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CYPD1120

型号:

CYPD1120

品牌:

CYPRESS[ CYPRESS ]

页数:

24 页

PDF大小:

672 K

CYPD1120  
USB Power Delivery Alternate Mode  
Controller on Type-C  
General Description  
The CYPD1120 device belongs to Cypress’s CCG1 product family, which provides a complete USB Type-C and USB Power Delivery  
port control solution. The scalable and reconfigurable core architecture of CCG1 enables a base Type-C solution that can scale to a  
complete 100-W USB Power Delivery with Alternate Mode mux support. CCG1 is also a Type-C cable ID IC for active and passive  
cables. The ARM® Cortex®-M0 CPU based core can use common open source firmware or custom solutions developed with common  
libraries and APIs. CCG1 is the CC controller that detects connector insert, plug orientation, and VCONN switching signals. CCG1  
makes it easier to add USB Power Delivery to any architecture because it provides the control signals to manage external VBUS and  
VCONN power management solutions as well as external mux controls for most single cable-docking solutions. CCG1's packaging  
options, and programmability, enables any USB Type-C and USB Power Delivery solution.  
Integrated Digital Blocks  
Two configurable 16-bit TCPWM blocks  
Applications  
Dongles, docking stations  
One I2C master or slave  
Type-C to DisplayPort  
Type-C Support  
Type-C to HDMI  
Integrated transceiver (BB PHY)  
Type-C to DVI  
PD Support  
Type-C to VGA  
Supports VESA DisplayPort Alternate Mode on USB Type-C  
Standard Version 1.0  
Features  
Low-power Operation  
32-bit MCU Subsystem  
1.8-V to 5.5-V operation  
Sleep 1.3 mA, Deep Sleep 1.3 uA[2]  
48-MHz ARM Cortex-M0 CPU with 32-KB flash and 4-KB  
SRAM  
Packages  
40-pin QFN  
Integrated Analog Blocks  
12-bit, 1-Msps ADC for VBUS voltage and current monitoring  
35-ball wafer-level CSP (WLCSP)  
Figure 1. CCG1 Block Diagram[2, 3, 4, 5]  
Notes  
1. Values measured for CCG1 silicon only. Application specific power numbers may be higher.  
2. Timer, counter, pulse-width modulation block.  
2
3. Serial communication block configurable as I C.  
4. Base band.  
5. Termination resistor denoting an Alternate Mode Adaptor.  
Cypress Semiconductor Corporation  
Document Number: 001-96786 Rev. *C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised April 21, 2017  
CYPD1120  
Contents  
Functional Definition ........................................................3  
CPU and Memory Subsystem .....................................3  
System Resources ......................................................3  
GPIO ...........................................................................3  
Pin Definitions ..................................................................4  
Pinouts ..............................................................................6  
Power .................................................................................7  
Electrical Specifications ..................................................9  
Absolute Maximum Ratings ........................................9  
Device Level Specifications .........................................9  
Digital Peripherals .....................................................11  
Memory .....................................................................12  
System Resources ....................................................12  
Applications in Detail .....................................................14  
Ordering Information ......................................................18  
Ordering Code Definitions .........................................18  
Packaging ........................................................................19  
Acronyms ........................................................................21  
Document Conventions .................................................22  
Units of Measure .......................................................22  
Revision History .............................................................23  
Sales, Solutions, and Legal Information ......................24  
Worldwide Sales and Design Support .......................24  
Products ....................................................................24  
PSoC Solutions .........................................................24  
Cypress Developer Community .................................24  
Technical Support .....................................................24  
Document Number: 001-96786 Rev. *C  
Page 2 of 24  
CYPD1120  
The I2C peripheral is compatible with the I2C Standard-mode,  
Fast-mode, and Fast-mode Plus devices, as defined in the NXP  
I2C-bus specification and user manual (UM10204). The I2C bus  
I/O is implemented with GPIO in open-drain modes.  
The CCG1 is not completely compliant with the I2C spec in the  
following respects:  
Functional Definition  
CPU and Memory Subsystem  
CPU  
The Cortex-M0 CPU in the CCG1 is part of the 32-bit MCU  
subsystem, which is optimized for low-power operation with  
extensive clock gating. It mostly uses 16-bit instructions and  
executes a subset of the Thumb-2 instruction set. This enables  
fully compatible binary upward migration of the code to higher  
performance processors such as the Cortex-M3 and M4, thus  
enabling upward compatibility. The Cypress implementation  
includes a hardware multiplier that provides a 32-bit result in one  
cycle. It includes a nested vectored interrupt controller (NVIC)  
block with 32 interrupt inputs and a Wakeup Interrupt Controller  
(WIC). The WIC can wake the processor up from the Deep Sleep  
mode, allowing power to be switched off to the main processor  
when the chip is in the Deep Sleep mode. The Cortex-M0 CPU  
provides a Non-Maskable Interrupt (NMI) input, which is made  
available to the user when it is not in use for system functions  
requested by the user.  
GPIO cells are not overvoltage tolerant and, therefore, cannot  
be hot-swapped or powered up independently of the rest of the  
I2C system.  
Fast-mode Plus has an IOL specification of 20 mA at a VOL of  
0.4 V. The GPIO cells can sink a maximum of 8 mA IOL with a  
VOL maximum of 0.6 V.  
Fast-mode and Fast-mode Plus specify minimum Fall times,  
which are not met with the GPIO cell; Slow strong mode can  
help meet this spec depending on the Bus Load.  
When the SCB is an I2C Master, it interposes an IDLE state  
between NACK and Repeated Start; the I2C spec defines Bus  
free as following a Stop condition so other Active Masters do  
not intervene but a Master that has just become activated may  
start an Arbitration cycle.  
The CPU also includes a debug interface, the serial wire debug  
(SWD) interface, which is a 2-wire form of JTAG; the debug  
configuration used for CCG1 has four break-point (address)  
comparators and two watchpoint (data) comparators.  
When the SCB is in the I2C Slave mode, and Address Match  
on External Clock is enabled (EC_AM = 1) along with operation  
in the internally clocked mode (EC_OP = 0), then its I2C  
address must be even.  
Flash  
The CCG1 device has a flash module with a flash accelerator,  
tightly coupled to the CPU to improve average access times from  
the flash block. The flash block is designed to deliver 1 wait-state  
(WS) access time at 48 MHz and 0-WS access time at 24 MHz.  
The flash accelerator delivers 85% of single-cycle SRAM access  
performance on average. Part of the flash module can be used  
to emulate EEPROM operation if required.  
