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DZ2S180C0L

型号:

DZ2S180C0L

品牌:

PANASONIC[ PANASONIC ]

页数:

5 页

PDF大小:

334 K

Doc No. TT4-EA-12597  
Revision. 3  
Zener Diode  
DZ2S180C0L  
DZ2S180C0L  
Silicon epitaxial planar type  
Unit: mm  
For ESD protection  
Bi-directional type  
0.8  
0.13  
2
Features  
High ESD  
Low terminal capacitance Ct  
Halogen-free / RoHS compliant  
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)  
Marking Symbol:  
YH  
1
0.3  
0.6  
Packaging  
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)  
1. Cathode  
2. Cathode  
Absolute Maximum Ratings Ta = 25 C  
Panasonic  
JEITA  
SSMini2-F5-B  
SC-79  
SOD-523  
Parameter  
Symbol  
PT  
Rating  
150  
15  
Unit  
mW  
kV  
*1  
Code  
Total power dissipation  
*2  
ESD  
Tj  
Electrostatic discharge  
Junction temperature  
150  
C  
Operating ambient temperature  
Storage temperature  
Topr  
Tstg  
-40 to +85  
-55 to +150  
Internal Connection  
C  
C  
2
Note)  
*1  
Mounted on glass epoxy print board ( 45 mm 45 mm 1 mm )  
Solder in ( 0.8 mm 0.6 mm )  
*2 Test method : IEC61000_4_2  
( C = 150 pF, R = 330 , Contact discharge : 10 times )  
1
Electrical Characteristics Ta = 25 C 3 C  
Parameter Symbol  
Zener voltage *1, *2  
Zener operating resistance  
Reverse current  
Conditions  
Min Typ Max  
Unit  
V
VZ  
RZ  
IR  
IZ = 5 mA  
IZ = 5 mA  
VR = 13 V  
17.5  
20.0  
60  
15  
nA  
Terminal capacitance  
Ct  
SZ  
VR = 0 V, f = 1 MHz  
IZ = 5 mA  
5
14  
pF  
mV/C  
*3  
Temperature coefficient of zener voltage  
Note) 1.  
Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.  
2. *1  
The temperature must be controlled 25 C for VZ mesurement.  
VZ value measured at other temperature must be adjusted to VZ (25 C).  
VZ guaranted 20 ms after current flow  
*2  
*3  
Tj = 25 C to 150 C  
Page 1 of 4  
Established : 2010-05-27  
Revised : 2013-07-24  
Doc No. TT4-EA-12597  
Revision. 3  
Zener Diode  
DZ2S180C0L  
Technical Data ( reference )  
PT - Ta  
IZ - VZ  
1.E-01  
200  
150  
100  
50  
Mounted on glass epoxy print board.  
Board size : 45 mm × 45 mm x 1 mm  
Solder in : 0.8 mm x 0.6 mm  
1.E-02  
1.E-03  
1.E-04  
1.E-05  
1.E-06  
Ta = 125 °C  
85 °C  
25 °C  
-40 °C  
0
0
20 40 60 80 100 120 140 160 180 200  
Ambient temperature Ta (°C)  
5
10  
15  
20  
25  
30  
Zener voltage VZ (V)  
IR - VR  
RZ - IZ  
1.E-06  
1.E-07  
1.E-08  
1.E-09  
1.E-10  
1.E-11  
1.E-12  
100  
10  
1
Ta = 25 °C  
Ta = 25 °C  
0
3
6
9
12  
15  
0.0001  
0.001  
0.01  
0.1  
Reverse voltage VR (V)  
Zener current IZ (A)  
SZ - IZ  
Ct - VR  
25  
20  
15  
10  
5
20  
Ta = 25 °C  
f = 1 MHz  
16  
12  
8
4
0
0
0
3
6
9
12  
15  
0
2
4
6
8
10  
Reverse voltage VR (V)  
Zener current IZ (mA)  
Page 2 of 4  
Established : 2010-05-27  
Revised : 2013-07-24  
Doc No. TT4-EA-12597  
Revision. 3  
Zener Diode  
DZ2S180C0L  
Technical Data ( reference )  
Rth - t  
PZSM - tw  
1000  
100  
10  
100  
(1)  
Ta = 25 °C  
Rth(j-l) = 80 °C/W  
(2)  
10  
1
(1) Non-heat sink  
(2) Mounted on glass epoxy print board.  
Board size : 45 mm × 45 mm x 1 mm  
Solder in : 0.8 mm x 0.6 mm  
1
0.1  
100  
0.001 0.01  
0.1  
1
10  
100  
1000  
1000  
10000  
Time t (s)  
Pulse width tw (μs)  
Page 3 of 4  
Established : 2010-05-27  
Revised : 2013-07-24  
Doc No. TT4-EA-12597  
Revision. 3  
Zener Diode  
DZ2S180C0L  
SSMini2-F5-B  
Unit: mm  
0.80+-0.053  
0.13+-0.052  
2
1
0.30±0.05  
0 to 0.05  
(5°)  
Land Pattern (Reference) (Unit: mm)  
0.8  
Page 4 of 4  
Established : 2010-05-27  
Revised : 2013-07-24  
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  
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