LZ9 MCPCB Family  
					Emitter + MCPCB  
					Thermal Resistance  
					(oC/W)  
					Diameter  
					(mm)  
					Typical Vf Typical If  
					Part number Type of MCPCB  
					(V)  
					(mA)  
					LZ9-Jxxxxx  
					1-channel  
					3-channel  
					19.9  
					19.9  
					1.3 + 0.2 = 1.5  
					1.3 + 0.2 = 1.5  
					29.1  
					700  
					LZ9-Mxxxxx  
					9.7/ ch  
					700/ ch  
					Mechanical Mounting of MCPCB  
					.
					MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to  
					substrate cracking and subsequently LED dies cracking.  
					.
					To avoid MCPCB bending:  
					o
					o
					Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.  
					Care must be taken when securing the board to the heat sink. This can be done by tightening three M3  
					screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will  
					increase the likelihood of board bending.  
					o
					o
					It is recommended to always use plastics washers in combinations with the three screws.  
					If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after  
					tightening (with controlled torque) and then re-tighten the screws again.  
					Thermal interface material  
					.
					.
					.
					To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when  
					mounting the MCPCB on to the heat sink.  
					There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal  
					epoxies. An example of such material is Electrolube EHTC.  
					It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating  
					conditions.  
					Wire soldering  
					.
					To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.  
					Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is  
					recommended to use a solder iron of more than 60W.  
					.
					It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:  
					24-7068-7601)  
					COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.  
					LZ9-00NW00 (1.7-02/23/14)  
					14  
					LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com