GPIO  
The CCG1 has up to 10 GPIOs, which are configured for various  
functions. Refer to the pinout tables for the definitions. The GPIO  
block implements the following:  
Eight drive strength modes:  
Analog input mode (input and output buffers disabled)  
Input only  
SROM  
Weak pull-up with strong pull-down  
Strong pull-up with weak pull-down  
Open drain with strong pull-down  
Open drain with strong pull-up  
Strong pull-up with strong pull-down  
Weak pull-up with weak pull-down  
A supervisory ROM that contains boot and configuration routines  
is provided.  
System Resources  
Power System  
The power system is described in detail in the section Power on  
page 7. It provides assurance that voltage levels are as required  
for each respective mode and either delay mode entry (on  
power-on reset (POR), for example) until voltage levels are as  
required for proper function or generate resets (Brown-Out  
Detect (BOD)) or interrupts (Low Voltage Detect (LVD)). The  
CCG1 operates with a single external supply over the range of  
1.8 to 5.5 V and has three different power modes: Active, Sleep,  
and Deep Sleep; transitions between modes are managed by the  
power system.  
Input threshold select (CMOS or LVTTL).  
Individual control of input and output buffer enabling/disabling  
in addition to the drive strength modes.  
Hold mode for latching previous state (used for retaining I/O  
state in Deep Sleep mode).  
Selectable slew rates for dV/dt related noise control to improve  
EMI.  
During power-on and reset, the I/O pins are forced to the disable  
state so as not to crowbar any inputs and/or cause excess  
turn-on current. A multiplexing network, known as a high-speed  
I/O matrix, is used to multiplex between various signals that may  
connect to an I/O pin.  
Serial Communication Blocks (SCB)  
The CCG1 has one SCB, which can implement an I2C interface.  
The hardware I2C block implements a full multi-master and slave  
interface (it is capable of multimaster arbitration). In addition, the  
block supports an 8-deep FIFO for receive and transmit which,  
by increasing the time given for the CPU to read data, greatly  
reduces the need for clock stretching caused by the CPU not  
having read data on time.  
Document Number: 001-96786 Rev. *C  
Page 3 of 24  
CYPD1120  
Pin Definitions  
Table 1 provides the pin definitions for 40-pin QFN and 35-ball WLCSP for the notebook, tablet, smartphone, and monitor applications.  
Refer to Table 20 on page 18 for par numbers to package mapping.  
Table 1. Pin Definition for 40-Pin QFN and 35-Ball WLCSP  
Functional Pin  
CYPD1120-35FNXIT CYPD1120-40LQXI Type  
Description  
Name  
CC1 control  
0: TX enabled  
z: RX sense  
CC1_RX  
C4  
35  
I
CC1_TX  
SWD_IO  
SWD_CLK  
I2C_SCL  
I2C_SDA  
I2C_INT  
XRES  
D7  
D1  
C1  
B1  
B2  
A2  
B6  
38  
12  
13  
18  
19  
20  
30  
O
I/O  
I
Configuration Channel 1  
SWD IO  
SWD Clock  
I
I2C Slave Clock signal  
I2C Slave Data signal  
I2C INT  
I/O  
O
I
Active Low Reset  
VCCD  
VDDD  
A7  
C7  
31  
32  
POWER Connect 1-μF capacitor between VCCD and Ground  
POWER  
VCONN Supply  
VDDA  
VSSA  
C7  
B7  
33  
34  
9
POWER  
GND Ground  
GND Ground  
VSS  
CC_VREF  
ADC_BYPASS  
TX_U  
C5  
E7  
B3  
B5  
36  
40  
26  
29  
I
I
Data reference signal for CC lines  
No Connect  
O
I
Signals for internal use only. The TX_U output signal  
should be connected to the TX_M signal  
TX_M  
Reference signal for internal use. Connect to TX_REF  
output via a 2.4K 1% resistor  
TX_REF_IN  
TX_GND  
D3  
A3  
D4  
3
I
I
25  
39  
Connect to GND via 2K 1% resistor  
Reference signal generated by connecting internal  
current source to two 1K external resistors  
TX_REF_OUT  
O
Optional control signal to remove RA after assertion of  
VCONN  
0: RA disconnected  
1: RA connected  
RA_DISCONNECT  
E4  
4
O
Reference signal for internal use. Connect to the output  
of resistor divider from VDDD.  
CC1_LPREF  
VCONN_DET  
A5  
E5  
23  
5
I
Detects presence of VCONN before responding to CC  
communication  
O
D5  
BYPASS  
I
Bypass capacitor for internal analog circuits  
37  
Configuration Channel 1 RX signal for Low Power  
States  
CC1_LPRX  
VBUS_DET  
C3  
B4  
22  
28  
I
I
Detects presence of VBUS before enabling Billboard  
device  
Document Number: 001-96786 Rev. *C  
Page 4 of 24  
CYPD1120  
Table 1. Pin Definition for 40-Pin QFN and 35-Ball WLCSP (continued)  
Functional Pin  
CYPD1120-35FNXIT CYPD1120-40LQXI Type  
Name  
Description  
Enables Billboard Device  
D6  
1
BILLBOARD_CTRL  
DP_AUX_CTRL  
O
O
Closes AUX_P/N switch after successful Alternate  
Mode entry  
E1  
10  
AUX_CH_P_SENSE  
AUX_CH_N_SENSE  
E2  
E3  
8
7
I
I
Senses presence of DisplayPort on UFP_D  
Senses presence of DisplayPort on DFP_D  
HotPlug Detection/Driver for DisplayPort Alternate  
Mode  
HOTPLUG_DET  
E6  
6
I/O  
GPIO_0  
GPIO_1  
GPIO_2  
GPIO_3  
A1  
A6  
C2  
D2  
C6  
21  
27  
14  
11  
I/O  
I/O  
I/O  
I/O  
GPIO  
GPIO  
GPIO  
GPIO  
GPIO_4  
I/O  
GPIO  
2
GPIO_5  
GPIO_6  
GPIO_7  
GPIO_8  
A4  
24  
15  
16  
17  
I/O  
I/O  
I/O  
I/O  
GPIO  
GPIO  
GPIO  
GPIO  
Document Number: 001-96786 Rev. *C  
Page 5 of 24  
CYPD1120  
Pinouts  
Figure 2. 40-pin QFN Pinout  
30 XRES  
BILLBD_CTRL  
1
29 TX_M  
GPIO_4  
TX_REF_IN  
2
3
28 VBUS_DET  
27 GPIO_1  
26 TX_U  
RA_DISCONNECT  
VCONN_DET  
4
5
6
QFN  
(Top View)  
25 TX_GND  
HOTPLUG_DET  
AUX_CH_N_SENSE  
AUX_CH_P_SENSE  
VSS  
24  
23  
22  
21  
GPIO_5  
7
8
9
CC1_LPREF  
CC1_LPRX  
GPIO_0  
DP_AUX_CTRL  
10  
Figure 3. 35-Ball WLCSP Pinout  
7
6
5
4
3
2
1
CC1_LPRE  
F
GPIO_1  
I2C_INT  
A
B
C
D
E
GPIO_5  
VCCD  
TX_GND  
GPIO_0  
VBUS_DET  
XRES  
I2C_SDA  
GPIO_2  
TX_M  
TX_U  
VSSA  
VDDD  
I2C_SCL  
SWD_CLK  
SWD_IO  
CC1_RX  
GPIO_4  
CC_VREF  
BYPASS  
CC1_LPRX  
TX_REF_IN  
TX_REF_O  
UT  
BILLBOAR  
D_CTRL  
GPIO_3  
CC1_TX  
RA_DISCO  
NNECT  
HOTPLUG_  
DET  
AUX_CH_P  
_SENSE  
VCONN_D  
ET  
ADC_BYPA  
SS  
AUX_CH_N  
_SENSE  
DP_AUX_C  
TRL  
Document Number: 001-96786 Rev. *C  
Page 6 of 24  
CYPD1120  
Power  
The following power system diagram shows the minimum set of  
power supply pins as implemented for the CCG1. The system  
has one regulator in Active mode for the digital circuitry. There is  
no analog regulator; the analog circuits run directly from the  
VDDA input. There is a separate regulator for the Deep Sleep  
mode. There is a separate low-noise regulator for the bandgap.  
