GZ Series
Maxi Broadband DC Block to 40GHz
GENERAL INFORMATION
The GZ Series was developed specifically to address DC
Blocking issues from ~15KHz through 40GHz and incorporate
small footprints to conserve board space. The three parts in
this series are designed to match .015" (0.381mm) and .020"
(0.508mm) micro strip widths. These assemblies (patent
pending) combine high capacitance Ni-Au terminated MLC’s
for low frequency coverage and specially configured Maxi
dielectric Single Layer Ceramics to facilitate conventional
surface mounting. Most applications will experience reso-
nance-free performance of <0.5dB thru at least 26.5GHz.
Insertion loss at higher frequencies is in part dependent on
installation parameters.
Custom designs (including those to match wider strip
lines) are available upon request. Wire bondable designs for
applications where strip line matching is not imperative, are
also available. More information can be obtained by contacting
the factory or your local AVX representative.
W1
W2
L2
The assemblies are especially robust and capable of exceeding
Resistance to Flexure Stress tests normally applied to
MLC’s. The high temperature connection between the MLC
and SLC results in a joint whose re-melt temperature will
withstand all normal soldering processes without deterioration.
In applications where SN63 is used, the SLC termination will
contribute <1% Au to the resultant joint–thereby, eliminating
possible solder embrittlement problems.
H
P
G
L1
P
ELECTRICAL SPECIFICATIONS
PART NUMBER
GZ0415ZD104M600ZNW
GZ0402ZD104M800ZNW
GZ06023C104M800ZNW
ELECTRICAL DATA
Capacitance - MLC
Capacitance - SLC
Voltage Rating
0.1 µF ±±0ꢀ
60 pF +80ꢀ, -±0ꢀ
80 pF +80ꢀ, -±0ꢀ
16 VDC @ +85°C; 10 VDC @ +1±5°C
±5 VDC @ 1±5°C
Insulation Resistance
Operating Temp Range
Temp Coefficient
10,000 MegOhms @ ±5°C; 1,000 MegOhms @ 1±5°C
-55°C to +1±5°C
X5R to +85°C; X7S to +1±5°C
X7R to +1±5°C
DIMENSIONS – Inches (Millimeters)
L1 (SLC Length)
.043 ±.003 ꢁ1.0ꢂ± ±.076ꢃ
.040 ±.004 ꢁ1.016 ±.10±ꢃ
.0±0 ±.00± ꢁ.508 ±.051ꢃ
.0±4 ꢁ.061ꢃ
.063 ±.003 ꢁ1.600 ±.076ꢃ
.063 ±.003 ꢁ1.600 ±.076ꢃ
.0±± ±.00± ꢁ.55ꢂ ±.051ꢃ
.036 ꢁ.ꢂ14ꢃ
L2 (MLC Length)
W1 (SLC Width)
W2 (MLC Max Width)
H (Overall Height)
G (Gap)
.015 ±.00± ꢁ.381 ±.051ꢃ
.046 ꢁ1.168ꢃ Max /.04± ꢁ1.067ꢃ Typ
.010 ꢁ.±54ꢃ Typ
.056 ꢁ1.4±±ꢃ Max /.053 ꢁ1.346ꢃ Typ
.0±0 ꢁ.508ꢃ Typ
SLC PAD SIZE
(P x W1 – Typ of 2)
.015 ±.003 x .015 ±.00±
ꢁ.381 ±.076 x .381 ±.051ꢃ
.015 ±.003 x .0±0 ±.00±
ꢁ.381 ±.076 x .508 ±.051ꢃ
.0±0 ±.003 x .0±± ±.00±
ꢁ.508 ±.076 x .55ꢂ ±.051ꢃ
MTG FOOTPRINT
(L1 x W1)
.043 ±.003 x .015 ±.00±
ꢁ1.0ꢂ± ±.076 x .381 ±.051ꢃ
.043 ±.003 x .0±0 ±.00±
ꢁ1.0ꢂ± ±.076 x .508 ±.051ꢃ
.063 ±.003 x .0±± ±.00±
ꢁ1.600 ±.076 x .55ꢂ ±.051ꢃ
TERMINATIONS
ATTACHMENT
PACKAGING
MLC – Ni-Au ꢁplatedꢃ; SLC – Ti/W-Ni-Au ꢁsputteredꢃ
Conductive Epoxy and Sn/Pb, Au/Sn & SAC Alloys
Waffle Pack ꢁ1ꢂ± perꢃ - 7" 8mm Tape & Reel Available ꢁ±000 pieces minimumꢃ
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