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HYMP31GP72CUP4-C6

型号:

HYMP31GP72CUP4-C6

品牌:

HYNIX[ HYNIX SEMICONDUCTOR ]

页数:

32 页

PDF大小:

250 K

240pin DDR2 MetaSDRAM Registered DIMM based on 1Gb version C  
This Hynix 8GB DDR2 MetaSDRAM Registered DIMM contains standard Hynix C-version 1Gb DDR2  
SDRAMs in Fine Ball Grid Array(FBGA) packages on a 240pin glass-epoxy substrate. The module is capable  
of operating at PC2-4200(DDR2-533) data rate.  
The MetaRAM 8GB DDR2 SDRAM module operates in registered mode, where the address and command  
inputs clocked into register chips on the rising edge of the clock signal. The registered mode adds a one  
clock cycle delay to all the commands. A phase-lock loop (PLL) chip on the module receives the differential  
clock signal from the motherboard and re-drives multiple copies to the register adn buffer chips on the  
module. The register and PLL chips minimize the loading on the address, control, and clock lines on the  
motherboard. The PLL used on the MetaRAM 8GB R-DIMM is fully compliant with the JEDEC specications.  
The MetaRAM 8GB R-DIMM also has an on-board SPD EEPROM. The SPD chip contains 256byte, the first  
128 of which are used by the module vendors to specify information like module type, DRAM organization,  
DRAM timing, and module manufacturer. The last 128 bytes are not programmed, and may be used the  
customer. The SPD chip may be read via a standard I2C bus using the SCL, SDA, and SA[2:O] signals. The  
write protect (WP) pin is tied to ground on the module to enable writes to the SPD.  
The MetaRAM 8GB RDIMM features WakeOneUse power saving technology capable of lowering the power  
consumption of the modules under all workloads. The modules support additive latency (AL). WakeOnUse  
is disabled when additive latency is enabled.  
The 8GB MetaSDRAM RDIMM also provides higher sustained bandwidth than a standard RDIMM. The  
modules are designed with no tFAW restriction (i.e. tFAW = 4 * tRRD). In addition, the MetaSDRAM  
RDIMM provides 0-cycle turnaround for reads to the two ranks of the DIMM. That is, the memory control-  
ler can schedule a read to one rank of a DIMM followed immediately (i.e. with 0-cycle gap or delay) by a  
read to the other rank of the same DIMM. Similarly, the MetaSDRAM RDIMM provides 0-cycle turnaround  
for writes to the two ranks of the DIMM. Since tFAW and intra-DIMM rank-rank turnaround time are not  
part of the DDR2 SPD specification, BIOS must recognize the MetaSDRAM RDIMM at boot time and  
explicitly configure the memory controller to take advantage of the tFAW and 0-cycle rank-rank  
turnaround capabilities of the MetaSDRAM RDIMM. Please refer to the SPD application note on how BIOS  
may recognize a Hynix’s MetaSDRAM RDIMM.  
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  
Rev. 0.2 / Sep. 2008  
1
1240pin DDR2 MetaSDRAM Registered DIMMs  
Features  
240-pin, registered, dual in-line memory module  
Electrically compatible with standard DDR2 R-DIMM interface  
PC2-4200 data transfer rate  
Two independent ranks minimize chip selects  
8 internal device banks per rank for concurrent operation  
Programmable burst length: 4 or 8 for maximum flexibility  
TM  
Features the MetaRAM WakeOnUse active power management  
Supports SECDED error detection and correction  
Supports address parity checking  
TM  
Support for x4 ChipKill  
Additive latency support  
WRITE latency = READ latency - 1 tCK  
0-cycles rank-rank turnaround time for reads  
0-cycles rank-rank turnaround time for writes  
No tFAW restrictions (i.e. tFAW=4*tRRD)  
Differential data strobe (DQS, DQS)  
On-die termination (ODT)  
8192 refresh cycles/ 64ms  
Serial presence-detect(SPD) EEPROM  
RoHS Compliant  
133.35mm x 30.40 mm form factor  
No heat spreader required  
JEDEC-standard 1.8V I/O (SSTL_18 compatible)  
VDD = VDDQ = 1.8V  
VDDSPD = 1.7V to 3.6V  
Rev. 0.2 / Sep. 2008  
2
1240pin DDR2 MetaSDRAM Registered DIMMs  
ORDERING INFORMATION  
# of  
DRAMs  
# of  
ranks  
Parity  
Support  
Part Name  
Density  
Organization  
HYMP31GP72CUP4 - C6  
HYMP31GP72CUP4M - C5  
8GB  
8GB  
1Gbx72  
1Gbx72  
72  
72  
2
2
O
O
SPEED GRADE & KEY PARAMETERS  
C6 (DDR2-533)  
C6 (DDR2-533)  
Unit  
Speed@CL3  
Speed@CL4  
Speed@CL5  
Speed@CL6  
CL-tRCD-tRP  
-
-
-
-
Mbps  
Mbps  
Mbps  
Mbps  
tCK  
533  
-
-
533  
6-6-6  
5-5-5  
ADDRESS TABLE  
# of  
DRAMs  
Refresh  
Method  
Organization Ranks  
SDRAMs  
# of Row/Bank/Column Address  
8GB  
1Gb x 72  
2
512Mb x 4  
36  
15(A0~A14)/3(BA0~BA2)/11(A0~A9,A11)  
8K / 64ms  
Rev. 0.2 / Sep. 2008  
3
1240pin DDR2 MetaSDRAM Registered DIMMs  
PIN DESCRIPTIONS  
Name  
Type  
To / From  
Description  
On-die termination: ODT (registered HIGH) enables termination resistance internal to the buffer chips.  
When enabled, ODT is only applied to the following pins: DQ, DQS, DQS, and CB. The ODT input will be  
ignored if disabled via the LOAD MODE command.  
Input  
(SSTL_18)  
ODT[1:0]  
Register  
Clock: CK and CK are differential clock inputs. All address and control input signals are sampled on the  
crossing of the positive edge of CK and negative edge of CK. Output data (DQ and DQS/DQS) is refer-  
enced th the crossing of CK and CK.  
Input  
(SSTL_18)  
CK0, CK0  
PLL  
Input  
(SSTL_18)  
Clock Enable: CKE (registered HIGH) activates and CKE (registered LOW) de-activates the I/O circuits of  
the DDRs SDRAMs.  
CKE[1:0]  
S0, S1  
Register  
Register  
Register  
Register  
Input  
(SSTL_18)  
Chip Select: S0 and S1 identify valid commands to the register and the DDR2 SDRAMs and differentiate  
ranks within the DIMM.  
RAS, CAS,  
WE  
Input  
(SSTL_18)  
Command inputs: RAS, CAS, WE, and S0 specify the command directed to the DDR2 SDRAMs.  
Input  
(SSTL_18)  
Bank address inputs: BA[2:0] specifies the bank to which the command is directed towards. They also  
specify which mode register is loaded during a LOAD MODE command.  
BA[2:0]  
A[14:0]  
PAR_IN  
Address inputs: A[14:0] specify the row address during an ACTIVE command; A[11, 9:0] specify the col-  
umn address during a READ or WRITE command; A[10] specifies whether the PRECHARGE command  
applies to one bank (A[10] LOW, bank specified by BA[2:0]) or al banks (A[10] HIGH). They also provide  
the op-code during a LOAD MODE command.  
Input  
(SSTL_18)  
Register  
Register  
Input  
(SSTL_18)  
Parity Input: PAR_IN is the parity bit for the address and control bus.  
Serial clock for presence-detect: SCL is used to synchronize the presence-detect data transfer to and  
from the SPD EEPROM.  
SCL  
Input  
Input  
SPD  
SPD  
SA[2:0]  
RESET  
Serial presence-detect address inputs: These pins are used to configure the SPD EEPROM.  
Input (LVC-  
MOS)  
Reset: RESET asynchronously forces all registered outputs LOW when RESET is LOW. This signal can  
be used during power up to ensure that CKE is LOW and all DQ are in the High-Z state.  
Register  
Date strobe: DQS and DQS signals are edge aligned with the read data but are center aligned with the  
write data. DQS signals are used only when the differential strobe mode is enabled via the LOAD MODE  
command.  
DQS[17:0],  
DQS[17:0]  
I/O  
(SSTL_18)  
Buffer  
I/O  
(SSTL_18)  
DQ[63:0]  
CB[7:0]  
SDA  
Buffer  
Buffer  
SPD  
Data: DQ[63:0] are the bi-directional data signals.  
Check bits: CB[7:0] are the ECC bits associated with DQ[63:0] during read ro write operation.  
I/O  
(SSTL_18)  
Serial presence-datect data: SDA is used bi-directionally to transfer address and data between the mem-  
ory controller and the SPD EEPROM.  
I/O  
Output  
(open-  
drain)  
Parity error: This signal is pulled low by the register to indicate a parity error on the address and control  
bus.  
ERR_OUT  
Register  
Buffer,  
DRAM,PLL,  
Register  
Power supply: 1.8V+/- 0.1V.  