The supply voltage range is 1.8 V to 5.5 V with all functions and  
circuits operating over that range.  
VDDA and VDDD must be shorted together; the grounds, VSSA  
and VSS must also be shorted together. Bypass capacitors must  
be used from VDDD to ground. The typical practice for systems  
in this frequency range is to use a capacitor in the 1-µF range in  
parallel with a smaller capacitor (0.1 µF, for example). Note that  
these are simply rules of thumb and that, for critical applications,  
the PCB layout, lead inductance, and the bypass capacitor  
parasitic should be simulated to design and obtain optimal  
bypassing.  
The CCG1 is powered by an external power supply that can be  
anywhere in the range of 1.8 V to 5.5 V. This range is also  
designed for battery-powered operation.For example, the chip  
can be powered from a battery system that starts at 3.5 V and  
works down to 1.8 V. In this mode, the internal regulator of the  
CCG1 supplies the internal logic and the VCCD output of the  
CCG1 must be bypassed to ground via an external capacitor (in  
the range of 1 µF to 1.6 µF; X5R ceramic or better). No voltage  
source should be applied to this pin.  
Examples of bypass schemes follow.  
Figure 4. 40-pin QFN Example  
VDDD  
C1  
1 µF  
VSSA  
VSS  
VSS  
VCCD  
C4 1 µF  
30  
XRES  
TX_M  
BILLBD_CTRL  
GPIO_4  
1
2
3
VSS  
29  
28  
27  
26  
25  
24  
23  
22  
21  
VBUS_DET  
GPIO_1  
TX_REF_IN  
RA_DISCONNECT  
VCONN_DET  
4
5
6
QFN  
(Top View)  
TX_U  
TX_GND  
GPIO_5  
HOTPLUG_DET  
AUX_CH_N_SENSE  
AUX_CH_P_SENSE  
7
8
9
CC1_LPREF  
CC1_LPRX  
GPIO_0  
VSS  
DP_AUX_CTRL  
10  
VSS  
Document Number: 001-96786 Rev. *C  
Page 7 of 24  
CYPD1120  
Figure 5. 35-ball WLCSP Example  
7
6
5
4
3
2
1
CC1_LP  
REF  
TX_GN  
D
VCCD  
GPIO_1  
I2C_INT  
A
B
C
D
E
GPIO_5  
VCCD  
GPIO_0  
1uF  
C4  
VBUS_  
DET  
I2C_SD  
A
I2C_SC  
L
VSS  
XRES  
TX_M  
VSSA  
VDDD  
TX_U  
VSS  
CC1_R  
X
CC_VR  
EF  
CC1_LP  
RX  
SWD_C  
LK  
VDDD  
GPIO_4  
GPIO_2  
GPIO_3  
1uF  
C1  
VSS  
BILLBO  
ARD_C  
TRL  
TX_REF  
_OUT  
BYPAS  
S
TX_REF  
_IN  
SWD_I  
O
CC1_TX  
RA_DIS  
CONNE  
CT  
HOTPL  
UG_DE  
T
AUX_C  
H_P_SE  
NSE  
AUX_C  
H_N_SE  
NSE  
VCONN  
_DET  
ADC_B  
YPASS  
DP_AU  
X_CTRL  
Document Number: 001-96786 Rev. *C  
Page 8 of 24  
CYPD1120  
Electrical Specifications  
Absolute Maximum Ratings  
Table 2. Absolute Maximum Ratings[6]  
Details/  
Conditions  
Spec ID# Parameter  
Description  
Min  
Typ  
Max  
Units  
SID1  
SID2  
VDDD_ABS  
VCCD_ABS  
VGPIO_ABS  
IGPIO_ABS  
Digital supply relative to VSSD  
–0.5  
–0.5  
6.0  
V
V
V
Absolute max  
Direct digital core voltage input relative  
to VSSD  
1.95  
Absolute max  
Absolute max  
SID3  
SID4  
GPIO voltage  
–0.5  
VDDD+0.5  
25.0  
Maximum current per GPIO  
–25.0  
mA Absolute max  
GPIO injection current, Max for VIH  
>
Absolute max, current  
injected per pin  
SID5  
IGPIO_injection  
ESD_HBM  
–0.50  
2200  
0.5  
mA  
V
VDDD, and Min for VIL < VSS  
Electrostatic discharge human body  
model  
BID44  
Electrostatic discharge charged device  
model  
BID45  
BID46  
ESD_CDM  
LU  
500  
V
Pin current for latch-up  
–200  
200  
mA  
Device Level Specifications  
All specifications are valid for –40 °C TA 85 °C and TJ 100 °C for 35-CSP and 40-QFN package options. Specifications are valid  
for 1.8 V to 5.5 V, except where noted.  
Table 3. DC Specifications  
Spec ID# Parameter  
Details/  
Description  
Min  
Typ  
Max  
Units  
Conditions  
With regulator enabled  
SID53  
SID54  
SID55  
SID56  
VDDD  
VCCD  
CEFC  
CEXC  
Power supply input voltage  
1.8  
5.5  
V
V
Output voltage (for core logic)  
External regulator voltage bypass  
Power supply decoupling capacitor  
1.8  
1.3  
1.0  
1.0  
1.6  
µF  
µF  
X5R ceramic or better  
X5R ceramic or better  
Active Mode, VDDD = 1.8 to 5.5 V. Typical values measured at VDD = 3.3 V.  
