NZD5V1MU Series
PACKAGE DIMENSIONS
X3DFN2, 0.62x0.32, 0.355P, (0201)
CASE 152AF
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
A B
D
2. CONTROLLING DIMENSION: MILLIMETERS.
PIN 1
INDICATOR
(OPTIONAL)
MILLIMETERS
DIM MIN
MAX
0.33
0.05
0.28
0.66
0.36
A
A1
b
D
E
0.25
−−−
E
TOP VIEW
0.22
0.58
0.28
e
0.355 BSC
0.23
L2 0.17
0.05
0.05
C
C
A
RECOMMENDED
MOUNTING FOOTPRINT*
2X
A1
SIDE VIEW
SEATING
PLANE
C
2X
0.30
0.74
1
e
2X b
1
2
2X
0.31
DIMENSIONS: MILLIMETERS
M
0.05
C A B
2X L2
See Application Note AND8398/D for more mounting details
M
0.05
C A B
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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