VDD  
Power  
Power  
Buffer,  
DRAM  
DQ power supply: 1.8V+/-0.1V.  
VDDQ  
Buffer,  
DRAM, PLL,  
Register  
Reference voltage: SSTL_18 reference voltage.  
VREF  
Power  
Power  
Ground  
VDDSPD  
VSS  
SPD  
SPD EEPROM power supply: 1.7V to 3.6V.  
Ground: 0V.  
Buffer,  
DRAM, PLL,  
Register  
NC  
No connect: These pins should be left unconnected.  
RFU  
Reserved for future use: These pins are reserved for future use.  
Rev. 0.2 / Sep. 2008  
4
1240pin DDR2 MetaSDRAM Registered DIMMs  
PIN LOCATION  
Front Side  
1 pin  
64 pin 65 pin  
120 pin  
184 pin  
240 pin  
185 pin  
121 pin  
Back Side  
Rev. 0.2 / Sep. 2008  
5
1240pin DDR2 MetaSDRAM Registered DIMMs  
PIN ASSIGNMENT  
Pin  
Name  
VREF  
VSS  
Pin  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
Name  
VSS  
CB0  
Pin  
81  
Name  
DQ33  
VSS  
Pin  
121  
122  
123  
124  
125  
126  
127  
128  
129  
130  
131  
132  
133  
134  
135  
136  
137  
138  
139  
140  
141  
142  
143  
144  
145  
146  
147  
148  
149  
150  
151  
152  
153  
154  
155  
156  
157  
158  
159  
160  
Name  
VSS  
Pin  
161  
162  
163  
164  
165  
166  
167  
168  
169  
170  
171  
172  
173  
174  
175  
176  
177  
178  
179  
180  
181  
182  
183  
184  
Name  
CB4  
CB5  
VSS  
DQS17  
DQS17  
VSS  
CB6  
CB7  
VSS  
VDDQ  
CKE1  
VDD  
NC  
Pin  
201  
202  
203  
204  
205  
206  
207  
208  
209  
210  
211  
212  
213  
214  
215  
216  
217  
218  
219  
220  
221  
222  
223  
224  
225  
226  
227  
228  
229  
230  
231  
232  
233  
234  
235  
236  
237  
238  
239  
240  
Name  
VSS  
1
2
82  
DQ4  
DQS13  
DQS13  
VSS  
3
DQ0  
CB1  
83  
DQS4  
DQS4  
VSS  
DQ5  
4
DQ1  
VSS  
DQS8  
DQS8  
VSS  
CB2  
84  
VSS  
5
VSS  
85  
DQS9  
DQS9  
VSS  
DQ38  
DQ39  
VSS  
6
DQS0  
DQS0  
VSS  
86  
DQ34  
DQ35  
VSS  
7
87  
8
88  
DQ6  
DQ44  
DQ45  
VSS  
9
DQ2  
CB3  
89  
DQ40  
DQ41  
VSS  
DQ7  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
DQ3  
VSS  
VDDQ  
CKE0  
VDD  
BA2  
90  
VSS  
VSS  
91  
DQ12  
DQ13  
VSS  
DQS14  
DQS14  
VSS  
DQ8  
92  
DQS5  
DQS5  
VSS  
DQ9  
93  
VSS  
94  
DQS10  
DQS10  
VSS  
A14  
DQ46  
DQ47  
VSS  
DQS1  
DQS1  
VSS  
Err_Out  
VDDQ  
A11  
95  
DQ42  
DQ43  
VSS  
VDDQ  
A12  
96  
97  
RFU  
A9  
DQ52  
DQ53  
VSS  
RESET  
NC  
A7  
98  
DQ48  
DQ49  
VSS  
RFU  
VDD  
A8  
VDD  
A5  
99  
VSS  
VSS  
100  
101  
102  
103  
104  
105  
106  
107  
108  
109  
110  
111  
112  
113  
114  
115  
116  
117  
118  
119  
120  
DQ14  
DQ15  
VSS  
A6  
RFU  
DQ10  
DQ11  
VSS  
A4  
SA2  
VDDQ  
A3  
RFU  
VDDQ  
A2  
NC  
VSS  
VSS  
DQ20  
DQ21  
VSS  
A1  
DQS15  
DQS15  
VSS  
DQ16  
DQ17  
VSS  
VDD  
DQS6  
DQS6  
VSS  
VDD  
Key  
Key  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
VSS  
VSS  
DQS11  
DQS11  
VSS  
185  
186  
187  
188  
189  
190  
191  
192  
193  
194  
195  
196  
197  
198  
199  
200  
CK0  
CK0  
DQ54  
DQ55  
VSS  
DQS2  
DQS2  
VSS  
DQ50  
DQ51  
VSS  
VDD  
VDD  
A0  
PAR_IN  
VDD  
DQ22  
DQ23  
VSS  
DQ60  
DQ61  
VSS  
DQ18  
DQ19  
VSS  
DQ56  
DQ57  
VSS  
VDD  
BA1  
A10/AP  
BA0  
DQ28  
DQ29  
VSS  
VDDQ  
RAS  
S0  
DQS16  
DQS16  
VSS  
DQ24  
DQ25  
VSS  
VDDQ  
WE  
DQS7  
DQS7  
VSS  
CAS  
DQS12  
DQS12  
VSS  
VDDQ  
ODT0  
A13  
DQ62  
DQ63  
VSS  
DQS3  
DQS3  
VSS  
VDDQ  
S1  
DQ58  
DQ59  
VSS  
ODT1  
VDDQ  
VSS  
DQ30  
DQ31  
VSS  
VDD  
VSS  
DQ36  
DQ37  
VDDSPD  
SA0  
DQ26  
DQ27  
SDA  
SCL  
SA1  
DQ32  
NC= No Connect, RFU= Reserved for Future Use.  
Note:  
1. RESET(Pin 18) is connected to both OE of PLL and Reset of register.  
2. NC/Err_out (Pin 55) and NC/Par_In(Pin68) are for optional function to check address and command parity.  
3. The Test pin(Pin 102) is reserved for bus analysis probes and is not connected on normal memory modules(DIMMs)  
Rev. 0.2 / Sep. 2008  
6
1240pin DDR2 MetaSDRAM Registered DIMMs  
FUNCTIONAL BLOCK DIAGRAM  
RODT0  
RCKE0  
RODT1  
RCKE1  
RODT0  
RCKE0  
RODT1  
RCKE1  
RS0  
RS1  
RS0  
RS1  
22Ω  
DQS0  
DQS  
DQS  
DQS9  
DQS  
DQS  
DQS0  
DQ3~0  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS9  
DQ7~4  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
D0  
D1  
D2  
D3  
D4
D18  
D19  
D20  
D21  
D22  
D9  
D27  
D28  
D29  
D30  
D31  
DQS1  
DQS  
DQS  
DQS10  
DQS  
DQS  
DQS1  
DQ11~8  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS10  
DQ15~12  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
D10  
D11  
D12  
D13  
DQS2  
DQS  
DQS  
DQS11  
DQS  
DQS  
DQS2  
DQ19~26  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS11  
DQ23~20  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS3  
DQS  
DQS  
DQS12  
DQS  
DQS  
DQS3  
DQ27~24  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS12  
DQ31~28  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS4  
DQS  
DQS  
DQS13  
DQS  
DQS  
DQS4  
DQ35~32  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS13  
DQ39~36  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
RODT0  
RCKE0  
RODT1  
RCKE1  
RODT0  
RCKE0  
RODT1  
RCKE1  
RS0  
RS1  
RS0  
RS1  
DQS5  
DQS  
DQS  
DQS14  
DQS  
DQS  
DQS5  
DQ43~40  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS14  
DQ47~44  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
D5  
D6  
D7  
D8  
D23  
D24  
D25  
D26  
D14  
D15  
D16  
D17  
D32  
D33  
D34  
D35  
DQS6  
DQS  
DQS  
DQS15  
DQS  
DQS  
DQS6  
DQ51~48  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS15  
DQ55~52  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS7  
DQS  
DQS  
DQS16  
DQS  
DQS  
DQS7  
DQ59~56  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS16  
DQ63~60  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS7  
DQS  
DQS  
DQS16  
DQS  
DQS  
DQS7  
CB3~0  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
DQS16  
CB7~4  
DQS  
DQ3~0  
DM  
DQS  
DQ3~0  
DM  
Sideband signal  
Register  
R0, Back Right  
Address/Control  
R0, Back Left  
Address/Control  
PARIN  
PTYERR  
0Ω  
0Ω  
PAR_IN  
ERR_OUT  
Serial PD  
Register  
PARIN  
PTYERR  
100KΩ  
R0, Front Left  
Address/Control  
R0, Front Right  
Address/Control  
SCL  
SDA  
WP A0 A1 A2  
SA0 SA1 SA2  
Access  
CK0  
CK0  
P
PCK7 -> CK: Register  
PCK7 -> CK: Register  
Manager  
R1, Front Left  
Address/Control  
R1, Front Right  
Address/Control  
L
PCK0-PCK6, PCK8, PCK9 -> CK: SDRAMs D0-D35  
PCK0-PCK6, PCK8, PCK9 -> CK: SDRAMs D0-D35  
L
OE  
RESET  
R1, Back Right  
Address/Control  
R1, Back Left  
Address/Control  
Address/Control  
(From MC)  
Rev. 0.2 / Sep. 2008  
7
1240pin DDR2 MetaSDRAM Registered DIMMs  
POWER-ON RESET SYSTEM REQUIREMENTS  
This section outlines the range of power on system behavior which is guaranteed by design or through testing. Func-  
tional operation of the device at any other conditions beyond those indicated in the following sub-sections is not guar-  
anteed; non-functionality at any other condition is likewise not necessarily implied.  