SID19  
SID20  
IDD14  
IDD15  
Execute from flash; CPU at 48 MHz  
Execute from flash; CPU at 48 MHz  
12.8  
mA  
mA  
T = 25 °C  
13.8  
Sleep Mode, VDDD = 1.8 to 5.5 V  
SID25A IDD20A  
I2C wakeup and comparators on  
Deep Sleep Mode, VDDD = 1.8 to 3.6 V (Regulator on)  
1.7  
2.2  
mA  
SID31  
SID32  
IDD26  
IDD27  
I2C wakeup on  
I2C wakeup on  
1.3  
µA  
µA  
T = 25 °C, 3.6 V  
T = 85 °C  
50.0  
Deep Sleep Mode, VDDD = 3.6 to 5.5 V  
SID34  
IDD29  
I2C wakeup  
15.0  
2.0  
µA  
T = 25 °C, 5.5 V  
XRES Current  
SID307  
IDD_XR  
Supply current while XRES asserted  
5.0  
mA  
Note  
6. Usage above the absolute maximum conditions listed in Table 2 may cause permanent damage to the device. Exposure to absolute maximum conditions for extended  
periods of time may affect device reliability. The maximum storage temperature is 150 °C in compliance with JEDEC Standard JESD22-A103, High Temperature  
Storage Life. When used below absolute maximum conditions but above normal operating conditions, the device may not operate to specification.  
Document Number: 001-96786 Rev. *C  
Page 9 of 24  
CYPD1120  
Table 4. AC Specifications  
Spec ID# Parameter  
Details/  
Conditions  
Description  
CPU frequency  
Wakeup from sleep mode  
Min  
Typ  
Max  
Units  
SID48  
SID49  
FCPU  
DC  
0
48.0  
MHz  
µs  
1.8 VDD 5.5  
TSLEEP  
Guaranteed by characterization  
24-MHz IMO. Guaranteed by  
characterization  
SID50  
SID52  
TDEEPSLEEP Wakeup from Deep Sleep mode  
TRESETWIDTH External reset pulse width  
25.0  
µs  
µs  
1.0  
Guaranteed by characterization  
I/O  
Table 5. I/O DC Specifications  
Details/  
Conditions  
Spec ID# Parameter  
Description  
Min  
Typ  
Max  
Units  
0.7 ×  
VDDD  
[7]  
SID57  
VIH  
VIL  
VIH  
VIL  
Input voltage high threshold  
Input voltage low threshold  
LVTTL input, VDDD < 2.7 V  
LVTTL input, VDDD < 2.7 V  
V
V
V
V
CMOS Input  
0.3 ×  
VDDD  
SID58  
CMOS Input  
0.7×  
VDDD  
[7]  
SID241  
SID242  
0.3 ×  
VDDD  
[7]  
SID243  
SID244  
VIH  
VIL  
LVTTL input, VDDD 2.7 V  
LVTTL input, VDDD 2.7 V  
2.0  
V
V
0.8  
VDDD  
–0.6  
SID59  
SID60  
VOH  
VOH  
Output voltage high level  
Output voltage high level  
V
V
IOH = 4 mA at 3-V VDDD  
IOH = 1 mA at 1.8-V VDDD  
VDDD  
–0.5  
SID61  
SID62  
SID62A  
SID63  
SID64  
VOL  
Output voltage low level  
Output voltage low level  
Output voltage low level  
Pull-up resistor  
0.6  
0.6  
0.4  
8.5  
8.5  
V
V
IOL = 4 mA at 1.8-V VDDD  
VOL  
IOL = 8 mA at 3-V VDDD  
VOL  
V
IOL = 3 mA at 3-V VDDD  
RPULLUP  
3.5  
3.5  
5.6  
5.6  
kΩ  
kΩ  
RPULLDOWN Pull-down resistor  
Input leakage current (absolute  
value)  
SID65  
IIL  
2.0  
nA 25 °C, VDDD = 3.0 V  
Input leakage current (absolute  
value) for analog pins  
SID65A  
SID66  
SID67  
IIL_CTBM  
CIN  
4.0  
7.0  
nA  
pF  
Input capacitance  
VDDD 2.7 V. Guaranteed by  
VHYSTTL  
Input hysteresis LVTTL  
15.0  
40.0  
mV  
characterization  
VDDD 4.5 V.  
SID68  
SID69  
SID69A  
VHYSCMOS Input hysteresis CMOS  
200.0  
mV  
Guaranteed by characterization  
Current through protection diode  
to VDD/VSS  
IDIODE  
100.0  
200.0  
µA Guaranteed by characterization  
Maximum Total Source or Sink  
Chip Current  
ITOT_GPIO  
mA Guaranteed by characterization  
Note  
7. VIH must not exceed VDDD + 0.2 V.  
Document Number: 001-96786 Rev. *C  
Page 10 of 24  
CYPD1120  
Table 6. I/O AC Specifications  
(Guaranteed by Characterization)  
Details/  
Spec ID#  
Parameter  
TRISEF  
TFALLF  
Description  
Min  
Typ  
Max  
Units  
Conditions  
SID70  
SID71  
Rise time  
Fall time  
2.0  
2.0  
12.0  
12.0  
ns  
ns  
3.3-V VDDD, Cload = 25 pF  
3.3-V VDDD, Cload = 25 pF  
XRES  
Table 7. XRES DC Specifications  
Details/  
Spec ID#  
Parameter  
VIH  
Description  
Min  
Typ  
Max  
Units  
Conditions  
0.7 ×  
VDDD  
SID77  
Input voltage high threshold  
V
CMOS input  
CMOS input  
0.3 ×  
VDDD  
SID78  
VIL  
Input voltage low threshold  
V
SID79  
SID80  
SID81  
RPULLUP  
CIN  
Pull-up resistor  
3.5  
5.6  
3.0  
8.5  
kΩ  
Input capacitance  
Input voltage hysteresis  
pF  
VHYSXRES  
100.0  
mV Guaranteed by characterization  
Current through protection  
diode to VDDD/VSS  
SID82  
IDIODE  
100.0  
µA  
Guaranteed by characterization  
Digital Peripherals  
The following specifications apply to the Timer/Counter/PWM peripherals in the Timer mode.  
