SPECIFICATIONS
mPGA604 socket
BGA Series CPU Socket
Vertical, SMT Type
1.27mm [.050”] Pitch
604 Pos.
Mechanical
Contact Retention Force: 0.13Kg min.
Durability: 50 Cycles
Electrical
Contact Resistance: 25mΩ max.
Dielectric Withstanding Voltage: 360V VRMS min.
Insulation Resistance: 800MΩ min.
Physical
Cover: Thermoplastic, UL 94V-0 rated, Natural Color
Base: Thermoplastic, UL 94V-0 rated, Black Color
Cam: Zinc Alloy
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
Operating Temperature: -40℃ to +105℃
DRAWING
ORDERING INFORMATION
DIM A:
The Socket Height:
5.81±0.20mm Before Soldering On Board
5.65±0.20mm After Soldering On Board
PRODUCT NO.: P Z 604 * 3 - 01 3 - T
P=PGA Socket
ZIF
Actual Loading Contacts No.
604=604 Pos.
T=Tooless Type
Termination Type & Length
3=Dual Arm Contact
0=63/37 Sn/Pb;1=Lead Free Type
Contact Area Plating
01=Plastic Cap
3=30µ"Gold
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
4
