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HYT722

型号:

HYT722

描述:

TOP LED器件[ TOP LED DEVICE ]

品牌:

SEOUL[ Seoul Semiconductor ]

页数:

13 页

PDF大小:

573 K

Specification  
HYT722  
SSC  
CUSTOMER  
Drawn  
Approval  
Approval  
CONTENTS  
1. Feature & Application  
2. Absolute Maximum Ratings  
3. Electro Characteristics  
4. Optical characteristics  
5. Rank of HYT722  
6. Outline Dimension  
7. Packing  
8. Lot number  
9. Soldering  
10. Precaution for use  
HYT722  
HYT722  
Description  
Features  
This surface-mount LED comes  
in PLCC standard package  
dimension. It has a substrate  
made up of a molded plastic  
reflector sitting on top of a bent  
lead frame. The die is attached  
within the reflector cavity and  
the cavity is encapsulated by  
epoxy or silicone.  
White colored SMT  
package.  
• Material : AlInGaP  
• Encapsulating Resin :  
Epoxy Resin  
• Suitable for all SMT  
assembly methods ;  
Suitable for all  
The package design coupled  
with careful selection of  
component materials allow these  
products to perform with high  
reliability in a larger  
soldering methods  
• RoHS Compliant  
temperature range -40to  
100. The high reliability  
feature is crucial to Automotive  
interior and Indoor ESS.  
Applications  
• Interior automotive  
• Office Automation,  
Electrical Appliances,  
Industrial Equipment  
2. Absolute maximum ratings  
Parameter  
Symbol  
Value  
252  
Unit  
mW  
Power Dissipation  
Pd  
Forward Current  
IF  
90  
mA  
*2  
Peak Forward Current  
Reverse Voltage (per die)  
Operating Temperature  
Storage Temperature  
IFM  
100  
5
mA  
V
VR  
Topr  
Tstg  
-40 ~ +85  
-40 ~ +100  
ºC  
ºC  
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.  
*2 IFM was measured at TW 1msec of pulse width and D 1/10 of duty ratio.  
3. Electric & Optical characteristics  
Sym  
Parameter  
Condition  
Min  
Typ  
Max  
Unit  
bol  
VF  
IR  
Forward Voltage (per die)  
Reverse Current (per die)  
IF =20 mA  
VR=5V  
1.6  
-
2.2  
-
2.8  
10  
V
µA  
*1  
Luminance Intensity  
IV  
IF =60 mA  
950  
1400  
1700  
mcd  
ΦV  
λd  
λP  
Luminance Flux  
Dominant Wavelength  
Peak Wavelength  
IF =60 mA  
IF =60 mA  
IF =60mA  
IF =60 mA  
IF =60 mA  
IF =60 mA  
-
4
-
lm  
nm  
582  
590  
593  
18  
598  
-
-
-
-
-
-
-
-
nm  
∆λ  
2θ  
Spectral Bandwidth  
nm  
*2  
Viewing Angle  
120  
30  
deg  
lm/W  
½
ηopt  
Optical Efficiency  
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned  
with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%  
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.  
[Note] All measurements were made under the standardized environment of SSC.  
4. Optical characteristics  
Forward Current vs. Forward Voltage (per die)  
(Ta=25 OC )  
100  
50  
20  
10  
5
1
1.6  
1.8  
2.0  
2.2  
2.4  
2.6  
2.8  
3.0  
3.2  
Forward Voltage VF[V]  
Relative Luminous Intensity vs Forward Current  
(Ta=25 OC )  
6
5
4
3
2
1
0
0
30  
(10)  
60  
(20)  
90 120 150 180 210 240 270 300 < total  
(50) (60) (100)  
(30) (40)  
(90)  
(70) (80)  
< per die  
Forward Current IF[mA]  
4. Optical characteristics  
Ambient Temperature vs. Allowable Forward Current (per die)  
(Ta=25 OC )  
40  
3 Chip ON  
30  
20  
10  
0
0
20  
40  
60  
80  
100  
Ambient Temperature TA[oC]  
Radiation Diagram  
0
30  
-30  
60  
-60  
90  
-90  
5. Rank of HYT722  
Rank Name  
X1  
X2  
IV  
X3  
VF  
WD  
Forward Voltage [V]  
Rank  
Name  
MIN  
1.6  
2.0  
2.4  
MAX  
2.0  
2.4  
2.8  
A
B
C
Luminous Intensity [mcd]  
Rank  
Name  
MIN  
950  
MAX  
1150  
1400  
1700  
N
O
P
1150  
1400  
Dominant Wavelength [nm]  
Rank  
Name  
MIN  
582  
586  
590  
594  
MAX  
586  
590  
594  
598  
1
2
3
4
6.outline dimension  
Package Outlines  
6
5
4
Package  
Marking  
(Anode)  
1
2
3
Front View  
Right View  
Rear View  
( Tolerance: ±0.2, Unit: mm )  
Recommended  
Solder Pad  
Circuit Diagram  
Yellow  
Yellow  
Yellow  
Cathode Cathode Cathode  
5
4
6
Y1  
Y2  
Y3  
1
2
3
Yellow  
Anode  
Yellow  
Anode  
Yellow  
Anode  
* MATERIALS  
PARTS  
MATERIALS  
Heat-Resistant Polymer  
Epoxy Resin  
Package  
Encapsulating Resin  