Pulse Width Modulation (PWM) for VSEL and CUR_LIM Pins  
Table 8. PWM AC Specifications  
(Guaranteed by Characterization)  
Spec ID#  
SID140  
SID141  
SID142  
SID143  
SID144  
SID145  
SID146  
SID147  
SID148  
Parameter  
TPWMFREQ  
TPWMPWINT  
TPWMEXT  
Description  
Operating frequency  
Pulse width (internal)  
Pulse width (external)  
Min  
Typ  
Max  
Units  
MHz  
ns  
Details/Conditions  
48.0  
42.0  
42.0  
42.0  
42.0  
42.0  
42.0  
42.0  
42.0  
ns  
TPWMKILLINT Kill pulse width (internal)  
TPWMKILLEXT Kill pulse width (external)  
ns  
ns  
TPWMEINT  
Enable pulse width (internal)  
Enable pulse width (external)  
ns  
TPWMENEXT  
ns  
TPWMRESWINT Reset pulse width (internal)  
TPWMRESWEXT Reset pulse width (external)  
ns  
ns  
I2C  
Table 9. Fixed I2C DC Specifications  
(Guaranteed by Characterization)  
Spec ID#  
Parameter  
II2C1  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
Block current consumption at  
100 kHz  
SID149  
10.5  
135.0  
310.0  
1.4  
µA  
µA  
µA  
µA  
Block current consumption at  
400 kHz  
SID150  
SID151  
SID152  
II2C2  
II2C3  
II2C4  
Block current consumption at 1  
Mbps  
I2C enabled in Deep Sleep  
mode  
Document Number: 001-96786 Rev. *C  
Page 11 of 24  
CYPD1120  
Table 10. Fixed I2C AC Specifications  
(Guaranteed by Characterization)  
Spec ID#  
Parameter  
FI2C1  
Description  
Min  
Typ  
Max Units  
1.0 Mbps  
Details/Conditions  
SID153  
Bit rate  
Memory  
Table 11. Flash DC Specifications  
Spec ID#  
Parameter  
VPE  
Description  
Min  
1.8  
Typ  
Max  
Units  
Details/Conditions  
SID173  
Erase and program voltage  
5.5  
V
Table 12. Flash AC Specifications  
Spec ID#  
Parameter  
Description  
Min Typ  
Max  
Units  
Details/Conditions  
Row (block) write time (erase  
and program)  
[8]  
SID174  
TROWWRITE  
20.0  
ms  
Row (block) = 128 bytes  
[8]  
SID175  
SID176  
SID178  
TROWERASE  
Row erase time  
13.0  
7.0  
35  
ms  
ms  
ms  
[8]  
TROWPROGRAM  
Row program time after erase  
Bulk erase time (32 KB)  
[8]  
TBULKERASE  
second  
s
[8]  
SID180  
SID181  
SID182  
TDEVPROG  
Total device program time  
Flash endurance  
7.0  
Guaranteed by characterization  
FEND  
100 K  
20  
cycles Guaranteed by characterization  
Flash retention. TA 55 °C,  
100 K P/E cycles  
[9]  
FRET  
years Guaranteed by characterization  
Flash retention. TA 85 °C,  
SID182A  
SID182B  
10  
3
years Guaranteed by characterization  
years Guaranteed by characterization  
10 K P/E cycles  
Flash retention. 85 °C < TA <  
105 °C, 10K P/E cycles  
System Resources  
Power-on-Reset (POR) with Brown Out  
Table 13. Imprecise Power On Reset (PRES)  
Spec ID#  
SID185  
Parameter  
VRISEIPOR  
VFALLIPOR  
VIPORHYST  
Description  
Rising trip voltage  
Min  
0.80  
0.75  
15.0  
Typ  
Max Units  
Details/Conditions  
1.45  
1.40  
V
V
Guaranteed by characterization  
Guaranteed by characterization  
SID186  
Falling trip voltage  
Hysteresis  
SID187  
200.0  
mV Guaranteed by characterization  
Table 14. Precise Power On Reset (POR)  
Spec ID#  
SID190  
Parameter  
VFALLPPOR  
VFALLDPSLP  
Description  
Min  
Typ  
Max Units  
Details/Conditions  
BOD trip voltage in active and  
sleep modes  
1.64  
V
V
Guaranteed by characterization  
Guaranteed by characterization  
SID192  
BOD trip voltage in Deep Sleep 1.40  
Note  
8. It can take as much as 20 milliseconds to write to flash. During this time the device should not be Reset, or flash operations will be interrupted and cannot be relied  
on to have completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs.  
Make certain that these are not inadvertently activated.  
9. Cypress provides a retention calculator to calculate the retention lifetime based on customers' individual temperature profiles for operation over the –40 °C to +105 °C  
ambient temperature range. Contact customercare@cypress.com.  
Document Number: 001-96786 Rev. *C  
Page 12 of 24  
CYPD1120  
SWD Interface  
Table 15. SWD Interface Specifications  
Spec ID  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
SWDCLK 1/3 CPU clock  
frequency  
SID213 F_SWDCLK1  
SID214 F_SWDCLK2  
3.3 V VDDD 5.5 V  
14.0  
MHz  
SWDCLK 1/3 CPU clock  
frequency  
1.8 V VDDD 3.3 V  
7.0  
MHz  
SID215 T_SWDI_SETUP T = 1/f SWDCLK  
SID216 T_SWDI_HOLD T = 1/f SWDCLK  
SID217 T_SWDO_VALID T = 1/f SWDCLK  
SID217A T_SWDO_HOLD T = 1/f SWDCLK  
0.25*T  
ns  
ns  
ns  
ns  
Guaranteed by characterization  
Guaranteed by characterization  
Guaranteed by characterization  
Guaranteed by characterization  
0.25*T  
1
0.5*T  
Internal Main Oscillator  