1. Power-On: Ramp Requirements  
1-1. VDD must ramp from 0 to 1.7V in less than 10ms and no faster than 100us.  
1-2. Power Ramp is considered complete when VDD reaches 1.7V at the DIMM’s edge connector.  
2. Power-On: Initial Conditions  
2-1. RESET# and CKE should be driven low during power-ramp for at least 50ms after Power Ramp is complete.  
2-2. CLK/CLK# may toggle at any frequency up to the maximum DIMM frequency or be left Low/Low.  
2-3. No command can be issued to the DIMM until 200ms after Power Ramp is complete.  
3. Power-On: Exit  
3-1. CKE must not be raised until 20 clocks after RESET# is de-asserted  
3-2. Full JEDEC initialization sequence commands can follow (PRE_ALL, LM, etc.)  
Rev. 0.2 / Sep. 2008  
8
1240pin DDR2 MetaSDRAM Registered DIMMs  
ABSOLUTE MAXIMUM RATINGS  
Stress greater than those listed may cause permanent damage to the device. This is a stress rating only, and device  
functional operation at or above the conditions indicated is not implied. Expousure to absolute maximum rating condi-  
tions for extended periods may affect reliablility.  
Parameter  
DD supply voltage relative to VSS  
VDDQ supply voltage relative to VSS  
DDL supply voltage ralative to VSS  
Symbol  
VDD  
Min  
-0.5  
-0.5  
-0.5  
-0.5  
-55  
0
Max  
2.3  
2.3  
2.3  
2.3  
100  
95  
Unit  
V
V
VDDQ  
VDDL  
VIN, VOUT  
TSTG  
TCASE  
II  
V
V
V
Voltage on any pin relative to VSS  
V
C
Storage temperature  
C
DDR2 SDRAM device perating temperature (2X refresh at 85C)  
-10  
180  
Input leakage current; Any  
input 0V VIN VDD; VREF  
Command/address, RAS, CAS,  
WE, S, CKE, CK, CK, DM  
input 0V VIN 0.95V; all  
other pins not under test = 0V  
IOZ  
-10  
-50  
10  
50  
Output leakage current; 0V ≤  
DQ, DQS, DQS  
VOUT VDDQ; DQs and ODT  
are disabled  
IVREF  
VREF leakage current; VREF = valid VREF level  
OPERATING CONDITIONS  
Parameter  
Symbol  
Rating  
Units  
Notes  
o
T
0 ~ +55  
105 to 69  
0 ~+95  
C
OPR  
DIMM Operating temperature(ambient)  
DIMM Barometric Pressure(operating & storage)  
BAR  
K Pascal  
1
2
P
o
T
DRAM Component Case Temperature Range  
C
CASE  
Note :  
1. Up to 9850 ft.  
2. If the DRAM case temperature is Above 85oC, the Auto-Refresh command interval has to be reduced to  
tREFI=3.9us. For Measurement conditions of TCASE, please refer to the JEDEC document JESD51-2.  
DC OPERATING CONDITIONS (SSTL_1.8)  
Parameter  
Symbol  
VDD/VDDQ  
VREF  
Min  
1.7  
Max  
1.9  
Unit  
V
Note  
1
2
Power Supply Voltage  
Input Reference Voltage  
EEPROM Supply Voltage  
0.49 x VDDQ  
1.7  
0.51 x VDDQ  
3.6  
V
VDDSPD  
VTT  
V
VREF+0.04  
V
3
VREF-0.04  
Termination Voltage  
Note :  
1. VDDQ must be less than or equal to VDD  
.
2. Peak to peak ac noise on VREF may not exeed +/-2% VREF(dc)  
3. VTT of transmitting device must track VREF of receiving device.  
Rev. 0.2 / Sep. 2008  
9
1240pin DDR2 MetaSDRAM Registered DIMMs  
INPUT DC/AC LOGIC LEVEL for Data Inputs, Addresses, CS, PAR_IN  
Parameter  
Input High Voltage  
Input Low Voltage  
AC Input logic High  
AC Input logic Low  
Symbol  
VIH(DC)  
VIL(DC)  
VIH(AC)  
VIL(AC)  
Min  
VREF + 0.125  
-0.3  
Max  
VDD + 0.3  
VREF - 0.125  
-
Unit  
V
Note  
V
V
VREF + 0.250  
-
V
VREF - 0.250  
INPUT DC LOGIC LEVEL for RESET  
Parameter  
Input High Voltage  
Input Low Voltage  
Symbol  
VIH(DC)  
VIL(DC)  
Min  
Max  
-
Unit  
V
Note  
VDD *0.65  
-
VDD *0.35  
V
Rev. 0.2 / Sep. 2008  
10  
1240pin DDR2 MetaSDRAM Registered DIMMs  
AC INPUT TEST CONDITIONS  
Symbol  
VREF  
Condition  
Value  
Units  
Notes  
Input reference voltage  
0.5 * VDDQ  
V
1
VSWING(MAX)  
SLEW  
Input signal maximum peak to peak swing  
Input signal minimum slew rate  
1.0  
1.0  
V
1
V/ns  
2, 3  
Note:  
1. Input waveform timing is referenced to the input signal crossing through the VREF level applied to the device  
under test.  
2. The input signal minimum slew rate is to be maintained over the range from VREF max to VIH(ac) min for rising  
edges and the range from VREF min to VIL(ac) max for falling edges as shown in the below figure.  
3. AC timings are referenced with input waveforms switching from VIL(ac) to VIH(ac) on the positive transitions and  
VIH(ac) to VIL(ac) on the negative transitions.  
Start of Rising Edge Input Timing  
Start of Falling Edge Input Timing  
V
V
V
V
V
V
V
DDQ  
IH(ac)  
IH(dc)  
REF  
min  
min  
V
SWING(MAX)  
max  
max  
IL(dc)  
IL(ac)  
SS  
delta TF  
delta TR  
V
min - V  
REF  
V
-
V
max  
IL(ac)  
IH(ac)  
REF  
Falling Slew =  
Rising Slew =  
delta TR  
delta TF  
< Figure : AC Input Test Signal Waveform >  
Rev. 0.2 / Sep. 2008  
11  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Differential Input AC logic Level  
Note  
Symbol  
Parameter  
Min.  
Max.  
Units  
1
VID (ac)  
0.6  
-
V
ac differential input voltage  
ac differential cross point voltage  
2
VIX (ac)  
0.5 * VDDQ - 0.225  
0.5 * VDDQ + 0.225  
V
1. VIN(DC) specifies the allowable DC execution of each input of differential pair such as CK, CK, DQS, DQS, LDQS,  
LDQS, UDQS and UDQS.  
2. VID(DC) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input (such as  
CK, DQS, LDQS or UDQS) level and VCP is the complementary input (such as CK, DQS, LDQS or UDQS) level. The  
minimum value is equal to VIH(DC) - VIL(DC).  
V
DDQ  
V
TR  
Crossing point  
V
ID  
V
V
IX or OX  
V
CP  
V
SSQ  
< Differential signal levels >  
Note:  
1. VID(AC) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input signal  
(such as CK, DQS, LDQS or UDQS) and VCP is the complementary input signal (such as CK, DQS, LDQS or UDQS).  
The minimum value is equal to V IH(AC) - VIL(AC).  
2. The typical value of VIX(AC) is expected to be about 0.5 * VDDQ of the transmitting device and VIX(AC) is expected to  
track variations in VDDQ . VIX(AC) indicates the voltage at whitch differential input signals must cross.  
DIFFERENTIAL AC OUTPUT PARAMETERS  
Symbol  
Parameter  
Min.  
Max.  
Units  
Note  
VOX (ac)  
0.5 * VDDQ - 0.125  
0.5 * VDDQ + 0.125  
V
1
ac differential cross point voltage  
Note:  
1. The typical value of VOX(AC) is expected to be about 0.5 * VDDQ of the transmitting device and VOX(AC) is expected to  
track variations in VDDQ . VOX(AC) indicates the voltage at whitch differential output signals must cross.  
