder pad  
Temperature  
check point  
Notes :  
[1] All dimensions are in millimeters.  
[2] Scale : none  
[3] This drawing without tolerances are for reference only  
Rev. 01  
January. 2012  
16  
www.seoulsemicon.com  
Reflow Soldering Conditions / Profile  
Tm : Reflow machine setting temp (max 30 sec.)  
Ts : Surface temp of PCB (max)  
Ts : Surface temp of PCB (recommend)  
Ts : Surface temp of PCB (min)  
260  
240  
220  
200  
Cooling  
-5 °C/sec  
Rising  
5 °C/sec  
Pre-heating  
180  
150  
0
Time  
[Hr]  
* Caution  
1. Reflow soldering should not be done more than one time.  
2. Repairs should not be done after the LEDs have been soldered. When  
repair is unavoidable, suitable tools must be used.  
3. Die slug is to be soldered.  
4. When soldering, do not put stress on the LEDs during heating.  
5. After soldering, do not warp the circuit board.  
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.  
Rev. 01  
January. 2012  
17  
www.seoulsemicon.com  
Precaution for use  
• Storage  
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box  
with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum  
humidity of 50%.  
• Use Precaution after Opening the Packaging  
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may  
affect the light output efficiency.  
Pay attention to the following:  
a. Soldering should be done immediately after opening the package (within 24Hrs).  
b. Required conditions after opening the package  
- Sealing  
- Temperature : 5 ~ 40  
Humidity : less than 30%  
c. If the package has been opened more than 1 week or the color of the desiccant changes,  
components should be dried for 10-12hr at 60 5  
• Do not apply mechanical force or excess vibration during the cooling process to normal  
temperature after soldering.  
• Do not rapidly cool device after soldering.  
• Components should not be mounted on warped (non coplanar) portion of PCB.  
• Radioactive exposure is not considered for the products listed here in.  
• Gallium arsenide is used in some of the products listed in this publication. These products are  
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to  
drink the liquid or inhale the gas generated by such products when chemically disposed of.  
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.  
When washing is required, IPA (Isopropyl Alcohol) should be used.  
• When the LEDs are in operation the maximum current should be decided after measuring the  
package temperature.  
• LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or  
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used  
for storage.  
• The appearance and specifications of the product may be modified for improvement without  
notice.  
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.  
• The slug is isolated.  
• Attaching LEDs, do not use adhesives that outgas organic vapor.  
Rev. 01  
January. 2012  
18  
www.seoulsemicon.com  
Handling of Silicone resin LEDs  
The Z-Power LED is encapsulated with a silicone resin for the highest flux efficiency.  
Notes for handling:  
• Avoid touching silicone resin parts especially with sharp tools such as Pincette  
(Tweezers)  
• Avoid leaving fingerprints on silicone resin parts.  
• Silicone resin will attract dust so use covered containers for storage.  
• When populating boards in SMT production, there are basically no restrictions  
regarding the form of the pick and place nozzle, except that excessive mechanical  
pressure on the surface of the resin must be prevented.  
• It is not recommend to cover the silicone resin of the LEDs with other resin  
(epoxy, urethane, etc)  
Rev. 01  
January. 2012  
19  
www.seoulsemicon.com  
Revision Profile  
No  
1
Change Date  
2012.01.26  
Change Issue  
Version  
Rev.1  
Max current ;240mA ->200mA(Page 5)  
Rev. 01  
January. 2012  
www.seoulsemicon.com  
厂商 型号 描述 页数 下载

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