Electrodes  
Ag Plating Copper Alloy  
7. packing  
Package  
Marking  
( Tolerance: ±0.2, Unit: mm )  
1)Quantity : 700pcs/Reel  
2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm  
3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is  
turned off from the carrier tape at the angle of 10 to the carrier tape  
4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof  
Package  
● Reel Packing Structure  
Reel  
RANK:  
XXX  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
PART NUMBER :  
XXXXXX  
SEOUL SEMICONDUCTOR CO., LTD.  
HUMIDITY INDICATOR  
DESI PAK  
Aluminum Vinyl Bag  
RANK:  
XXX  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
PART NUMBER :  
XXXXXX  
SEOUL SEMICONDUCTOR CO., LTD.  
Outer Box Structure  
Material : Paper(SW3B(B))  
SIZE (mm)  
TYPE  
a
c
b
7inch 245 220 142  
SIDE  
1
c
RANK:  
XXX  
1
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
RoHS  
b
PART NUMBER :  
XXXXXX  
SEOUL SEMICONDUCTOR CO., LTD.  
a
8. lot number  
The lot number is composed of the following characters;  
HYT○□□◎◎ # ~ #  
HYT –First Part Name  
– Year (6 for 2006, 7 for 2007, 8 for 2008 )  
□□ – Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.)  
◎◎ – Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.)  
# ~# – The number of the internal quality control  
XXX  
QUANTITY : 700  
LOT NUMBER : HYT70426 01 512  
PART NUMBER : HYT722  
SEOUL SEMICONDUCTOR CO., LTD.  
9. soldering  
(1) Lead Solder  
Lead Solder  
Lead Solder  
o
o
2.5~5 C / sec.  
240 C Max.  
10 sec. Max.  
Pre-heat  
120~150  
Pre-heating  
Pre-heat time  
120 sec. Max.  
240Max.  
10 sec. Max.  
o
60sec. Max.  
120~150 C  
2.5~5 C / sec.  
o
Above 200 C  
Peak-Temperature  
Soldering time Condition  
120sec. Max.  
(2) Lead-Free Solder  
Lead-frame Solder  
o
Lead Free Solder  
150~200℃  
o
1~5 C / sec.  
260 C Max.  
10 sec. Max.  
Pre-heat  
Pre-heating  
o
Pre-heat time  
120 sec. Max.  
260Max.  
60sec. Max.  
o
150~200  
C
1~5 C / sec.  
o
Above 220 C  
Peak-Temperature  
Soldering time Condition  
10 sec. Max.  
120sec. Max.  
(3) Hand Soldering conditions  
Do not exceed 4 seconds at maximum 315ºC under soldering iron.  
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.  
10. precaution for use  
(1) Storage  
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or  
a desiccator) with a desiccant. Otherwise, to store them in the following environment is  
recommended.  
Temperature : 5ºC ~30ºC Humidity : maximum 65%RH  
(2) Attention after open.  
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect  
the light transmission efficiency, causing the light intensity to drop. Attention in followed;  
a. After opened and mounted the soldering shall be quickly.  
b. Keeping of a fraction  
Temperature : 5 ~ 40ºC Humidity : less than 30%  
(3) In the case of more than 1 week passed after opening or change color of indicator  
on desiccant, components shall be dried 10-12hr. at 60±5ºC.  
(4) Any mechanical force or any excess vibration shall not be accepted to apply during  
cooling process to normal temperature after soldering.  
(5) Quick cooling shall be avoided.  
(6) Components shall not be mounted on warped direction of PCB.  
(7) Anti radioactive ray design is not considered for the products.  
(8) This device should not be used in any type of fluid such as water, oil, organic solvent  
etc. When washing is required, IPA should be used.  
(9) When the LEDs are illuminating, operating current should be decided after  
considering the ambient maximum temperature.  
(10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3  
months or more after being shipped from SSC, a sealed container with a nitrogen  
atmosphere should be used for storage.  
(11) The LEDs must be soldered within seven days after opening the moisture-proof  
packing.  
(12) Repack unused products with anti-moisture packing, fold to close any opening and  
then store in a dry place.  
(13) The appearance and specifications of the product may be modified for improvement  
without notice.  
厂商 型号 描述 页数 下载

SEOUL

HYT722_1 TOP LED器件[ TOP LED DEVICE ] 13 页

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