Rev. 0.2 / Sep. 2008  
12  
1240pin DDR2 MetaSDRAM Registered DIMMs  
OUTPUT BUFFER LEVELS  
Output AC Test Conditions  
Symbol  
Parameter  
Output Timing Measurement Reference Level  
SSTL_18  
Units  
Notes  
VOTR  
0.5 * VDDQ  
V
1
Note:  
1. The VDDQ of the device under test is referenced.  
Output DC Current Drive  
Symbol  
IOH(dc)  
IOL(dc)  
Parameter  
Output Minimum Source DC Current  
Output Minimum Sink DC Current  
SSTl_18  
Units  
Notes  
- 8.0  
8.0  
mA  
mA  
1, 3, 4  
2, 3, 4  
Note:  
1.VDDQ = 1.7 V; VOUT = 1420 mV. (VOUT - VDDQ)/IOH must be less than 21 ohm for values of VOUT between VDDQ and  
VDDQ - 280 mV.  
2. VDDQ = 1.7 V; VOUT = 280 mV. VOUT/IOL must be less than 21 ohm for values of VOUT between 0 V and 280 mV.  
3. The dc value of VREF applied to the receiving device is set to VTT  
4. The values of IOH(dc) and IOL(dc) are based on the conditions given in Notes 1 and 2. They are used to test device  
drive current capability to ensure VIH min plus a noise margin and VIL max minus a noise margin are delivered to an  
SSTL_18 receiver. The actual current values are derived by shifting the desired driver operating point along a 21 ohm  
load line to define a convenient driver current for measurement.  
Output DC Logic Level  
Parameter  
Output High Voltage  
Output Low Voltage  
Symbol  
VOH  
VOL  
Min  
Max  
Unit  
V
Note  
0.5*VDD - 0.125  
-
-
0.5*VDD + 0.125  
V
Rev. 0.2 / Sep. 2008  
13  
1240pin DDR2 MetaSDRAM Registered DIMMs  
PIN Capacitance (VDD=1.8V,VDDQ=1.8V, TA=25oC. f=1MHz )  
8GB : HYMP31GP72CUP4  
Symbol  
Min  
Max  
Unit  
Pin  
pF  
pF  
pF  
pF  
pF  
CK0, CK0  
CCK  
CI1  
TBD  
TBD  
TBD  
TBD  
2.5  
TBD  
TBD  
TBD  
TBD  
3.5  
CKE, ODT  
CS  
CI2  
CI3  
CIO  
Address, RAS, CAS, WE  
DQ, DM, DQS, DQS  
Note :  
1. Pins not under test are tied to GND.  
2. These value are guaranteed by design and tested on a sample basis only.  
Rev. 0.2 / Sep. 2008  
14  
1240pin DDR2 MetaSDRAM Registered DIMMs  
IDD SPECIFICATIONS (TCASE : 0 to 95oC)  
8GB, 1G x 72 Registered DIMM : HYMP31GP72CUP4  
Symbol  
IDD0  
C5(DDR2 533@CL 5)  
C6(DDR2 533@CL 6)  
Unit  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
note  
3187  
3455  
1747  
TBD  
2647  
2107  
3007  
5078  
5008  
5707  
TBD  
5956  
3187  
3411  
1747  
TBD  
2647  
2107  
3007  
5078  
5008  
5482  
TBD  
5956  
IDD1  
IDD2P  
IDD2Q  
IDD2N  
IDD3P  
IDD3N  
IDD4R  
IDD4W  
IDD5  
IDD6  
IDD7  
Note : 1. IDD6 current values are guaranteed up to Tcase of 85oC max.  
Rev. 0.2 / Sep. 2008  
15  
1240pin DDR2 MetaSDRAM Registered DIMMs  
IDD Measurement Conditions  
Symbol  
Conditions  
Units  
t
t
t
t
t
t
Operating one bank active-precharge current; CK = CK(IDD), RC = RC(IDD), RAS = RAS-  
min(IDD);CKE is HIGH, CS is HIGH between valid commands;Address bus inputs are SWITCHING;Data bus  
inputs are SWITCHING  
mA  
IDD0  
IDD1  
Operating one bank active-read-precharge curren ; IOUT = 0mA;BL = 4, CL = CL(IDD), AL = 0;  
t
t
t
t
t
t
t
t
CK = CK(IDD), RC = RC (IDD), RAS = RASmin(IDD), RCD = RCD(IDD) ; CKE is HIGH, CS is HIGH  
between valid commands ; Address bus inputs are SWITCHING ; Data pattern is same as IDD4W  
mA  
t
t
Precharge power-down current ; All banks idle ; CK = CK(IDD) ; CKE is LOW ; Other control and address  
mA  
mA  
mA  
IDD2P  
IDD2Q  
IDD2N  
bus inputs are STABLE; Data bus inputs are FLOATING  
t
t
Precharge quiet standby current;All banks idle; CK = CK(IDD);CKE is HIGH, CS is HIGH; Other control  
and address bus inputs are STABLE; Data bus inputs are FLOATING  
t
t
Precharge standby current; All banks idle; CK = CK(IDD); CKE is HIGH, CS is HIGH; Other control and  
address bus inputs are SWITCHING; Data bus inputs are SWITCHING  
t
t
mA  
mA  
Active power-down current; All banks open; CK = CK(IDD); CKE is LOW;  
Other control and address bus inputs are STABLE; Data bus inputs are  
FLOATING  
Fast PDN Exit MRS(12) = 0  
Slow PDN Exit MRS(12) = 1  
IDD3P  
IDD3N  
IDD4W  
IDD4R  
t
t
t
t
t
t
Active standby current; All banks open; CK = CK(IDD), RAS = RASmax(IDD), RP = RP(IDD); CKE is  
HIGH, CS is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data  
bus inputs are SWITCHING  
mA  
mA  
mA  
t
Operating burst write current; All banks open, Continuous burst writes; BL = 4, CL = CL(IDD), AL = 0; CK =  
t
t
t
t
t
CK(IDD), RAS = RASmax(IDD), RP = RP(IDD); CKE is HIGH, CS is HIGH between valid commands;  
Address bus inputs are SWITCHING; Data bus inputs are SWITCHING  
Operating burst read current; All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(IDD),  
t
t
t
t
t
t
AL = 0; CK = CK(IDD), RAS = RASmax(IDD), RP = RP(IDD); CKE is HIGH, CS is HIGH between valid  
commands; Address bus inputs are SWITCHING;; Data pattern is same as IDD4W  
t
t
t
Burst refresh current; CK = CK(IDD); Refresh command at every RFC(IDD) interval; CKE is HIGH, CS is  
HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are  
SWITCHING  
IDD5B  
IDD6  
mA  
mA  
Self refresh current; CK and CK at 0V; CKE 0.2V; Other control and address bus inputs are FLOATING;  
o
Data bus inputs are FLOATING. IDD6 current values are guaranted up to Tcase of 85 C max.  
Operating bank interleave read current; All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL  
t
t
t
t
t
t
t
t
t
t
= RCD(IDD)-1* CK(IDD); CK = CK(IDD), RC = RC(IDD), RRD = RRD(IDD), RCD = 1* CK(IDD); CKE is  
HIGH, CS is HIGH between valid commands; Address bus inputs are STABLE during DESELECTs; Data pat-  
tern is same as IDD4R; - Refer to the following page for detailed timing conditions  
IDD7  
mA  
Note:  
1. IDD specifications are tested after the device is properly initialized  
2. Input slew rate is specified by AC Parametric Test Condition  
3. IDD parameters are specified with ODT disabled.  
4. Data bus consists of DQ, DM, DQS, DQS, RDQS, RDQS, LDQS, LDQS, UDQS, and UDQS. IDD values must be met with all combina-  
tions of EMRS bits 10 and 11.  
5. Definitions for IDD  
LOW is defined as Vin VILAC(max)  
HIGH is defined as Vin VIHAC(min)  
STABLE is defined as inputs stable at a HIGH or LOW level  
FLOATING is defined as inputs at VREF = VDDQ/2  
SWITCHING is defined as:  
Rev. 0.2 / Sep. 2008  
16  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Memory Timing Parameters**  
DDR2-533 @ 5-5-5 ¹  
DDR2-533 @ 6-6-6  
clocks  
PARAMETER  
ns  
clocks  
ns  
3.75  
22.5  
30  
tCK  
tCAS (CL)  
tFAW ²  
tCCD  
tRAS  
3.75  
18.75  
30  
1
5
1
6
8
8
7.5  
2
7.5  
2
41.25  
60  
11  
16  
5
48.25  
71.25  
22.5  
195  
22.5  
7.5  
13  
19  
6
tRC  
tRCD  
tRFC  
18.75  
195  
52  
5
52  
6
tRP  
18.75  
tRRD  
tRTP  
tWR  
7.5  
7.5  
2
2
4
3
2
2
4
2
7.5  
15  
15  
tWTR  
11.25  
7.5  
Note :  
1) Must use Additive Latency  
2) MetaRAM 8GB R-DIMM can support a tFAW=4*tRRD. Since tFAW is not an SPD parameter, the BIOS must explicitly configure  
the memory controoler to not use any tFAW restriction when accessing a MetaSDRAM RDIMM.  
