NZ3FxxxT1G Series, SZNZ3FxxxT1G Series
PACKAGE DIMENSIONS
SOD−323FL
CASE 477AC
ISSUE B
NOTES:
A1
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS INCLUDES LEAD FINISH.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
E
MILLIMETERS
DIM
A
A1
b
c
D
E
HE
L
MIN
0.90
−−−
0.50
0.10
2.00
1.30
2.40
0.35
MAX
1.08
0.10
0.70
0.25
2.20
1.60
2.80
0.65
TOP VIEW
END VIEW
c
A
RECOMMENDED
SOLDERING FOOTPRINT*
SIDE VIEW
HE
3.00
0.80
b
0.80
L
DIMENSION: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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