ZXMN2A02X8
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
S YMBOL
LIMIT
20
UNIT
V
Dra in -S o u rce Vo lta g e
Ga te S o u rce Vo lta g e
V
V
DS S
GS
20
V
Co n tin u o u s Dra in Cu rre n t V =10V; T =25°C (b )
I
7.8
6.3
6.2
A
GS
A
D
V
=10V; T =70°C (b )
GS
A
V
=10V; T =25°C (a )
GS
A
Pu ls e d Dra in Cu rre n t (c)
I
I
I
39
3.1
39
A
A
A
DM
Co n tin u o u s S o u rce Cu rre n t (Bo d y Dio d e ) (b )
Pu ls e d S o u rce Cu rre n t (Bo d y Dio d e ) (c)
S
S M
Po w e r Dis s ip a tio n a t T =25°C (a )
A
Lin e a r De ra tin g Fa cto r
P
1.1
8.8
W
m W/°C
D
Po w e r Dis s ip a tio n a t T =25°C (b )
A
Lin e a r De ra tin g Fa cto r
P
1.67
13.4
W
m W/°C
D
Op e ra tin g a n d S to ra g e Te m p e ra tu re Ra n g e
T :T
-55 to +150
°C
j
s tg
THERMAL RESISTANCE
PARAMETER
S YMBOL
VALUE
113
UNIT
°C/W
°C/W
J u n ctio n to Am b ie n t (a )
J u n ctio n to Am b ie n t (b )
R
R
θJ A
θJ A
74.5
NOTES
(a) For a device surface m ounted on 25m m x 25m m FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
(b) For a device surface m ounted on FR4 PCB m easured at tр10 secs.
(c) Repetitive rating 25m m x 25m m FR4 PCB, D = 0.05, pulse width 10s - pulse width lim ited by m axim um junction tem perature. Refer to
Transient Therm al Im pedance graph. Refer to transient therm al im pedance graph.
ISSUE 2 - J ANUARY 2005
2