** For details and notes, please refer to the relevant HYNIX component datasheet: HY5PS1G831CUP.  
Rev. 0.2 / Sep. 2008  
17  
1240pin DDR2 MetaSDRAM Registered DIMMs  
MetaRAM 8GB DDR2 SDRAM Registered DIMM  
CLK  
tRC=16  
CMD_DIMM  
ACT(n) READ  
Register_Latency  
ACT(n) READ  
ACT(n)  
CMD_DRAM  
DATA_DIMM  
ACT(n)  
RL=tAL + tCAS = 9  
D0 D1 D2 D3  
Figure 1: DRAM Posted-CAS Read (with Auto-precharge) Timing Example (DDR2-533 @ 5-5-5)  
CLK  
CMD_DIMM  
ACT(n)WRITE  
ACT(n)  
tWR=4  
tRP=5  
Register_Latency  
CMD_DRAM  
DATA_DIMM  
ACT(n)WRITE  
ACT(n)  
WL = tAL + tCAS - 1 = 8  
D0 D1 D2 D3  
Figure 2: DRAM Posted-CAS Write (with Auto-precharge) Timing Example (DDR2-533 @ 5-5-5)  
Rev. 0.2 / Sep. 2008  
18  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Flow Controller Description  
The metaRAM Flow Controller FC530/FC540 is an important component of the MetaRAM chipset that  
enable DRAM and DIMM Manufacturers to build high density DIMMs using mainstream DDR2 SDRAM  
devices. It controls the flow of data into and out of the DRAM devices. It also implements all of the I/O fucn-  
tions(like On Die Termination) of a standard DDR2 SDRAM device as specified by JEDEC. This ensures  
full compatibility with the DDR2 RDIMM JEDEC specifications. The FC530/FC540 is designed to provide  
up to 16 ports, each of which is capable of connecting to a 4-bit wide standard DDR2 SDRAM devices. The  
I/O circuits are optimized to drive the interconnect and loads on the high density R-DIMM. The FC 530/FC  
540 supports PC2-4200 (DDR2-533) and PC2-5300(DDR2-667) speeds.  
Part Numbers  
Latency  
Part Number  
DIMM DENSITY  
8GB  
Data Rate ( MT/s )  
( CL - tRCD - tRP )  
5-5-5, 6-6-6  
6-6-6  
FC530-A  
FC530-B  
FC540-A  
FC540-B  
533  
667  
533  
667  
8GB  
16GB  
6-6-6  
16GB  
6-6-6  
Rev. 0.2 / Sep. 2008  
19  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Logic Symbol  
MC_DQ[15:0]  
MC_DQS[3:0]  
CLK[3:0]  
CLK[3:0]  
MC_DQS[2:0]  
A_DQ0B[3:0]  
A_DQS0  
MC_CLK  
MC_CLK  
MC_ODT0  
MC_ODT1  
C_DQ1B[3:0]  
C_DQS1  
MC_RESET  
A_DQ2B[3:0]  
A_DQS2  
SB_CMD[2:0]  
C_DQ3B[3:0]  
C_DQS3  
C_DQ4B[3:0]  
C_DQS4  
OSCIN  
P_CLK  
CDI  
CDO  
CEI  
CEO  
MM  
POR  
P_CS  
A_DQ5B[3:0]  
A_DQS5  
C_DQ6B[3:0]  
C_DQS6  
A_DQ7B[3:0]  
FC5xx  
SET[1:0]  
CALIB[1:0]  
A_DQS7  
TMS  
TCK  
TDI  
D_DQ8B[3:0]  
D_DQS8  
TDO  
B_DQ9B[3:0]  
B_DQS9  
D_DQ10B[3:0]  
D_DQS10  
B_DQ11B[3:0]  
B_DQS11  
B_DQ12B[3:0]  
B_DQS12  
VREF[0]  
VREF[1]  
VREF[2]  
VDDA  
D_DQ13B[3:0]  
D_DQS13  
VDD  
B_DQ14B[3:0]  
B_DQS14  
D_DQ15B[3:0]  
D_DQS15  
VSSA  
VSS  
Rev. 0.2 / Sep. 2008  
20  
1240pin DDR2 MetaSDRAM Registered DIMMs  
161-ball FBGA Ball Map  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
C_DQ3 C_DQ3  
C_  
DQS3  
C_DQ3 C_DQ3 C_DQ6 C_DQ6  
C_  
C_  
C_DQ1 C_DQ1  
A_DQ2 A_DQ2  
B[3] B[2]  
A_  
DQS2  
A_DQ2 A_DQ2 A_DQ7 A_DQ7  
A_  
A_  
A_DQ0 A_DQ0  
VDD  
A
B
C
D
E
F
B[3]  
B[2]  
B[1]  
B[0]  
B[3]  
B[2]  
DQS6 DQS1  
B[1]  
B[20]  
B[1]  
B[0]  
B[3]  
B[2]  
DQS7 DQS0  
B[1]  
B[0]  
C_DQ4 C_DQ4 C_DQ4  
C_DQ4 C_DQ1  
C_DQ1 C_DQ6  
B[2]  
C_DQ6  
B[0]  
A_DQ5 A_DQ5 A_DQ5 MC_ A_DQ5 A_DQ0  
A_DQ0 A_DQ7  
A_DQ7  
B[0]  
VSS  
B[3]  
B[2]  
B[1]  
B[0]  
B[3]  
SET[0] SET[1]  
B[1]  
CEI  
B[3]  
B[2]  
B[1]  
ODT1  
VDD  
MC_  
B[0]  
B[3]  
TCK  
MC_  
B[2]  
TMS  
MC_  
B[1]  
VREF CALIB  
C_  
DQS4  
SB_  
CMD[1]  
MC_RE  
SET# DQS5  
A_  
CLK1#  
VSS  
CLK0#  
CLK0  
VDD  
[1]  
[1]  
CALIB MC_  
[0]  
MC_  
MC_  
MC_  
MC_  
CLK  
VREF  
[2]  
MC_  
DQ[6] DQ[5]  
MC_  
CLK1  
VDD  
VDD  
VDDA  
CDO  
VDD  
DQ[15] DQ[13]  
DQ[1] DQ[9]  
DQ[3] DQ[1]  
MC_ MC_D  
DQS[3] QS#[3]  
MC_  
MC_D  
MC_  
CLK#  
MC_  
DQS[1] QS#[1]  
MC_D  
MC_  
DQS[0] QS#[0]  
MC_D  
VSS  
P_CS#  
TDO  
VSSA  
CEO  
MM  
VSS  
VSS  
DQS[2] QS#[2]  
MC_  
DQ[14] DQ[12]  
MC_  
MC_  
DQ[11] DQ[8]  
MC_  
SB-  
PLLCL PLLCL  
MC_  
MC_  
MC_  
DQ[2] DQ[0]  
MC_  
CLK2  
CLK2#  
VSS  
VDD  
VSS  
P_CLK  
CLK3  
CLK3#  
CMD[2]  
K
K#  
ODT0 DQ[7] DQ[4]  
D_  
DQS15  
SB_  
CMD[0]  
B_  
DQS14  
CDI  
OSCIN  
TDI  
G
H
J
D_DQ1 D_DQ D_DQ1  
5B[3] 15B[2] 5B[1]  
D_DQ1 D_DQ1 VREF D_DQ1 D_DQ1  
D_DQ1  
3B[0]  
B_DQ1 B_DQ1 B_DQ1  
B_DQ1 B_DQ1  
B_DQ1 B_DQ1  
1B[2]  
B_DQ1  
2B[0]  
VSS  
VSS  
POR#  
5B[0]  
0B[3]  
[0]  
0B[2]  
3B[1]  
4B[3]  
4B[2]  
4B[1]  
4B[0]  
1B[3]  
2B[1]  
D_DQ8 D_DQ8  
B[3] B[2]  
D_  
DQS8  
D_DQ8 D_DQ8 D_DQ1 D_DQ1  
B[1] B[0] 3B[3]  
D-  
D_  
D_DQ1 D_DQ1  
0B[0]  
B_DQ9 B_DQ9  
B[3] B[2]  
B_  
DQS9  
B_DQ9 B_DQ9 B_DQ1 B_DQ1  
B[1] B[0] 2B[3]  
B_  
B_  
B_DQ1 B_DQ1  
1B[0]  
VDD  
3B[2] DQS13 DQS10 0B[1]  
2B[2] DQS12 DQS11 1B[1]  
Rev. 0.2 / Sep. 2008  
21  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Ball Description  
Symbol  
VDD  
Type  
Fuction / D  
Quantity  
Supply  
Digital Power Supply:1.8V +/- 0.1V  
8
9
3
1
1
VSS  
Supply  
Digital ground  
VREF  
Supply  
Supply  
Supply  
Reference Voltage: SSTL_18 reference voltage  
Analog Power Supply:1.8V +/-0.1V  
Analog Ground  
VDDA  
VSSA  
Memory Controller Data Input/Output: These are the bi-directional  
data strobe signals that connect to the memory controller.  
