SPICE MODEL: QZX563C6V8C
QZX563C6V8C
QUAD SURFACE MOUNT TVS ARRAY
Lead-free Green
Features
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Quad TVS in Common Anode Configuration
Nominal Zener Voltage: 6.8V
A
SOT-563
Ultra-Small Surface Mount Package
Ideal For Transient Suppression
Dim Min
Max
0.30
1.25
1.70
0.50
1.10
1.70
0.60
0.30
0.18
Typ
0.25
1.20
1.60
A
B
C
D
G
H
K
L
0.15
1.10
1.55
B
Lead Free By Design/RoHS Compliant (Note 1)
"Green Device" (Note 2)
C
Qualified to AEC-Q101 Standards for High Reliability
D
G
0.90
1.50
0.56
0.10
0.10
1.00
1.60
0.60
0.20
¾
ESD Capability
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IEC 61000-4-2 Contact Method: ±8kV
M
K
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IEC 61000-4-2 Air Discharge Method: ±25kV
H
L
M
Mechanical Data
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All Dimensions in mm
Case: SOT-563
NC
C1
C2
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
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Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Finish: Matte Tin, Annealed Over Copper
Leadframe. Solderable per MIL-STD-202, Method 208
C4
A
C3
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Orientation: See Diagram
Marking: See Table Below
Weight: 0.003 grams (approximate)
Ordering Information: See Page 2
@TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
VF
Value
0.9
Unit
V
Forward Voltage @ IF = 10mA (Note 3)
Forward Voltage @ IF = 100mA (Note 3)
Power Dissipation (Note 4)
VF
1.0
V
Pd
150
10
mW
Peak Power Dissipation, 10x1000mS Waveform (Note 5)
Peak Power Dissipation, 8x20mS Waveform (Note 5)
Thermal Resistance, Junction-to-Ambient (Note 4)
Operating and Storage Temperature Range
Ppk
W
80
RqJA
833
°C/W
Tj, TSTG
-65 to +150
°C
@TA = 25°C unless otherwise specified
Electrical Characteristics
Maximum Reverse
Breakdown Voltage
(Note 3)
Reverse Standoff Voltage
and Leakage
Typical Junction
Capacitance
Current
(Note 3)
IR @ VR
Type
Number
Marking
Code
CT @ VR = 0V,
f = 1MHz
VRWM
IR @ VRWM
VBR @ IT = 1mA
V
5
mA
Min (V)
Nom (V)
Max (V)
mA
V
pF
QZX563C6V8C
CB
1.5
6.47
6.8
7.14
1.0
3.0
63
Note:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Short duration pulse test used to minimize self-heating effect.
4. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. Suggested Pad Layout Document AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
5. Non-repetitive current pulse per Figure 2 and derate above T = 25°C per Figure 1.
A
DS30716 Rev. 3 - 2
1 of 3
QZX563C6V8C
www.diodes.com
ã Diodes Incorporated
