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DZ2606800L

型号:

DZ2606800L

品牌:

PANASONIC[ PANASONIC ]

页数:

5 页

PDF大小:

309 K

Doc No. TT4-EA-14612  
Revision. 1  
Zener Diode  
DZ2606800L  
DZ2606800L  
Silicon epitaxial planar type  
Unit : mm  
For constant voltage / For surge absorption circuit  
DZ27068 in ML2 type package  
0.6  
2
Features  
Excellent rising characteristics of zener current IZ  
Low zener operating resistance RZ  
Halogen-free / RoHS compliant  
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)  
Marking Symbol :  
Packaging  
GJ  
1
Embossed type (Thermo-compression sealing) 10 000 pcs / reel (standard)  
0.39  
1. Cathode  
2. Anode  
Panasonic  
JEITA  
ML2-N3-B  
SOD-882  
Absolute Maximum Ratings Ta = 25 C  
Code  
Parameter  
Symbol  
IFRM  
PT  
Rating  
200  
100  
15  
150  
Unit  
mA  
mW  
kV  
C  
C  
Repetitive peak forward current  
*1  
Total power dissipation  
Electrostatic discharge  
*2  
ESD  
Tj  
Tstg  
Internal Connection  
Junction temperature  
Storage temperature  
2
-55 to +150  
Note) *1 PT = 100 mW achieved with a printed circuit board.  
*2 Test method:IEC61000_4_2  
( C = 150 pF , R = 330 , Contact discharge : 10 times )  
1
Electrical Characteristics Ta = 25 C 3 C  
Parameter  
Forward voltage  
Zener voltage *1, *2  
Symbol  
VF  
Conditions  
Min Typ Max  
1.0  
Unit  
V
V
IF = 10 mA  
IZ = 5 mA  
IZ = 5 mA  
IZ = 0.5 mA  
VR = 4.0 V  
IZ = 5 mA  
VZ  
6.46  
7.14  
20  
Zener operating resistance  
Zener rise operating resistance  
Reverse current  
RZ  
RZK  
IR  
60  
0.1  
A  
mV/C  
*3  
SZ  
3.2  
Temperature coefficient of zener voltage  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.  
2. Absolute frequency of input and output is 5 MHz.  
3. *1  
The temperature must be controlled 25 C for VZ mesurement.  
VZ value measured at other temperature must be adjusted to VZ ( 25 C )  
*2 VZ guaranteed 20 ms after current flow.  
*3  
Tj = 25 C to 150 C  
Page 1 of 4  
Established : 2013-04-08  
Revised : ####-##-##  
Doc No. TT4-EA-14612  
Revision. 1  
Zener Diode  
DZ2606800L  
Technical Data ( reference )  
PT - Ta  
IF - VF  
200  
150  
100  
50  
1.E+00  
Mounted on glass epoxy print board.  
Ta = 25 C  
1.E-01  
1.E-02  
1.E-03  
1.E-04  
1.E-05  
1.E-06  
0
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
50  
100  
150  
200  
Forward voltage VF (V)  
Ambient temperature Ta (C)  
IR - VR  
IZ - VZ  
1.E-08  
1.E-09  
1.E-10  
1.E-11  
1.E-12  
1.E-13  
1.E-14  
1.E-01  
1.E-02  
1.E-03  
1.E-04  
1.E-05  
1.E-06  
Ta = 25C  
Ta = 25 C  
0
2
4
6
8
10  
12  
0
1
2
3
4
5
6
Zener voltage VZ (V)  
Reverse voltage VR (V)  
SZ - IZ  
RZ - IZ  
5
4
10  
Ta = 25 C  
3
2
1
0
-1  
-2  
-3  
-4  
-5  
1
0.0001  
0.001  
0.01  
0.1  
0
2
4
6
8
10  
Zener current IZ (A)  
Zener current IZ (mA)  
Page 2 of 4  
Established : 2013-04-08  
Revised : ####-##-##  
Doc No. TT4-EA-14612  
Revision. 1  
Zener Diode  
DZ2606800L  
Technical Data ( reference )  
Ct - VR  
40  
30  
20  
10  
0
Ta = 25 C  
0
1
2
3
4
5
Reverse voltage VR (V)  
Page 3 of 4  
Established : 2013-04-08  
Revised : ####-##-##  
Doc No. TT4-EA-14612  
Revision. 1  
Zener Diode  
DZ2606800L  
ML2-N3-B  
Unit : mm  
0.60±0.05  
2
1
0.05±0.03  
0.50±0.05  
Land Pattern (Reference) (Unit : mm)  
0.6  
Page 4 of 4  
Established : 2013-04-08  
Revised  
: ####-##-##  
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  
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