MC_DQ[15:0]  
I/O  
I/O  
16  
8
MC_DQS[3:0]  
MC_DQS[3:0]#  
Memory Controller Data Strobes: These are the bi-directional data  
strobe signals that connect to the memory controller  
Memory Controller Clocks: These are differential clock inputs.  
The output data(DQS and DQS/DQS#) is referenced to the  
crossing of CLK and CLK#.  
MC_CLK, MC_CLK#  
MC_ODT0, MC_ODT1  
MC_RESET#  
Input  
Input  
Input  
2
2
1
Memory Controller On-Die Terminations: MC_ODT(registered  
HIGH) enables the on-die termination resisters in the MetaRAM  
flow controller. When enabled, ODT is only applied to each of the  
following pins: MC_DQS, and MC_DQS#.  
The ODT input will be ignored if disabled via the LOAD MODE  
command.  
Memory Controller Reset: This input asynchronously forces all  
registered outputs LOW when it is LOW. This signal can be used  
during power up to ensure that MC_CKE is LOW.  
Clocks: These are 4 differential clock output pairs. Each pair can  
drive the Clock pins of up to 4 DDR2 SDRAM devices that  
are connected to the Flow Controller.  
CLK[3:0], CLK[3:0]#  
Output  
I/O  
8
Data Buses: These are the bi-directional data signal of the 16port  
. Each port can connect to one 4-bit wide, DDR2 SDRAM device  
(A/B/C/D)_DQ[15:0]B[3:0]  
(A/B/C/D)_DQS[15:0]  
64  
16  
Data Strobe: These are the bi-directional data strobe signals of  
16ports. Each port can connect to one 4-bit wide, DDR2 SDRAM  
device.  
I/O  
Side Band Signals: These side band signals are used for  
communication between the MetaRAM Access Manager and  
MetaRAM Flow Controller on the DIMM.  
SB_CMD[2:0]  
Input  
3
Oscillator Input: 25MHz Crystal generated CLK or P_CLK  
regenerated CLK.  
OSCIN  
P_CLK  
Input  
1
1
Output  
PROM Clock: Regenerated 25MHz CLK  
Rev. 0.2 / Sep. 2008  
22  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Ball Description  
Symbol  
CDI  
Type  
Input  
Fuction / Description  
Quantity  
PROM Configuration Data Input: This pin receives the configura-  
tion data bits from the upstream MetaRAM device or the configu-  
ration PROM  
1
CDO  
CEI  
Output  
Input  
PROM Configuration Data Output: This pin provides the configu-  
ration data bits for the downstream MetaRAM device.  
1
1
PROM Configuration Enable Input: This pin is asserted by the  
upstream MetaRAM device to frame the valid configuration bits.  
CEO  
Output  
PROM Configuration Enable Output: This pin is assertd by the  
Flow controller to frame the valid configuration bits being shifted  
to the downstream Metaram device.  
1
MM  
Input  
Master Mode: This pin is used to select which device in the Met-  
aRAM chipset will behave as the master PROM controller. This  
pin should be tied to VDD on the device that is the master PROM  
controller, and should be tied to GND on all the other devices in  
the chipset.  
1
PLLCLK, PLLCLK#  
Output  
PLL Clock Test Pins: These pins are used to verify the operation  
of the internal PLL. Special care must be paid to the layout pf  
these pins since they are susceptible to picking up noise from the  
PCB. Please see the section on PCB Layout requirements for  
guidelines on decoupling these pins from the system.  
2
POR#  
Input  
Power On Reset: This input is used to asynchroniusly reset the  
internal state of the Flow Controller.  
1
1
P_CS#  
Output  
PROM Chip Select: This pin is asserted by the master PROM  
controller to initiate the reading of the configuration bits stored in  
the PROM. This pin should be left unconnected(floating) on all  
the MetaRAM devices that are not the master PROM controller.  
CALIB[1:O]  
SET[1:O]  
Input  
Input  
Calibration: These signal are used to calibrate the internal cir-  
cuitry of the chip. Please see the section on PCB Layout require-  
ments for connection guidelines  
2
2
Set up: These signals are used to configure the internal circuitry  
of the chips. Please refer to the relevant Metaram application  
note or reference schematic for the wiring of these inputs  
TCK  
TDI  
Input  
Input  
Input  
Output  
-
JTAG Test Clock: This pin should be left unconnected(floating)  
on the DIMM  
1
1
1
1
JTAG Test Data In: This pin should be left unconnected(floating)  
on the DIMM  
TMS  
TDO  
NC  
JTAG Test Mode Select: This should be left unconnected(float-  
ing) on the DIMM  
JTAG Test Data Out: This pin should be left unconnected(float-  
ing) on the DIMM  
No Connect Pins: These pins must be left unconnected  
TOTAL  
0
161  
Rev. 0.2 / Sep. 2008  
23  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Pin Configuration & Address Table for MetaSDRAM DDP  
7
8
3
9
1
2
VSSQ  
DQS_0  
VSS  
VDDQ  
VDD  
DQ1_1  
VDDQ  
DQ3_1  
VDDL  
DQS_1  
A
B
C
DQS_0  
VDDQ  
DQ2_0  
VSSDL  
RAS  
VSSQ  
DQ0_0  
VSSQ  
CK  
DQS_1  
VDDQ  
DQ3_0  
VSS  
DQ0_1  
VDDQ  
DQ2_1  
VDD  
VSSQ  
DQ1_0  
VSSQ  
VREF  
CKE  
D
E
F
G
H
J
CK  
WE  
ODT  
CAS  
A2  
CS  
A0  
BA1  
A1  
BA2  
VSS  
VDD  
BA0  
A10  
A3  
VDD  
VSS  
A6  
A4  
A5  
K
A11  
RFU  
A8  
A9  
A7  
L
A13  
A14  
A12  
ROW AND COLUMN ADDRESS TABLE  
ITEMS  
256Mx8  
# of Bank  
8
Bank Address  
BA0,BA1,BA2  
A10/AP  
Auto Precharge Flag  
Row Address  
A0 - A14  
A0-A9, A11  
1 KB  
Column Address  
Page size  
Rev. 0.2 / Sep. 2008  
24  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Access Manager Description  
The MetaRAM Access Manager AM150/AM160 is an integral component of the MetaRAM  
chipset that enables DRAM and DIMM manufacturers to build high density, 1-rank and 2-rank  
DIMMs using mainstream DDR2 SDRAM devices. It integrates the functions of the JEDEC stan-  
dard register chip and manages the accesses to the DRAM devices on the DIMM in order to  
ensure full compatibility with the DDR2 R-DIMM JEDEC specifications.  
The AM150/AM160 is designed to drive up to 72 DRAM devices on a DIMM using 8 address  
buses. Custom I/O circuits are used to ensure good signal integrity, low power dissipation, and  
high operating speeds. It supports PC2-4200 (DDR2-533) and PC2-5300 (DDR2-667) data rates.  
