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IXTT50P085

型号:

IXTT50P085

品牌:

IXYS[ IXYS CORPORATION ]

页数:

4 页

PDF大小:

568 K

IXTH 50P085  
IXTT 50P085  
Standard Power MOSFET  
VDSS = -85 V  
ID25 = -50 A  
RDS(on) = 55 mΩ  
P-Channel Enhancement Mode  
Avalanche Rated  
Symbol  
TestConditions  
Maximum Ratings  
TO-247 (IXTH)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
-85  
-85  
V
V
VGS  
Continuous  
Transient  
20  
30  
V
V
D (TAB)  
VGSM  
ID25  
IDM  
IAR  
TC = 25°C  
TC = 25°C, pulse width limited by TJ  
TC = 25°C  
-50  
-200  
-50  
A
A
A
TO-268 (IXTT)  
EAR  
PD  
TC = 25°C  
TC = 25°C  
30  
mJ  
W
300  
G
TJ  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
S
D (TAB)  
TJM  
Tstg  
G = Gate,  
D=Drain,  
TAB = Drain  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
Plastic Body for 10s  
300  
°C  
S = Source,  
250  
°C  
Features  
Md  
Mounting torque (TO-247)  
1.13/10 Nm/lb.in.  
International standard packages  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
Weight  
TO-247  
TO-268  
6
5
g
g
Unclamped Inductive Switching (UIS)  
rated  
Symbol  
VDSS  
TestConditions  
Characteristic Values  
Low package inductance (<5 nH)  
- easy to drive and to protect  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
VGS = 0 V, ID = -250 µA  
-85  
V
Applications  
High side switching  
Push-pull amplifiers  
DC choppers  
VGS(th)  
IGSS  
VDS = VGS, ID = -250 µA  
-3.0  
-5.0  
100  
-25  
V
nA  
µA  
VGS = 20 VDC, VDS = 0  
IDSS  
VDS = 0.8 • VDSS  
VGS = 0 V  
T = 25°C  
TJJ = 125°C  
Automatic test equipment  
-1 mA  
RDS(on)  
VGS = -10 V, ID = 0.5 • ID25  
55 mΩ  
Advantages  
Easy to mount with 1 screw  
(isolatedmountingscrewhole)  
Space savings  
High power density  
© 2005 IXYS All rights reserved  
DS99140B(02/05)  
IXTH 50P085  
IXTT 50P085  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
TO-247 (IXTH) Outline  
VDS = -10 V; ID = ID25, pulse test  
8
16  
S
Ciss  
Coss  
Crss  
4200  
1720  
750  
pF  
pF  
pF  
1
2
3
VGS = 0 V, VDS = -25 V, f = 1 MHz  
td(on)  
tr  
td(off)  
tf  
46  
39  
86  
38  
ns  
ns  
ns  
ns  
VGS = -10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
Terminals: 1 - Gate  
3 - Source  
2 - Drain  
RG = 4.7 (External)  
Tab - Drain  
Dim.  
Millimeter  
Min. Max.  
Inches  
Min. Max.  
Qg(on)  
Qgs  
150  
36  
nC  
nC  
nC  
A
A12  
4.7  
2.2  
2.2  
5.3  
2.54  
2.6  
.185 .209  
.087 .102  
.059 .098  
VGS = -10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
A
Qgd  
70  
b
b12  
1.0  
1.65  
2.87  
1.4  
2.13  
3.12  
.040 .055  
.065 .084  
.113 .123  
b
RthJC  
RthCS  
0.42  
K/W  
K/W  
C
D
E
.4  
.8  
.016 .031  
.819 .845  
.610 .640  
(TO-247)  
0.25  
20.80 21.46  
15.75 16.26  
e
5.20  
5.72 0.205 0.225  
L
19.81 20.32  
4.50  
.780 .800  
.177  
L1  
P 3.55  
3.65  
.140 .144  
Q
5.89  
4.32  
6.40 0.232 0.252  
R
S
5.49  
.170 .216  
242 BSC  