Table 16. IMO DC Specifications  
(Guaranteed by Design)  
Spec ID  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
SID218 IIMO1  
IMO operating current at 48 MHz  
1000.0  
µA  
Table 17. IMO AC Specifications  
Spec ID  
Parameter  
Description  
Frequency variation  
IMO startup time  
Min  
Typ  
Max  
±2.0  
12.0  
Units  
%
Details/Conditions  
SID223 FIMOTOL1  
SID226 TSTARTIMO  
SID229 TJITRMSIMO3  
With API-called calibration  
µs  
RMS Jitter at 48 MHz  
139.0  
ps  
Internal Low-Speed Oscillator  
Table 18. ILO DC Specifications  
(Guaranteed by Design)  
Spec ID Parameter  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
Guaranteed by characterization  
Guaranteed by design  
SID231 IILO1  
ILO operating current at 32 kHz  
ILO leakage current  
0.30  
2.0  
1.05  
15.0  
µA  
nA  
SID233 IILOLEAK  
Table 19. ILO AC Specifications  
Spec ID Parameter  
Description  
Min  
Typ  
Max  
2.0  
Units  
ms  
Details/Conditions  
Guaranteed by characterization  
Guaranteed by characterization  
±60% with trim  
SID234 TSTARTILO1  
SID236 TILODUTY  
SID237 FILOTRIM1  
ILO startup time  
ILO duty cycle  
32-kHz trimmed frequency  
40.0  
15.0  
50.0  
32.0  
60.0  
50.0  
%
kHz  
Document Number: 001-96786 Rev. *C  
Page 13 of 24  
CYPD1120  
Applications in Detail  
Figure 6. Type-C to DisplayPort/Mini-DisplayPort Application Using 35-CSP Package  
Paddle Card on  
Type-C Plug  
VBUS  
3.3V  
Regulator  
VCONN  
VBUS  
D+/-  
USB-Billboard  
SDA  
SCL  
3.3V  
XRES INT  
VCONN  
2.2k5%  
2.2k5%  
3.3V  
100k  
B2  
I2C_SDA  
B1  
A2  
I2C_  
I2C_SCL  
INT  
D6  
D
1%  
TF412S  
Ra  
G
BILLBOA  
RD_CTRL  
S
C7  
A5  
800  
1%  
VDDD  
A7  
VCCD  
1uF  
25V  
10%  
100k1%  
20k1%  
1uF  
25V  
10%VBUS  
CC1_LPREF  
D1  
C1  
SWD_IO  
SWD_CLK  
VCONN  
mDP/  
DP  
Plug  
B3  
B5  
Type-C  
Plug  
TX_U  
TX_M  
E4  
E5  
100k1%  
RA_DISCONNECT  
VCONN_DET  
B4  
E6  
100k1%  
100k1%  
VBUS_DET  
HotPlug Detect  
100k1%  
HOTPLUG_DET  
221%  
D7  
CC1_TX  
A1  
A6  
C2  
D2  
C6  
A4  
GPIO_0  
GPIO_1  
GPIO_2  
GPIO_3  
GPIO_4  
GPIO_5  
CYPD1120-35FNXIT  
35CSP  
C4  
C3  
CC1_RX  
CC  
CC1_LPRX  
5.1k1%  
B6  
E7  
0.01µF  
25V  
10%  
XRES  
D4  
D3  
TX_REF_OUT  
TX_REF_IN  
DP/  
mDP  
Wire  
Pads  
2.4k1%  
ADC_BYPASS  
D5  
BYPASS  
47pF  
25V  
10%  
0  
C5  
2.2nF  
25V  
10%  
CC_VREF  
2k1%  
A3  
B7  
2k1%  
TX_GND  
VSSA  
AUX_CH DP_AU  
AUX_CH_  
P_CTRL _N_CTRL  
E2 E3  
X_CTRL  
E1  
SBU_1/2  
AUX_P/N  
SW for AUX  
Display Port  
Data Lanes  
Document Number: 001-96786 Rev. *C  
Page 14 of 24  
CYPD1120  
Figure 7. Type-C to DisplayPort/mini-DisplayPort Application Using 40-QFN Package  
Paddle Card on  
Type-C Plug  
VBUS  
3.3V  
Regulator  
VCONN  
VBUS  
D+/-  
USB-Billboard  
SDA  
SCL  
3.3V  
XRES INT  
VCONN  
2.2k5%  
2.2k5%  
3.3V  
100k  
1
20  
18  
I2C_SCL  
19  
I2C_SDA  
D
1%  
TF412S  
Ra  
G
I2C_  
INT  
BILLBOA  
RD_CTRL  
S
32  
33  
23  
800  
1%  
VDDD  
VDDA  
31  
VCCD  
1uF  
25V  
10%  
100k1%  
1uF  
25V  
10%VBUS  
CC1_LPREF  
12  
13  
SWD_IO  
SWD_CLK  
20k1%  
VCONN  
mDP/  
DP  
Plug  
26  
29  
Type-C  
Plug  
TX_U  
TX_M  
4
5
100k1%  
RA_DISCONNECT  
VCONN_DET  
28  
6
100k1%  
100k1%  
VBUS_DET  
HotPlug Detect  
100k1%  
HOTPLUG_DET  
21  
27  
14  
11  
2
24  
15  
16  
17  
221%  
GPIO_0  
GPIO_1  
GPIO_2  
GPIO_3  
GPIO_4  
GPIO_5  
GPIO_6  
GPIO_7  
GPIO_8  
38  
CC1_TX  
CYPD1120-40LQXI  
40QFN  
35  
22  
CC1_RX  
CC  
CC1_LPRX  
5.1k1%  
30  
40  
0.01µF  
25V  
10%  
XRES  
39  
3
TX_REF_OUT  
TX_REF_IN  
DP/  
mDP  
Wire  
Pads  
2.4k1%  
ADC_BYPASS  
37  
BYPASS  
47pF  
25V  
10%  
0  
36  
2.2nF  
25V  
10%  
CC_VREF  
2k1%  
25  
34  
2k1%  
TX_GND  
VSSA  
VSS  
AUX_CH DP_AU  
AUX_CH_  
P_CTRL _N_CTRL  
X_CTRL  
8
7
10  
9
AUX_P/N  
SBU_1/2  
SW for AUX  
Display Port  
Data Lanes  
Document Number: 001-96786 Rev. *C  
Page 15 of 24  
CYPD1120  
Figure 8. Type-C to HDMI Application Using 35-CSP Package  
1.2V  
Paddle Card on  
Type-C Plug  
5V  
3.3V  
Regulator  
VBUS  
BuckBoost  
VCONN  
VBUS  
D+/-  
USB-Billboard  
SDA  
SCL  
3.3V  
XRES  
INT  
VCONN  
2.2k5%  
2.2k5%  
3.3V  
100k  
B2  
I2C_SDA  
A2  
B1  
I2C_SCL  
D6  
D
1%  
TF412S  
Ra  
G
BILLBOA  
RD_CTRL  
I2C_  
INT  
S
C7  
A5  
800  
1%  
VDDD  
A7  
VCCD  
1uF  
25V  
10%  
100k1%  
1uF  
25V  
10%VBUS  
CC1_LPREF  
D1  
C1  
SWD_IO  
SWD_CLK  
20k1%  
VCONN  
B3  
B5  
Type-C  
Plug  
TX_U  
TX_M  
E4  
E5  
100k1%  
100k1%  
RA_DISCONNECT  
VCONN_DET  
B4  
100k1%  
100k1%  
VBUS_DET  
E6  
HOTPLUG_DET  
221%  
D7  
CC1_TX  
A1  
A6  
C2  
D2  
C6  
A4  
