I/O Card Interface Connectors
NX Series
3. ESD Secure
Thermoplastic molded covers assures insulation
of the connections and shields from ESD.
4. Secure Latching
A built-in latch assures correct and secure
mating of connector.
5. Reliable Conductor Termination
Reliable termination of conductors is
accomplished by proven IDC termination.
6. Sequential Mating
The 0.8mm pitch contacts are engaging the
corresponding parts in sequence: Ground-
Power & Signal
7. Rugged Construction
Securely attached to the board with optional
screws.
■Features
1. Low Profile
8. Card Frame Kits
Protorusion above the PCB board is only 2.9mm, and the
connectors can be mounted to type I and II I/O cards.
Available as a separate part number.
9. Secure Attachment to Frame Kit.
Compliant mounting bracket attaches the
connectore directly to the frame kit.
2. EMI/RFI protection
Full metal shielding. Shield connects first, ahead of
contacts.
■Applications
Used with I/O cards, portable personal computers,and the external connections of various small-sized portable
terminals.
■Specifications
Current rating 0.5 A
Operating temperature
Operating humidity
-30ç to +70ç (Note 1) Storage temperature range -10ç to +60ç (Note 2)
Ratings
95% R.H. or less
(No condensation)
Voltage rating 125 V AC
Storage humidity range
40 to 70% (Note 2)
Item
Specification
Conditions
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
250 M ohms min.
100 V DC
No flashover or insulation breakdown.
40 m ohms max.
300 V AC / 1 minute
100 mA
No electrical discontinuity of 10µs or
more
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm,
2 hours in each of the 3 directions.
4. Vibration
Insulation resistance: 100 M ohms min.
No damage, cracks, or parts looseness.
60 m ohms max.
5. Humidity (Steady state)
6. Temperature cycle
96 hours at temperature of 60ç and humidity of 90% to 95%
-55ç, 30 min./15 to 30ç, within 5 min/85ç, 30 min
/15 to 35ç, within 5 min, for 5 cycles
7. Durability
(Insertion/withdrawal)
3000 cycles
Reflow: At the recommended temperature profile
Manual soldering: 300ç for 3 seconds
8. Resistance to
Soldering heat
No deformation of components affecting
performance.
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature
Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during
transportation.
B8