Source-DrainDiode  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
6.15 BSC  
TO-268 (IXTT) Outline  
Symbol  
TestConditions  
IS  
VGS = 0  
-25  
-200  
-3  
A
ISM  
VSD  
Repetitive; pulse width limited by TJM  
A
V
IF = IS, V = 0 V,  
Pulse teGsSt, t 300 µs, duty cycle d 2 %  
trr  
IF = IS, di/dt = 100 A/µs, VR = -50 V  
180  
ns  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered by  
oneormoreofthefollowingU.S.patents:  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,381,025  
5,486,715  
6,162,665  
6,259,123B1  
6,306,728 B1  
6,404,065B1  
6,534,343  
6,583,505  
6,683,344  
6,710,405B2  
6,710,463  
6,727,585  
6,759,692  
6771478B2  
IXTH 50P085  
IXTT 50P085  
Fig. 1. Output Characteristics  
@ 25 Deg. C  
Fig. 2. Extended Output Characteristics  
@ 25 deg. C  
-140  
-120  
-100  
-80  
-60  
-40  
-20  
0
-50  
-45  
-40  
-35  
-30  
-25  
-20  
-15  
-10  
-5  
VGS = -10V  
VGS = -10V  
-9V  
-8V  
-7V  
-9V  
-8V  
-7V  
-6V  
-5V  
-6V  
-5V  
0
0
-2  
-4 -6  
-8 -10 -12 -14 -16 -18 -20  
0
-0.5  
-1  
-1.5  
-2  
-2.5  
VD S - Volts  
VD S - Volts  
Fig. 3. Output Characteristics  
@ 125 Deg. C  
Fig. 4. RDS(on) Normalized to ID25 Value vs.  
Junction Temperature  
-50  
-45  
-40  
-35  
-30  
-25  
-20  
-15  
-10  
-5  
2
1.8  
1.6  
1.4  
1.2  
1
VGS = -10V  
-9V  
VGS = -10V  
-8V  
ID = -50A  
-7V  
-6V  
-5V  
ID = -25A  
0.8  
0.6  
0
0
-1  
-2  
-3  
-4  
-5  
-50  
-25  
0
25  
50  
75  
100 125 150  
VD S - Volts  
TJ - Degrees Centigrade  
Fig. 5. RDS(on) Normalized to ID25  
Value vs. ID  
Fig. 6. Drain Current vs. Case  
Temperature  
2.4  
2.2  
2
-55  
-50  
-45  
-40  
-35  
-30  
-25  
-20  
-15  
-10  
-5  
VGS = -10V  
1.8  
1.6  
1.4  
1.2  
1
TJ = 125ºC  
TJ = 25ºC  
0.8  
0
0
-25  
-50  
-75  
-100  
-125  
-50  
-25  
0
25  
50  
75  
100 125 150  
I D - Amperes  
TC - Degrees Centigrade  
© 2005 IXYS All rights reserved  
IXTH 50P085  
IXTT 50P085  
Fig. 7. Input Admittance  
Fig. 8. Transconductance  
40  
35  
30  
25  
20  
15  
10  
5
-150  
-125  
-100  
-75  
-50  
-25  
0
TJ = -40ºC  
25ºC  
125ºC  
TJ = -40ºC  
25ºC  
125ºC  
0
-4  
-5  
-6  
-7  
-8  
-9  
-10  
-11  
0
-25  
-50  
-75  
-100  
-125  
-150  
VG S - Volts  
I D - Amperes  
Fig. 10. Gate Charge  
Fig. 9. Source Current vs. Source-To-  
Drain Voltage  
-10  
-9  
-8  
-7  
-6  
-5  
-4  
-3  
-2  
-1  
0
-150  
-125  
-100  
-75  
-50  
-25  
0
VDS = -50V  
ID = -25A  
IG = -1mA  
TJ = 125ºC  
TJ = 25ºC  
-0.5  
-1  
-1.5  
-2  
-2.5  
-3  
-3.5  
-4  
0
20  
40  
60  
80  
100  
120  
140  
Q G - nanoCoulombs  
VS D - Volts  
Fig. 12. Maximum Transient Thermal  
Resistance  
Fig. 11. Capacitance  
6000  
5000  
4000  
3000  
2000  
1000  
0
1.00  
0.10  
0.01  
f = 1MHz  
C
iss  
C
oss  
C
rss  
-20  
1
10  
100  
1000  
0
-5  
-10  
-15  
-25  
-30  
-35  
-40  
VD S - Volts  
Pulse Width - milliseconds  
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