Part Numbers  
Latency  
Part Number  
DIMM DENSITY  
8GB  
Data Rate ( MT/s )  
( CL - tRCD - tRP )  
5-5-5, 6-6-6  
6-6-6  
AM150-A  
AM150-B  
AM160-A  
AM160-B  
533  
667  
533  
667  
8GB  
16GB  
6-6-6  
16GB  
6-6-6  
Rev. 0.2 / Sep. 2008  
25  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Logic Symbol  
MC_A[15:0]  
MC_BA[2:0]  
A0_A[13:0]  
A0_BA[2:0]  
MC_CAS  
MC_RAS  
MC_WE  
MC_CS0  
MC_CS1  
MC_CKE0  
MC_CKE1  
MC_CLK  
A0_CAS  
A0_RAS  
A0_WE  
A0_CS  
A0_HICKE  
A0_LOCKE  
A1_A[13:0]  
A1_BA[2:0]  
A1_CAS  
A1_RAS  
A1_WE  
MC_CLK  
MC_ODT0  
MC_ODT1  
MC_PAR_IN  
A1_CS  
MC_RESET  
MC_EER_OUT  
SB_CMD[2:0]  
A1_HICKE  
A1_LOCKE  
A2_A[13:0]  
ODT_OUT[1:0]  
A2_BA[2:0]  
OSCIN  
P_CLK  
CDI  
A2_CAS  
A2_RAS  
A2_WE  
CDO  
A2_CS  
CEI  
CEO  
MM  
POR  
P_CS  
A2_HICKE  
A2_LOCKE  
A3_A[13:0]  
A3_BA[2:0]  
A3_CAS  
A3_RAS  
A3_WE  
AM1xx  
SET[1:0]  
CALIB[1:0]  
A3_CS  
TMS  
TCK  
TDI  
A3_HICKE  
A3_LOCKE  
A4_A[13:0]  
TDO  
A4_BA[2:0]  
A4_CAS  
A4_RAS  
A4_WE  
A4_CS  
A04_ECCCKE  
A15_ECCCKE  
A26_ECCCKE  
A37_ECCCKE  
A4_HICKE  
A4_LOCKE  
A5_A[13:0]  
A7_A[13:0]  
A7_BA[2:0]  
A7_CAS  
A7_RAS  
A7_WE  
A5_BA[2:0]  
A5_CAS  
A5_RAS  
A5_WE  
A5_CS  
A5_HICKE  
A5_LOCKE  
A6_A[13:0]  
A7_CS  
A7_HICKE  
A7_LOCKE  
VREF[0]  
VREF[1]  
VREF[2]  
VDDA  
A6_BA[2:0]  
A6_CAS  
A6_RAS  
A6_WE  
VDD  
A6_CS  
A6_HICKE  
A6_LOCKE  
VSSA  
VSS  
Rev. 0.2 / Sep. 2008  
26  
1240pin DDR2 MetaSDRAM Registered DIMMs  
371-ball FBGA Ball Map  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
A3_A A3_BA  
A3_  
WE#  
A2_  
CS#  
A7_  
A6_  
A04_E  
A0_  
A3_  
A0_  
A2_  
A[10]  
A2_  
BA[0]  
A2_  
WE#  
VDD A1_A[7] A3_A[5] A1_A[3]  
VDD  
VDD  
A0_A[1] VDD  
A0_A[7] A2_A[5]  
A
B
C
D
E
[10]  
[1]  
CS# LOCKE CCCKE  
LOCKE LOCKE A[10]  
A3_  
BA[1]  
A5_  
CS#  
A3_ A5_ A37_E  
CS# HICKE CCCKE HICKE  
A0_  
A2_  
HICKE WE#  
A0_  
A2_  
A[13]  
A2_  
A0_  
A3_A[9] VDD A1_A[5] A3_A[3] A3-A[1] A1_A[1]  
VDD  
VDD  
A2_A[3] A2_A[1] A0_A[3] VDD  
A[11]  
A[12]  
A3_  
A[12]  
A1_  
A[12]  
A1_  
A[10]  
A1_  
WE#  
A6_  
CS# HICKE  
A4_  
A15_E  
CCCKE  
A0_  
VSS  
A4_  
VSS A3_A[7]  
VSS  
A2_A[5]  
A0_A[5] VSS A0_A[9]  
CAS#  
BA[2]  
A3_  
CAS# RAS#  
A2_  
A1_  
BA[0]  
A1_  
BA[2]  
A5_  
LOCKE  
A2_  
LOCKE  
A0_  
BA[1]  
A2_  
BA[2]  
A1_A[2]  
VSS  
A1_A[9]  
VSS  
VSS  
VSS A2_A[5]  
A3_  
BA[0]  
A3_  
BA[2]  
A0_  
VDD  
CS#  
A26_E  
CCCKE  
A0_  
A[10]  
A2_  
BA[1] RAS#  
A0_  
A3_A[2] A1_A[0]  
A3_A[6] VDD  
A2_A[7]  
VDD  
A0_A[2]  
A2_A[4]  
A7_  
A3_A[0]  
A3_  
A[13]  
A1_  
A[13]  
A1_  
CS#  
A7_  
HICKE  
A1_  
HICKE A[12]  
A2_  
A0_  
A2_  
CAS#  
A0_  
A[13]  
A0_  
A[11]  
A6_  
CAS# RAS#  
A6_  
F
VDD A1_A[6]  
A3_  
VDD  
A6_  
A2_A[0]  
CAS#  
VDD  
A2_A[2]  
A[13]  
A3_  
A[11]  
A1_  
A[11]  
A1_  
A4_  
A4_  
A7_  
A1_ A3_  
A2_  
RAS#  
A4_  
VDD  
RAS#  
VDD A1_A[4]  
A3_A[4] A3_A[8]  
A2_A[9] A0-A[0] A0_A[6] A0_A[4]  
A6_A[8] A4_A[0]  
G
H
J
RAS# CAS#  
CS# LOCKE LOCKE HICKE LOCKE HICKE  
A5_  
VDD  
A[13]  
VDD A4_A[2]  
A5_A[8] A1-A[8] VSS  
VSS A4_A[4] A6-A[0]  
V0_A[5] A6_A[0]  
A5_  
A7_A[8]  
VSS  
VDD  
VDD  
VSS  
VDD  
VDD  
VDD  
VDD  
VSS  
VDD  
VDD  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VDD  
VDD  
VSS  
VDD  
VDD  
VDD  
VDD  
VSS  
VDD  
VDD  
VSS  
K
L
A[11]  
A7_  
A5_  
VDD  
VDD  
VSS  
VDD  
VSS  
VSS  
VDD  
VSS  
VDD  
VDD  
A4_A[6] A6_A[4]  
A[11]  
A[11]  
A7_A[6] A7_A[4]  
A5_A[6] A5_A[0]  
A4_A[8] A6_A[6]  
M
N
P
A4_  
A[13]  
A4_  
A[11]  
A6_  
A[11]  
A6_  
A[13]  
A7_A[0] A7_A[2]  
A7_  
VSS  
VSS  
A4_  
A[12]  
A6_  
WE#  
A5_A[2] VSS  
VSS  
R
T
CAS#  
A7_  
RAS#  
VREF VREF  
[2]  
VDD  
RFU  
VDD A4_A[9]  
[1]  
A7_  
A[12]  
A7_  
A[10]  
CALIB VREF  
[0] [0]  
A5_  
WE#  
PLLCL PLLCL  
CALIB  
[1]  
A6_  
BA[0]  
A6_  
VDD  
BA[1]  
U
V
VDD  
P_CS#  
TDO  
CDI  
CEI  
NE  
CEO P_CLK TMS  
TCK  
K
K#  
A5_  
CAS#  
A5_  
RAS# BA[0]  
A7-  
SB_  
CMD[2]  
A4_  
BA[2]  
A4_  
WE#  
A7_A[9]  
A7_A[7]  
VDD SET[0]  
VDD  
NC  
NC  
MM  
OSCIN VDD  
A4_A[3] A4_A[7] A4_A[5]  
A5_  
A[12]  
A7_  
VDD  
BA[1]  
A7_  
BA[2]  
A5_  
BA[2]  
SB_  
CMD[1]  
A6_  
BA[2]  
A6_  
A4_A[1] A6_A[1]  
A[10]  
VDD  
NC  
CDO  
VDD  
TDI  
POR#  
W
Y
A5-  
BA[0]  
SB_  
CMD[0]  
A4_  
BA[0]  
A5_A[7] A5_A[9] A7_A[5] VSS  
SET[1] VSS  
NC  
VSS  
VSS A6_A[5]  
A4_  
A7_  
A5_A[5] A5_A[3] VSS  
WE#  
MC_  
A[15]  
MC_  
A[14]  
MC_  
VSS  
MC_  
A[2]  
MC_RE  
SET#  
MC_  
ODT0  
MC_  
S0#  
A6_  
A[12]  
VSS  
VSS  
A6_A[3]  
AA  
AB  
A[5]  
A[10]  
A5_  
A[11]  
A5-  
BA[1]  
MC_  
BA[2]  
MC_  
A[11]  
MC_  
A[7]  
MC_  
A[6]  
MC_  
A[3]  
MC_  
A[0]  
MC_  
CK0  
MC_ER MC_  
R_OUT A[10]  
MC_  
BA[0]  
MC_  
WE#  
MC_  
CAS#  
MC_  
CKE1  
A4_  
BA[1]  
A7_A[3] VDD  
VDD A7_A[1]  
VDD  
VDDA  
VDD  
VDD  
A6_A[7]  
A5_  
A[10]  
MC_PA MC_  
R_IN A[12]  
MC_  
A[9]  
MC_  
A[8]  
MC_  
A[4]  
MC_  
A[1]  
MC_  
CK0#  
ODT_  
MC_  
ODT_  
MC_  
MC_  
MC_  
CKE0  
MC_  
A[13]  
MC_  
S1#  
A6_  
A[9]  
VDD  
VSSA  
VDD  
VDD  
AC  
OUT[1] ODT1 OUT[0] BA[1] RAS#  
Rev. 0.2 / Sep. 2008  
27  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Ball Description  
Symbol  
VDD  
Type  
Fuction / Description  
Digital Power Supply:1.8V +/- 0.1V  
Quantity  
Supply  
Supply  
Supply  
Supply  
Supply  
58  
57  
3
VSS  
Digital ground  
VREF[2:0]  
VDDA  
VSSA  
Reference Voltage: SSTL_18 reference voltage  
Analog Power Supply:1.8V +/-0.1V  
Analog Ground  
1
1
Address Buses [7:0]: These signals are the Row/Column address  
bits for the 8 address buses, which are labeled A0 through A7.  
The 14 address pins in each address bus provide support for  
512Mb DRAM devices and 1Gb DRAM devices.  
A[7:0]_A[13:0]  
A[7:0]_BA[2:0]  
Output  
112  
Bank Address Buses [7:0]: These signals are the Bank address  
bits for the 8 address buses, which are labeled A0 through A7.  
The 3 bank address pins in each address bus provide support for  
DRAM devices with 4 banks and DRAM devices with 8 banks.  