GPIO_0  
GPIO_1  
GPIO_2  
GPIO_3  
GPIO_4  
GPIO_5  
CYPD1120-35FNXIT  
35CSP  
C4  
C3  
CC1_RX  
CC  
CC1_LPRX  
HotPlug  
Detect  
5.1k1%  
B6  
E7  
0.01µF  
25V  
10%  
XRES  
D4  
D3  
TX_REF_OUT  
TX_REF_IN  
2.4k1%  
ADC_BYPASS  
5V  
D5  
BYPASS  
47pF  
25V  
0  
C5  
2.2nF  
25V  
10%  
CC_VREF  
2k1%  
10%  
A3  
B7  
2k1%  
TX_GND  
VSSA  
AUX_CH DP_AU  
AUX_CH_  
P_CTRL _N_CTRL  
E2 E3  
X_CTRL  
E1  
1.2V  
3.3V  
HDMI/DVI/  
VGA  
Receptacle  
DP to HDMI/  
DVI/VGA  
Convertor  
SBU_1/2  
AUX_P/N  
SW for AUX  
Display Port  
Data Lanes  
Document Number: 001-96786 Rev. *C  
Page 16 of 24  
CYPD1120  
Figure 9. Type-C to HDMI Application Using 40-QFN Package  
1.2V  
Paddle Card on  
Type-C Plug  
5V  
3.3V  
Regulator  
VBUS  
BuckBoost  
VCONN  
VBUS  
D+/-  
USB-Billboard  
SDA  
SCL  
3.3V  
INT  
XRES  
VCONN  
2.2k5%  
2.2k5%  
3.3V  
100k  
1
18  
19  
I2C_SDA  
20  
D
1%  
TF412S  
Ra  
G
BILLBOA I2C_INT I2C_SCL  
RD_CTRL  
S
32  
33  
23  
800  
1%  
VDDD  
VDDA  
31  
VCCD  
1uF  
25V  
10%  
100k1%  
1uF  
25V  
10%VBUS  
CC1_LPREF  
12  
13  
SWD_IO  
SWD_CLK  
20k1%  
VCONN  
26  
29  
Type-C  
Plug  
TX_U  
TX_M  
4
5
100k1%  
100k1%  
RA_DISCONNECT  
VCONN_DET  
28  
6
100k1%  
100k1%  
VBUS_DET  
HOTPLUG_DET  
GPIO_0  
21  
27  
14  
11  
2
24  
15  
16  
17  
221%  
38  
CC1_TX  
GPIO_1  
GPIO_2  
CYPD1120-40LQXI  
35  
22  
CC1_RX  
CC  
40QFN  
GPIO_3  
GPIO_4  
GPIO_5  
GPIO_6  
GPIO_7  
GPIO_8  
CC1_LPRX  
5.1k1%  
HotPlug  
Detect  
30  
40  
0.01µF  
25V  
10%  
XRES  
39  
3
TX_REF_OUT  
TX_REF_IN  
2.4k1%  
ADC_BYPASS  
37  
5V  
BYPASS  
47pF  
25V  
0  
36  
2.2nF  
25V  
10%  
CC_VREF  
2k1%  
10%  
25  
34  
2k1%  
TX_GND  
VSSA  
VSS  
AUX_CH DP_AU  
AUX_CH_  
P_CTRL _N_CTRL  
X_CTRL  
9
8
7
10  
HDMI/DVI/  
VGA  
1.2V  
3.3V  
Receptacle  
DP to HDMI/  
DVI/VGA  
AUX_P/N  
SBU_1/2  
SW for AUX  
Display Port  
Data Lanes  
Convertor  
Document Number: 001-96786 Rev. *C  
Page 17 of 24  
CYPD1120  
Ordering Information  
The CCG1 part numbers and features are listed in the following table.  
Table 20. CCG1 Ordering Information  
Termination  
Resistor[12]  
Part Number[10]  
CYPD1120-35FNXIT  
CYPD1120-40LQXI  
CYPD1120-40LQXIT  
Application  
Type-C Ports[11]  
Role[13]  
UFP[17]  
UFP[17]  
UFP[17]  
Package  
35-WLCSP[15]  
40-QFN[16]  
40-QFN[16]  
Si ID  
0492  
0488  
0488  
Type-C to DP,  
Type-C to HDMI  
[14]  
1
1
1
Rd  
Type-C to DP,  
Type-C to HDMI  
[14]  
Rd  
Type-C to DP,  
Type-C to HDMI  
[14]  
Rd  
Ordering Code Definitions  
-
X X X  
XX  
X
PD X XX XX  
CY  
T = Tape and reel for CSP, N/A for other packages  
Temperature Range: I = Industrial, Q = Extended industrial  
Lead: X = Pb-free  
Package Type: LQ = QFN, FN = CSP  
Number of pins in the package  
0X: OCP and OVP not supported, 1X: reserved,  
2X, 3X: OCP and OVP supported  
Number of Type-C Ports: 1 = 1 Port, 2 = 2 Port  
Product Type: 1 = First-generation product family, CCG1  
Marketing Code: PD = Power delivery product family  
Company ID: CY = Cypress  
Notes  
10. All part numbers support: Input voltage range from 1.8 to 5.5 V. Industrial parts support -40 °C to +85 °C, Extended Industrial parts support -40 °C to 105 °C.  
11. Number of USB Type-C Ports Supported .  
12. Default V  
13. PD Role.  
Termination.  
CONN  
14. Termination resistor denoting an upstream facing port.  
15. 35-WLCSP#1 pinout.  
16. 40-QFN#3 pinout.  
17. Upstream Facing Port.  
Document Number: 001-96786 Rev. *C  
Page 18 of 24  
CYPD1120  
Packaging  
Table 21. Package Characteristics  
Parameter  
A (40-QFN, 35-CSP)  
Description  
Conditions  
Min  
–40  
–40  
Typ  
25.00  
Max  
85  
100  
Units  
°C  
T
Operating ambient temperature  
Operating junction temperature  
Package JA (40-pin QFN)  
Package JA (35-CSP)  
T
°C  
J (40-QFN, 35-CSP)  
TJA  
15.34  
28.00  
02.50  
°C/Watt  
°C/Watt  
°C/Watt  
TJA  
TJC  
Package JC (40-pin QFN)  
Table 22. Solder Reflow Peak Temperature  
Package  
40-pin QFN  
Maximum Peak Temperature  
Maximum Time at Peak Temperature  
30 seconds  
260 °C  
260 °C  
35-ball WLCSP  
30 seconds  
Table 23. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2  
Package  
MSL  
40-pin QFN  
MSL 3  
MSL 1  
35-ball WLCSP  
Document Number: 001-96786 Rev. *C  
Page 19 of 24  
CYPD1120  
Figure 10. 40-pin QFN Package Outline, 001-80659  
001-80659 *A  
The center pad on the QFN package should be connected to ground (VSS) for best mechanical, thermal, and electrical performance.  
If not connected to ground, it should be electrically floating and not connected to any other signal.  
