TECHNICAL DATA SHEET  
					Gort Road Business Park, Ennis, Co. Clare, Ireland.  
					Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
					6 Lake Street, Lawrence, MA 01841  
					Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
					Website: http://www.microsemi.com  
					- High Reliability controlled devices  
					- Unidirectional (A) construction  
					- Available in both J-bend and Gull-wing terminations  
					- Selections for 6.5 to 170 V standoff voltages (VWM)  
					SURFACE MOUNT  
					1500 Watt Low Capacitance  
					Transient Voltage Suppressor  
					LEVELS  
					M, MA, MX, MXL  
					DEVICES  
					MSMCJLCE6.5A thru MSMCJLCE170A, e3  
					and MSMCGLCE6.5A thru MSMCGLCE170A, e3  
					FEATURES  
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					High reliability controlled devices with fabrication and assembly lot traceability  
					100% surge tested devices  
					Low capacitance of 100 pF or less  
					Optional upscreening available by replacing the M prefix with MA, MX or MXL. These prefixes  
					specify various screening and conformance inspection options based on MIL-PRF-19500. Refer  
					to MicroNote 129 for more details on the screening options.  
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					Axial-lead equivalent packages for thru-hole mounting available as MLCE6.5A to MLCE170CA  
					Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B  
					RoHS compliant devices available by adding an “e3” suffix  
					3σ lot norm screening performed on Standby Current ID  
					APPLICATIONS / BENEFITS  
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					1500 Watts of Peak Pulse Power at 10/1000 s  
					Low capacitance for data line protection to 1 MHz  
					Protection for aircraft fast data rate lines up to Level 5 Waveform 4 and Level 2 Waveform 5A in  
					RTCA/DO-160D (also see MicroNote 130) & ARINC 429 with bit rates of 100 kb/s (per ARINC  
					429, Part 1, par 2.4.1.1)  
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					IEC 61000-4-2 ESD 15 kV (air), 8 kV (contact)  
					IEC 61000-4-5 (lightning) as further detailed in MLCE6.5 thru MLCE170A data sheet  
					T1/E1 Line Cards  
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					Base Stations, WAN & XDSL Interfaces  
					CSU/DSU Equipment  
					MAXIMUM RATINGS  
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					Peak Pulse Power dissipation at 25 ºC: 1500 watts at 10/1000 μs (also see Figures 1,2, and 3)  
					with impulse repetition rate (duty factor) of 0.01 % or less  
					Clamping Factor: 1.40 @ Full Rated power:  
					1.30 @ 50 % Rated power  
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					tclamping (0 V to VBR min): Less than 5x10-9 seconds  
					Operating and Storage temperatures: -65 ºC to +150 ºC  
					Steady State power dissipation: 5.0W @ TL = 50 ºC  
					Thermal Resistance: 20 ºC /W (typical junction to lead (tab) at mounting plane  
					When pulse testing, do not pulse in opposite direction. (See “Schematic Applications” section  
					herein and Figures 5 & 6 for further protection in both directions)  
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					Solder temperatures: 260 ºC for 10 s (maximum)  
					RF01002 Rev A, June 2010  
					High Reliability Product Group  
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