Output  
Output  
Ouput  
24  
24  
8
Commands: RAS#, CAS# and WE# (along with CS#) define the  
command associated with the corresponding address bus.  
A[7:0]_CAS#  
A[7:0]_RAS#  
A[7:0]_WE#  
Chip Selects: CS# enables (registered LOW) and disables (regis-  
tered HIGH) the command decoder of the DRAM devices that are  
connected to the associated address bus. All commands are  
masked when CS# is registered HIGH.  
A[7:0]_CS#  
Clock Enables: CKE activates (registered HIGH) and de-activates  
(registered LOW) the input clocking circuitry of the DRAM devices  
that are connected to the associated address bus. HICKE and  
LOCKE are copies of each other and always have the same  
value. Each pin is designed to drive at most 8 DRAM devices that  
are connected to the associated address bus. The ECC DRAM  
devices of the associated address bus are driven by a separate  
ECC CKE signal.  
A[7:0]_HICKE  
A[7:0]_LOCKE  
Ouput  
16  
ECC Clock Enables: CKE activates (registered HIGH) and de-  
activates (registered LOW) the input clocking circuitry of the  
DRAM devices that are connected to the associated address bus.  
Each ECC Clock Enable pin may be assigned to one of two  
address buses, and should be used to drive the two ECC DRAM  
devices that are connected to the corresponding address bus. For  
example, the A04_ECCCKE pin may be assigned to either  
address bus A0 or address bus A4  
A04_ECCCKE,  
A15_ECCCKE,  
A26_ECCCKE,  
A37_ECCCKE  
Output  
Input  
4
Memory Controller Address Bus: These are the Row/Column  
address bits that are received from the memory controller.  
MC_A[14:0] are used by the memory controller to address an  
8GB DIMM while MC_A[15:0] are used to address a 16GB DIMM.  
16  
MC_A[15:0]  
Rev. 0.2 / Sep. 2008  
28  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Ball Description  
Symbol  
Type  
Input  
Fuction / Description  
Quantity  
MC_BA[2:0]  
Memory Controller Bank Address Bus: These are the Bank  
address bits that are received from the memory controller. The  
memory controller uses all 3 bank address bits during a row or  
column access.  
3
MC_CAS#  
MC_RAS#  
MC_WE#  
Input  
Input  
Memory Controller Commands: RAS#, CAS# and WE# (along  
with CS#) define the command being sent to the DIMM module  
by the memory controller.  
3
2
MC_CS0#  
MC_CS1#  
Memory Controller Chip Selects: CS# enables (registered LOW)  
and disables (registered HIGH) the command decoder of the  
DRAM devices on the DIMM. All commands are masked when  
CS# is registered HIGH. MC_CS0# controls rank 0 of the DIMM  
while MC_CS1# controls rank 1 of the DIMM.  
MC_CKEO,  
MC_CKE1  
Input  
Input  
Memory Controller Clock Enables: CKE activates (registered  
HIGH) and de-activates (registered LOW) the input clocking cir-  
cuitry of the DRAM devices on the DIMM. MC_CKE0 enables the  
clock circuitry of the rank 0 DRAM devices while MC_CKE1  
enables the clock circuitry of the rank 1 DRAM devices.  
2
MC_CLK  
MC_CLK#  
Memory Controller Clock: These are the differential clock inputs.  
All address and control input signals are sampled on the crossing  
of the positive edge of CLK and negative edge of CLK#. Output  
data (DQs and DQS/DQS#) is referenced to the crossings of CLK  
and CLK#  
2
1
MC_ERR_OUT  
Output  
Input  
Memory Controller Error Out: This signal is asserted when a par-  
ity error is detected on the address and command signals  
received from the memory controller. The parity error detection  
logic implements the relevant JEDEC specification.  
MC_ODT0  
MC_ODT1  
Memory Controller On-Die Terminations: ODT (registered HIGH)  
enables the on-die termination resistors in the MetaRAM Flow  
Controller devices. When enabled, ODT is only applied to each of  
the following pins: MC_DQ (including the ECC check bits),  
MC_DQS, MC_DQS#. The ODT input will be ignored if disabled  
via the LOAD MODE command.  
2
MC_PAR_IN  
MC_RESET#  
SB_CMD[2:0]  
ODT_OUT[1:0]  
Input  
Input  
Memory Controller Parity Input: This is the parity bit for the  
address and control received from the memory controller. The  
parity bit is supplied by the memory controller.  
1
1
3
Memory Controller Reset: This input asynchronously forces all  
registered outputs LOW when it is LOW. This signal can be used  
during power up to ensure that MC_CKE is LOW.  
Output  
Output  
Side Band Signals: These side band signals are used for commu-  
nication between the MetaRAM Access Manager(s) and the Met-  
aRAM Flow Controllers on the DIMM.  
Flow Controller ODT: These signals control the on-die termination  
resistors in the MetaRAM Flow Controller devices. They are gen-  
erated in response to the MC_ODT signals received from the  
memory controller.  
2
OSCIN  
P_CLK  
Input  
Oscillator Input: 25MHz Crystal generated CLK.  
PROM Clock: Regenerated 25MHz CLK  
1
1
Output  
Rev. 0.2 / Sep. 2008  
29  
1240pin DDR2 MetaSDRAM Registered DIMMs  
Ball Description  
Symbol  
CDI  
Type  
Input  
Fuction / Description  
Quantity  
PROM Configuration Data Input: This pin receives the configura-  
tion bits from the upstream MetaRAM device or the configuration  
PROM.  
1
CDO  
CEI  
Output  
Input  
PROM Configuration Data Output: This pin shifts out the configu-  
ration bits into the downstream MetaRAM device.  
1
1
PROM Configuration Enable Input: This pin is asserted by the  
upstream MetaRAM device to frame the valid configuration bits.  
CEO  
Output  
PROM Configuration Enable Output: This pin is asserted to  
frame the valid configuration bits being shifted to the down-  
stream MetaRAM device.  
1
1
MM  
Input  
Master Mode: This pin is used to select which device in the Met-  
aRAM chipset will behave as the master PROM controller. This  
pin should be tied to VDD on the device that is the master PROM  
controller, and should be tied to GND on all the other devices in  
the chipset.  
PLLCLK, PLLCLK#  
Output  
PLL Clock Test Pins: These pins are used to verify the operation  
of the internal PLL. Special care must bepaid to the layout pf  
these pins since they are susceptible to picking up noise from  
the PCB. Please see the section on PCB Layout requirements  
for guidelines on decoupling these pins from the system.  
2
1
1
POR#  
Input  
Power On Reset: This input is used to asynchronously reset the  
internal state of the Access Manager.  
P_CS#  
Output  
PROM Chip Select: This pin is asserted by the master PROM  
controller to initiate the down loading of the configuration bits  
stored in the PROM. This pin should be left unconnected (float-  
ing) on all the MetaRAM devices that are not the master PROM  
controller.  
CALIB[1:O]  
SET[1:O]  
Input  
Input  
Calibration: These signals are used to calibrate the internal cir-  
cuitry of the chip. Please see the section on PCB Layout require-  
ments for connection guidelines.  
2
2
Setup: These signals are used to configure the internal circuitry  
of the chip. Please refer to the relevant MetaRAM application  
note or reference schematic for the wiring of these inputs.  
TCK  
TDI  
Input  
Input  
Input  
Output  
-
JTAG Test Clock: This should be left unconnected (floating) on  
the DIMM.  
1
1
1
1
1
JTAG Test Data In: This should be left unconnected (floating) on  
the DIMM.  
TMS  
TDO  
RFU  
NC  
JTAG Test Mode Select: This should be left unconnected (float-  
ing) on the DIMM.  
JTAG Test Data Out: This should be left unconnected (floating)  
on the DIMM.  
Reserved For Future Use: This should be left unconnected  
(floating) on the DIM M .  
-
No Connect Balls: These balls must be left unconnected (float-  
ing)  
5
TOTAL Ball  
371  
Rev. 0.2 / Sep. 2008  
30  
1240pin DDR2 MetaSDRAM Registered DIMMs  
PACKAGE OUTLINE  
1Gx72 (4 ranks) - HYMP31GP72CMP4  
Front  
Side  
133.35  
7.55max  
MetaRAM  
Access  
Manager  
4.0 ± 0.1  
30.0  
5.175  
5.175  
1.0max  
63.0  
55.0  
5.0  
Detail-A  
Detail-B  
1.27 ± 0.10  
Back  
PLL  
3.0  
3.0  
Detail of Contacts A  
Detail of Contacts B  
2.50  
1.0  
0.8 ± 0.05  
1.50 ± 0.10  
5.00  
Rev. 0.2 / Sep. 2008  
31  
1240pin DDR2 MetaSDRAM Registered DIMMs  
REVISION HISTORY  
Revision  
0.1  
History  
Preliminary  
Date  
Remark  
Feb. 2008  
Sep. 2008  
0.2  
Initial Release with IDD update  
Rev. 0.2 / Sep. 2008  
32  
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