Figure 11. 35-Ball WLCSP Package Outline, 001-93741  
SIDE VIEW  
TOP VIEW  
BOTTOM VIEW  
1
2
3
4
5
6
7
7
6
5
4
3
2
1
A
B
C
D
E
A
B
C
D
E
NOTES:  
1. REFERENCE JEDEC PUBLICATION 95, DESIGN GUIDE 4.18  
2. ALL DIMENSIONS ARE IN MILLIMETERS  
001-93741 **  
Document Number: 001-96786 Rev. *C  
Page 20 of 24  
CYPD1120  
Acronyms  
Table 24. Acronyms Used in this Document (continued)  
Table 24. Acronyms Used in this Document  
Acronym  
opamp  
Description  
operational amplifier  
Acronym  
ADC  
Description  
analog-to-digital converter  
OCP  
OVP  
PCB  
PGA  
PHY  
POR  
PRES  
PSoC®  
PWM  
RAM  
RISC  
RMS  
RTC  
RX  
Overcurrent protection  
Overvoltage protection  
printed circuit board  
programmable gain amplifier  
physical layer  
API  
ARM®  
application programming interface  
advanced RISC machine, a CPU architecture  
Configuration Channel  
CC  
CPU  
central processing unit  
cyclic redundancy check, an error-checking  
protocol  
CRC  
power-on reset  
CS  
Current Sense  
precise power-on reset  
Programmable System-on-Chip™  
pulse-width modulator  
random-access memory  
reduced-instruction-set computing  
root-mean-square  
DFP  
Downstream Facing Port  
digital input/output, GPIO with only digital  
capabilities, no analog. See GPIO.  
DIO  
DP  
DisplayPort  
electrically erasable programmable read-only  
memory  
EEPROM  
real-time clock  
EMI  
ESD  
FPB  
FS  
electromagnetic interference  
electrostatic discharge  
flash patch and breakpoint  
full-speed  
receive  
SAR  
SCL  
successive approximation register  
I2C serial clock  
I2C serial data  
SDA  
S/H  
general-purpose input/output, applies to a PSoC  
pin  
GPIO  
sample and hold  
IC  
integrated circuit  
Serial Peripheral Interface, a communications  
protocol  
SPI  
IDE  
integrated development environment  
SRAM  
SWD  
TX  
static random access memory  
serial wire debug, a test protocol  
transmit  
Inter-Integrated Circuit, a communications  
protocol  
I2C, or IIC  
ILO  
internal low-speed oscillator, see also IMO  
internal main oscillator, see also ILO  
input/output, see also GPIO, DIO, SIO, USBIO  
low-voltage detect  
IMO  
I/O  
Universal Asynchronous Transmitter Receiver, a  
communications protocol  
UART  
UFP  
USB  
Upstream Facing Port  
Universal Serial Bus  
LVD  
LVTTL  
MCU  
NC  
low-voltage transistor-transistor logic  
microcontroller unit  
USB input/output, PSoC pins used to connect to  
a USB port  
USBIO  
no connect  
VESA  
XRES  
Video Electronics Standards Association  
external reset I/O pin  
NMI  
NVIC  
nonmaskable interrupt  
nested vectored interrupt controller  
Document Number: 001-96786 Rev. *C  
Page 21 of 24  
CYPD1120  
Document Conventions  
Units of Measure  
Table 25. Units of Measure  
Symbol  
°C  
Unit of Measure  
degrees Celsius  
hertz  
Hz  
KB  
kHz  
k  
Mbps  
MHz  
M  
Msps  
µA  
1024 bytes  
kilohertz  
kilo ohm  
megabits per second  
megahertz  
mega-ohm  
megasamples per second  
microampere  
microfarad  
microsecond  
microvolt  
µF  
µs  
µV  
µW  
mA  
ms  
mV  
nA  
microwatt  
milliampere  
millisecond  
millivolt  
nanoampere  
nanosecond  
ohm  
ns  
pF  
picofarad  
ppm  
ps  
parts per million  
picosecond  
second  
s
sps  
V
samples per second  
volt  
Document Number: 001-96786 Rev. *C  
Page 22 of 24  
CYPD1120  
.
Revision History  
Description Title: CYPD1120, USB Power Delivery Alternate Mode Controller on Type-C  
Document Number: 001-96786  
Orig. of Submission  
Revision  
ECN  
Description of Change  
Change  
Date  
**  
4686071  
4829889  
5104916  
5705375  
VGT  
05/13/2015 New datasheet  
*A  
*B  
*C  
VGT  
07/20/2015 Added CYPD1120-40LQXIT in Ordering Information.  
02/05/2016 Updated Ordering Information.  
VGT  
VGT  
04/21/2017 Updated Sales, Solutions, and Legal Information.  
Updated Copyright and Disclaimer.  
Updated template.  
Document Number: 001-96786 Rev. *C  
Page 23 of 24  
CYPD1120  
Sales, Solutions, and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at Cypress Locations.  
®
Products  
PSoC Solutions  
ARM® Cortex® Microcontrollers  
cypress.com/arm  
cypress.com/automotive  
cypress.com/clocks  
cypress.com/interface  
cypress.com/iot  
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP  
Automotive  
Cypress Developer Community  
Clocks & Buffers  
Interface  
Forums | WICED IOT Forums | Projects | Video | Blogs |  
Training | Components  
Internet of Things  
Memory  
Technical Support  
cypress.com/memory  
cypress.com/mcu  
cypress.com/support  
Microcontrollers  
PSoC  
cypress.com/psoc  
Power Management ICs  
Touch Sensing  
USB Controllers  
Wireless Connectivity  
cypress.com/pmic  
cypress.com/touch  
cypress.com/usb  
cypress.com/wireless  
Notice regarding compliance with Universal Serial Bus specification. Cypress offers firmware and hardware solutions that are certified to comply with the Universal Serial  
Bus specification, USB Type-C™ Cable and Connector Specification, and other specifications of USB Implementers Forum, Inc (USB-IF). You may use Cypress or third  
party software tools, including sample code, to modify the firmware for Cypress USB products. Modification of such firmware could cause the firmware/hardware combi-  
nation to no longer comply with the relevant USB-IF specification. You are solely responsible ensuring the compliance of any modifications you make, and you must follow  
the compliance requirements of USB-IF before using any USB-IF trademarks or logos in connection with any modifications you make. In addition, if Cypress modifies firm-  
ware based on your specifications, then you are responsible for ensuring compliance with any desired standard or specifications as if you had made the modification.  
CYPRESS IS NOT RESPONSIBLE IN THE EVENT THAT YOU MODIFY OR HAVE MODIFIED A CERTIFIED CYPRESS PRODUCT AND SUCH MODIFIED PRODUCT  
NO LONGER COMPLIES WITH THE RELEVANT USB-IF SPECIFICATIONS.  
© Cypress Semiconductor Corporation, 2015-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,  
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries  
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other  
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress  
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to  
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users  
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as  
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation  
of the Software is prohibited.  
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE  
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent  
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any  
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is  
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products  
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or  
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the  
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably  
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,  
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other  
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.  
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in  
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.  
Document Number: 001-96786 Rev. *C  
Revised April 21, 2017  
Page 24 of 24  
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