IN74LV32
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC supply voltage (Referenced to GND)
DC input diode current
-0.5 ¸ +5.0
±20
V
1
IIK
*
mA
mA
mA
2
IOK
*
DC output diode current
±50
IO *3
ICC
IGND
PD
DC output source or sink current
-bus driver outputs
±25
DC VCC current for types with
- bus driver outputs
±50
±50
mA
mA
mW
DC GND current for types with
- bus driver outputs
Power dissipation per package, plastic DIP+
SOIC package+
750
500
Tstg
TL
Storage temperature
-65 ¸ +150
°C
°C
Lead temperature, 1.5 mm from Case for 10 seconds
(Plastic DIP ), 0.3 mm (SOIC Package)
260
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 12 mW/°C from 70° to 125°C
SOIC Package: : - 8 mW/°C from 70° to 125°C
*1: V < -0.5V or V > VCC+0.5V
I
I
*2: Vo < -0.5V or Vo > VCC+0.5V
*3: -0.5V < Vo < VCC+0.5V
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Min
1.2
0
Max
Unit
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
3.6
VCC
V , VOUT
IN
V
TA
-40
+125
°C
ns
tr, tf
Input Rise and Fall Time
VCC =1.2 V
VCC =2.0 V
VCC =3.0 V
VCC =3.6 V
0
0
0
0
1000
700
500
400
This device contains protection circuitry to guard against damage due to high static voltages or electric
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages
to this high-impedance circuit. For proper operation, V and VOUT should be constrained to the range GND£(V or
IN
IN
VOUT)£VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused
outputs must be left open.
INTEGRAL
2
